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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Renesas UPD44165182BF5-E33-EQ3-A

Name: UPD44165182BF5-E33-EQ3-A
Brand: Renesas
SKU: UPD44165182BF5-E33-EQ3-A
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: UPD44165182BF5-E33-EQ3-A

Manufacturer:: Renesas

Category:: Memory

Package:: -

Datasheet:: UPD44165182BF5-E33-EQ3-A.pdf

Description:: QDR SRAM, 1MX18, 0.45NS

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Product details

Overview

UPD44165182BF5-E33-EQ3-A from Renesas Electronics is a 1,048,576-word × 18-bit synchronous Quad Data Rate II (QDR-II) SRAM with 300 MHz clock operation, 3.3 ns cycle time, and HSTL interface. It features separate read/write ports, burst-2 operation, and PLL-based output timing control for high-speed networking buffer applications.

For engineers reviewing the UPD44165182BF5-E33-EQ3-A datasheet, UPD44165182BF5-E33-EQ3-A pinout, UPD44165182BF5-E33-EQ3-A application, or UPD44165182BF5-E33-EQ3-A equivalent, this page delivers verified specifications, package mapping, functional pin roles, real-world use cases in packet buffering and switch fabric, and validated alternative parts for memory subsystem design.

Technical Context

This QDR-II SRAM uses dual-clock architecture: K/K# for address/control/data input registration and C/C# for precise output data timing alignment. Its internal burst counter and echo clocks (CQ/CQ#) enable deterministic 2-word DDR transactions with matched flight time between data and clock outputs.

The device integrates a PLL for jitter-tolerant operation and supports user-programmable output impedance (35–70 Ω) via ZQ calibration. Clock-stop mode suspends operation with full state retention and restores normal function within 20 μs upon clock resumption.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	1,048,576 words × 18 bits = 18 Mbit total capacity; enables 18-bit wide data path for high-throughput packet buffering.
Clock Frequency / Cycle Time	300 MHz / 3.3 ns; supports DDR read/write at 600 MT/s per data pin with guaranteed timing margins.
Supply Voltages	VDD = 1.8 V ±0.1 V; VDDQ = 1.4–1.8 V; independent I/O supply allows optimized signal integrity on HSTL bus.
Interface Standard	HSTL Class I compliant; ensures compatibility with FPGA/ASIC memory controllers using 1.5 V reference (VREF = VDDQ/2).
Operating Temperature	0 °C to +70 °C; qualified for commercial-grade embedded systems and telecom line cards.
Package	165-pin Plastic BGA (13 mm × 15 mm); standard footprint for high-density PCB layouts with thermal pad.
Power Consumption	IDD = 690 mA max (active), ISB1 = 340 mA max (standby); enables predictable thermal budgeting in multi-chip memory banks.

Pinout & Package

165-pin Plastic BGA (13 × 15 mm, 0.8 mm pitch) with exposed thermal pad. Pin functions are defined per top-view layout in datasheet Rev.2.00 Page 5.

Pin/Terminal	Circuit Role	Design Meaning
K, K#	Input Clock Pair	Registers address, R#, W#, BW0#/BW1#, and D0–D17 on rising edges; K and K# must be 180° out-of-phase for timing compliance.
C, C#	Output Clock Pair	Controls output data timing; rising edge of C# latches first word, C latches second word; can be tied HIGH to use K/K# as output reference.
R#, W#	Read/Write Control	Active-low synchronous commands; both HIGH = NOP; concurrent read/write allowed due to independent ports.
BW0#, BW1#	Byte Write Select	Enable writing to lower (D0–D8) or upper (D9–D17) 9-bit byte; both HIGH disables write, both LOW enables full 18-bit write.
D0–D17	Data Inputs	18-bit synchronous write data path; registered on K and K# rising edges; supports partial-byte writes via BWx#.
Q0–Q17	Data Outputs	18-bit synchronous read data path; aligned to C/C# rising edges; high-impedance when deselected or during clock stop.
CQ, CQ#	Echo Clock Outputs	Tightly matched to Q outputs; used as data-valid strobes; continue running even when Q tristates; stop only when K/K# stop.
ZQ	Impedance Calibration Input	Connects to external resistor to ground (175–350 Ω) to tune Q/CQ/CQ# output impedance to 35–70 Ω; critical for HSTL signal integrity.
DLL#	PLL Disable	Pull LOW to bypass PLL for low-frequency debug; must be HIGH (tied to VDDQ) for normal 300 MHz operation.
TMS, TDI, TCK, TDO	JTAG Test Interface	IEEE 1149.1 compliant; supports boundary-scan testing; TCK must tie to VSS if unused.

