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Renesas UPD44325182BF5-E40-FQ1

Part No.:
UPD44325182BF5-E40-FQ1
Manufacturer:
Renesas
Category:
Memory
Package:
-
Datasheet:
AetrixUPD44325182BF5-E40-FQ1.pdf
Description:
QDR SRAM, 2MX18, 0.45NS
Quantity:
Payment:
Payment
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Inventory:380

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Product details

Overview

UPD44325182BF5-E40-FQ1 from Renesas Electronics is a 2,097,152-word × 18-bit synchronous quad data rate (QDR II) SRAM with 4.0 ns clock cycle time (250 MHz), 1.8 V core supply, HSTL interface, and 165-pin plastic BGA (15 × 17 mm) package. It supports concurrent read/write operations, burst-2 transfers, and clock-stop mode for low-power idle states - deployed in high-speed packet buffering for network switches and FPGA-based protocol accelerators.

For engineers reviewing the UPD44325182BF5-E40-FQ1 datasheet, UPD44325182BF5-E40-FQ1 pinout, UPD44325182BF5-E40-FQ1 application, or UPD44325182BF5-E40-FQ1 equivalent, key selection criteria include its dual-port DDR timing architecture, user-programmable output impedance (35–70 Ω), JTAG 1149.1 test access, and guaranteed 20 μs PLL lock after clock resumption.

Technical Context

This QDR II SRAM uses full-CMOS six-transistor memory cells and integrates a PLL for jitter-tolerant output timing, with separate K/K# input clocks for address/control registration and C/C# output clocks for precise data delivery. Its burst-2 operation delivers two words per transaction with 100% bus utilization on both read and write cycles.

The device implements independent read and write data ports, enabling simultaneous access without arbitration delay. Internally self-timed write control eliminates external write pulse generation, while clock-stop capability suspends all internal activity except PLL reset - restoring full operation within 20 μs of clock resumption.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization2,097,152 words × 18 bits (36 Mbit total)
Clock Cycle Time4.0 ns - supports 250 MHz DDR operation with guaranteed timing margins at TA = 0 to 70°C
Supply VoltageVDD = 1.8 ± 0.1 V - core logic supply; VDDQ = 1.4 V to 1.8 V - isolated I/O buffer supply
Interface StandardHSTL Class I - meets JEDEC JESD8-6A for 1.5 V/1.8 V signaling with programmable 35–70 Ω output impedance
Burst ModeFixed 2-word burst - delivers consecutive data on C# and C rising edges with no software configuration required
Operating TemperatureTA = 0 to 70°C - commercial-grade ambient range verified across all AC/DC parameters
Package165-pin plastic BGA (15 mm × 17 mm, 1.0 mm pitch) - RoHS-compliant, lead-free finish

Pinout & Package

UPD44325182BF5-E40-FQ1 is housed in a 165-pin plastic BGA (15 × 17 mm, 1.0 mm pitch) with standard ball grid layout optimized for signal integrity and thermal dissipation in high-speed memory subsystems.

Pin/TerminalCircuit RoleDesign Meaning
K, K#Input Clock PairRegisters address, R#, W#, BW0#/BW1# on rising edges; K and K# must be 180° out-of-phase for valid DDR timing
C, C#Output Clock PairControls data output timing - first word aligned to C# rising edge, second to C rising edge; tied HIGH to use K/K# as reference
R#, W#Read/Write ControlActive-low synchronous commands - both HIGH enables NOP; setup/hold referenced to K rising edge
BW0#, BW1#Byte Write SelectEnable writing to D0–D8 (BW0# = LOW) or D9–D17 (BW1# = LOW); both HIGH disables write
Q0–Q17Data Outputs18-bit DDR outputs synchronized to C/C#; high-impedance when deselected or during clock stop
D0–D17Data Inputs18-bit DDR inputs registered on K and K# rising edges; require matching setup/hold to both clocks
ZQImpedance CalibrationConnects to external resistor to ground (175–350 Ω) to calibrate Q/CQ/CQ# output impedance to 0.2×RQ
DLL#PLL DisablePull HIGH for normal operation; pull LOW only for debug at sub-120 MHz - AC/DC specs not guaranteed
TCK, TMS, TDI, TDOJTAG InterfaceIEEE 1149.1 compliant test port - 1.8 V I/O level; TCK must tie to VSS if unused

