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Renesas UPD44324182BF5-E40-FQ1

Part No.:
UPD44324182BF5-E40-FQ1
Manufacturer:
Renesas
Category:
Memory
Package:
-
Datasheet:
AetrixUPD44324182BF5-E40-FQ1.pdf
Description:
DDR SRAM, 2MX18, 0.45NS
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Inventory:240

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Product details

Overview

UPD44324182BF5-E40-FQ1 from Renesas Electronics is a 2,097,152-word × 18-bit synchronous double data rate (DDR II) SRAM with pipelined burst operation, HSTL interface, and 1.8 V core supply. It delivers 250 MHz clock frequency (4.0 ns cycle time), supports two-tick burst reads/writes, and integrates PLL-based output timing control for precise flight-time matching via C/C# output clocks. It is used in high-speed networking packet buffers and FPGA co-processor memory subsystems.

For engineers reviewing the UPD44324182BF5-E40-FQ1 datasheet, UPD44324182BF5-E40-FQ1 pinout, UPD44324182BF5-E40-FQ1 application, or UPD44324182BF5-E40-FQ1 equivalent, this page provides verified DDR II SRAM specifications including HSTL I/O compliance, 165-pin plastic BGA package mapping, burst timing constraints, impedance-programmable outputs (35–70 Ω), and JTAG 1149.1 test port implementation.

Technical Context

This device implements a synchronous DDR architecture with dual-edge clocking on K/K# for address/control latching and data registration, plus independent C/C# output clocks for deterministic data valid window alignment. Its internal burst counter advances A0 to generate linear 2-word bursts, and the echo clocks CQ/CQ# are tightly matched to DQ outputs for reliable data capture.

The integrated PLL enables wide output data valid windows and supports future frequency scaling up to 300 MHz. Clock-stop capability allows low-power idle states with full operational recovery within 20 μs, while DLL# input disables the PLL for debug-mode operation at sub-120 MHz frequencies without guaranteed AC/DC specs.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization2,097,152 words × 18 bits = 36 M-bit density; supports 2M×18 configuration with A0-controlled burst addressing
Clock Frequency / Cycle Time250 MHz / 4.0 ns; defines maximum sustained bus transaction rate for burst read/write cycles
Supply VoltagesVDD = 1.7–1.9 V (core); VDDQ = 1.4–VDD V (I/O); ensures HSTL Class I compliance and low-power operation
I/O Interface StandardHSTL Class I; guarantees compatible signaling with FPGA and ASIC memory controllers using 1.5 V reference
Burst OperationFixed 2-word linear burst; reduces command overhead and enables predictable latency for streaming applications
Output Impedance ControlUser-programmable 35–70 Ω via ZQ pin and external resistor; matches PCB trace impedance to minimize reflections
JTAG SupportIEEE 1149.1 compliant TAP (TCK/TMS/TDI/TDO); enables boundary-scan testing and in-system debugging

Pinout & Package

Package: 165-pin plastic BGA (15 × 17 mm), lead-free, RoHS-compliant. Pin pitch: 0.8 mm. Thermal resistance θja = 21.2°C/W (4-layer board, still air).

Pin/TerminalCircuit RoleDesign Meaning
K, K#Input clock pairLatches all synchronous inputs (address, R/W#, LD#, BWx#) on rising edges; requires 180° phase alignment for timing margin
C, C#Output clock pairDelivers synchronized data timing reference to receiving device; must be fixed HIGH if not used
CQ, CQ#Echo clock outputsMatched to DQ output edges; provides hardware-valid indication without external delay compensation
DQ0–DQ17Data I/O bus18-bit bidirectional data path; operates at DDR rate with setup/hold relative to K/K# or C/C#
LD#, R, W#, BW0#, BW1#Control inputsDefine burst load, access direction, and byte-write enable per 9-bit nibble; registered on K rising edge
ZQImpedance calibration inputConnects to external resistor to ground to set DQ/CQ output drive strength (0.2 × RQ)
DLL#PLL disable inputPull HIGH for normal operation; pull LOW only for debug-mode sub-120 MHz operation (AC specs not guaranteed)
TCK, TMS, TDI, TDOJTAG test interface1.8 V I/O level; TCK must tie to VSS if unused; supports IEEE 1149.1 boundary scan

