Renesas UPD44165084BF5-E40-EQ3
- Part No.:
- UPD44165084BF5-E40-EQ3
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
UPD44165084BF5-E40-EQ3.pdf
- Description:
- QDR SRAM, 2MX8, 0.45NS
- Quantity:
- Payment:

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Product details
Overview
UPD44165084BF5-E40-EQ3 from Renesas Electronics is a 2,097,152-word × 8-bit synchronous quad data rate (QDR II) SRAM with 4-word burst operation, 1.8 V core supply, HSTL interface, and 165-pin plastic BGA (13 × 15) packaging. It delivers 250 MHz clock frequency (4.0 ns cycle time), supports concurrent read/write ports, and is used in high-bandwidth networking buffers and packet memory applications.
For engineers reviewing the UPD44165084BF5-E40-EQ3 datasheet, UPD44165084BF5-E40-EQ3 pinout, UPD44165084BF5-E40-EQ3 application, or UPD44165084BF5-E40-EQ3 equivalent, key selection considerations include its QDR II timing architecture, dual-clock (K/K# and C/C#) synchronization, user-programmable output impedance (35–70 Ω), clock-stop capability (20 μs recovery), and JTAG 1149.1 test access.
Technical Context
The UPD44165084BF5-E40-EQ3 implements a true QDR II architecture with separate, independent read and write data paths enabling simultaneous transactions. Its internal burst counter and synchronous peripheral circuitry register all inputs on the rising edge of K and K#, while output data is synchronized to C and C# rising edges for precise flight-time matching.
It integrates a PLL for wide output data valid window and future frequency scaling, supports four-tick burst addressing to reduce address bus frequency, and features internally self-timed write control with clock-stop mode that restores normal operation within 20 μs after clock resumption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 2,097,152 words × 8 bits (16 Mbit total capacity) |
| Clock Frequency | 250 MHz - enables 500 MT/s effective data rate per data line |
| Cycle Time | 4.0 ns - defines minimum clock period for reliable DDR read/write operations |
| Supply Voltage | VDD = 1.7–1.9 V, VDDQ = 1.4–VDD V - supports low-power 1.8 V system integration with isolated I/O rail |
| Interface Standard | HSTL Class I - ensures signal integrity at high speeds with controlled-impedance outputs |
| Operating Temperature | 0 °C to +70 °C - qualified for commercial-grade embedded and telecom infrastructure use |
| Package | 165-pin plastic BGA (13 mm × 15 mm) - provides high I/O density and thermal performance for dense PCB layouts |
Pinout & Package
UPD44165084BF5-E40-EQ3 is housed in a 165-pin plastic BGA (13 × 15 mm) package with standard ball pitch and land pattern per Renesas specification R10DS0018EJ0200. The package supports lead-free assembly and includes dedicated power/ground balls for noise suppression and impedance-controlled I/O routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| K, K# | Input clock pair | Registers address/control on K rising edge; registers input data on both K and K# rising edges (DDR) |
| C, C# | Output clock pair | Controls output timing reference: C# rising edge clocks first/third data, C rising edge clocks second/fourth data |
| R#, W# | Read and write command inputs | Active-low synchronous commands; mutually exclusive-read takes precedence if both asserted |
| NW0#, NW1# | Nibble write select | Enable selective writing of D0–D3 (NW1# low) or D4–D7 (NW0# low); both high disables write |
| D0–D7 | Data inputs | Synchronous 8-bit input bus registered on K/K# rising edges during WRITE cycles |
| Q0–Q7 | Data outputs | Synchronous 8-bit output bus delivered on C/C# rising edges during READ cycles |
| ZQ | Output impedance calibration input | Connects to external resistor to ground to set Q/CQ/CQ# output impedance to 0.2 × RQ (35–70 Ω range) |
| DLL# | PLL disable input | Pull HIGH for normal operation; pull LOW to bypass PLL for low-frequency debug (AC/DC specs not guaranteed) |
| TMS, TDI, TCK, TDO | JTAG 1149.1 test port | Fully compliant boundary-scan interface operating at 1.8 V I/O level |
| VREF | HSTL input reference | Provides VDDQ/2 reference for HSTL input buffers; must be decoupled per datasheet guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent read/write ports | Enables full-duplex memory access without arbitration delay-critical for packet buffering in switches/routers |
| Four-tick burst addressing | Reduces required address bus frequency by 4×, simplifying high-speed controller design and layout |
| User-programmable output impedance | 35–70 Ω tuning via ZQ pin eliminates need for external series termination resistors |
| Internally self-timed write control | Removes external write-strobe timing constraints-simplifies system-level timing closure |
| Clock-stop capability | Enters low-power state with 20 μs restart latency-supports dynamic power management in bursty traffic scenarios |
Applications
| High-Speed Network Packet Buffer | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet switches. IC Role / Device Role / Timing Role: QDR II SRAM serving as dual-port buffer with simultaneous read (forwarding engine) and write (ingress parser) access. Use Value: 250 MHz clock + 4-word burst delivers 2 Gbps sustained bandwidth per port-meets 10G/25G line-rate requirements. | Use Scenario: Frame buffering in SONET/SDH add-drop multiplexers and OTN transport equipment. IC Role / Device Role / Timing Role: High-reliability, low-latency memory for real-time cell/frame reassembly and jitter correction. Use Value: Clock-stop mode reduces standby current to 370 mA while preserving data-extends thermal margin in fanless chassis. |
| Baseband Processing Cache | Test Equipment Pattern Memory |
Use Scenario: Temporary storage of channelized IQ samples in LTE/5G massive MIMO baseband units. IC Role / Device Role / Timing Role: Burst-access memory interfaced to FPGA-based FFT engines and digital up/down converters. Use Value: HSTL I/O and 1.8 V supply ensure compatibility with modern FPGA I/O banks and low-noise power domains. | Use Scenario: Storing stimulus/response vectors in automated test equipment (ATE) for high-speed digital IC validation. IC Role / Device Role / Timing Role: Deterministic-latency memory providing synchronized read/write sequences under JTAG-controlled test patterns. Use Value: JTAG 1149.1 compliance enables in-system visibility and boundary-scan verification without additional test logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1722KV18-250BZI | 2M × 18 organization, 250 MHz, same 165-pin BGA but different pinout; requires redesign of address/data routing | Targets wider data-path systems (e.g., DSP co-processors); not drop-in for 8-bit interfaces | Select only when 18-bit bus width and higher density are required; verify layout compatibility |
| AS7C33256P-25JCIN | Asynchronous 32 Mbit SRAM, 25 ns access, 3.3 V supply, SOJ-44 package-no QDR, no burst, no DDR timing | Suitable for legacy control-plane memory where timing determinism is secondary to cost and simplicity | Choose only for non-critical, low-bandwidth subsystems; cannot replace UPD44165084BF5-E40-EQ3 in data-path roles |
Compared with CY7C1722KV18-250BZI and AS7C33256P-25JCIN, the UPD44165084BF5-E40-EQ3 uniquely delivers true concurrent QDR II operation at 250 MHz in an 8-bit configuration with HSTL signaling-making it irreplaceable for high-throughput, low-latency packet memory where dual-port bandwidth and precise timing alignment are mandatory.