Key Features

FeatureDesign Value
Concurrent Read/Write PortsIndependent address/data paths enable simultaneous access - eliminates arbitration latency in real-time buffering
User-Programmable Output Impedance35–70 Ω tuning via ZQ pin and external resistor - matches PCB trace impedance without external termination
Two-Tick Burst OperationFixed 2-word transfer per clock cycle - reduces command overhead and maximizes bandwidth efficiency
Internally Self-Timed WriteNo external write-pulse generator needed - simplifies controller design and improves timing margin robustness
PLL-Based Output TimingWide data-valid window and scalable frequency support - enables stable operation up to 300 MHz across speed grades

Applications

Network Packet BufferingFPGA-Based Protocol Acceleration

Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches before forwarding decisions.

IC Role / Device Role / Timing Role: Dual-port QDR II SRAM serving as line-rate FIFO - reads frame headers while writing payloads concurrently.

Use Value: 250 MHz DDR throughput (9 Gbps effective) sustains 10 GbE line rate with zero packet loss under burst traffic.

Use Scenario: Offloading TCP/IP checksum, encryption, or packet classification in FPGA-accelerated NICs.

IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory for FPGA soft-core processors executing real-time packet inspection.

Use Value: Burst-2 read/write eliminates pipeline stalls - reduces average memory latency by 40% vs. single-data-rate alternatives.

Telecom Baseband ProcessingHigh-Performance Test Equipment

Use Scenario: Buffering IQ samples between ADC/DAC and DSP cores in 4G/5G radio units.

IC Role / Device Role / Timing Role: Synchronous memory interfacing directly to FPGA fabric - accepts sampled data on K# and outputs processed results on C/C#.

Use Value: Clock-stop mode cuts standby current to 310 mA - extends uptime in battery-backed remote radio heads.

Use Scenario: Capturing high-speed digital waveforms in automated test systems with >1 GS/s sampling.

IC Role / Device Role / Timing Role: Deep memory buffer staging captured data before host transfer - operates as burst-2 FIFO with deterministic latency.

Use Value: HSTL I/O and 1.8 V supply reduce switching noise - maintains <1 ps jitter on 250 MHz clock domain for measurement accuracy.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C2665KV182M × 18 organization, 3.5 ns cycle time (287 MHz), same 165-pin BGA but Cypress-specific pinoutHigher speed grade; requires PCB redesign due to non-identical pin mapping for BWx#, C/C#, and ZQSelect when 287 MHz operation is mandatory and layout revision is feasible
AS7C33256P2M × 18, 5.0 ns cycle time (200 MHz), 100-pin TQFP package - no HSTL, no burst-2, no JTAGLacks QDR timing, PLL, and concurrent ports - suitable only for asynchronous or single-data-rate control-plane storageChoose only for cost-sensitive, non-real-time applications where bandwidth and timing precision are secondary

Compared with CY7C2665KV18 and AS7C33256P, UPD44325182BF5-E40-FQ1 delivers optimal balance of 250 MHz performance, HSTL signal integrity, and JTAG debug support in a drop-in-compatible 165-pin BGA footprint - making it ideal for new designs targeting telecom and networking infrastructure.

Availability

UPD44325182BF5-E40-FQ1 is available at Aetrix Electronics and suitable for network switch buffering, FPGA-based protocol acceleration, and telecom baseband processing requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for UPD44325182BF5-E40-FQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The UPD44325182BF5-E40-FQ1 belongs to Renesas' QDR II SRAM product line, engineered specifically for high-bandwidth, low-latency buffering in networking equipment, base stations, and test instrumentation where deterministic DDR timing and concurrent access are critical.

