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Renesas UPD44165182BF5-E40-EQ3

Part No.:
UPD44165182BF5-E40-EQ3
Manufacturer:
Renesas
Category:
Memory
Package:
-
Datasheet:
AetrixUPD44165182BF5-E40-EQ3.pdf
Description:
QDR SRAM, 1MX18, 0.45NS
Quantity:
Payment:
Payment
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Inventory:18,575

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Product details

Overview

UPD44165182BF5-E40-EQ3 from Renesas Electronics is a 1,048,576-word × 18-bit synchronous QDR II SRAM with 4.0 ns clock cycle time (250 MHz), 1.8 V core supply, HSTL I/O interface, and 165-pin plastic BGA (13 × 15) package. It supports concurrent read/write operations, burst-2 DDR transactions, and clock-stop mode with 20 μs recovery - deployed in high-bandwidth network packet buffers and FPGA co-processor memory subsystems.

For engineers reviewing the UPD44165182BF5-E40-EQ3 datasheet, UPD44165182BF5-E40-EQ3 pinout, UPD44165182BF5-E40-EQ3 application, or UPD44165182BF5-E40-EQ3 equivalent, key selection criteria include its dual-port burst timing, user-programmable output impedance (35–70 Ω), JTAG 1149.1 test access, and precise echo clock (CQ/CQ#) alignment for high-speed signal integrity validation.

Technical Context

This QDR II SRAM employs full-CMOS six-transistor memory cells and integrates a PLL-based DLL for jitter-tolerant operation across 200–300 MHz. Its synchronous architecture uses separate K/K# input clocks for address/control registration and C/C# output clocks for data timing - enabling deterministic flight-time matching between clock and data at the receiver.

The device implements independent read and write data paths with concurrent transaction capability, two-tick burst addressing, and byte-write control via BW0#/BW1#. All inputs are registered on K rising edge (READ) or K# rising edge (WRITE); outputs are synchronized to C/C# rising edges, with echo clocks CQ/CQ# tightly matched to data valid windows.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization1,048,576 words × 18 bits = 18 Mbit total capacity; enables 36-bit data path expansion via depth stacking.
Clock Cycle Time4.0 ns (250 MHz); defines minimum clock period for guaranteed timing compliance in burst-2 DDR operation.
Supply VoltageVDD = 1.8 ± 0.1 V; powers core logic; requires VDDQ ≤ VDD during power-up/down to prevent latch-up.
I/O InterfaceHSTL Class I compliant; supports 1.5 V or 1.8 V VDDQ; reference voltage VREF = VDDQ/2 for input threshold stability.
Output ImpedanceUser programmable 35–70 Ω via ZQ pin and external resistor; matches PCB trace impedance for signal integrity.
Package165-pin plastic BGA (13 × 15 mm); 0.8 mm ball pitch; thermal resistance θja = 21.4°C/W (4-layer board, still air).
Operating Temperature0°C to +70°C ambient; validated for industrial networking equipment with stable thermal profile.

Pinout & Package

165-pin plastic BGA (13 × 15 mm, 0.8 mm pitch), RoHS-compliant, lead-free finish. Pin mapping follows JEDEC MO-251 standard with index mark at corner A1.

Pin/Terminal Circuit Role Design Meaning
K, K#Input clock pairRegisters address/control on K↑ (READ) and K#↑ (WRITE); 180° phase relationship required for timing margin.
C, C#Output clock pairControls data output timing; C#↑ latches first word, C↑ latches second word; must be tied HIGH if using K/K# for output sync.
CQ, CQ#Echo clock outputsMatched to Q outputs within ±0.35 ns; used as data-valid strobes at receiver; continue running when Q tristates.
R#, W#Read/Write enableActive-low synchronous controls; both HIGH = NOP; setup/hold referenced to K↑; enables concurrent port operation.
BW0#, BW1#Byte write selectIndependent control of D0–D8 (BW0#) and D9–D17 (BW1#); LOW enables write, HIGH masks byte; supports partial writes per burst.
ZQImpedance calibration inputConnects to external resistor to ground (RQ = 175–350 Ω); sets Q/CQ/CQ# output impedance to 0.2×RQ; recalibrates every 20 μs.
D0–D17Data inputs18-bit synchronous write data; registered on K↑ and K#↑; must meet 0.35 ns setup/hold at 250 MHz.
Q0–Q17Data outputs18-bit synchronous read data; driven on C#↑ and C↑; high-Z when C/C# stopped or R# = W# = HIGH.
TCK, TMS, TDI, TDOJTAG 1149.1 interface1.8 V I/O level; TCK must tie to VSS if unused; supports boundary-scan testing and debug access.

