Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas UPD44164362BF5-E40-EQ3

Part No.:
UPD44164362BF5-E40-EQ3
Manufacturer:
Renesas
Category:
Memory
Package:
-
Datasheet:
AetrixUPD44164362BF5-E40-EQ3.pdf
Description:
DDR SRAM, 512KX36, 0.45NS
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:21,564

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

UPD44164362BF5-E40-EQ3 from Renesas Electronics is a 524,288-word × 36-bit synchronous double data rate (DDR) SRAM with pipelined burst operation, HSTL interface, and PLL-based timing control. It operates at 1.8 V supply, supports 250 MHz clock frequency (4.0 ns cycle time), and delivers synchronized echo clocks (CQ/CQ#) for precise data valid window alignment in high-speed memory subsystems used in network packet buffers and FPGA co-processor caches.

For engineers reviewing the UPD44164362BF5-E40-EQ3 datasheet, UPD44164362BF5-E40-EQ3 pinout, UPD44164362BF5-E40-EQ3 application, or UPD44164362BF5-E40-EQ3 equivalent, this page provides verified DDR II SRAM specifications including burst timing, HSTL I/O compliance, user-programmable output impedance (35–70 Ω), clock-stop recovery (20 μs), and JTAG 1149.1 test access - all confirmed for the exact 512K × 36 organization and 165-pin plastic BGA package.

Technical Context

This device implements a synchronous DDR architecture with dual input clocks (K/K#) latching address/control on K's rising edge and data on both K and K# edges. Its internal PLL generates tightly matched C/C# and CQ/CQ# outputs to minimize flight-time skew and enable deterministic data capture at receiving logic.

The memory uses a 2-word linear burst mode with A0 controlling burst start address, and integrates byte-write enable (BW0#–BW3#) for selective 9-bit writes across four data groups. All I/Os comply with JEDEC HSTL Class I standards, and output impedance is calibrated via ZQ pin using an external resistor to ground.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 524,288 words × 36 bits (18 Mbit total); enables wide-data-path buffering without external depth expansion
Clock Frequency 250 MHz (4.0 ns cycle time); validated for stable operation across 0°C to 70°C ambient range
Supply Voltage VDD = 1.8 ± 0.1 V; VDDQ = 1.4–1.8 V; separate I/O supply allows optimized signal integrity
Interface Standard HSTL Class I compliant I/Os; meets JEDEC JESD8-15A for 1.5 V/1.8 V systems with VREF = VDDQ/2
Burst Mode Fixed 2-word linear burst; A0 selects starting address within burst, reducing address bus toggling
Output Impedance User-programmable 35–70 Ω via ZQ pin; matches typical PCB trace impedances without external termination
PLL Lock Time 20 μs after stable clock applied; ensures deterministic timing startup for synchronous system initialization

Pinout & Package

Package: 165-pin plastic BGA (13 × 15 mm, 0.8 mm pitch), lead-free, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
K, K# Input clock pair Latches all address, control, and write data on rising edges; 180° phase relationship required for DDR timing
C, C# Output clock pair Provides user-tunable timing reference for output data; fixed HIGH if K/K# used as reference
CQ, CQ# Echo clock outputs Tightly matched to DQ valid/hold windows (±0.1 ns); enables receiver-side data capture without additional delay compensation
DQ0–DQ35 Synchronous data I/O 36-bit bidirectional bus; registered on K/K# for writes, driven on C/C# or K/K# for reads per configuration
BW0#–BW3# Byte write enables Four active-low signals selecting 9-bit subwords (DQ0–8, DQ9–17, DQ18–26, DQ27–35) during WRITE cycles
ZQ Impedance calibration input Connects to external resistor to ground; sets DQ/CQ/CQ# output drive strength to 0.2 × RQ
DLL# PLL disable Pull LOW to bypass PLL for low-frequency debug; normal operation requires HIGH (tied to VDDQ)
TCK, TMS, TDI, TDO JTAG 1149.1 interface 1.8 V I/O level test access port; TCK must be tied to VSS if unused