Availability
UPD44165084BF5-E40-EQ3 is available at Aetrix Electronics and suitable for high-speed network packet buffering, telecom line card memory, and baseband processing cache requiring stable component supply across extended production lifecycles.
Supply support for UPD44165084BF5-E40-EQ3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The UPD44165084BF5-E40-EQ3 belongs to Renesas' QDR II SRAM product line, engineered specifically for deterministic, high-bandwidth memory applications in networking and communications equipment where dual-port concurrency and sub-5 ns timing precision are essential.
FAQ
What is the maximum clock frequency supported by the UPD44165084BF5-E40-EQ3?
The UPD44165084BF5-E40-EQ3 is rated for a maximum clock frequency of 250 MHz, corresponding to a 4.0 ns cycle time. This specification is validated under commercial temperature conditions (0 °C to +70 °C) with VDD = 1.8 V ± 0.1 V and meets all AC timing parameters defined in Renesas datasheet R10DS0018EJ0200 Rev.2.00. Operation beyond this frequency is not guaranteed.
Does the UPD44165084BF5-E40-EQ3 support true concurrent read and write operations?
Yes, the UPD44165084BF5-E40-EQ3 supports true concurrent read and write operations via physically separate data paths. During a single clock cycle, it can accept new write data on D0–D7 while simultaneously delivering previously requested read data on Q0–Q7-enabling full-duplex memory access critical for packet buffering and streaming applications.
How is output impedance calibrated on the UPD44165084BF5-E40-EQ3?
Output impedance on the UPD44165084BF5-E40-EQ3 is calibrated using the ZQ pin, which connects to an external resistor (RQ) tied to ground. The device sets Q, CQ, and CQ# output impedance to 0.2 × RQ, yielding a programmable range of 35–70 Ω. Calibration occurs automatically every 20 μs after power-up and tracks supply voltage and temperature drift.
Can the UPD44165084BF5-E40-EQ3 operate without its PLL enabled?
Yes-the UPD44165084BF5-E40-EQ3 can operate with its PLL disabled by pulling DLL# LOW. In this mode, the device functions at reduced clock frequencies below 120 MHz without PLL locking, but AC and DC electrical characteristics are not guaranteed. For full-spec operation at 250 MHz, DLL# must be held HIGH (e.g., tied to VDDQ via ≤10 kΩ resistor).
What is the purpose of the C and C# pins on the UPD44165084BF5-E40-EQ3?
The C and C# pins on the UPD44165084BF5-E40-EQ3 serve as user-controlled output clocks that define the timing reference for data output delivery. C# rising edge clocks the first and third data words; C rising edge clocks the second and fourth-enabling precise flight-time matching between clock and data signals at the receiving device, which is essential for high-speed DDR interfaces.
UPD44165084BF5-E40-EQ3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
UPD44165084BF5-E40-EQ3 FAQ
1.How can I place an order for UPD44165084BF5-E40-EQ3 through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD44165084BF5-E40-EQ3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD44165084BF5-E40-EQ3 reliable?
The price and inventory of UPD44165084BF5-E40-EQ3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44165084BF5-E40-EQ3 is usually 5 days.
3.What payment methods are accepted for UPD44165084BF5-E40-EQ3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD44165084BF5-E40-EQ3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UPD44165084BF5-E40-EQ3?
UPD44165084BF5-E40-EQ3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD44165084BF5-E40-EQ3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD44165084BF5-E40-EQ3?
For technical support, including UPD44165084BF5-E40-EQ3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44165084BF5-E40-EQ3 requirements.
6.How does Aetrix verify that UPD44165084BF5-E40-EQ3 is sourced from the original manufacturer or authorized distributors?
All UPD44165084BF5-E40-EQ3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44165084BF5-E40-EQ3 meets industry standards.
7.What is the process for return or replacement of UPD44165084BF5-E40-EQ3?
All UPD44165084BF5-E40-EQ3 units undergo pre-shipment inspection (PSI). If there is an issue with UPD44165084BF5-E40-EQ3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD44165084BF5-E40-EQ3 part is unused and in its original packaging.
Return procedure for UPD44165084BF5-E40-EQ3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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