Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas UPD44325182BF5-E40-FQ1-A

Part No.:
UPD44325182BF5-E40-FQ1-A
Manufacturer:
Renesas
Category:
Memory
Package:
165-FBGA
Datasheet:
AetrixUPD44325182BF5-E40-FQ1-A.pdf
Description:
IC SRAM 36MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,546

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

UPD44325182BF5-E40-FQ1-A from Renesas Electronics is a 2,097,152-word × 18-bit synchronous Quad Data Rate II (QDR II) SRAM with 4.0 ns clock cycle time (250 MHz), 1.8 V core supply, HSTL interface, and 165-pin plastic BGA (15 × 17) package. It supports concurrent read/write operations, burst-2 DDR transactions, and is used in high-bandwidth networking buffers and packet forwarding engines.

For engineers reviewing the UPD44325182BF5-E40-FQ1-A datasheet, UPD44325182BF5-E40-FQ1-A pinout, UPD44325182BF5-E40-FQ1-A application, or UPD44325182BF5-E40-FQ1-A equivalent, key selection considerations include its 2M × 18 organization, 250 MHz QDR II timing, HSTL I/O compliance, PLL-enabled output clock alignment, and user-programmable output impedance (35–70 Ω).

Technical Context

This device implements a dual-port synchronous architecture with independent read and write data paths, enabling true concurrent access without arbitration overhead. Its burst-2 operation delivers two words per clock cycle on both ports, achieving 100% bus utilization under DDR timing.

The internal PLL synchronizes C/C# output clocks to K/K# inputs for precise flight-time matching, while DLL# allows PLL bypass during debug. Echo clocks CQ/CQ# provide tightly matched data-valid timing references, and ZQ enables dynamic output impedance calibration against system trace impedance.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization2,097,152 words × 18 bits - provides 36 Mbit density with wide data path for burst-2 packet buffering
Clock Cycle Time4.0 ns - supports 250 MHz operation with guaranteed timing margins across industrial temperature range
Supply VoltageVDD = 1.8 ± 0.1 V, VDDQ = 1.4–1.8 V - dual-rail design isolates core logic from I/O drivers to reduce noise coupling
Interface StandardHSTL Class I - ensures compatibility with FPGA and ASIC memory controllers using 1.5 V I/O swing and VREF-based input thresholds
Output ImpedanceUser-programmable 35–70 Ω via ZQ pin - enables trace impedance matching without external termination resistors
Operating Temperature0 °C to +70 °C - validated for commercial/industrial embedded systems requiring stable timing at full speed
Package165-pin plastic BGA (15 × 17 mm) - standard footprint compatible with automated PCB assembly and thermal management

Pinout & Package

165-pin plastic BGA (15 × 17 mm) with 0.8 mm pitch; top-side index mark per JEDEC MO-270. Package includes dedicated HSTL-compatible power (VDD, VDDQ), ground (VSS), reference (VREF), and impedance calibration (ZQ) pins.

Pin/TerminalCircuit RoleDesign Meaning
K, K#Input clock pairRegisters address/control on K rising edge and write data on K# rising edge; phase-aligned 180° differential pair required for timing closure
C, C#Output clock pairControls output data timing; rising edges define valid windows for Q0–Q17; must be tied HIGH if using K/K# as output reference
CQ, CQ#Echo clock outputsMatched to Q outputs within ±0.35 ns; remain active during tristate and provide hardware-validated data-ready signal
R#, W#Read/write strobesActive-low synchronous commands; both high = NOP; setup/hold referenced to K rising edge only
BW0#, BW1#Byte write enablesSelect D0–D8 or D9–D17 for partial writes; independent control per burst word enables efficient sub-word updates
ZQImpedance calibration inputConnects to external resistor to ground; sets Q/CQ/CQ# output drive strength to 0.2 × RQ for controlled 35–70 Ω range
DLL#PLL disablePull HIGH for normal operation; pull LOW to bypass PLL during low-frequency debug - AC specs not guaranteed
TMS, TDI, TCK, TDOJTAG 1149.1 interface1.8 V I/O level test access port; TCK must tie to VSS if unused; supports boundary-scan and device ID verification