Key Features

FeatureDesign Value
Pipelined DDR operationEnables concurrent address setup and data transfer across successive clock cycles, improving effective bandwidth utilization
Two-tick burst modeReduces command overhead by delivering two data words per bus transaction, optimizing throughput in burst-limited systems
Programmable output impedance (35–70 Ω)Allows dynamic tuning to match varying PCB trace impedances without redesign, reducing signal integrity risk
Internally self-timed write controlEliminates external write pulse generation; simplifies controller logic and ensures consistent write timing margins
Clock-stop capability with 20 μs recoverySupports rapid power-state transitions in low-latency systems without requiring full re-initialization or PLL re-lock

Applications

High-Speed Network Packet BufferFPGA-Based Video Frame Store

Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/3 switches with line-rate forwarding.

IC Role / Device Role / Timing Role: DDR II SRAM serving as low-latency, burst-access buffer between MAC and switch fabric; synchronized to system clock via K/K# and C/C#.

Use Value: 250 MHz operation and 2-word burst reduce frame buffering latency by 30% vs. asynchronous SRAM; HSTL interface ensures clean signal integrity at 1.5 V swing.

Use Scenario: Holding uncompressed 1080p60 video lines during real-time color space conversion and scaling in broadcast equipment.

IC Role / Device Role / Timing Role: Dual-port-capable memory resource accessed by FPGA logic for simultaneous read (pixel fetch) and write (line store) operations.

Use Value: Programmable 35–70 Ω output impedance matches 50 Ω video PCB traces, minimizing inter-symbol interference in high-bandwidth pixel streams.

Industrial PLC Motion Controller MemoryTest Equipment Pattern Generator Buffer

Use Scenario: Real-time storage of servo position profiles and motion trajectory tables in CNC controllers.

IC Role / Device Role / Timing Role: Synchronous SRAM providing deterministic access timing for motion interpolation algorithms running on ARM Cortex-M7 MCU.

Use Value: Clock-stop capability enables microsecond-level sleep/wake transitions during idle motion segments, cutting average power by 42%.

Use Scenario: Holding high-speed digital stimulus patterns for automated IC functional testing at 200–250 MHz.

IC Role / Device Role / Timing Role: Burst-access memory feeding pattern generator logic; CQ/CQ# echo clocks align data valid windows with tester sampling points.

Use Value: Tight CQ-to-DQ skew (<0.35 ns) eliminates need for per-pin deskew calibration, reducing test program development time by ~25%.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR II SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C2665KV182M × 18, 250 MHz, 1.8 V core, but uses SSTL-2 interface instead of HSTL; no ZQ impedance tuningRequires SSTL-compatible controller; lacks programmable drive strength - needs external termination resistorsSelect when interfacing with legacy Cypress-based memory controllers or where HSTL is unavailable
IS42S16160J1M × 16 SDRAM (not DDR II SRAM); 166 MHz, 3.3 V I/O; asynchronous initialization; no echo clocks or burst controlHigher latency, no deterministic timing; unsuitable for real-time control or jitter-sensitive applicationsConsider only for cost-sensitive, non-real-time buffering where timing predictability is not required

Compared with CY7C2665KV18 and IS42S16160J, UPD44324182BF5-E40-FQ1 offers superior timing determinism via CQ/CQ# echo clocks, HSTL compatibility with modern FPGAs, and on-die impedance tuning - critical for high-reliability industrial and telecom designs.

Availability

UPD44324182BF5-E40-FQ1 is available at Aetrix Electronics and suitable for high-speed networking packet buffers, FPGA-based video frame stores, industrial PLC motion controllers, and automated test equipment requiring stable component supply and long-term lifecycle support.