FAQ

What is the maximum guaranteed clock frequency for UPD44325182BF5-E40-FQ1?

The UPD44325182BF5-E40-FQ1 is rated for 250 MHz operation, corresponding to a 4.0 ns clock cycle time. This specification is guaranteed across the full commercial temperature range (0 to 70°C) and includes all AC timing parameters such as TAVKH, TKHAX, and TCHQV. The device supports lower frequencies down to 120 MHz when DLL# is asserted, but AC characteristics are not guaranteed below 250 MHz unless explicitly validated per application.

Does UPD44325182BF5-E40-FQ1 support true concurrent read and write operations?

Yes, UPD44325182BF5-E40-FQ1 implements physically independent read and write data paths, allowing simultaneous access to the memory array without arbitration delay. The block diagram confirms separate address registries, data registries, and output buffers for each port. This enables real-time applications like network packet buffering where ingress data is written while egress data is read in the same clock cycle.

How is output impedance calibrated on UPD44325182BF5-E40-FQ1?

Output impedance calibration on UPD44325182BF5-E40-FQ1 is performed via the ZQ pin, which connects to an external resistor (175–350 Ω) to ground. The internal circuitry sets Q, CQ, and CQ# output impedance to 0.2×RQ. Calibration occurs automatically every 20 μs after power-up and tracks voltage/temperature drift. Direct connection of ZQ to VDDQ minimizes impedance; grounding or leaving ZQ floating is prohibited.

Can UPD44325182BF5-E40-FQ1 operate without using the C and C# output clocks?

Yes, UPD44325182BF5-E40-FQ1 can operate with C and C# fixed HIGH, causing data outputs to align with K and K# rising edges instead of C/C#. However, this mode sacrifices the flight-time matching benefit of echo clocks and reduces timing margin. The datasheet mandates that C and C# be fixed HIGH - not left floating - to ensure guaranteed operation when bypassing the output clock path.

What JTAG functionality does UPD44325182BF5-E40-FQ1 provide?

UPD44325182BF5-E40-FQ1 implements IEEE 1149.1 JTAG test access with TCK, TMS, TDI, and TDO pins operating at 1.8 V I/O level. These signals support boundary-scan testing and device identification. If JTAG is unused, TCK must be tied to VSS; TMS and TDI may be left unconnected. TDO should be pulled up to VDD when externally driven. No internal JTAG instruction set beyond standard BYPASS and SAMPLE/PRELOAD is documented for this SRAM.

UPD44325182BF5-E40-FQ1 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
-
Memory Format:
-
Technology:
-
Memory Size:
-
Memory Organization:
-
Memory Interface:
-
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

UPD44325182BF5-E40-FQ1 FAQ

1.How can I place an order for UPD44325182BF5-E40-FQ1 through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD44325182BF5-E40-FQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD44325182BF5-E40-FQ1 reliable?

The price and inventory of UPD44325182BF5-E40-FQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44325182BF5-E40-FQ1 is usually 5 days.

3.What payment methods are accepted for UPD44325182BF5-E40-FQ1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD44325182BF5-E40-FQ1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UPD44325182BF5-E40-FQ1?

UPD44325182BF5-E40-FQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD44325182BF5-E40-FQ1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD44325182BF5-E40-FQ1?

For technical support, including UPD44325182BF5-E40-FQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44325182BF5-E40-FQ1 requirements.

6.How does Aetrix verify that UPD44325182BF5-E40-FQ1 is sourced from the original manufacturer or authorized distributors?

All UPD44325182BF5-E40-FQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44325182BF5-E40-FQ1 meets industry standards.

7.What is the process for return or replacement of UPD44325182BF5-E40-FQ1?

All UPD44325182BF5-E40-FQ1 units undergo pre-shipment inspection (PSI). If there is an issue with UPD44325182BF5-E40-FQ1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD44325182BF5-E40-FQ1 part is unused and in its original packaging.

Return procedure for UPD44325182BF5-E40-FQ1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

UPD44325182BF5-E40-FQ1 Tags

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