Key Features

Feature Design Value
Pipelined DDR operation Enables concurrent address setup and data transfer across two consecutive clock edges, increasing effective bandwidth
Two-tick burst mode Minimizes transaction overhead for small data transfers; reduces bus arbitration latency in real-time packet processing
Internally self-timed write control Eliminates external write pulse generation; simplifies controller logic and guarantees write completion timing
Clock-stop capability Enters low-power state with 20 μs recovery; supports dynamic power gating in burst-oriented traffic patterns
JTAG 1149.1 test access Enables boundary-scan testing of SRAM interconnects without functional access; supports production test and debug

Applications

Network Packet Buffer FPGA Co-Processor Cache

Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches before forwarding decisions.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency DDR II SRAM providing 250 MHz burst read/write for frame header inspection and rewrite.

Use Value: 36-bit width matches common packet header sizes; echo clocks (CQ/CQ#) eliminate board-level timing margin uncertainty.

Use Scenario: Acting as local scratchpad memory between FPGA fabric and external DDR3 controller in AI inference accelerators.

IC Role / Device Role / Timing Role: Synchronous burst buffer decoupling variable-latency DRAM accesses from deterministic FPGA pipeline stages.

Use Value: 2-word burst and HSTL interface reduce controller complexity; clock-stop mode lowers average power during idle cycles.

Telecom Line Card Memory Industrial Motion Controller Buffer

Use Scenario: Holding real-time voice sample streams and protocol overhead data in VoIP gateways.

IC Role / Device Role / Timing Role: DDR II SRAM delivering jitter-free 250 MHz data delivery synchronized to telecom timing references.

Use Value: PLL-based C/C# outputs match flight time to downstream DSP; ZQ calibration maintains signal integrity across temperature.

Use Scenario: Buffering position feedback and motion command data in closed-loop servo drives with microsecond response requirements.

IC Role / Device Role / Timing Role: Deterministic-access memory supporting hard real-time interrupt servicing without cache misses.

Use Value: Self-timed write control guarantees write completion within one clock cycle; no external timing constraints on host interface.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1551KV18-250BZI 512K × 36, 250 MHz, 1.8 V core, but uses SSTL-2 I/O (not HSTL); no ZQ calibration or echo clocks Requires external termination resistors and lacks CQ/CQ# for flight-time matching; less suitable for long-trace backplanes Select when existing board design already uses SSTL-2 infrastructure and timing margins allow manual skew compensation
IS42S32400F-6BL SDRAM (not SRAM), 1M × 32, 166 MHz, 3.3 V; asynchronous refresh, higher latency, no burst-2 mode Not pin-compatible; requires full memory controller redesign; unsuitable for deterministic low-latency use cases Consider only for cost-sensitive, non-real-time applications where refresh overhead and variable latency are acceptable

Compared with CY7C1551KV18-250BZI and IS42S32400F-6BL, UPD44164362BF5-E40-EQ3 uniquely combines HSTL I/O, on-die impedance tuning, and echo-clock timing - enabling robust 250 MHz operation in thermally varying, high-density PCB layouts without layout-level timing closure effort.

Availability

UPD44164362BF5-E40-EQ3 is available at Aetrix Electronics and suitable for network packet buffers, FPGA co-processor caches, and telecom line card memory requiring stable component supply, guaranteed lead-free packaging, and long-term industrial temperature support.

Supply support for UPD44164362BF5-E40-EQ3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.

The UPD44164362BF5-E40-EQ3 belongs to Renesas' DDR II SRAM product line, designed specifically for high-speed, low-latency buffering in synchronous digital systems where deterministic timing, HSTL compatibility, and minimal controller overhead are critical.

FAQ

What is the operating temperature range for UPD44164362BF5-E40-EQ3?

The UPD44164362BF5-E40-EQ3 is rated for 0°C to 70°C ambient operation (industrial grade). Its ordering suffix "EQ3" confirms this temperature range, distinct from the "EQ3Y" variant rated for −40°C to +85°C. Electrical characteristics including IDD, ISB1, and AC timing parameters are fully specified across this range.

