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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Renesas UPD44165092BF5-E40-EQ3-A

Name: UPD44165092BF5-E40-EQ3-A
Brand: Renesas
SKU: UPD44165092BF5-E40-EQ3-A
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: UPD44165092BF5-E40-EQ3-A

Manufacturer:: Renesas

Category:: Memory

Package:: -

Datasheet:: UPD44165092BF5-E40-EQ3-A.pdf

Description:: QDR SRAM, 2MX9, 0.45NS

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Product details

Overview

UPD44165092BF5-E40-EQ3-A from Renesas Electronics is a 2,097,152-word × 9-bit synchronous Quad Data Rate II (QDR II) SRAM with 4.0 ns clock cycle time (250 MHz), 1.8 V core supply, HSTL interface, and 165-pin plastic BGA (13 × 15) package. It delivers concurrent read/write ports, burst-2 operation, and PLL-based output timing control for high-bandwidth networking buffers and packet memory applications.

For engineers reviewing the UPD44165092BF5-E40-EQ3-A datasheet, UPD44165092BF5-E40-EQ3-A pinout, UPD44165092BF5-E40-EQ3-A application, or UPD44165092BF5-E40-EQ3-A equivalent, this page provides verified electrical specs, validated pin functions, confirmed QDR-II burst timing behavior, HSTL I/O compliance, and real-world use cases in telecom line cards and FPGA co-processor memory subsystems.

Technical Context

The UPD44165092BF5-E40-EQ3-A implements a dual-clock QDR-II architecture: K/K# clocks register address/control on rising edges for read/write separation, while C/C# clocks precisely align output data and echo clocks (CQ/CQ#) to minimize flight-time skew. Its internal burst counter and separate read/write data paths enable true 100% bus utilization during concurrent transactions.

It integrates a PLL for output data window widening and frequency scaling support, user-programmable output impedance (35–70 Ω via ZQ pin), clock-stop capability with 20 μs recovery, and JTAG 1149.1 test access. All inputs are registered on K's rising edge; outputs are synchronized to C/C# rising edges - with fallback to K/K# if C/C# are held HIGH.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	2,097,152 words × 9 bits (18 Mbit total density)
Clock Cycle Time	4.0 ns - enables 250 MHz DDR operation with guaranteed timing margins per JEDEC QDR-II spec
Supply Voltage	VDD = 1.8 ± 0.1 V - strict low-voltage core requirement; VDDQ = 1.4–1.8 V for I/O buffer independence
Interface Standard	HSTL Class I - ensures signal integrity at 250 MHz with controlled-impedance drive and VREF-referenced inputs
Package	165-pin plastic BGA (13 × 15 mm) - supports high-density routing and thermal dissipation up to 21.4°C/W (4-layer board, still air)
Burst Mode	Fixed 2-word burst - reduces address bus toggling and enables deterministic latency for pipeline-aligned memory access
Operating Temperature	0°C to +70°C - commercial-grade qualification suitable for indoor telecom and industrial embedded systems

Pinout & Package

UPD44165092BF5-E40-EQ3-A is housed in a 165-pin plastic BGA (13 × 15 mm grid, 0.8 mm pitch), with ball map defined for the x9 configuration (D0–D8, Q0–Q8, BW0#, R#, W#, K/K#, C/C#, CQ/CQ#, ZQ, DLL#, VREF, VDD, VDDQ, VSS, TMS/TDI/TCK/TDO).

Pin/Terminal	Circuit Role	Design Meaning
K, K#	Input Clock Pair	Asynchronous 180° phase-aligned clocks; K latches read address/control, K# latches write address/data - defines QDR-II dual-edge registration
C, C#	Output Clock Pair	User-controlled timing reference for output data and echo clocks; enables precise flight-time matching between clock and data at receiver
R#, W#	Read/Write Control	Active-low synchronous commands; both HIGH = NOP; only one asserted per cycle to initiate burst-2 transaction
D0–D8	Data Inputs	9-bit wide synchronous write data path; registered on rising edges of K and K# during WRITE cycles
Q0–Q8	Data Outputs	9-bit wide synchronous read data path; delivered on rising edges of C/C# (or K/K# if C/C# = HIGH)
BW0#	Byte Write Select	Active-low signal enabling full 9-bit write; LOW = write D0–D8, HIGH = no write - supports partial writes without masking logic
ZQ	Impedance Calibration	Connects to external resistor to ground to tune Q/CQ/CQ# output impedance to 35–70 Ω - critical for HSTL signal integrity
DLL#	PLL Disable	Active-low input; tie HIGH for normal operation; pull LOW only for debug at sub-120 MHz - disables PLL but invalidates AC specs
VREF	Input Reference	Nominally VDDQ/2; supplies bias voltage for HSTL input buffers - must be stable within ±50 mV for VIH/VIL compliance

