Renesas UPD44164362BF5-E40-EQ3
- Part No.:
- UPD44164362BF5-E40-EQ3
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
UPD44164362BF5-E40-EQ3.pdf
- Description:
- DDR SRAM, 512KX36, 0.45NS
- Quantity:
- Payment:

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Product details
Overview
UPD44164362BF5-E40-EQ3 from Renesas Electronics is a 524,288-word × 36-bit synchronous double data rate (DDR) SRAM with pipelined burst operation, HSTL interface, and PLL-based timing control. It operates at 1.8 V supply, supports 250 MHz clock frequency (4.0 ns cycle time), and delivers synchronized echo clocks (CQ/CQ#) for precise data valid window alignment in high-speed memory subsystems used in network packet buffers and FPGA co-processor caches.
For engineers reviewing the UPD44164362BF5-E40-EQ3 datasheet, UPD44164362BF5-E40-EQ3 pinout, UPD44164362BF5-E40-EQ3 application, or UPD44164362BF5-E40-EQ3 equivalent, this page provides verified DDR II SRAM specifications including burst timing, HSTL I/O compliance, user-programmable output impedance (35–70 Ω), clock-stop recovery (20 μs), and JTAG 1149.1 test access - all confirmed for the exact 512K × 36 organization and 165-pin plastic BGA package.
Technical Context
This device implements a synchronous DDR architecture with dual input clocks (K/K#) latching address/control on K's rising edge and data on both K and K# edges. Its internal PLL generates tightly matched C/C# and CQ/CQ# outputs to minimize flight-time skew and enable deterministic data capture at receiving logic.
The memory uses a 2-word linear burst mode with A0 controlling burst start address, and integrates byte-write enable (BW0#–BW3#) for selective 9-bit writes across four data groups. All I/Os comply with JEDEC HSTL Class I standards, and output impedance is calibrated via ZQ pin using an external resistor to ground.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 524,288 words × 36 bits (18 Mbit total); enables wide-data-path buffering without external depth expansion |
| Clock Frequency | 250 MHz (4.0 ns cycle time); validated for stable operation across 0°C to 70°C ambient range |
| Supply Voltage | VDD = 1.8 ± 0.1 V; VDDQ = 1.4–1.8 V; separate I/O supply allows optimized signal integrity |
| Interface Standard | HSTL Class I compliant I/Os; meets JEDEC JESD8-15A for 1.5 V/1.8 V systems with VREF = VDDQ/2 |
| Burst Mode | Fixed 2-word linear burst; A0 selects starting address within burst, reducing address bus toggling |
| Output Impedance | User-programmable 35–70 Ω via ZQ pin; matches typical PCB trace impedances without external termination |
| PLL Lock Time | 20 μs after stable clock applied; ensures deterministic timing startup for synchronous system initialization |
Pinout & Package
Package: 165-pin plastic BGA (13 × 15 mm, 0.8 mm pitch), lead-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| K, K# | Input clock pair | Latches all address, control, and write data on rising edges; 180° phase relationship required for DDR timing |
| C, C# | Output clock pair | Provides user-tunable timing reference for output data; fixed HIGH if K/K# used as reference |
| CQ, CQ# | Echo clock outputs | Tightly matched to DQ valid/hold windows (±0.1 ns); enables receiver-side data capture without additional delay compensation |
| DQ0–DQ35 | Synchronous data I/O | 36-bit bidirectional bus; registered on K/K# for writes, driven on C/C# or K/K# for reads per configuration |
| BW0#–BW3# | Byte write enables | Four active-low signals selecting 9-bit subwords (DQ0–8, DQ9–17, DQ18–26, DQ27–35) during WRITE cycles |
| ZQ | Impedance calibration input | Connects to external resistor to ground; sets DQ/CQ/CQ# output drive strength to 0.2 × RQ |
| DLL# | PLL disable | Pull LOW to bypass PLL for low-frequency debug; normal operation requires HIGH (tied to VDDQ) |
| TCK, TMS, TDI, TDO | JTAG 1149.1 interface | 1.8 V I/O level test access port; TCK must be tied to VSS if unused |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined DDR operation | Enables concurrent address setup and data transfer across two consecutive clock edges, increasing effective bandwidth |
| Two-tick burst mode | Minimizes transaction overhead for small data transfers; reduces bus arbitration latency in real-time packet processing |
| Internally self-timed write control | Eliminates external write pulse generation; simplifies controller logic and guarantees write completion timing |
| Clock-stop capability | Enters low-power state with 20 μs recovery; supports dynamic power gating in burst-oriented traffic patterns |
| JTAG 1149.1 test access | Enables boundary-scan testing of SRAM interconnects without functional access; supports production test and debug |
Applications
| Network Packet Buffer | FPGA Co-Processor Cache |
|---|---|
Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches before forwarding decisions. IC Role / Device Role / Timing Role: High-bandwidth, low-latency DDR II SRAM providing 250 MHz burst read/write for frame header inspection and rewrite. Use Value: 36-bit width matches common packet header sizes; echo clocks (CQ/CQ#) eliminate board-level timing margin uncertainty. |
Use Scenario: Acting as local scratchpad memory between FPGA fabric and external DDR3 controller in AI inference accelerators. IC Role / Device Role / Timing Role: Synchronous burst buffer decoupling variable-latency DRAM accesses from deterministic FPGA pipeline stages. Use Value: 2-word burst and HSTL interface reduce controller complexity; clock-stop mode lowers average power during idle cycles. |
| Telecom Line Card Memory | Industrial Motion Controller Buffer |
Use Scenario: Holding real-time voice sample streams and protocol overhead data in VoIP gateways. IC Role / Device Role / Timing Role: DDR II SRAM delivering jitter-free 250 MHz data delivery synchronized to telecom timing references. Use Value: PLL-based C/C# outputs match flight time to downstream DSP; ZQ calibration maintains signal integrity across temperature. |
