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Renesas UPD44324362BF5-E40X-FQ1-A

Part No.:
UPD44324362BF5-E40X-FQ1-A
Manufacturer:
Renesas
Category:
Memory
Package:
-
Datasheet:
AetrixUPD44324362BF5-E40X-FQ1-A.pdf
Description:
DDR SRAM, 1MX36, 0.45NS
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Inventory:652

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Product details

Overview

UPD44324362BF5-E40X-FQ1-A from Renesas Electronics is a 1,048,576-word × 36-bit synchronous double data rate (DDR) SRAM with pipelined burst operation, HSTL interface, and 1.8 V core supply. It delivers 250 MHz clock frequency (4.0 ns cycle time), supports two-word linear burst reads/writes, and operates across industrial temperature range (−40°C to +85°C). This device serves as high-bandwidth buffer memory in network packet processors and FPGA-based acceleration subsystems.

For engineers reviewing the UPD44324362BF5-E40X-FQ1-A datasheet, UPD44324362BF5-E40X-FQ1-A pinout, UPD44324362BF5-E40X-FQ1-A application, or UPD44324362BF5-E40X-FQ1-A equivalent, key selection considerations include DDR timing compliance, HSTL Class I output drive capability, 165-pin plastic BGA (15 × 17 mm) mechanical fit, user-programmable output impedance (35–70 Ω), and JTAG 1149.1 test port integration.

Technical Context

This DDR II SRAM employs full-CMOS six-transistor memory cells and integrates synchronous peripheral circuitry including a burst counter, PLL-based clock recovery, and echo clock outputs (CQ/CQ#) tightly matched to data edges. All control and address inputs are registered on the rising edge of K/K#, while data I/O is synchronized to C/C# for flight-time compensation.

The architecture supports pipelined double data rate operation with two-tick burst, internally self-timed write control, clock-stop mode (20 μs recovery), and four independent byte-write enables (BW0#–BW3#) for selective 9-bit sub-word writes. Output impedance is calibrated via ZQ pin using external resistor-to-ground.

Key Specifications

Parameter Value and Actual Design Meaning
Memory organization 1,048,576 words × 36 bits = 36 Mbit total capacity; enables wide-data-path buffering without external depth expansion
Clock frequency / cycle time 250 MHz / 4.0 ns; defines maximum sustained throughput of 1.8 Gbps per data line in DDR mode
Supply voltages VDD = 1.7–1.9 V (core), VDDQ = 1.4–VDD V (I/O); separate supplies isolate noise-sensitive output drivers
Interface standard HSTL Class I compliant; ensures signal integrity at 250 MHz with controlled-impedance PCB routing
Burst length Fixed 2-word linear burst; minimizes transaction overhead and aligns with common packet header/data pair sizes
Operating temperature −40°C to +85°C; validated for industrial-grade reliability in telecom infrastructure and embedded computing
Package 165-pin plastic BGA (15 mm × 17 mm); compatible with standard reflow profiles and automated assembly

Pinout & Package

UPD44324362BF5-E40X-FQ1-A is housed in a 165-pin plastic ball grid array (BGA) package measuring 15 mm × 17 mm with 0.8 mm pitch. The package uses standard JEDEC MO-245AC footprint and supports lead-free reflow soldering.

Pin/Terminal Circuit Role Design Meaning
K, K# Input clock pair Registers all control/address inputs on rising edge of K; K# provides 180° phase reference for DDR timing alignment
C, C# Output clock pair Delivers synchronized timing reference for output data; enables precise flight-time matching between clock and DQ signals
CQ, CQ# Echo clock outputs Provide data-valid indication tightly matched to DQ edges; remain active even when DQ tristates
DQ0–DQ35 Data I/O bus 36-bit bidirectional synchronous data path; supports burst read/write with per-byte write enable (BW0#–BW3#)
LD#, R, W#, BW0#–BW3# Control inputs LD# latches address/control; R,W# selects read/write; BWx# enables selective 9-bit sub-word writes
ZQ Impedance calibration input Connects to external resistor to ground to tune DQ/CQ output impedance to 35–70 Ω system bus requirement
VREF HSTL reference voltage Nominally VDDQ/2; sets switching threshold for all HSTL-compatible inputs (K, C, LD#, etc.)
TCK, TMS, TDI, TDO JTAG 1149.1 interface Enables boundary-scan testing and debug; operates at 1.8 V I/O level with dedicated power sequencing

