Renesas UPD44165182BF5-E33-EQ3
- Part No.:
- UPD44165182BF5-E33-EQ3
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
UPD44165182BF5-E33-EQ3.pdf
- Description:
- QDR SRAM, 1MX18, 0.45NS
- Quantity:
- Payment:

- Shipping:

Inventory:140
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
UPD44165182BF5-E33-EQ3 from Renesas Electronics is a 1,048,576-word × 18-bit synchronous Quad Data Rate II (QDR II) SRAM with 300 MHz clock frequency, 3.3 ns cycle time, and HSTL interface. It features dual independent read/write ports, burst-2 operation, and PLL-based output timing control. It is used in high-bandwidth networking buffers and packet-forwarding ASIC/FPGA interfaces.
For engineers reviewing the UPD44165182BF5-E33-EQ3 datasheet, UPD44165182BF5-E33-EQ3 pinout, UPD44165182BF5-E33-EQ3 application, or UPD44165182BF5-E33-EQ3 equivalent, key selection considerations include its 165-pin plastic BGA (13×15) package, 1.8 V core supply with 1.4–1.8 V I/O supply, JTAG 1149.1 test port, and user-programmable output impedance (35–70 Ω).
Technical Context
This QDR II SRAM implements separate synchronous read and write data paths with concurrent transaction capability, using K/K# for address/control registration and C/C# for output data timing reference. Its internal burst counter and echo clocks (CQ/CQ#) enable precise DDR data valid windows aligned to system flight time.
The device integrates a PLL for jitter-tolerant clock scaling and supports clock-stop mode with 20 μs recovery. Input registers are edge-triggered on K (read) and K# (write); outputs are synchronized to C/C# rising edges - with fallback to K/K# if C/C# are held high.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 1,048,576 words × 18 bits (18 Mbit total) |
| Clock Frequency | 300 MHz - enables 600 MT/s per data pin in DDR mode |
| Cycle Time | 3.3 ns - defines minimum clock period for full-speed operation |
| Supply Voltage | VDD = 1.7–1.9 V; VDDQ = 1.4–VDD V - separates core logic and I/O power domains |
| Interface Standard | HSTL Class I - ensures signal integrity at high speeds with controlled impedance |
| Operating Temperature | 0 °C to +70 °C - commercial-grade thermal range for embedded infrastructure |
| Package | 165-pin plastic BGA (13 mm × 15 mm) - standard footprint for high-density PCB layouts |
Pinout & Package
UPD44165182BF5-E33-EQ3 is housed in a 165-pin plastic BGA (13 × 15 mm) with 0.8 mm ball pitch. The package supports HSTL I/O signaling, includes dedicated echo clocks (CQ/CQ#), output impedance tuning (ZQ), and IEEE 1149.1 JTAG test access.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| K, K# | Input Clock Pair | Edge-triggered register clocks: K latches read controls/addresses; K# latches write addresses/data |
| C, C# | Output Clock Pair | Timing reference for output data delivery; C# aligns first burst word, C aligns second |
| R#, W# | Read/Write Control | Active-low synchronous commands; both high = NOP (high-Z outputs) |
| BW0#, BW1# | Byte Write Select | Enable writing of D0–D8 (BW0#) or D9–D17 (BW1#); both high = no write |
| Q0–Q17 | Data Outputs | 18-bit synchronous DDR outputs aligned to C/C# rising edges |
| D0–D17 | Data Inputs | 18-bit synchronous DDR inputs registered on K and K# rising edges |
| ZQ | Impedance Calibration | Connects to external resistor to ground to set output driver impedance (35–70 Ω) |
| VREF | HSTL Reference | Nominally VDDQ/2; provides threshold reference for all HSTL input buffers |
| TMS, TDI, TCK, TDO | JTAG Interface | IEEE 1149.1 boundary-scan test port operating at 1.8 V I/O level |
Key Features
| Feature | Design Value |
|---|---|
| Two-tick burst operation | Delivers two consecutive data words per clock cycle - maximizes bus utilization without command overhead |
| Separate read/write data ports | Enables simultaneous read and write transactions - critical for pipeline buffering in switch fabric applications |
| User-programmable output impedance | 35–70 Ω tuning via ZQ pin - eliminates need for external series termination resistors |
| PLL-based output timing control | Widens data valid window and enables future frequency scaling - improves timing margin across PVT variations |
| Clock-stop capability | Enters low-power state with 20 μs recovery - supports dynamic power gating in burst-oriented traffic patterns |
| JTAG 1149.1 compliance | Full boundary-scan support - enables in-system test and debug without physical probe access |
Applications
| Network Packet Buffer | FPGA Co-Processor Cache |
|---|---|
Use Scenario: High-speed packet buffering in Layer 2/L3 Ethernet switches handling 10 GbE line rates. IC Role / Device Role / Timing Role: Dual-port QDR II SRAM acts as ingress/egress FIFO with concurrent read/write to sustain full-duplex throughput. Use Value: 300 MHz DDR interface delivers 1.08 GB/s bandwidth per port - matches FPGA memory controller bandwidth without wait states. |
Use Scenario: Low-latency local cache between FPGA fabric and external DDR3/DDR4 memory controllers. IC Role / Device Role / Timing Role: Acts as write-back buffer and prefetch staging area, decoupling variable-latency DRAM accesses from deterministic FPGA logic timing. Use Value: Burst-2 operation and echo clocks (CQ/CQ#) reduce interconnect skew sensitivity - enabling reliable 300 MHz operation on compact PCB traces. |
| Telecom Baseband Processing | High-Frequency Trading Engine |
Use Scenario: Real-time symbol processing in 4G/LTE baseband units requiring deterministic latency under bursty channel conditions. IC Role / Device Role / Timing Role: Stores interleaved I/Q sample streams with simultaneous read (DSP fetch) and write (ADC ingest) on independent ports. Use Value: Clock-stop mode reduces active current by >50% during idle periods - lowering thermal load in dense blade servers. |
