Renesas UPD44164184BF5-E40-EQ3
- Part No.:
- UPD44164184BF5-E40-EQ3
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
UPD44164184BF5-E40-EQ3.pdf
- Description:
- DDR SRAM, 1MX18, 0.45NS
- Quantity:
- Payment:

- Shipping:

Inventory:6,750
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Product details
Overview
UPD44164184BF5-E40-EQ3 from Renesas Electronics is a 1,048,576-word × 18-bit synchronous double data rate (DDR) SRAM with pipelined burst operation, HSTL interface, and PLL-based timing control. It operates at 250 MHz (4.0 ns cycle time), supports 1.8 V core supply and 1.4–1.8 V I/O supply, and is packaged in a 165-pin plastic BGA (13 × 15 mm). It serves as high-speed buffer memory in network packet processors requiring precise clock-aligned read/write bursts.
For engineers reviewing the UPD44164184BF5-E40-EQ3 datasheet, UPD44164184BF5-E40-EQ3 pinout, UPD44164184BF5-E40-EQ3 application, or UPD44164184BF5-E40-EQ3 equivalent, key selection considerations include DDR II timing compliance, HSTL Class I output drive, user-programmable 35–70 Ω output impedance, and JTAG 1149.1 test port support for system-level validation.
Technical Context
This device implements a synchronous DDR architecture with dual-clock domain separation: K/K# registers inputs on rising edges, while C/C# govern output data timing to match flight time and minimize skew. Its internal burst counter and linear 4-word burst sequence enable deterministic address progression without external sequencing logic.
The integrated PLL provides a wide output data valid window and enables future frequency scaling up to 300 MHz. Clock-stop capability (20 μs recovery) and DLL#-controlled PLL disable support low-power debug modes, while ZQ-calibrated output impedance ensures signal integrity across varying PCB trace impedances.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 1,048,576 words × 18 bits = 18 Mbit total capacity; supports depth expansion via simple control logic |
| Clock Frequency / Cycle Time | 250 MHz / 4.0 ns - defines maximum sustained throughput of 1.8 Gbps per data line in burst mode |
| Supply Voltages | VDD = 1.7–1.9 V (core); VDDQ = 1.4–VDD V (I/O) - enables low-voltage operation while maintaining HSTL compatibility |
| Interface Standard | HSTL Class I compliant - guarantees 1.5 V swing, controlled slew, and termination-matched signaling for >200 MHz bus operation |
| Output Impedance | User-programmable 35–70 Ω via ZQ pin - allows dynamic calibration to system bus impedance without external resistors |
| Timing Reference | Dual-clock architecture: K/K# for input registration, C/C# for output timing - decouples setup/hold margins from flight time variation |
| JTAG Support | IEEE 1149.1-compliant TAP (TCK/TMS/TDI/TDO) - enables boundary-scan testing and IDCODE verification in production |
Pinout & Package
UPD44164184BF5-E40-EQ3 is housed in a 165-pin plastic BGA package (13 × 15 mm grid, 0.8 mm pitch), optimized for high-density routing and thermal dissipation in networking and telecom modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| K, K# | Input Clock Pair | Registers all address/control/data on rising edges; 180° phase alignment required for jitter tolerance |
| C, C# | Output Clock Pair | Controls output data timing; enables precise clock-data alignment at receiver; fixed HIGH if using K/K# only |
| CQ, CQ# | Echo Clock Outputs | Tightly matched to DQ valid/hold windows (±0.1 ns); used as data-strobe reference independent of C/C# state |
| ZQ | Impedance Calibration Input | Connects to external resistor-to-ground (175–350 Ω) to set DQ/CQ output drive strength; auto-calibrates every 20 μs |
| DQ0–DQ17 | Bidirectional Data Bus | 18-bit common I/O; HSTL Class I outputs; tristated during NOP/clock stop; supports byte-write via BW0#/BW1# |
| LD#, R, W#, BW0#, BW1# | Synchronous Control Inputs | Edge-triggered on K rising edge; define burst start, access type, and byte-mask selection with strict setup/hold timing |
| VDD, VDDQ, VSS, VREF | Power & Reference | VDD (core), VDDQ (I/O), VSS (ground), VREF (VDDQ/2) - require separate decoupling; VREF must be stable before clock enable |