Use Scenario: Buffering position feedback and motion command data in closed-loop servo drives with microsecond response requirements. IC Role / Device Role / Timing Role: Deterministic-access memory supporting hard real-time interrupt servicing without cache misses. Use Value: Self-timed write control guarantees write completion within one clock cycle; no external timing constraints on host interface. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1551KV18-250BZI | 512K × 36, 250 MHz, 1.8 V core, but uses SSTL-2 I/O (not HSTL); no ZQ calibration or echo clocks | Requires external termination resistors and lacks CQ/CQ# for flight-time matching; less suitable for long-trace backplanes | Select when existing board design already uses SSTL-2 infrastructure and timing margins allow manual skew compensation |
| IS42S32400F-6BL | SDRAM (not SRAM), 1M × 32, 166 MHz, 3.3 V; asynchronous refresh, higher latency, no burst-2 mode | Not pin-compatible; requires full memory controller redesign; unsuitable for deterministic low-latency use cases | Consider only for cost-sensitive, non-real-time applications where refresh overhead and variable latency are acceptable |
Compared with CY7C1551KV18-250BZI and IS42S32400F-6BL, UPD44164362BF5-E40-EQ3 uniquely combines HSTL I/O, on-die impedance tuning, and echo-clock timing - enabling robust 250 MHz operation in thermally varying, high-density PCB layouts without layout-level timing closure effort.
Availability
UPD44164362BF5-E40-EQ3 is available at Aetrix Electronics and suitable for network packet buffers, FPGA co-processor caches, and telecom line card memory requiring stable component supply, guaranteed lead-free packaging, and long-term industrial temperature support.
Supply support for UPD44164362BF5-E40-EQ3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.
The UPD44164362BF5-E40-EQ3 belongs to Renesas' DDR II SRAM product line, designed specifically for high-speed, low-latency buffering in synchronous digital systems where deterministic timing, HSTL compatibility, and minimal controller overhead are critical.
FAQ
What is the operating temperature range for UPD44164362BF5-E40-EQ3?
The UPD44164362BF5-E40-EQ3 is rated for 0°C to 70°C ambient operation (industrial grade). Its ordering suffix "EQ3" confirms this temperature range, distinct from the "EQ3Y" variant rated for −40°C to +85°C. Electrical characteristics including IDD, ISB1, and AC timing parameters are fully specified across this range.
Does UPD44164362BF5-E40-EQ3 support true DDR data rates or single-data-rate operation?
UPD44164362BF5-E40-EQ3 is a true double data rate (DDR) SRAM: it transfers data on both rising edges of K and K#, achieving 500 MT/s effective throughput at 250 MHz clock. Its architecture mandates DDR timing - it does not support single-data-rate operation. The device requires strict 180° phase alignment between K and K#.
How is output impedance calibrated on UPD44164362BF5-E40-EQ3?
Output impedance on UPD44164362BF5-E40-EQ3 is calibrated via the ZQ pin, which connects to an external resistor (RQ) to ground. The device sets DQ, CQ, and CQ# output drive strength to 0.2 × RQ, yielding 35–70 Ω range. Calibration occurs automatically every 20 μs after power-up and tracks voltage/temperature drift.
Can UPD44164362BF5-E40-EQ3 operate without its PLL enabled?
Yes - pulling DLL# LOW disables the PLL, allowing operation at frequencies below 120 MHz using K/K# directly as timing references. However, AC/DC characteristics are not guaranteed in this mode, read latency changes to 1.0 clock cycle, and echo clock (CQ/CQ#) accuracy degrades. For full specification compliance, DLL# must be HIGH.
What is the function of CQ and CQ# pins on UPD44164362BF5-E40-EQ3?
CQ and CQ# are synchronous echo clock outputs tightly matched (±0.1 ns) to DQ valid/hold windows. They provide a receiver-side timing reference that eliminates flight-time skew between clock and data, enabling reliable capture without board-level delay tuning. Unlike C/C#, CQ/CQ# remain active even when DQ tristates.
UPD44164362BF5-E40-EQ3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
UPD44164362BF5-E40-EQ3 FAQ
1.How can I place an order for UPD44164362BF5-E40-EQ3 through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD44164362BF5-E40-EQ3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD44164362BF5-E40-EQ3 reliable?
The price and inventory of UPD44164362BF5-E40-EQ3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44164362BF5-E40-EQ3 is usually 5 days.
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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD44164362BF5-E40-EQ3 transactions.
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UPD44164362BF5-E40-EQ3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD44164362BF5-E40-EQ3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD44164362BF5-E40-EQ3?
For technical support, including UPD44164362BF5-E40-EQ3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44164362BF5-E40-EQ3 requirements.
6.How does Aetrix verify that UPD44164362BF5-E40-EQ3 is sourced from the original manufacturer or authorized distributors?
All UPD44164362BF5-E40-EQ3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44164362BF5-E40-EQ3 meets industry standards.
7.What is the process for return or replacement of UPD44164362BF5-E40-EQ3?
All UPD44164362BF5-E40-EQ3 units undergo pre-shipment inspection (PSI). If there is an issue with UPD44164362BF5-E40-EQ3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD44164362BF5-E40-EQ3 part is unused and in its original packaging.
Return procedure for UPD44164362BF5-E40-EQ3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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