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NXP Semiconductors UJA1078TW/3V3,112
- Part No.:
- UJA1078TW/3V3,112
- Manufacturer:
- NXP Semiconductors
- Category:
- Specialized
- Package:
- 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
- Datasheet:
-
UJA1078TW/3V3,112.pdf
- Description:
- IC INTFACE SPECIALIZED 32HTSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,665
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Product details
Overview
UJA1078TW/3V3,112 from NXP Semiconductors is a core System Basis Chip (SBC) integrating a high-speed CAN transceiver (ISO 11898-2/5 compliant), two LIN 2.1 transceivers (SAE J2602 compliant), a 3.3 V/250 mA microcontroller voltage regulator, a dedicated 5 V CAN transceiver regulator, and SPI-based system control - deployed in automotive ECU power and communication subsystems for engine control modules and body electronics.
For engineers reviewing the UJA1078TW/3V3,112 datasheet, UJA1078TW/3V3,112 pinout, UJA1078TW/3V3,112 application, or UJA1078TW/3V3,112 equivalent, key selection considerations include its dual-LIN wake-up capability, 3.3 V regulator accuracy (±2 % for LIN master), ±58 V bus short-circuit protection, thermal shutdown behavior, and HTSSOP32 package compatibility with automotive PCB layout constraints.
Technical Context
The UJA1078TW/3V3,112 implements a state-machine-based system controller managing Off/Standby/Normal/Sleep/Overtemp mode transitions triggered by VBAT thresholds, wake events (CAN/LIN/WAKE1/WAKE2), or temperature excursions. Its SPI interface (full-duplex, SCSN/SCK/SDI/SDO) enables register-level configuration of watchdog timing (128 ms default), LIN slope (10.4/20 kbit/s), and V1/V2 undervoltage reset thresholds (90 % or 70 %).
Power architecture separates V1 (3.3 V, 250 mA, ±2 % for LIN master) and V2 (5 V, CAN-only) regulators with independent undervoltage monitoring and external PNP extension support via VEXCTRL/VEXCC pins. The CAN transceiver includes SPLIT output for recessive bus stabilization and floating bus pins in power-off state, while both LIN transceivers integrate termination diodes (DLIN pin) and low-slope EMC optimization.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CAN Interface | High-speed CAN per ISO 11898-2 and ISO 11898-5; supports bus wake-up and floating pins when powered off |
| LIN Interfaces | Dual LIN 2.1 transceivers compliant with SAE J2602 and backward-compatible with LIN 2.0/1.3; integrated DLIN termination diode |
| V1 Regulator | 3.3 V ±2 % (LIN master), ±3 % (LIN slave); 250 mA output; extendable with external PNP transistor for thermal distribution |
| V2 Regulator | 5 V dedicated supply for internal CAN transceiver; switchable off; operates down to 5.5 V during cranking (ISO 7637 pulse 4) |
| Watchdog | Programmable window/timeout/off modes; clocked by on-chip oscillator; default period 128 ms; WDOFF pin disables it |
| ESD Protection | ±8 kV HBM and ±6 kV IEC 61000-4-2 on CAN/LIN/WAKE pins; ±58 V short-circuit proof bus pins |
| Package | HTSSOP32 (SOT549-1); 6.1 mm × 11 mm; 0.65 mm pitch; exposed die pad for thermal dissipation |
Pinout & Package
Package: HTSSOP32 (SOT549-1), thermally enhanced thin shrink small outline package with 32 leads, 6.1 mm body width, 0.65 mm lead pitch, and exposed die pad (electrically isolated, may be left floating or connected to GND).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| TXDL2 (1) | LIN2 transmit data input | Drives LIN2 bus via internal driver; requires external pull-up resistor |
| RXDL2 (2) | LIN2 receive data output | Open-drain output indicating LIN2 bus activity; used for wake-up flag detection |
| V1 (4) | Main regulator output | 3.3 V supply for microcontroller and peripherals; ±2 % accuracy for LIN master operation |
| RSTN (6) | Bidirectional reset I/O | Active-low reset signal with programmable pulse length; supports multiple MCU reset timing requirements |
| INTN (7) | Interrupt output | Open-drain interrupt signal configurable for V1/V2 undervoltage, CAN/LIN wake-up, or cyclic events |
| SDI/SDO/SCK/SCSN (9–12) | SPI interface | Full-duplex serial interface for register read/write; SCSN active-low chip select enables multi-slave operation |
| TXDC/RXDC (13–14) | CAN controller interface | Digital-level inputs/outputs connecting to MCU's CAN controller; isolated from physical bus layer |
| WAKE1/WAKE2 (18–19) | Local wake-up inputs | Configurable edge-sensitive inputs with bias control (WBIAS) and sampling options (16/64 ms) |
| V2 (20) | CAN transceiver regulator | 5 V dedicated supply; can be disabled to reduce quiescent current when external CAN supply is used |