| TCK, TMS, TDI, TDO | JTAG Test Port | 1.8 V I/O level; TCK must be tied to VSS if unused; supports boundary scan and ID register readout |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined DDR Operation | Enables concurrent address registration and data transfer across two clock cycles, achieving full bandwidth utilization without pipeline stalls |
| Two-Tick Burst Mode | Reduces DDR transaction overhead by limiting burst length to 4 words (2 clock periods), ideal for packet header buffering with minimal latency |
| Programmable Output Impedance | 35–70 Ω range calibrated via ZQ pin eliminates need for external series termination resistors and adapts to board stack-up variations |
| PLL-Based Timing Margining | Widens output data valid window and supports scalable clock frequencies up to 300 MHz without redesigning PCB layout or timing constraints |
| Clock-Stop Recovery | Resumes normal operation within 20 μs after clock restart - meets low-power idle requirements in burst-oriented traffic scenarios |
| JTAG 1149.1 Compliance | Full boundary-scan capability with IDCODE and bypass register - enables automated test coverage and interconnect verification in multi-SRAM systems |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with strict latency budgets. IC Role / Device Role / Timing Role: High-speed DDR II SRAM acting as first-level packet buffer, synchronized to switch fabric clock via K/K# and C/C#. Use Value: 4-word burst mode matches typical packet header sizes; HSTL interface ensures clean signal integrity at 250 MHz on dense backplanes. |
Use Scenario: Supporting real-time voice and data processing in carrier-grade DSLAMs and OLTs with temperature-critical operation. IC Role / Device Role / Timing Role: Synchronous memory for ATM cell assembly/disassembly engines, operating across −40 to +85°C (EY variant). Use Value: ZQ-calibrated outputs maintain impedance match over temperature drift; clock-stop mode reduces power between traffic bursts. |
| Baseband Processing Cache | Industrial Video Frame Buffer |
|
Use Scenario: Acting as low-latency cache for FPGA-based LTE/5G baseband processors handling channel estimation and FFT buffers. IC Role / Device Role / Timing Role: DDR II SRAM interfaced directly to FPGA I/O banks configured for HSTL Class I, with CQ/CQ# feeding FPGA IDELAYCTRL. Use Value: Echo clocks provide sub-100 ps data-valid reference; programmable impedance eliminates layout-dependent timing closure issues. |
Use Scenario: Buffering uncompressed HD video frames (1080p @ 60 fps) in broadcast equipment and medical imaging systems. IC Role / Device Role / Timing Role: Dual-port-capable memory accessed via burst reads/writes synchronized to pixel clock domain and system controller. Use Value: 18-bit bus width supports YUV422 packing; 250 MHz operation sustains 4.5 GB/s aggregate bandwidth for dual-stream capture/playback. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress CY7C1551KV18 | Same 1M × 18 organization, 250 MHz speed grade, but uses SSTL-2 interface and lacks ZQ calibration or echo clocks | Requires external termination resistors and tighter board-level timing margining; no built-in clock-data alignment aid | Choose when legacy SSTL-2 infrastructure exists and impedance tuning is handled externally |
| ISSI IS61WV102418B | Asynchronous SRAM with 10 ns access; no DDR, no PLL, no burst logic - fundamentally different timing model | Cannot replace UPD44164184BF5-E40-EQ3 in DDR-clocked systems without major controller redesign | Consider only for non-burst, low-frequency control-plane memory where synchronous timing is unnecessary |
Compared with CY7C1551KV18 and IS61WV102418B, UPD44164184BF5-E40-EQ3 delivers superior signal integrity via HSTL Class I + ZQ calibration, deterministic timing via C/C# and CQ/CQ#, and true DDR efficiency - making it optimal for high-speed packet and video buffering where timing predictability is critical.
Availability
UPD44164184BF5-E40-EQ3 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing cache, and industrial video frame buffering requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for UPD44164184BF5-E40-EQ3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.
The μPD44164184B family was designed specifically for high-bandwidth, low-latency synchronous memory applications in networking and telecom infrastructure - emphasizing DDR II timing precision, HSTL interoperability, and robust thermal performance in compact BGA packages.
