NXP Semiconductors UJA1169ATK/XZ

Overview

UJA1169ATK/XZ from NXP Semiconductors is a mini high-speed CAN System Basis Chip (SBC) integrating an ISO 11898-2:2016 and SAE J2284-1–5 compliant HS-CAN transceiver supporting CAN FD up to 5 Mbit/s, a scalable 5 V/250 mA microcontroller supply (V1), a protected 5 V off-board sensor supply (VEXT), SPI interface, watchdog, and LIMP fault signaling. It operates in Standby/Sleep modes with bus and local wake-up, and targets automotive body control modules requiring robust partial networking support.

For engineers reviewing the UJA1169ATK/XZ datasheet, UJA1169ATK/XZ pinout, UJA1169ATK/XZ application, or UJA1169ATK/XZ equivalent, key selection considerations include its VEXT short-circuit protection to BAT/GND/negative voltages, CAN FD-passive partial networking capability, autonomous bus biasing, thermal management via external PNP transistor, and non-volatile configuration of reset thresholds and limp-home behavior.

Technical Context

The UJA1169ATK/XZ implements a fully compliant ISO 11898-2:2016 physical layer with CAN FD active operation up to 5 Mbit/s and CAN FD-passive selective wake-up-enabling classic CAN nodes to remain in Sleep during CAN FD traffic without bus errors. Its internal transceiver is powered from V1, while VEXT supplies off-board sensors and is short-circuit proof to ±18 V.

Power management includes three distinct low-current states: Normal (V1 active, CAN active), Standby (V1 active, CAN offline), and Sleep (V1 off, CAN offline, SPI disabled). Wake-up sources include standard CAN patterns, ISO-compliant selective frames (with FD-passive), and the WAKE pin-with wake-source recognition and RXD-driven wake signaling.

Key Specifications

Pinout & Package

Package: HVSON20 (3.5 mm × 5.5 mm, 0.85 mm height), leadless, halogen-free, RoHS-compliant, with exposed die pad for enhanced thermal and electrical grounding.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar CAN SBC applications.

Compared with UJA1169ATK/XZ, UJA1169ATK/X/F adds certified partial networking but shares identical VEXT protection and thermal scalability; TJA1145A omits VEXT entirely and cannot replace UJA1169ATK/XZ in sensor-supply-critical designs without redesigning power architecture.

Availability

UJA1169ATK/XZ is available at Aetrix Electronics and suitable for automotive body control modules, door control units, roof modules, and seat control units requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 qualified sourcing.

Supply support for UJA1169ATK/XZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in CAN, SBC, and functional safety architectures.

The UJA1169A product line is designed specifically for automotive body electronics requiring integrated CAN FD communication, scalable power regulation, and robust fault management-including partial networking support for next-generation E/E architectures.

FAQ

What is the maximum CAN FD data rate supported by the UJA1169ATK/XZ?

The UJA1169ATK/XZ supports CAN FD active communication up to 5 Mbit/s in the fast phase, as defined by ISO 11898-2:2016. This enables high-throughput diagnostics, firmware updates, and real-time sensor data streaming in automotive networks. The transceiver maintains full compliance at this rate, including proper bit timing, slew rate control, and common-mode rejection.

Does the UJA1169ATK/XZ support partial networking, and what does "CAN FD-passive" mean for this device?

The UJA1169ATK/XZ does not include partial networking functionality-only /F variants (e.g., UJA1169ATK/X/F) support ISO 11898-2:2016 partial networking with CAN FD-passive. CAN FD-passive means the device ignores CAN FD frames in Sleep/Standby mode, preventing false wake-ups while allowing classic CAN nodes to remain asleep during CAN FD traffic-critical for power-sensitive body domain networks.

How is the VEXT supply on the UJA1169ATK/XZ protected against electrical faults?

The VEXT supply on the UJA1169ATK/XZ is short-circuit proof to battery (BAT), ground (GND), and negative voltages down to −18 V. This protection is built-in and requires no external components, enabling direct connection to external sensors-even in harsh automotive environments with load-dump or reverse-battery conditions. Fault current is internally limited, and recovery is automatic after fault removal.

Can the UJA1169ATK/XZ retain microcontroller RAM during low-battery conditions?

Yes-the UJA1169ATK/XZ supports microcontroller RAM retention down to a battery voltage of 2 V, but only in 5 V variants like UJA1169ATK/XZ. This is achieved through controlled V1 discharge behavior during power-down, ensuring critical memory contents survive ignition-off transitions and brown-out events without external backup capacitors or supercapacitors.

What is the role of the LIMP output pin on the UJA1169ATK/XZ, and how is it configured?

The LIMP output pin on the UJA1169ATK/XZ is an open-drain, active-low signal that flags critical system failures-including overtemperature, watchdog timeout/failure, and RSTN clamping. Its activation threshold (e.g., temperature trip point or watchdog error condition) is configurable via non-volatile memory, allowing tailoring to specific safety architecture requirements without hardware changes.

Is the UJA1169ATK/XZ compatible with external PNP transistors for thermal management?

Yes-the UJA1169ATK/XZ supports thermal scaling of its V1 regulator using an external PNP transistor connected via VEXCTRL (base control) and VEXCC (collector sense). This allows designers to adjust thermal performance based on PCB layout, enclosure constraints, and sustained load requirements-enabling reliable 250 mA operation in compact automotive modules without derating.