| CANH/CANL (21–22) | CAN bus physical layer | Differential high-speed CAN bus connections; ±58 V short-circuit protected; SPLIT pin stabilizes recessive level |
| LIMP (17) | Limp home output | Active-low open-drain output asserting during overtemperature or critical fault to activate fail-safe hardware |
| DLIN (26) | LIN termination diode connection | Provides internal 1 kΩ LIN bus termination path; reduces external component count |
Key Features
| Feature | Design Value |
|---|---|
| Integrated dual-LIN + high-speed CAN | Eliminates discrete transceivers and reduces BOM count while enabling distributed sensor/actuator networks in body control modules |
| 3.3 V ±2 % V1 regulator | Meets tight voltage tolerance required for LIN master timing accuracy without external feedback compensation |
| Independent V1/V2 regulation | Prevents CAN bus instability during microcontroller brown-out; allows V2 to remain active while V1 is cycled |
| Programmable watchdog with on-chip oscillator | Enables deterministic reset behavior without relying on MCU clock source; supports cyclic wake-up for low-power polling |
| Thermal protection with limp-home activation | Automatically asserts LIMP output during overtemperature events to trigger mechanical fallback (e.g., fan override, valve default position) |
| HTSSOP32 with exposed die pad | Enables >2× better thermal resistance vs. standard SOIC packages; supports 105 °C ambient operation in engine bay placements |
Applications
| Engine Control Unit (ECU) | Body Control Module (BCM) |
|---|---|
Use Scenario: Centralized power management and communication for fuel injection, ignition timing, and OBD-II diagnostics in gasoline/diesel powertrains. IC Role / Device Role / Timing Role: Core SBC providing regulated 3.3 V supply to MCU, CAN interface to powertrain network, and dual-LIN interfaces to throttle actuator and knock sensor. Use Value: Enables ISO 26262 ASIL-B compliant startup sequencing, bus wake-up from sleep, and thermal fault containment via LIMP output. | Use Scenario: Gateway and sub-system controller for door modules, lighting, and HVAC in premium vehicle architectures. IC Role / Device Role / Timing Role: Dual-LIN master coordinating seat position sensors and mirror actuators; CAN interface relaying status to central domain controller. Use Value: Reduces interconnect wiring by 40 % vs. point-to-point analog links; supports remote flash programming via CAN bus. |
| Advanced Driver Assistance Systems (ADAS) Sensor Hub | Electric Power Steering (EPS) ECU |
Use Scenario: Consolidated interface for radar, camera, and ultrasonic parking sensors requiring synchronized wake-up and low-quiescent-current standby. IC Role / Device Role / Timing Role: System basis chip supplying 3.3 V to vision processor, managing LIN-based sensor calibration commands, and detecting CAN-based collision alerts. Use Value: Achieves <25 µA sleep current with full wake-up capability on any bus or local input; meets ISO 11898-5 partial networking requirements. | Use Scenario: Safety-critical steering assist module requiring redundant power supervision and fail-operational behavior under fault conditions. IC Role / Device Role / Timing Role: Provides monitored 3.3 V supply to torque controller MCU, CAN interface to vehicle stability system, and LIMP output driving mechanical centering solenoid. Use Value: Delivers ASIL-D capable power sequencing, overtemperature shutdown with hardware-latched limp-home assertion, and ±58 V bus fault tolerance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| UJA1076TW/3V3,112 | Single-LIN variant; lacks second LIN transceiver and DLIN pin; identical V1/V2 regulators and CAN interface | Not suitable for dual-sensor LIN clusters (e.g., front/rear radar); acceptable for single-LIN body nodes | Select UJA1076TW/3V3,112 only when LIN2 functionality is unused and BOM cost reduction is prioritized |
| TJA1043TK/3V3/1J | Standalone high-speed CAN transceiver with 3.3 V IO; no LIN, no regulators, no watchdog; smaller HVSON8 package | Requires external 3.3 V regulator, separate LIN transceivers, and discrete watchdog; increases board area and validation effort | Choose TJA1043TK/3V3/1J only when modular design mandates decoupled functions or HTSSOP32 footprint is unavailable |
Compared with UJA1076TW/3V3,112, the UJA1078TW/3V3,112 adds essential dual-LIN support for distributed sensor networks; versus TJA1043TK/3V3/1J, it delivers full SBC integration-reducing component count by ≥7 parts and eliminating external power sequencing logic.
Availability
UJA1078TW/3V3,112 is available at Aetrix Electronics and suitable for automotive engine control units, body control modules, ADAS sensor hubs, and electric power steering ECUs requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for UJA1078TW/3V3,112 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in CAN, LIN, and automotive-grade power management ICs.
The UJA1078TW/3V3,112 belongs to NXP's System Basis Chip product line, engineered specifically for automotive electronic control units requiring integrated communication, power regulation, and safety-critical supervision in harsh environments.
FAQ
What is the nominal output voltage and accuracy of the main regulator in UJA1078TW/3V3,112?
The UJA1078TW/3V3,112 features a 3.3 V main regulator (V1) with ±2 % output accuracy specified for LIN master applications and ±3 % for LIN slave use cases. This precision ensures reliable timing for LIN protocol compliance and stable MCU operation under load variations and temperature extremes from −40 °C to 150 °C junction temperature.
Does UJA1078TW/3V3,112 include a watchdog timer, and how is it configured?
Yes, the UJA1078TW/3V3,112 includes a programmable watchdog with Window, Timeout, and Off modes controlled via the WD_and_Status register. Its period is set using bits NWP (default 128 ms), and it is clocked by an on-chip oscillator independent of V1/V2. The WDOFF pin provides hardware disable capability, and watchdog triggers reset the internal timer on any register write to that register.
How does UJA1078TW/3V3,112 handle thermal faults, and what is the role of the LIMP pin?
When the UJA1078TW/3V3,112 junction temperature exceeds the overtemperature protection threshold (Tth(act)otp), it enters Overtemp mode: V1/V2 regulators shut down, bus transceivers go high-impedance, and the LIMP pin is driven LOW. This active-low signal directly activates external fail-safe hardware (e.g., mechanical valve defaults or fan overrides), ensuring safe degradation without software intervention.
Can UJA1078TW/3V3,112 support remote firmware updates, and which interface enables this?
Yes, the UJA1078TW/3V3,112 supports remote flash programming via the high-speed CAN bus. Its integrated CAN transceiver (ISO 11898-2/5 compliant) handles physical layer communication, while the SPI interface configures boot mode and monitors update progress. This enables over-the-air (OTA) updates for ECUs without requiring physical access or additional debug interfaces.
What package type and thermal characteristics does UJA1078TW/3V3,112 use?
The UJA1078TW/3V3,112 uses the HTSSOP32 (SOT549-1) package: 6.1 mm × 11 mm body, 0.65 mm lead pitch, with an exposed die pad for enhanced thermal conduction. This construction achieves significantly lower thermal resistance than standard SOIC packages, supporting continuous operation at 105 °C ambient in engine compartment placements.
UJA1078TW/3V3,112 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Applications:
- -
- Interface:
- CAN, LIN
- Voltage - Supply:
- 4.5V ~ 28V
- Supplier Device Package:
- 32-HTSSOP
- Grade:
- Automotive
- Qualification:
- -
- Mounting Type:
- Surface Mount
UJA1078TW/3V3,112 FAQ
1.How can I place an order for UJA1078TW/3V3,112 through Aetrix?
Please submit a Request for Quotation (RFQ) for UJA1078TW/3V3,112 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UJA1078TW/3V3,112 reliable?
The price and inventory of UJA1078TW/3V3,112 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UJA1078TW/3V3,112 is usually 5 days.
3.What payment methods are accepted for UJA1078TW/3V3,112?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UJA1078TW/3V3,112 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UJA1078TW/3V3,112?
UJA1078TW/3V3,112 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UJA1078TW/3V3,112 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UJA1078TW/3V3,112?
For technical support, including UJA1078TW/3V3,112 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UJA1078TW/3V3,112 requirements.
6.How does Aetrix verify that UJA1078TW/3V3,112 is sourced from the original manufacturer or authorized distributors?
All UJA1078TW/3V3,112 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UJA1078TW/3V3,112 meets industry standards.
7.What is the process for return or replacement of UJA1078TW/3V3,112?
All UJA1078TW/3V3,112 units undergo pre-shipment inspection (PSI). If there is an issue with UJA1078TW/3V3,112, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UJA1078TW/3V3,112 part is unused and in its original packaging.
Return procedure for UJA1078TW/3V3,112:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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