Key Features

Feature Design Value
Pipelined DDR operation with echo clocks Eliminates need for external delay lines by delivering CQ/CQ# edges matched to DQ valid windows within ±0.35 ns
User-programmable output impedance 35–70 Ω tuning via ZQ pin resistor allows optimization for varying PCB trace impedances without layout change
Two-word burst with A0-controlled start address Supports random-access burst initiation (e.g., odd-aligned headers), enabling efficient use of 36-bit bus width
PLL-based clock recovery Locks to input clock in ≤20 μs; maintains stable output timing across voltage/temperature drift and jitter up to 0.2 ns p-p
Four independent byte-write enables Enables granular 9-bit sub-word writes (DQ0–8, DQ9–17, DQ18–26, DQ27–35) without full-word overwrite overhead
Integrated JTAG 1149.1 test access port Provides IEEE-standard boundary-scan capability for production test and in-system debug without additional probe points

Applications

Network Packet Buffering FPGA Co-Processing Memory

Use Scenario: Storing ingress/egress packet headers and payloads in Layer 3 switches with real-time classification.

IC Role / Device Role / Timing Role: High-speed DDR SRAM acting as dual-port FIFO buffer between MAC and traffic manager ASICs.

Use Value: 250 MHz DDR interface sustains 18 Gbps aggregate bandwidth across 36-bit bus, eliminating backpressure during bursty traffic.

Use Scenario: Providing low-latency, wide-data scratchpad memory for Xilinx Virtex-7 FPGA-based video analytics pipelines.

IC Role / Device Role / Timing Role: Synchronous burst memory interfaced directly to FPGA's HSTL-capable I/O banks for pixel block transfers.

Use Value: Two-word burst mode matches 16×16 pixel tile size; echo clocks (CQ/CQ#) simplify timing closure versus source-synchronous interfaces.

Industrial Motion Controller Cache Test Equipment Pattern Memory

Use Scenario: Holding interpolated motion trajectory data for multi-axis servo drives requiring deterministic microsecond response.

IC Role / Device Role / Timing Role: Deterministic latency SRAM used as instruction/data cache for real-time DSP cores.

Use Value: Clock-stop capability enables power gating between motion segments; 20 μs wake-up preserves real-time scheduling integrity.

Use Scenario: Storing high-resolution digital stimulus patterns in automated test equipment (ATE) for semiconductor wafer probing.

IC Role / Device Role / Timing Role: Burst-mode pattern generator memory synchronized to tester's master clock domain.

Use Value: Four byte-write enables allow dynamic patching of test vectors without reloading entire pattern set, reducing test time by >12%.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C2663KV18 4M × 18 organization, 300 MHz max, 165-pin BGA but 13 × 15 mm footprint Requires PCB redesign due to smaller package; lacks ZQ impedance tuning and echo clocks Choose when higher density per pin count is needed and board layout permits footprint change
AS7C336000B 1M × 36 organization, 200 MHz max, 165-pin BGA (15 × 17 mm), no PLL or echo clocks Lower speed limits throughput to 1.44 Gbps; requires external timing margining for flight-time matching Choose for cost-sensitive designs where 250 MHz DDR performance and precise clock-data alignment are not required

Compared with CY7C2663KV18 and AS7C336000B, UPD44324362BF5-E40X-FQ1-A uniquely combines 250 MHz DDR operation, echo clock outputs for data validity, and programmable output impedance-enabling robust timing closure in high-speed industrial and networking systems without layout iteration.

Availability

UPD44324362BF5-E40X-FQ1-A is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processing memory, industrial motion controller cache, and test equipment pattern memory requiring stable component supply, long-term lifecycle support, and guaranteed industrial temperature grade (-40°C to +85°C).