FAQ
What is the operating temperature range for UPD44164184BF5-E40-EQ3?
The UPD44164184BF5-E40-EQ3 is rated for an operating ambient temperature of 0 to 70°C, as indicated by the "E" suffix in its ordering code. This distinguishes it from the "EY" variants (e.g., UPD44164184BF5-E40Y-EQ3), which support −40 to +85°C. The device's thermal resistance (θja) is 21.4°C/W under still-air conditions on a 4-layer board, enabling reliable operation within this range when properly decoupled and heatsinked.
Does UPD44164184BF5-E40-EQ3 support true DDR data transfers on both clock edges?
Yes, UPD44164184BF5-E40-EQ3 implements true double data rate operation: input data is latched on both rising edges of K and K#, and output data is driven aligned to rising edges of C and C#. Its pipelined architecture ensures full utilization of both edges without internal serialization, delivering 250 MHz effective data rate per DQ line - confirmed by AC timing parameters TKHKH (4.0 ns) and TCHQV/TCHQX (±0.45 ns hold/setup relative to C/C#).
How is output impedance calibrated on UPD44164184BF5-E40-EQ3?
Output impedance on UPD44164184BF5-E40-EQ3 is calibrated via the ZQ pin, which connects to an external resistor (RQ = 175–350 Ω) to ground. The device internally sets DQ, CQ, and CQ# driver strength to 0.2 × RQ, yielding a programmable range of 35–70 Ω. Calibration occurs automatically every 20 μs after power-up and tracks supply voltage and temperature drift - eliminating manual trimming or fixed external termination.
Can UPD44164184BF5-E40-EQ3 operate without the PLL enabled?
Yes - pulling DLL# LOW disables the PLL, allowing operation at reduced clock frequencies (<250 MHz) for debug or low-power modes. In this state, read latency becomes 1.0 clock cycle, but AC/DC characteristics are not guaranteed per datasheet. For full-spec operation at 250 MHz, DLL# must be held HIGH (e.g., tied to VDDQ via ≤10 kΩ resistor), and stable clock must be applied for ≥20 μs to achieve PLL lock before initiating transactions.
What JTAG functions are supported by UPD44164184BF5-E40-EQ3?
UPD44164184BF5-E40-EQ3 implements IEEE 1149.1 JTAG with TCK, TMS, TDI, and TDO pins. It supports IDCODE register readout (32-bit vendor/device ID), boundary-scan testing via the boundary register, and bypass mode. TRST is not implemented; test-logic reset is achieved by holding TMS HIGH for five TCK cycles. All JTAG I/O operates at 1.8 V and requires proper termination per JEDEC HSTL guidelines.
UPD44164184BF5-E40-EQ3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
UPD44164184BF5-E40-EQ3 FAQ
1.How can I place an order for UPD44164184BF5-E40-EQ3 through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD44164184BF5-E40-EQ3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD44164184BF5-E40-EQ3 reliable?
The price and inventory of UPD44164184BF5-E40-EQ3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44164184BF5-E40-EQ3 is usually 5 days.
3.What payment methods are accepted for UPD44164184BF5-E40-EQ3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD44164184BF5-E40-EQ3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UPD44164184BF5-E40-EQ3?
UPD44164184BF5-E40-EQ3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD44164184BF5-E40-EQ3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD44164184BF5-E40-EQ3?
For technical support, including UPD44164184BF5-E40-EQ3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44164184BF5-E40-EQ3 requirements.
6.How does Aetrix verify that UPD44164184BF5-E40-EQ3 is sourced from the original manufacturer or authorized distributors?
All UPD44164184BF5-E40-EQ3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44164184BF5-E40-EQ3 meets industry standards.
7.What is the process for return or replacement of UPD44164184BF5-E40-EQ3?
All UPD44164184BF5-E40-EQ3 units undergo pre-shipment inspection (PSI). If there is an issue with UPD44164184BF5-E40-EQ3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD44164184BF5-E40-EQ3 part is unused and in its original packaging.
Return procedure for UPD44164184BF5-E40-EQ3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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