Does UPD44164362BF5-E40-EQ3 support true DDR data rates or single-data-rate operation?

UPD44164362BF5-E40-EQ3 is a true double data rate (DDR) SRAM: it transfers data on both rising edges of K and K#, achieving 500 MT/s effective throughput at 250 MHz clock. Its architecture mandates DDR timing - it does not support single-data-rate operation. The device requires strict 180° phase alignment between K and K#.

How is output impedance calibrated on UPD44164362BF5-E40-EQ3?

Output impedance on UPD44164362BF5-E40-EQ3 is calibrated via the ZQ pin, which connects to an external resistor (RQ) to ground. The device sets DQ, CQ, and CQ# output drive strength to 0.2 × RQ, yielding 35–70 Ω range. Calibration occurs automatically every 20 μs after power-up and tracks voltage/temperature drift.

Can UPD44164362BF5-E40-EQ3 operate without its PLL enabled?

Yes - pulling DLL# LOW disables the PLL, allowing operation at frequencies below 120 MHz using K/K# directly as timing references. However, AC/DC characteristics are not guaranteed in this mode, read latency changes to 1.0 clock cycle, and echo clock (CQ/CQ#) accuracy degrades. For full specification compliance, DLL# must be HIGH.

What is the function of CQ and CQ# pins on UPD44164362BF5-E40-EQ3?

CQ and CQ# are synchronous echo clock outputs tightly matched (±0.1 ns) to DQ valid/hold windows. They provide a receiver-side timing reference that eliminates flight-time skew between clock and data, enabling reliable capture without board-level delay tuning. Unlike C/C#, CQ/CQ# remain active even when DQ tristates.

UPD44164362BF5-E40-EQ3 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
-
Memory Format:
-
Technology:
-
Memory Size:
-
Memory Organization:
-
Memory Interface:
-
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

UPD44164362BF5-E40-EQ3 FAQ

1.How can I place an order for UPD44164362BF5-E40-EQ3 through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD44164362BF5-E40-EQ3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD44164362BF5-E40-EQ3 reliable?

The price and inventory of UPD44164362BF5-E40-EQ3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44164362BF5-E40-EQ3 is usually 5 days.

3.What payment methods are accepted for UPD44164362BF5-E40-EQ3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD44164362BF5-E40-EQ3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UPD44164362BF5-E40-EQ3?

UPD44164362BF5-E40-EQ3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD44164362BF5-E40-EQ3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD44164362BF5-E40-EQ3?

For technical support, including UPD44164362BF5-E40-EQ3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44164362BF5-E40-EQ3 requirements.

6.How does Aetrix verify that UPD44164362BF5-E40-EQ3 is sourced from the original manufacturer or authorized distributors?

All UPD44164362BF5-E40-EQ3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44164362BF5-E40-EQ3 meets industry standards.

7.What is the process for return or replacement of UPD44164362BF5-E40-EQ3?

All UPD44164362BF5-E40-EQ3 units undergo pre-shipment inspection (PSI). If there is an issue with UPD44164362BF5-E40-EQ3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD44164362BF5-E40-EQ3 part is unused and in its original packaging.

Return procedure for UPD44164362BF5-E40-EQ3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

UPD44164362BF5-E40-EQ3 Tags

  • UPD44164362BF5-E40-EQ3
  • UPD44164362BF5-E40-EQ3 PDF
  • UPD44164362BF5-E40-EQ3 Datasheet
  • UPD44164362BF5-E40-EQ3 Specifications
  • UPD44164362BF5-E40-EQ3 Images
  • Renesas
  • Renesas UPD44164362BF5-E40-EQ3
  • Buy UPD44164362BF5-E40-EQ3
  • UPD44164362BF5-E40-EQ3 Price
  • UPD44164362BF5-E40-EQ3 Distributor
  • UPD44164362BF5-E40-EQ3 Supplier
  • UPD44164362BF5-E40-EQ3 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER