Renesas UPD44164362BF5-E40X-EQ3-A
- Part No.:
- UPD44164362BF5-E40X-EQ3-A
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
UPD44164362BF5-E40X-EQ3-A.pdf
- Description:
- DDR SRAM, 512KX36, 0.45NS
- Quantity:
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Inventory:648
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Product details
Overview
UPD44164362BF5-E40X-EQ3-A from NEC Electronics (now Renesas Electronics) is a 2,097,152-word × 9-bit synchronous DDR II SRAM with HSTL interface, 1.8 V core supply, 165-pin plastic BGA (13 × 15), and 4.0 ns clock cycle time (250 MHz). It delivers pipelined double data rate operation with separate read/write data ports for high-bandwidth buffering in network packet processors.
For engineers reviewing the UPD44164362BF5-E40X-EQ3-A datasheet, UPD44164362BF5-E40X-EQ3-A pinout, UPD44164362BF5-E40X-EQ3-A application, or UPD44164362BF5-E40X-EQ3-A equivalent, key selection criteria include burst-2 DDR timing compliance, user-programmable output impedance (35–70 Ω), echo clock (CQ/CQ#) synchronization, JTAG 1149.1 test access, and clock-stop recovery within 20 μs.
Technical Context
This device implements a synchronous peripheral architecture with dual input clocks (K/K#) latching all control and address inputs on K's rising edge and data on both K and K# rising edges. Its internal PLL enables wide output data valid windows and supports frequency scaling up to 300 MHz.
The memory array uses full-CMOS six-transistor cells and integrates a burst counter, separate read/write data paths, and echo clock outputs (CQ/CQ#) tightly matched to Q outputs for precise flight-time compensation. Output clocks C/C# provide programmable timing reference for data delivery, while DLL# allows PLL bypass during debug.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Organization | 2,097,152 × 9-bit (2M × 9), 18 Mbit total density |
| Clock cycle time | 4.0 ns - supports 250 MHz DDR operation with guaranteed AC timing margins |
| Supply voltage | VDD = 1.7–1.9 V, VDDQ = 1.4–VDD - enables low-power 1.8 V system integration |
| I/O interface | HSTL Class I compliant - ensures signal integrity at high-speed DDR rates on controlled-impedance PCBs |
| Output impedance | User-programmable 35–70 Ω via ZQ pin - matches system bus impedance without external termination resistors |
| Burst mode | Fixed 2-word burst per cycle - reduces command overhead and simplifies controller logic |
| Timing reference | CQ/CQ# echo clocks synchronized to Q outputs ±0.1 ns - eliminates board-level skew between clock and data |
Pinout & Package
Package: 165-pin plastic BGA (13 × 15 mm), RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| K, K# | Input clock pair | Latches address/control on K↑; latches write data on K↑ and K#↑ - defines DDR timing baseline |
| C, C# | Output clock pair | Controls Q output timing; C#↑ triggers first data, C↑ triggers second data - enables flight-time tuning |
| CQ, CQ# | Echo clock outputs | Matched to Q outputs ±0.1 ns - provides receiver-side data-valid indication without added latency |
| LD#, R, W#, BW0# | Synchronous control inputs | Define burst address load, read/write direction, and byte-write enable - all registered on K↑ |
| D0–D8, Q0–Q8 | Data I/O terminals | Separate 9-bit input and output buses - eliminates read-modify-write bottlenecks |
| ZQ | Impedance calibration input | Connects to external resistor to ground to set Q/CQ/CQ# output drive strength - enables on-die termination |
| TCK, TMS, TDI, TDO | JTAG 1149.1 interface | Supports boundary-scan testing and debug - requires no additional protocol logic |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined DDR operation | Enables back-to-back 2-word bursts with zero turnaround cycles - sustains 450 MB/s sustained bandwidth at 250 MHz |
| Separate read/write data ports | Eliminates bus contention during simultaneous read and write - critical for FIFO and buffer applications |
| Internally self-timed write control | Removes external write-strobe timing constraints - simplifies controller design and improves reliability |
| Clock-stop capability | Enters low-power state immediately upon clock halt; resumes normal operation in ≤20 μs - supports dynamic power gating |
| JTAG 1149.1 test access | Provides IEEE-standard boundary-scan for interconnect validation - reduces production test development effort |
Applications
| Network Packet Buffering | High-Speed Test Equipment Memory |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2/3 switches with real-time latency constraints. IC Role / Device Role / Timing Role: Dual-port DDR SRAM acting as frame buffer with independent read/write paths and echo-clock–synchronized data delivery. Use Value: 250 MHz DDR throughput and 2-word burst reduce controller overhead, enabling line-rate 10 GbE packet processing without external arbitration logic. | Use Scenario: Capturing high-fidelity analog waveform samples at >200 MS/s in automated test equipment (ATE) digitizers. IC Role / Device Role / Timing Role: High-speed acquisition memory with deterministic read latency and clock-stop support for trigger-gated capture windows. Use Value: CQ/CQ# echo clocks align sampled data edges precisely with system clock domain, eliminating setup/hold violations in downstream FPGA processing stages. |
| Baseband Signal Processing | Industrial Motion Controller Buffer |
Use Scenario: Temporary storage of OFDM symbol data between FFT and channel estimation blocks in LTE femtocell baseband units. IC Role / Device Role / Timing Role: Synchronous DDR II SRAM interfacing directly to ASIC baseband processor with HSTL I/O and 1.8 V supply compatibility. Use Value: User-programmable 35–70 Ω output impedance matches 50 Ω RF subsystem traces, reducing signal reflections and improving SNR in sensitive analog front-end paths. | Use Scenario: Holding interpolated motion trajectory points for multi-axis servo drives requiring sub-microsecond position update jitter. IC Role / Device Role / Timing Role: Low-latency buffer between motion planning CPU and real-time PWM generation FPGA, using clock-stop to synchronize axis updates. Use Value: 20 μs clock-resume time enables deterministic microsecond-scale axis synchronization across distributed drive modules without external reset coordination. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1551KV18-250BZI | 1M × 18 organization, 250 MHz, 165-pin BGA, but uses SSTL-2 interface and 2.5 V VDDQ | Requires level-shifting for 1.8 V systems; higher power consumption due to 2.5 V I/O | Select only if existing board uses SSTL-2 and 2.5 V VDDQ rails; not drop-in compatible |
| IS42S16160F-6BL | SDRAM (not DDR II SRAM), 1M × 16, 166 MHz, 54-pin TSOP - asynchronous refresh, no echo clock | Lacks pipelined DDR timing, echo clock, or clock-stop - unsuitable for deterministic low-latency buffering | Consider only for cost-sensitive non-real-time applications where latency jitter <100 ns is not required |
Compared with CY7C1551KV18-250BZI and IS42S16160F-6BL, UPD44164362BF5-E40X-EQ3-A uniquely combines 2M×9 density, HSTL I/O at 1.8 V, echo-clock synchronization, and clock-stop recovery - making it the only option for deterministic 250 MHz DDR buffering in compact 13×15 mm BGA footprint.