Key Features

Feature	Design Value
Separate Read/Write Ports	Enables simultaneous 18-bit read and write operations without bus contention-critical for full-duplex packet buffering in switches.
2-Word Burst Operation	Guarantees 100% bus utilization per clock cycle; eliminates dead cycles between consecutive DDR transfers in streaming applications.
User-Programmable Output Impedance	35–70 Ω range via ZQ resistor; eliminates need for external series termination resistors and reduces PCB routing complexity.
PLL-Based Timing Control	Widens output data valid window and enables future frequency scaling up to 300 MHz while maintaining setup/hold margins.
Clock-Stop Mode	Enters low-power state with zero latency recovery (20 μs); ideal for power-gated memory subsystems in energy-aware network processors.
JTAG 1149.1 Support	Enables in-system testability and debug visibility without requiring additional test access hardware on production boards.

Applications

Packet Buffer Memory	Switch Fabric Interface
Use Scenario: Storing ingress/egress packets in Layer 2/L3 Ethernet switches before forwarding decisions. IC Role / Device Role / Timing Role: Dual-port QDR-II SRAM serving as shared buffer pool with concurrent read (forwarding engine) and write (ingress parser) access. Use Value: 18-bit width matches typical packet header size; 300 MHz DDR enables ≥5.4 Gbps aggregate bandwidth per device-sufficient for 10G line-rate buffering.	Use Scenario: Interfacing between traffic manager ASIC and crossbar switch fabric in modular routers. IC Role / Device Role / Timing Role: High-speed FIFO replacement providing deterministic latency and burst-aligned data transfer between pipeline stages. Use Value: Echo clocks (CQ/CQ#) eliminate board-level skew compensation; matched flight time ensures sub-nanosecond timing closure at 300 MHz.
Network Processor Cache	Telecom Line Card Buffer
Use Scenario: Offloading packet classification and deep packet inspection results from NPU cores to dedicated memory. IC Role / Device Role / Timing Role: Low-latency, high-bandwidth scratchpad memory accessed by multiple NPU threads via separate read/write ports. Use Value: Clock-stop capability allows dynamic power gating during idle periods; standby current ≤340 mA minimizes thermal load in dense line cards.	Use Scenario: Buffering ATM/SONET cell payloads in OC-192 or 10Gbps optical transport equipment. IC Role / Device Role / Timing Role: Synchronous SRAM interfaced to SerDes PHYs via HSTL I/O; handles fixed-size 53-byte cell bursts with zero wait states. Use Value: HSTL Class I compliance guarantees interoperability with Xilinx Virtex-5/7 and Intel Stratix IV/V FPGA memory controllers.

Packet Buffer Memory

Switch Fabric Interface

Use Scenario: Storing ingress/egress packets in Layer 2/L3 Ethernet switches before forwarding decisions.

IC Role / Device Role / Timing Role: Dual-port QDR-II SRAM serving as shared buffer pool with concurrent read (forwarding engine) and write (ingress parser) access.

Use Value: 18-bit width matches typical packet header size; 300 MHz DDR enables ≥5.4 Gbps aggregate bandwidth per device-sufficient for 10G line-rate buffering.

Use Scenario: Interfacing between traffic manager ASIC and crossbar switch fabric in modular routers.

IC Role / Device Role / Timing Role: High-speed FIFO replacement providing deterministic latency and burst-aligned data transfer between pipeline stages.

Use Value: Echo clocks (CQ/CQ#) eliminate board-level skew compensation; matched flight time ensures sub-nanosecond timing closure at 300 MHz.

Network Processor Cache

Telecom Line Card Buffer

Use Scenario: Offloading packet classification and deep packet inspection results from NPU cores to dedicated memory.

IC Role / Device Role / Timing Role: Low-latency, high-bandwidth scratchpad memory accessed by multiple NPU threads via separate read/write ports.

Use Value: Clock-stop capability allows dynamic power gating during idle periods; standby current ≤340 mA minimizes thermal load in dense line cards.

Use Scenario: Buffering ATM/SONET cell payloads in OC-192 or 10Gbps optical transport equipment.

IC Role / Device Role / Timing Role: Synchronous SRAM interfaced to SerDes PHYs via HSTL I/O; handles fixed-size 53-byte cell bursts with zero wait states.

Use Value: HSTL Class I compliance guarantees interoperability with Xilinx Virtex-5/7 and Intel Stratix IV/V FPGA memory controllers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR-II SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY7C1721KV18-333BZI	1M × 18, 333 MHz (3.0 ns), -40°C to +95°C industrial temp grade; same 165-pin BGA but different pinout for BWx# and echo clocks.	Supports extended temperature range and faster timing; requires PCB redesign due to non-identical pin mapping.	Select when operating beyond 70°C ambient or requiring tighter tAVKH/tIVKH setup margins.
AS7C3318B-333BIN	1M × 18, 333 MHz (3.0 ns), 1.8 V core, but uses SSTL-2 interface instead of HSTL; 165-pin BGA with distinct power/ground pin distribution.	Requires level-shifting or controller reconfiguration for HSTL-to-SSTL conversion; not drop-in compatible.	Choose only if existing system already uses SSTL-2 infrastructure and controller supports mixed-interface memory maps.