Use Scenario: Ultra-low-latency order book synchronization between matching engines and market data feeds. IC Role / Device Role / Timing Role: Serves as shared memory between parallel execution cores, with atomic updates enabled by byte-write select (BW0#/BW1#). Use Value: 18-bit organization matches common financial data field widths (e.g., price × quantity), minimizing packing/unpacking overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C2663KV18 | 1M × 18, 300 MHz, 165-pin BGA - identical organization and speed; Cypress (now Infineon) implementation with different AC timing margins | Same dual-port burst-2 QDR II functionality; requires validation of setup/hold timing against host controller | Select when existing design uses Infineon QDR II family or requires long-term supply continuity under Infineon's product roadmap |
| AS7C3318B | 1M × 18, 250 MHz, 165-pin BGA - slower max frequency (4.0 ns cycle), same voltage and interface | Limited to 250 MHz systems; lower IDD (610 mA vs. 690 mA at 300 MHz) reduces power density | Choose for cost-sensitive, thermally constrained designs where 250 MHz bandwidth suffices and layout reuse is prioritized |
Compared with CY7C2663KV18 and AS7C3318B, UPD44165182BF5-E33-EQ3 delivers higher bandwidth (300 MHz vs. 250 MHz) and tighter output timing control via integrated PLL, but requires stricter clock jitter compliance (0.2 ns TKC var) and careful ZQ calibration for impedance matching.
Availability
UPD44165182BF5-E33-EQ3 is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor caching, and telecom baseband processing requiring stable component supply across multi-year production cycles.
Supply support for UPD44165182BF5-E33-EQ3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
UPD44165182BF5-E33-EQ3 belongs to Renesas' QDR II SRAM product line, engineered for ultra-high-bandwidth, low-latency memory interfacing in networking and communications equipment.
FAQ
What is the maximum guaranteed clock frequency for UPD44165182BF5-E33-EQ3?
The UPD44165182BF5-E33-EQ3 is rated for 300 MHz operation with a 3.3 ns clock cycle time. This is validated across the full commercial temperature range (0 °C to +70 °C) and requires input clock phase jitter ≤ 0.2 ns (TKC var). Operation above 300 MHz is not guaranteed and may violate setup/hold timing margins.
Does UPD44165182BF5-E33-EQ3 support true dual-port concurrent read/write operations?
Yes, UPD44165182BF5-E33-EQ3 supports fully concurrent read and write transactions on independent data buses. The read port uses Q0–Q17 and C/C# timing; the write port uses D0–D17 and K/K# timing. The block diagram confirms separate address registries, data registries, and output drivers enabling simultaneous access without arbitration delay.
How is output impedance calibrated on UPD44165182BF5-E33-EQ3?
Output impedance is calibrated via the ZQ pin: connect an external resistor RQ from ZQ to ground, where Q, CQ, and CQ# output impedance is set to 0.2 × RQ. Typical RQ values yield 35–70 Ω. Calibration occurs automatically every 20 μs after power-up. Direct connection to VDDQ minimizes impedance; grounding or leaving ZQ floating is prohibited.
Can UPD44165182BF5-E33-EQ3 operate without the PLL enabled?
Yes - pulling DLL# LOW disables the PLL, allowing operation at frequencies below the PLL's 120 MHz minimum lock range. However, AC/DC characteristics are not guaranteed in this mode, and timing margins degrade. For production use at 300 MHz, DLL# must be HIGH (tied to VDDQ via ≤10 kΩ resistor) to ensure full specification compliance.
What is the function of the CQ and CQ# pins on UPD44165182BF5-E33-EQ3?
CQ and CQ# are synchronous echo clock outputs tightly matched to data output timing. Their rising edges indicate valid data windows for Q0–Q17: CQ# aligns with the first burst word, CQ with the second. They remain active even when outputs are tristated and stop only when K/K# clocks halt - providing robust data-valid signaling for high-speed capture logic.
UPD44165182BF5-E33-EQ3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
UPD44165182BF5-E33-EQ3 FAQ
1.How can I place an order for UPD44165182BF5-E33-EQ3 through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD44165182BF5-E33-EQ3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD44165182BF5-E33-EQ3 reliable?
The price and inventory of UPD44165182BF5-E33-EQ3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44165182BF5-E33-EQ3 is usually 5 days.
3.What payment methods are accepted for UPD44165182BF5-E33-EQ3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD44165182BF5-E33-EQ3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UPD44165182BF5-E33-EQ3?
UPD44165182BF5-E33-EQ3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD44165182BF5-E33-EQ3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD44165182BF5-E33-EQ3?
For technical support, including UPD44165182BF5-E33-EQ3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44165182BF5-E33-EQ3 requirements.
6.How does Aetrix verify that UPD44165182BF5-E33-EQ3 is sourced from the original manufacturer or authorized distributors?
All UPD44165182BF5-E33-EQ3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44165182BF5-E33-EQ3 meets industry standards.
7.What is the process for return or replacement of UPD44165182BF5-E33-EQ3?
All UPD44165182BF5-E33-EQ3 units undergo pre-shipment inspection (PSI). If there is an issue with UPD44165182BF5-E33-EQ3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD44165182BF5-E33-EQ3 part is unused and in its original packaging.
Return procedure for UPD44165182BF5-E33-EQ3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
UPD44165182BF5-E33-EQ3 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