Availability
UPD44164362BF5-E40X-EQ3-A is available at Aetrix Electronics and suitable for network packet buffering, high-speed test equipment memory, baseband signal processing, industrial motion controller buffer, and telecom infrastructure requiring stable component supply across extended temperature ranges.
Supply support for UPD44164362BF5-E40X-EQ3-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation (formerly NEC Electronics) is a global semiconductor manufacturer specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.
The μPD44164xxx family was designed specifically for high-bandwidth, low-latency synchronous buffering in networking and test equipment - emphasizing DDR II timing precision, echo-clock alignment, and robust 1.8 V system integration.
FAQ
What is the exact memory organization and density of UPD44164362BF5-E40X-EQ3-A?
UPD44164362BF5-E40X-EQ3-A is a 2,097,152-word × 9-bit (2M × 9) DDR II SRAM, delivering 18 Mbit total density. This configuration is confirmed in the official Renesas datasheet R10DS0016EJ0200 Rev.2.00, Page 1, under "Description" and "Ordering Information" tables. The '362' suffix corresponds to the E40 speed grade (4.0 ns) and EQ3 package variant.
Does UPD44164362BF5-E40X-EQ3-A support true dual-port operation with simultaneous read and write?
Yes, UPD44164362BF5-E40X-EQ3-A implements physically separate read and write data paths (D0–D8 and Q0–Q8), enabling concurrent access without bus contention. As stated in the datasheet "Features" section (Page 1), it provides "Separate independent read and write data ports", and the block diagram (Page 7) confirms distinct input registry and output register paths feeding the same memory array.
What is the role of CQ and CQ# pins on UPD44164362BF5-E40X-EQ3-A, and how are they timed?
CQ and CQ# are synchronous echo clock outputs tightly matched to Q data outputs (±0.1 ns variation), providing a receiver-side data-valid indication. Per datasheet Page 5 and Page 17, CQ/CQ# rise edges align precisely with Q data transitions and remain active even when Q tristates. They are used instead of C/C# for timing-critical receivers needing minimal skew between clock and data.
Can UPD44164362BF5-E40X-EQ3-A operate without its internal PLL enabled?
Yes - pulling DLL# LOW disables the PLL, allowing operation at frequencies below the minimum rated 200 MHz (TKHKH min). However, as noted on Page 6 and Page 17, AC/DC characteristics are not guaranteed in this mode, and read latency changes to 1.0 clock cycle. For full-spec operation, DLL# must be tied HIGH (e.g., to VDDQ via ≤10 kΩ resistor).
How does the ZQ pin function for output impedance control on UPD44164362BF5-E40X-EQ3-A?
ZQ is an input pin used to calibrate Q, CQ, and CQ# output driver impedance to match the system data bus. As detailed on Page 6 and Page 13, connecting ZQ to ground through an external resistor (175–350 Ω) sets output impedance to 0.2 × RQ. Direct connection to VDDQ minimizes impedance; ZQ must never be left floating or tied to VSS.
UPD44164362BF5-E40X-EQ3-A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
UPD44164362BF5-E40X-EQ3-A FAQ
1.How can I place an order for UPD44164362BF5-E40X-EQ3-A through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD44164362BF5-E40X-EQ3-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD44164362BF5-E40X-EQ3-A reliable?
The price and inventory of UPD44164362BF5-E40X-EQ3-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44164362BF5-E40X-EQ3-A is usually 5 days.
3.What payment methods are accepted for UPD44164362BF5-E40X-EQ3-A?
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD44164362BF5-E40X-EQ3-A?
For technical support, including UPD44164362BF5-E40X-EQ3-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44164362BF5-E40X-EQ3-A requirements.
6.How does Aetrix verify that UPD44164362BF5-E40X-EQ3-A is sourced from the original manufacturer or authorized distributors?
All UPD44164362BF5-E40X-EQ3-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44164362BF5-E40X-EQ3-A meets industry standards.
7.What is the process for return or replacement of UPD44164362BF5-E40X-EQ3-A?
All UPD44164362BF5-E40X-EQ3-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD44164362BF5-E40X-EQ3-A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD44164362BF5-E40X-EQ3-A part is unused and in its original packaging.
Return procedure for UPD44164362BF5-E40X-EQ3-A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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