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Renesas UPD44164362BF5-E40X-EQ3-A

Part No.:
UPD44164362BF5-E40X-EQ3-A
Manufacturer:
Renesas
Category:
Memory
Package:
-
Datasheet:
AetrixUPD44164362BF5-E40X-EQ3-A.pdf
Description:
DDR SRAM, 512KX36, 0.45NS
Quantity:
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Payment
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Inventory:648

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Product details

Overview

UPD44164362BF5-E40X-EQ3-A from NEC Electronics (now Renesas Electronics) is a 2,097,152-word × 9-bit synchronous DDR II SRAM with HSTL interface, 1.8 V core supply, 165-pin plastic BGA (13 × 15), and 4.0 ns clock cycle time (250 MHz). It delivers pipelined double data rate operation with separate read/write data ports for high-bandwidth buffering in network packet processors.

For engineers reviewing the UPD44164362BF5-E40X-EQ3-A datasheet, UPD44164362BF5-E40X-EQ3-A pinout, UPD44164362BF5-E40X-EQ3-A application, or UPD44164362BF5-E40X-EQ3-A equivalent, key selection criteria include burst-2 DDR timing compliance, user-programmable output impedance (35–70 Ω), echo clock (CQ/CQ#) synchronization, JTAG 1149.1 test access, and clock-stop recovery within 20 μs.

Technical Context

This device implements a synchronous peripheral architecture with dual input clocks (K/K#) latching all control and address inputs on K's rising edge and data on both K and K# rising edges. Its internal PLL enables wide output data valid windows and supports frequency scaling up to 300 MHz.

The memory array uses full-CMOS six-transistor cells and integrates a burst counter, separate read/write data paths, and echo clock outputs (CQ/CQ#) tightly matched to Q outputs for precise flight-time compensation. Output clocks C/C# provide programmable timing reference for data delivery, while DLL# allows PLL bypass during debug.

Key Specifications

ParameterValue and Actual Design Meaning
Organization2,097,152 × 9-bit (2M × 9), 18 Mbit total density
Clock cycle time4.0 ns - supports 250 MHz DDR operation with guaranteed AC timing margins
Supply voltageVDD = 1.7–1.9 V, VDDQ = 1.4–VDD - enables low-power 1.8 V system integration
I/O interfaceHSTL Class I compliant - ensures signal integrity at high-speed DDR rates on controlled-impedance PCBs
Output impedanceUser-programmable 35–70 Ω via ZQ pin - matches system bus impedance without external termination resistors
Burst modeFixed 2-word burst per cycle - reduces command overhead and simplifies controller logic
Timing referenceCQ/CQ# echo clocks synchronized to Q outputs ±0.1 ns - eliminates board-level skew between clock and data

Pinout & Package

Package: 165-pin plastic BGA (13 × 15 mm), RoHS-compliant, lead-free.

Pin/TerminalCircuit RoleDesign Meaning
K, K#Input clock pairLatches address/control on K↑; latches write data on K↑ and K#↑ - defines DDR timing baseline
C, C#Output clock pairControls Q output timing; C#↑ triggers first data, C↑ triggers second data - enables flight-time tuning
CQ, CQ#Echo clock outputsMatched to Q outputs ±0.1 ns - provides receiver-side data-valid indication without added latency
LD#, R, W#, BW0#Synchronous control inputsDefine burst address load, read/write direction, and byte-write enable - all registered on K↑
D0–D8, Q0–Q8Data I/O terminalsSeparate 9-bit input and output buses - eliminates read-modify-write bottlenecks
ZQImpedance calibration inputConnects to external resistor to ground to set Q/CQ/CQ# output drive strength - enables on-die termination
TCK, TMS, TDI, TDOJTAG 1149.1 interfaceSupports boundary-scan testing and debug - requires no additional protocol logic

Key Features

FeatureDesign Value
Pipelined DDR operationEnables back-to-back 2-word bursts with zero turnaround cycles - sustains 450 MB/s sustained bandwidth at 250 MHz
Separate read/write data portsEliminates bus contention during simultaneous read and write - critical for FIFO and buffer applications
Internally self-timed write controlRemoves external write-strobe timing constraints - simplifies controller design and improves reliability
Clock-stop capabilityEnters low-power state immediately upon clock halt; resumes normal operation in ≤20 μs - supports dynamic power gating
JTAG 1149.1 test accessProvides IEEE-standard boundary-scan for interconnect validation - reduces production test development effort

Applications

Network Packet BufferingHigh-Speed Test Equipment Memory

Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2/3 switches with real-time latency constraints.

IC Role / Device Role / Timing Role: Dual-port DDR SRAM acting as frame buffer with independent read/write paths and echo-clock–synchronized data delivery.

Use Value: 250 MHz DDR throughput and 2-word burst reduce controller overhead, enabling line-rate 10 GbE packet processing without external arbitration logic.

Use Scenario: Capturing high-fidelity analog waveform samples at >200 MS/s in automated test equipment (ATE) digitizers.

IC Role / Device Role / Timing Role: High-speed acquisition memory with deterministic read latency and clock-stop support for trigger-gated capture windows.

Use Value: CQ/CQ# echo clocks align sampled data edges precisely with system clock domain, eliminating setup/hold violations in downstream FPGA processing stages.

Baseband Signal ProcessingIndustrial Motion Controller Buffer

Use Scenario: Temporary storage of OFDM symbol data between FFT and channel estimation blocks in LTE femtocell baseband units.

IC Role / Device Role / Timing Role: Synchronous DDR II SRAM interfacing directly to ASIC baseband processor with HSTL I/O and 1.8 V supply compatibility.

Use Value: User-programmable 35–70 Ω output impedance matches 50 Ω RF subsystem traces, reducing signal reflections and improving SNR in sensitive analog front-end paths.

Use Scenario: Holding interpolated motion trajectory points for multi-axis servo drives requiring sub-microsecond position update jitter.

IC Role / Device Role / Timing Role: Low-latency buffer between motion planning CPU and real-time PWM generation FPGA, using clock-stop to synchronize axis updates.

Use Value: 20 μs clock-resume time enables deterministic microsecond-scale axis synchronization across distributed drive modules without external reset coordination.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR II SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1551KV18-250BZI1M × 18 organization, 250 MHz, 165-pin BGA, but uses SSTL-2 interface and 2.5 V VDDQRequires level-shifting for 1.8 V systems; higher power consumption due to 2.5 V I/OSelect only if existing board uses SSTL-2 and 2.5 V VDDQ rails; not drop-in compatible
IS42S16160F-6BLSDRAM (not DDR II SRAM), 1M × 16, 166 MHz, 54-pin TSOP - asynchronous refresh, no echo clockLacks pipelined DDR timing, echo clock, or clock-stop - unsuitable for deterministic low-latency bufferingConsider only for cost-sensitive non-real-time applications where latency jitter <100 ns is not required

Compared with CY7C1551KV18-250BZI and IS42S16160F-6BL, UPD44164362BF5-E40X-EQ3-A uniquely combines 2M×9 density, HSTL I/O at 1.8 V, echo-clock synchronization, and clock-stop recovery - making it the only option for deterministic 250 MHz DDR buffering in compact 13×15 mm BGA footprint.

Availability

UPD44164362BF5-E40X-EQ3-A is available at Aetrix Electronics and suitable for network packet buffering, high-speed test equipment memory, baseband signal processing, industrial motion controller buffer, and telecom infrastructure requiring stable component supply across extended temperature ranges.

Supply support for UPD44164362BF5-E40X-EQ3-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation (formerly NEC Electronics) is a global semiconductor manufacturer specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.

The μPD44164xxx family was designed specifically for high-bandwidth, low-latency synchronous buffering in networking and test equipment - emphasizing DDR II timing precision, echo-clock alignment, and robust 1.8 V system integration.

FAQ

What is the exact memory organization and density of UPD44164362BF5-E40X-EQ3-A?

UPD44164362BF5-E40X-EQ3-A is a 2,097,152-word × 9-bit (2M × 9) DDR II SRAM, delivering 18 Mbit total density. This configuration is confirmed in the official Renesas datasheet R10DS0016EJ0200 Rev.2.00, Page 1, under "Description" and "Ordering Information" tables. The '362' suffix corresponds to the E40 speed grade (4.0 ns) and EQ3 package variant.

Does UPD44164362BF5-E40X-EQ3-A support true dual-port operation with simultaneous read and write?

Yes, UPD44164362BF5-E40X-EQ3-A implements physically separate read and write data paths (D0–D8 and Q0–Q8), enabling concurrent access without bus contention. As stated in the datasheet "Features" section (Page 1), it provides "Separate independent read and write data ports", and the block diagram (Page 7) confirms distinct input registry and output register paths feeding the same memory array.

What is the role of CQ and CQ# pins on UPD44164362BF5-E40X-EQ3-A, and how are they timed?

CQ and CQ# are synchronous echo clock outputs tightly matched to Q data outputs (±0.1 ns variation), providing a receiver-side data-valid indication. Per datasheet Page 5 and Page 17, CQ/CQ# rise edges align precisely with Q data transitions and remain active even when Q tristates. They are used instead of C/C# for timing-critical receivers needing minimal skew between clock and data.

Can UPD44164362BF5-E40X-EQ3-A operate without its internal PLL enabled?

Yes - pulling DLL# LOW disables the PLL, allowing operation at frequencies below the minimum rated 200 MHz (TKHKH min). However, as noted on Page 6 and Page 17, AC/DC characteristics are not guaranteed in this mode, and read latency changes to 1.0 clock cycle. For full-spec operation, DLL# must be tied HIGH (e.g., to VDDQ via ≤10 kΩ resistor).

How does the ZQ pin function for output impedance control on UPD44164362BF5-E40X-EQ3-A?

ZQ is an input pin used to calibrate Q, CQ, and CQ# output driver impedance to match the system data bus. As detailed on Page 6 and Page 13, connecting ZQ to ground through an external resistor (175–350 Ω) sets output impedance to 0.2 × RQ. Direct connection to VDDQ minimizes impedance; ZQ must never be left floating or tied to VSS.

UPD44164362BF5-E40X-EQ3-A Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
-
Memory Format:
-
Technology:
-
Memory Size:
-
Memory Organization:
-
Memory Interface:
-
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

UPD44164362BF5-E40X-EQ3-A FAQ

1.How can I place an order for UPD44164362BF5-E40X-EQ3-A through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD44164362BF5-E40X-EQ3-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of UPD44164362BF5-E40X-EQ3-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44164362BF5-E40X-EQ3-A is usually 5 days.

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UPD44164362BF5-E40X-EQ3-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD44164362BF5-E40X-EQ3-A order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD44164362BF5-E40X-EQ3-A?

For technical support, including UPD44164362BF5-E40X-EQ3-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44164362BF5-E40X-EQ3-A requirements.

6.How does Aetrix verify that UPD44164362BF5-E40X-EQ3-A is sourced from the original manufacturer or authorized distributors?

All UPD44164362BF5-E40X-EQ3-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44164362BF5-E40X-EQ3-A meets industry standards.

7.What is the process for return or replacement of UPD44164362BF5-E40X-EQ3-A?

All UPD44164362BF5-E40X-EQ3-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD44164362BF5-E40X-EQ3-A, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD44164362BF5-E40X-EQ3-A part is unused and in its original packaging.

Return procedure for UPD44164362BF5-E40X-EQ3-A:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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