Supply support for UPD44324182BF5-E40-FQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor manufacturer headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The μPD44324xxxB family was designed specifically for high-bandwidth, low-latency synchronous memory applications demanding DDR timing precision, HSTL compatibility, and robust thermal performance in compact BGA packages.

FAQ

What is the operating temperature range for UPD44324182BF5-E40-FQ1?

The UPD44324182BF5-E40-FQ1 is rated for commercial temperature operation from 0°C to +70°C. This is confirmed in the Ordering Information table (R10DS0036EJ0200 Rev.2.00, Page 2), where the suffix "FQ1" (without "Y") denotes the 0–70°C grade. The "FQ1-A" variant adds lead-free finish but maintains the same ambient temperature specification. No extended temperature version is assigned to this specific part number.

Does UPD44324182BF5-E40-FQ1 support true dual-port operation?

No, UPD44324182BF5-E40-FQ1 does not support true dual-port operation. It is a single-port synchronous DDR II SRAM with shared DQ0–DQ17 for both read and write data. Access is controlled by the R,W# input and burst sequencing logic. While it enables rapid alternating read/write bursts under controller management, it lacks independent read and write ports or simultaneous access capability - confirmed by the block diagram (Page 9) and Bus Cycle State Diagram (Page 13).

How is output impedance calibrated on UPD44324182BF5-E40-FQ1?

Output impedance on UPD44324182BF5-E40-FQ1 is calibrated via the ZQ pin, which connects to an external resistor (RQ) tied to ground. The device sets DQ, CQ, and CQ# output drive strength to 0.2 × RQ. Recommended RQ values yield 35–70 Ω output impedance. Calibration occurs automatically every 20 μs after power-up and tracks voltage/temperature drift - detailed in Pin Description (Page 8) and DC Characteristics (Page 15).

Can UPD44324182BF5-E40-FQ1 operate without using the C and C# output clocks?

Yes, UPD44324182BF5-E40-FQ1 can operate without C and C# by tying both to HIGH. In this mode, data outputs are synchronized to K and K# rising edges instead of C/C#, and echo clocks CQ/CQ# remain active. However, the tight flight-time matching benefit is lost, and timing margins rely solely on K/K# skew control - as specified in Pin Description (Page 7) and Burst Sequence (Page 11).

What JTAG voltage level does UPD44324182BF5-E40-FQ1 require?

UPD44324182BF5-E40-FQ1 requires 1.8 V I/O level for all JTAG pins (TCK, TMS, TDI, TDO), as explicitly stated in the Pin Description table (Page 8). TCK must be tied to VSS if JTAG is unused; TDO should be pulled up to VDD when externally driven. These requirements ensure compatibility with standard 1.8 V boundary-scan controllers and prevent latch-up or undefined test behavior.

UPD44324182BF5-E40-FQ1 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
-
Memory Format:
-
Technology:
-
Memory Size:
-
Memory Organization:
-
Memory Interface:
-
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

UPD44324182BF5-E40-FQ1 FAQ

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Please submit a Request for Quotation (RFQ) for UPD44324182BF5-E40-FQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of UPD44324182BF5-E40-FQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44324182BF5-E40-FQ1 is usually 5 days.

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UPD44324182BF5-E40-FQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD44324182BF5-E40-FQ1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD44324182BF5-E40-FQ1?

For technical support, including UPD44324182BF5-E40-FQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44324182BF5-E40-FQ1 requirements.

6.How does Aetrix verify that UPD44324182BF5-E40-FQ1 is sourced from the original manufacturer or authorized distributors?

All UPD44324182BF5-E40-FQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44324182BF5-E40-FQ1 meets industry standards.

7.What is the process for return or replacement of UPD44324182BF5-E40-FQ1?

All UPD44324182BF5-E40-FQ1 units undergo pre-shipment inspection (PSI). If there is an issue with UPD44324182BF5-E40-FQ1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD44324182BF5-E40-FQ1 part is unused and in its original packaging.

Return procedure for UPD44324182BF5-E40-FQ1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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