Compared with UPD44165182BF5-E33-EQ3-A, CY7C1721KV18-333BZI offers higher speed and wider temperature range but demands layout changes, while AS7C3318B-333BIN trades HSTL compatibility for SSTL-2-making UPD44165182BF5-E33-EQ3-A the optimal choice for cost-sensitive, HSTL-native 0–70°C telecom designs.

Availability

UPD44165182BF5-E33-EQ3-A is available at Aetrix Electronics and suitable for packet buffering, switch fabric interfaces, and network processor cache applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for UPD44165182BF5-E33-EQ3-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.

The UPD44165182BF5-E33-EQ3-A belongs to Renesas' QDR-II SRAM product line, engineered specifically for high-bandwidth, low-latency buffer applications in networking and telecommunications infrastructure where deterministic DDR timing and dual-port concurrency are essential.

FAQ

What is the maximum supported clock frequency for UPD44165182BF5-E33-EQ3-A?

The UPD44165182BF5-E33-EQ3-A is rated for 300 MHz operation with a 3.3 ns clock cycle time. This is confirmed in the Ordering Information table (Page 2) and AC Characteristics (Page 19), where TKHKH (average clock cycle time) is specified as 3.3 ns min for the -E33 variant. Operation above 300 MHz is not guaranteed and violates datasheet timing limits.

Does UPD44165182BF5-E33-EQ3-A support true dual-port operation with simultaneous read and write?

Yes, UPD44165182BF5-E33-EQ3-A supports concurrent read and write operations via physically separate data paths: D0–D17 for write input and Q0–Q17 for read output. The block diagram (Page 9) and Truth Table (Page 11) confirm independent port arbitration, enabling full-duplex data flow without internal contention or arbitration delay.

How is output impedance calibrated on UPD44165182BF5-E33-EQ3-A?

Output impedance is calibrated using the ZQ pin: a resistor (175–350 Ω) is connected from ZQ to ground, setting Q, CQ, and CQ# driver impedance to 0.2 × RQ (i.e., 35–70 Ω). Calibration occurs automatically every 20 μs after power-up, as documented in the Pin Description (Page 8) and Electrical Characteristics (Page 15).

Can UPD44165182BF5-E33-EQ3-A operate without the PLL enabled?

Yes-pulling DLL# LOW disables the PLL for low-frequency debugging, but AC/DC characteristics are not guaranteed per datasheet (Page 8). For all production operation at 300 MHz, DLL# must be HIGH (tied to VDDQ), as required by the Power-On Sequence (Page 10) and PLL Constraints (Page 10).

What is the purpose of CQ and CQ# pins on UPD44165182BF5-E33-EQ3-A?

CQ and CQ# are echo clock outputs tightly matched to Q0–Q17 data edges, serving as hardware-validated data-valid strobes. They remain active during clock-stop mode and provide precise timing references for receiving devices-eliminating need for board-level skew compensation in high-speed links, as detailed in Pin Description (Page 8) and Block Diagram (Page 9).

UPD44165182BF5-E33-EQ3-A Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: *

Package/Case:: -

Packaging:: Bulk

Product Status:: Active

Programmable:: Not Verified

Memory Type:: -

Memory Format:: -

Technology:: -

Memory Size:: -

Memory Organization:: -

Memory Interface:: -

Clock Frequency:: -

Write Cycle Time - Word, Page:: -

Access Time:: -

Voltage - Supply:: -

Operating Temperature:: -

Grade:: -

Qualification:: -

Mounting Type:: -

Supplier Device Package:: -

UPD44165182BF5-E33-EQ3-A FAQ

1.How can I place an order for UPD44165182BF5-E33-EQ3-A through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD44165182BF5-E33-EQ3-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD44165182BF5-E33-EQ3-A reliable?

The price and inventory of UPD44165182BF5-E33-EQ3-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44165182BF5-E33-EQ3-A is usually 5 days.

3.What payment methods are accepted for UPD44165182BF5-E33-EQ3-A?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD44165182BF5-E33-EQ3-A transactions.

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4.How is shipping managed for UPD44165182BF5-E33-EQ3-A?

UPD44165182BF5-E33-EQ3-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD44165182BF5-E33-EQ3-A order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD44165182BF5-E33-EQ3-A?

For technical support, including UPD44165182BF5-E33-EQ3-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44165182BF5-E33-EQ3-A requirements.

6.How does Aetrix verify that UPD44165182BF5-E33-EQ3-A is sourced from the original manufacturer or authorized distributors?

All UPD44165182BF5-E33-EQ3-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44165182BF5-E33-EQ3-A meets industry standards.

7.What is the process for return or replacement of UPD44165182BF5-E33-EQ3-A?

All UPD44165182BF5-E33-EQ3-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD44165182BF5-E33-EQ3-A, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD44165182BF5-E33-EQ3-A part is unused and in its original packaging.

Return procedure for UPD44165182BF5-E33-EQ3-A:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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