Supply support for UPD44324362BF5-E40X-FQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The UPD44324362BF5-E40X-FQ1-A belongs to Renesas' DDR II SRAM product line, designed specifically for high-throughput, low-latency buffering in networking, test equipment, and real-time control systems demanding deterministic DDR timing and industrial reliability.

FAQ

What is the operating temperature range for UPD44324362BF5-E40X-FQ1-A?

The UPD44324362BF5-E40X-FQ1-A is rated for industrial ambient temperature operation from −40°C to +85°C. This range is confirmed in the Ordering Information table (R10DS0036EJ0200 Rev.2.00 Page 3) under the "E40Y" suffix variant, which corresponds to the "-E40X-FQ1-A" marking indicating extended temperature qualification. Thermal resistance values (θja = 20.2°C/W) are specified for this range.

Does UPD44324362BF5-E40X-FQ1-A support true DDR timing with separate read/write clocks?

No. UPD44324362BF5-E40X-FQ1-A uses a single input clock pair (K/K#) for all register sampling and a separate output clock pair (C/C#) for data timing. As stated in the Pin Description (Page 7), C/C# provide "user controlled means of tuning device output data," and if unused, must be fixed HIGH. True bidirectional DDR clocks are not implemented; instead, it uses echo clocks (CQ/CQ#) for data validity.

How is output impedance calibrated on UPD44324362BF5-E40X-FQ1-A?

Output impedance is calibrated via the ZQ pin, which connects to an external resistor (RQ) to ground. The device sets DQ, CQ, and CQ# output impedance to 0.2 × RQ. Typical RQ values of 175–350 Ω yield 35–70 Ω output drive strength. Calibration occurs every 20 μs after power-up and tracks supply/temperature drift, as detailed on Page 8 of the datasheet.

Can UPD44324362BF5-E40X-FQ1-A operate without its PLL enabled?

Yes. Pulling DLL# LOW disables the PLL, allowing operation at frequencies below the minimum PLL lock threshold (120 MHz). However, AC/DC characteristics are not guaranteed in this mode, and read latency changes to 1.0 clock cycle. For full specification compliance, DLL# must be tied HIGH (e.g., to VDDQ via ≤10 kΩ resistor), as stated on Page 8.

What burst length does UPD44324362BF5-E40X-FQ1-A support?

The UPD44324362BF5-E40X-FQ1-A supports only fixed two-word linear burst operation. This is explicitly defined in the Description (Page 1), Features (Page 1), and Burst Sequence (Page 11) sections. There is no provision for configurable burst lengths or sequential/interleaved addressing modes - the architecture is optimized for minimal transaction overhead in high-speed buffering applications.

UPD44324362BF5-E40X-FQ1-A Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
-
Memory Format:
-
Technology:
-
Memory Size:
-
Memory Organization:
-
Memory Interface:
-
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

UPD44324362BF5-E40X-FQ1-A FAQ

1.How can I place an order for UPD44324362BF5-E40X-FQ1-A through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD44324362BF5-E40X-FQ1-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD44324362BF5-E40X-FQ1-A reliable?

The price and inventory of UPD44324362BF5-E40X-FQ1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44324362BF5-E40X-FQ1-A is usually 5 days.

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UPD44324362BF5-E40X-FQ1-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD44324362BF5-E40X-FQ1-A order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD44324362BF5-E40X-FQ1-A?

For technical support, including UPD44324362BF5-E40X-FQ1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44324362BF5-E40X-FQ1-A requirements.

6.How does Aetrix verify that UPD44324362BF5-E40X-FQ1-A is sourced from the original manufacturer or authorized distributors?

All UPD44324362BF5-E40X-FQ1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44324362BF5-E40X-FQ1-A meets industry standards.

7.What is the process for return or replacement of UPD44324362BF5-E40X-FQ1-A?

All UPD44324362BF5-E40X-FQ1-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD44324362BF5-E40X-FQ1-A, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD44324362BF5-E40X-FQ1-A part is unused and in its original packaging.

Return procedure for UPD44324362BF5-E40X-FQ1-A:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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