Key Features

FeatureDesign Value
Concurrent read/write portsEnables simultaneous packet ingress/egress in switch fabric without arbitration latency or pipeline stalls
Burst-2 DDR operationDelivers two 18-bit words per clock edge pair, doubling effective bandwidth versus single-data-rate SRAM
Programmable output impedanceEliminates need for discrete series termination resistors, reducing BOM count and PCB area in high-speed routing
PLL-synchronized output clocksReduces clock skew between C/C# and Q outputs to <0.45 ns, simplifying timing closure in 250 MHz systems
Clock-stop capabilityEnters low-power state with 20 μs recovery to full operation - supports dynamic power gating in bursty traffic scenarios

Applications

Network Packet BufferHigh-Speed Test Equipment

Use Scenario: Storing incoming Ethernet frames in a Layer 2 switch before classification and forwarding.

IC Role / Device Role / Timing Role: Dual-port QDR II SRAM serving as first-in-first-out (FIFO) buffer with separate read/write address spaces and burst-2 throughput.

Use Value: 250 MHz DDR operation delivers 9 Gbps sustained bandwidth, enabling line-rate 10GbE packet buffering without backpressure.

Use Scenario: Capturing high-resolution waveform samples in automated test equipment with real-time pattern generation.

IC Role / Device Role / Timing Role: High-density memory for deep sample storage, interfaced to FPGA logic implementing parallel compare and trigger functions.

Use Value: Concurrent read/write allows simultaneous acquisition and analysis, eliminating memory contention bottlenecks in multi-channel test systems.

Baseband Processing BufferIndustrial PLC Data Exchange

Use Scenario: Temporary storage of OFDM symbol data between FFT processing stages in LTE/5G baseband units.

IC Role / Device Role / Timing Role: Synchronous SRAM acting as ping-pong buffer between digital front-end and channel estimation blocks.

Use Value: HSTL interface ensures clean signal integrity at 250 MHz, while programmable impedance matches PCB traces for minimal reflection-induced jitter.

Use Scenario: Exchanging deterministic I/O data between redundant CPU modules in safety-critical programmable logic controllers.

IC Role / Device Role / Timing Role: Deterministic-access memory providing atomic read-modify-write cycles for shared process variables.

Use Value: Clock-stop mode enables synchronized power-down of redundant channels without data loss, supporting SIL3-certified fail-safe transitions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C2663KV18-400BAXI400 MHz (2.5 ns), 2M × 18, same 165-pin BGA but requires 1.5 V VDDQ onlyHigher speed but tighter voltage tolerance; less margin for VDDQ droop in noisy environmentsSelect when system clock exceeds 250 MHz and board layout supports stricter 1.5 V regulation
AS7C3256A-15JINAsynchronous 32K × 8 CMOS SRAM, 15 ns access, SOJ-32 packageNo burst, no DDR, no PLL - simpler interface but 1/33rd bandwidth and incompatible pinoutSelect only for legacy designs where QDR timing and concurrency are unnecessary and cost is primary constraint

Compared with CY7C2663KV18-400BAXI and AS7C3256A-15JIN, UPD44325182BF5-E40-FQ1-A offers optimal balance of 250 MHz performance, industrial temperature support, and flexible 1.4–1.8 V VDDQ operation - making it suitable for new designs requiring reliable QDR II functionality without over-spec'ing speed or sacrificing voltage margin.

Availability

UPD44325182BF5-E40-FQ1-A is available at Aetrix Electronics and suitable for network packet buffering, high-speed test instrumentation, baseband processing, industrial PLC data exchange, and deterministic real-time control applications requiring stable component supply and long-term lifecycle support.

Supply support for UPD44325182BF5-E40-FQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor manufacturer specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The UPD44325182BF5-E40-FQ1-A belongs to Renesas' QDR II SRAM product line, designed specifically for high-throughput, low-latency buffering in networking, telecommunications, and test equipment where concurrent dual-port access and precise DDR timing are critical.