Key Features

Feature Design Value
Concurrent read/write portsEnables full 100% bus utilization in DDR mode - no arbitration delay between back-to-back read and write bursts.
Two-tick burst operationFixed 2-word burst per transaction reduces address overhead and simplifies controller logic versus variable-length bursts.
Programmable output impedance35–70 Ω tuning via ZQ pin eliminates need for external series termination resistors on high-speed data lines.
PLL-based DLL with clock-stop recoveryLocks in ≤20 μs; resumes normal operation within 20 μs after clock restart - critical for low-power sleep/wake cycles.
HSTL Class I I/OGuarantees signal integrity at 250 MHz with <0.45 ns output skew; compatible with FPGA and ASIC memory controllers requiring fast edge rates.

Applications

Network Packet Buffer FPGA Co-Processor Memory

Use Scenario: Storing ingress/egress Ethernet frames in 10 GbE line cards with real-time classification and forwarding.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as ping-pong buffer; reads frame metadata while writing new payload under independent clock domains.

Use Value: Concurrent read/write eliminates pipeline stalls; 250 MHz burst rate sustains >4.5 GB/s aggregate bandwidth for wire-speed processing.

Use Scenario: Offloading compute-intensive tasks (e.g., FFT, filtering) from host CPU to FPGA-accelerated subsystems.

IC Role / Device Role / Timing Role: High-speed local memory for FPGA fabric; supplies operands and stores results with sub-2 ns output valid window.

Use Value: Echo clocks CQ/CQ# enable precise data capture at FPGA inputs; HSTL interface ensures clean signal integrity at 250 MHz.

Telecom Baseband Processing Test Equipment Pattern Memory

Use Scenario: Real-time channel equalization and modulation/demodulation in LTE/5G base stations with strict latency constraints.

IC Role / Device Role / Timing Role: Burst-access memory for symbol-level data streaming; synchronized to system clock via K/K# and C/C#.

Use Value: Clock-stop capability reduces dynamic power by >50% during idle periods without compromising restart latency.

Use Scenario: Storing stimulus/response vectors in automated test equipment (ATE) for semiconductor wafer probing.

IC Role / Device Role / Timing Role: Deterministic timing memory; delivers known-good patterns with <0.35 ns output hold margin at 250 MHz.

Use Value: User-programmable impedance (via ZQ) eliminates board-level tuning; simplifies fixture design and improves test repeatability.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C2663KV18-400BZI400 MHz (2.5 ns), 1M × 18, same 165-pin BGA but 1.5 V VDDQ only; no ZQ impedance tuning.Higher bandwidth but narrower voltage margin; requires tighter VDDQ regulation and lacks programmable drive strength.Select when 400 MHz operation is mandatory and board layout accommodates stricter power delivery.
AS7C3256A-15JINAsynchronous 32K × 16 SRAM, 15 ns access, SOJ-44; no burst, no DDR, no clocking infrastructure.Limited to low-speed control-plane buffering; incompatible with QDR timing protocols or burst interfaces.Only viable for non-critical, cost-sensitive legacy designs where bandwidth and concurrency are not required.

Compared with CY7C2663KV18-400BZI and AS7C3256A-15JIN, UPD44165182BF5-E40-EQ3 provides optimal balance of 250 MHz performance, flexible 1.8 V/1.5 V I/O, and on-die impedance control - reducing BOM count and layout complexity in high-reliability telecom and test systems.

Availability

UPD44165182BF5-E40-EQ3 is available at Aetrix Electronics and suitable for network packet buffers, FPGA co-processor memory, and telecom baseband processing requiring stable component supply across extended product lifecycles.