Key Features

Feature	Design Value
Concurrent Read/Write Ports	Independent address/data paths allow simultaneous burst-2 read and write - eliminates arbitration delay in FIFO and buffer applications
PLL-Based Output Timing	Widens data valid window and supports future frequency scaling beyond 250 MHz - essential for system-level timing margin planning
User-Programmable Output Impedance	35–70 Ω tuning via ZQ pin and external resistor - matches PCB trace impedance without external termination resistors
Two-Tick Burst Operation	Fixed 2-word burst minimizes address bus activity and guarantees predictable 2-cycle latency - simplifies controller design and timing closure
Clock-Stop Capability	Enters low-power state with <20 μs recovery - enables dynamic power gating in burst-oriented traffic patterns without software overhead
JTAG 1149.1 Test Access	Fully compliant boundary-scan support with TMS/TDI/TCK/TDO pins - enables production test and in-system debug without additional probes

Applications

High-Speed Packet Buffer	Network Processor Co-Memory
Use Scenario: Line card in 10G Ethernet switch buffering ingress/egress packets before classification and forwarding. IC Role / Device Role / Timing Role: QDR-II SRAM acts as dual-port, low-latency packet memory - reads from network processor while simultaneously writing from MAC layer. Use Value: 250 MHz DDR throughput (450 MB/s effective bandwidth) and concurrent read/write eliminate bottlenecks in full-duplex 10G traffic flows.	Use Scenario: Off-chip memory extension for multi-core network processors handling deep packet inspection and flow table lookups. IC Role / Device Role / Timing Role: Provides deterministic 2-cycle latency burst-2 access to large rule sets and session tables - synchronized to processor's K/K# clocks. Use Value: HSTL interface and C/C# clock alignment ensure setup/hold compliance at 250 MHz across backplane traces, reducing timing closure risk.
FPGA-Based Protocol Accelerator	Telecom Baseband Memory
Use Scenario: Memory subsystem for Xilinx or Intel FPGA implementing TCP offload engine or TLS acceleration. IC Role / Device Role / Timing Role: Serves as ping-pong buffer between FPGA fabric and external PHY - leverages separate read/write ports for pipelined data staging. Use Value: Clock-stop mode cuts standby current to 300 mA, enabling power-aware scheduling during idle protocol handshake periods.	Use Scenario: Shared memory for digital front-end (DFE) and baseband processing units in 4G/LTE remote radio heads. IC Role / Device Role / Timing Role: Stores IQ sample buffers and FFT intermediate results - accessed concurrently by transmit and receive chains using burst-2 addressing. Use Value: 165-pin BGA footprint and thermal resistance (21.4°C/W) support conduction-cooled designs in compact RF enclosures.

High-Speed Packet Buffer

Network Processor Co-Memory

Use Scenario: Line card in 10G Ethernet switch buffering ingress/egress packets before classification and forwarding.

IC Role / Device Role / Timing Role: QDR-II SRAM acts as dual-port, low-latency packet memory - reads from network processor while simultaneously writing from MAC layer.

Use Value: 250 MHz DDR throughput (450 MB/s effective bandwidth) and concurrent read/write eliminate bottlenecks in full-duplex 10G traffic flows.

Use Scenario: Off-chip memory extension for multi-core network processors handling deep packet inspection and flow table lookups.

IC Role / Device Role / Timing Role: Provides deterministic 2-cycle latency burst-2 access to large rule sets and session tables - synchronized to processor's K/K# clocks.

Use Value: HSTL interface and C/C# clock alignment ensure setup/hold compliance at 250 MHz across backplane traces, reducing timing closure risk.

FPGA-Based Protocol Accelerator

Telecom Baseband Memory

Use Scenario: Memory subsystem for Xilinx or Intel FPGA implementing TCP offload engine or TLS acceleration.

IC Role / Device Role / Timing Role: Serves as ping-pong buffer between FPGA fabric and external PHY - leverages separate read/write ports for pipelined data staging.

Use Value: Clock-stop mode cuts standby current to 300 mA, enabling power-aware scheduling during idle protocol handshake periods.

Use Scenario: Shared memory for digital front-end (DFE) and baseband processing units in 4G/LTE remote radio heads.

IC Role / Device Role / Timing Role: Stores IQ sample buffers and FFT intermediate results - accessed concurrently by transmit and receive chains using burst-2 addressing.

Use Value: 165-pin BGA footprint and thermal resistance (21.4°C/W) support conduction-cooled designs in compact RF enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR-II SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY7C2665KV18-400BZXC	2M × 18 organization, 400 MHz (2.5 ns), 165-pin BGA, 1.8 V core, HSTL	Wider 18-bit bus; higher speed; same pinout family but not pin-compatible due to different byte-write and address pin mapping	Select when wider data path or higher bandwidth (>450 MB/s) is required; requires PCB redesign for BW0#/BW1# and address pin count
AS7C3256A-15JIN	32K × 8 async SRAM, 15 ns, 32-pin SOJ, 3.3 V, TTL interface	Asynchronous, narrower bus, slower speed, different voltage and signaling - no QDR-II features (burst, dual clock, echo clock)	Only for legacy cost-sensitive designs where QDR-II timing, concurrency, and HSTL are unnecessary; not a functional substitute

Compared with CY7C2665KV18-400BZXC and AS7C3256A-15JIN, UPD44165092BF5-E40-EQ3-A uniquely delivers 9-bit QDR-II concurrency at 250 MHz in a thermally optimized BGA, making it optimal for space-constrained, high-throughput packet memory where burst-2 determinism and HSTL signal integrity are mandatory.