Supply support for UPD44165182BF5-E40-EQ3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.

The UPD44165182BF5-E40-EQ3 belongs to Renesas' QDR II SRAM family, engineered for ultra-low-latency, high-throughput memory interfacing in next-generation networking and signal processing systems.

FAQ

What is the maximum operating frequency supported by UPD44165182BF5-E40-EQ3?

UPD44165182BF5-E40-EQ3 supports up to 250 MHz operation with a guaranteed 4.0 ns clock cycle time. This rating applies across the full 0°C to +70°C ambient temperature range and is validated under worst-case voltage (VDD = 1.7 V) and process corners. The device's PLL/DLL remains locked and functional at this frequency, ensuring stable burst-2 DDR timing without external timing margining.

Does UPD44165182BF5-E40-EQ3 support true concurrent read and write operations?

Yes, UPD44165182BF5-E40-EQ3 implements physically separate read and write data paths, allowing simultaneous READ and WRITE transactions without arbitration delay. The block diagram confirms independent address registry, data registry, and output select logic - enabling 100% bus utilization in DDR mode, as verified in the Truth Table and Bus Cycle State Diagram of the datasheet.

How is output impedance calibrated on UPD44165182BF5-E40-EQ3?

UPD44165182BF5-E40-EQ3 uses the ZQ pin to calibrate output driver impedance. A resistor (RQ = 175–350 Ω) is connected from ZQ to ground, setting Q, CQ, and CQ# output impedance to 0.2 × RQ. Calibration occurs automatically every 20 μs after power-up and tracks supply/temperature drift. Direct connection of ZQ to VDDQ minimizes impedance; grounding or leaving it floating is prohibited.

Can UPD44165182BF5-E40-EQ3 operate without an external PLL or DLL circuit?

Yes - UPD44165182BF5-E40-EQ3 integrates a fully self-contained PLL/DLL. When DLL# is held HIGH (default), the internal PLL locks to the K clock within 20 μs and provides jitter-clean C/C# and CQ/CQ# outputs. If DLL# is pulled LOW, the PLL is disabled and the device operates in "single-clock mode" using K/K# for all timing - though AC/DC specs are not guaranteed in this mode.

What is the purpose of the CQ and CQ# pins on UPD44165182BF5-E40-EQ3?

CQ and CQ# are synchronous echo clock outputs tightly matched to Q data outputs (±0.35 ns skew). They serve as hardware data-valid indicators at the receiving end - eliminating need for complex deskew logic. Unlike C/C#, CQ/CQ# continue running even when Q outputs are tristated, and they remain active during clock-stop mode, providing consistent timing references across power states.

UPD44165182BF5-E40-EQ3 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
-
Memory Format:
-
Technology:
-
Memory Size:
-
Memory Organization:
-
Memory Interface:
-
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

UPD44165182BF5-E40-EQ3 FAQ

1.How can I place an order for UPD44165182BF5-E40-EQ3 through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD44165182BF5-E40-EQ3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD44165182BF5-E40-EQ3 reliable?

The price and inventory of UPD44165182BF5-E40-EQ3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44165182BF5-E40-EQ3 is usually 5 days.

3.What payment methods are accepted for UPD44165182BF5-E40-EQ3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD44165182BF5-E40-EQ3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UPD44165182BF5-E40-EQ3?

UPD44165182BF5-E40-EQ3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD44165182BF5-E40-EQ3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD44165182BF5-E40-EQ3?

For technical support, including UPD44165182BF5-E40-EQ3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44165182BF5-E40-EQ3 requirements.

6.How does Aetrix verify that UPD44165182BF5-E40-EQ3 is sourced from the original manufacturer or authorized distributors?

All UPD44165182BF5-E40-EQ3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44165182BF5-E40-EQ3 meets industry standards.

7.What is the process for return or replacement of UPD44165182BF5-E40-EQ3?

All UPD44165182BF5-E40-EQ3 units undergo pre-shipment inspection (PSI). If there is an issue with UPD44165182BF5-E40-EQ3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD44165182BF5-E40-EQ3 part is unused and in its original packaging.

Return procedure for UPD44165182BF5-E40-EQ3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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