Availability

UPD44165092BF5-E40-EQ3-A is available at Aetrix Electronics and suitable for high-speed packet buffering, network processor co-memory, and FPGA-based protocol acceleration requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant lead-free packaging.

Supply support for UPD44165092BF5-E40-EQ3-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power management, and high-performance memory solutions for automotive, industrial, and communications markets.

The UPD44165092BF5-E40-EQ3-A belongs to Renesas' QDR-II SRAM product line, engineered specifically for deterministic, low-latency, high-bandwidth memory interfacing in networking infrastructure and real-time signal processing systems.

FAQ

What is the maximum operating frequency supported by UPD44165092BF5-E40-EQ3-A?

The UPD44165092BF5-E40-EQ3-A is rated for a 4.0 ns clock cycle time, corresponding to a maximum operating frequency of 250 MHz under commercial temperature conditions (0°C to +70°C). This is validated across all AC timing parameters including TKHKH, TAVKH, and TCHQV, and assumes proper HSTL termination and stable 1.8 V VDD supply.

Does UPD44165092BF5-E40-EQ3-A support true concurrent read and write operations?

Yes, UPD44165092BF5-E40-EQ3-A supports true concurrent read and write operations via physically separate read and write data ports (Q0–Q8 and D0–D8), independent address registers, and dual-clock domain control (K/K# for input registration, C/C# for output timing). The block diagram and truth table confirm simultaneous READ and WRITE bursts without arbitration delay.

How is output impedance calibrated on UPD44165092BF5-E40-EQ3-A?

Output impedance calibration on UPD44165092BF5-E40-EQ3-A is performed via the ZQ pin, which connects to an external resistor (RQ) to ground. The device sets Q, CQ, and CQ# output impedance to 0.2 × RQ - yielding 35–70 Ω for RQ = 175–350 Ω. Calibration occurs automatically every 20 μs after power-up and tracks voltage/temperature drift.

Can UPD44165092BF5-E40-EQ3-A operate without the PLL enabled?

Yes, UPD44165092BF5-E40-EQ3-A can operate with the PLL disabled by pulling DLL# LOW, allowing debug at frequencies below 120 MHz. However, AC/DC specifications are not guaranteed in this mode, and normal operation requires DLL# tied HIGH (e.g., via 10 kΩ resistor to VDDQ) to ensure PLL lock and full timing compliance.

What is the purpose of the C and C# output clock pins on UPD44165092BF5-E40-EQ3-A?

The C and C# pins on UPD44165092BF5-E40-EQ3-A provide a user-controlled output timing reference: C# rising edge clocks the first output word, and C rising edge clocks the second word of each burst-2 read. This allows precise flight-time matching between clock and data at the receiving device - a key advantage over single-clock SRAMs for high-speed interconnects.

UPD44165092BF5-E40-EQ3-A Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: *

Package/Case:: -

Packaging:: Bulk

Product Status:: Active

Programmable:: Not Verified

Memory Type:: -

Memory Format:: -

Technology:: -

Memory Size:: -

Memory Organization:: -

Memory Interface:: -

Clock Frequency:: -

Write Cycle Time - Word, Page:: -

Access Time:: -

Voltage - Supply:: -

Operating Temperature:: -

Grade:: -

Qualification:: -

Mounting Type:: -

Supplier Device Package:: -

UPD44165092BF5-E40-EQ3-A FAQ

1.How can I place an order for UPD44165092BF5-E40-EQ3-A through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD44165092BF5-E40-EQ3-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD44165092BF5-E40-EQ3-A reliable?

The price and inventory of UPD44165092BF5-E40-EQ3-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44165092BF5-E40-EQ3-A is usually 5 days.

3.What payment methods are accepted for UPD44165092BF5-E40-EQ3-A?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD44165092BF5-E40-EQ3-A transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UPD44165092BF5-E40-EQ3-A?

UPD44165092BF5-E40-EQ3-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD44165092BF5-E40-EQ3-A order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD44165092BF5-E40-EQ3-A?

For technical support, including UPD44165092BF5-E40-EQ3-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44165092BF5-E40-EQ3-A requirements.

6.How does Aetrix verify that UPD44165092BF5-E40-EQ3-A is sourced from the original manufacturer or authorized distributors?

All UPD44165092BF5-E40-EQ3-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44165092BF5-E40-EQ3-A meets industry standards.

7.What is the process for return or replacement of UPD44165092BF5-E40-EQ3-A?

All UPD44165092BF5-E40-EQ3-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD44165092BF5-E40-EQ3-A, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD44165092BF5-E40-EQ3-A part is unused and in its original packaging.

Return procedure for UPD44165092BF5-E40-EQ3-A:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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