FAQ

What is the maximum operating frequency of the UPD44325182BF5-E40-FQ1-A?

The UPD44325182BF5-E40-FQ1-A is rated for 250 MHz operation, corresponding to a 4.0 ns clock cycle time. This specification is guaranteed across the full 0 °C to +70 °C ambient temperature range and includes timing margins for setup/hold, clock jitter, and output validity. The device achieves this using an internal PLL that locks to the K/K# input clock and generates aligned C/C# output clocks.

Does the UPD44325182BF5-E40-FQ1-A support byte-level write masking?

Yes, the UPD44325182BF5-E40-FQ1-A supports byte-level write masking via two dedicated inputs: BW0# and BW1#. These active-low signals enable selective writing of D0–D8 (BW0# low) or D9–D17 (BW1# low) during each burst-2 write cycle. Both signals must be high to inhibit all writes. This feature allows efficient partial-word updates without read-modify-write overhead.

How does the ZQ pin function on the UPD44325182BF5-E40-FQ1-A?

The ZQ pin on the UPD44325182BF5-E40-FQ1-A serves as the output impedance calibration input. When connected to a precision resistor (typically 200 Ω) to ground, it configures the drive strength of Q, CQ, and CQ# outputs to 0.2 × RQ - yielding a calibrated range of 35–70 Ω. This eliminates external series termination and adapts dynamically every 20 μs to compensate for voltage and temperature drift.

Can the UPD44325182BF5-E40-FQ1-A operate without its internal PLL?

Yes, the UPD44325182BF5-E40-FQ1-A can operate without the internal PLL by asserting DLL# low. In this mode, the device uses K/K# directly as output timing references instead of C/C#, bypassing the PLL lock requirement. However, AC electrical characteristics including timing parameters and jitter tolerance are not guaranteed in PLL-bypass mode - it is intended only for debug or low-frequency validation.

What is the purpose of the CQ and CQ# pins on the UPD44325182BF5-E40-FQ1-A?

The CQ and CQ# pins on the UPD44325182BF5-E40-FQ1-A are synchronous echo clocks that track Q0–Q17 output data edges with tight skew (<0.35 ns). They remain active even when Q outputs are tristated and provide hardware-verified data-valid timing references for receiving logic - eliminating reliance on clock-to-output delay calculations and simplifying timing closure in high-speed interfaces.

UPD44325182BF5-E40-FQ1-A Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
165-FBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
36Mbit
Memory Organization:
2M x 18
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
4ns
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

UPD44325182BF5-E40-FQ1-A FAQ

1.How can I place an order for UPD44325182BF5-E40-FQ1-A through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD44325182BF5-E40-FQ1-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD44325182BF5-E40-FQ1-A reliable?

The price and inventory of UPD44325182BF5-E40-FQ1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44325182BF5-E40-FQ1-A is usually 5 days.

3.What payment methods are accepted for UPD44325182BF5-E40-FQ1-A?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD44325182BF5-E40-FQ1-A transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UPD44325182BF5-E40-FQ1-A?

UPD44325182BF5-E40-FQ1-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD44325182BF5-E40-FQ1-A order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD44325182BF5-E40-FQ1-A?

For technical support, including UPD44325182BF5-E40-FQ1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44325182BF5-E40-FQ1-A requirements.

6.How does Aetrix verify that UPD44325182BF5-E40-FQ1-A is sourced from the original manufacturer or authorized distributors?

All UPD44325182BF5-E40-FQ1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44325182BF5-E40-FQ1-A meets industry standards.

7.What is the process for return or replacement of UPD44325182BF5-E40-FQ1-A?

All UPD44325182BF5-E40-FQ1-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD44325182BF5-E40-FQ1-A, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD44325182BF5-E40-FQ1-A part is unused and in its original packaging.

Return procedure for UPD44325182BF5-E40-FQ1-A:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

UPD44325182BF5-E40-FQ1-A Tags

  • UPD44325182BF5-E40-FQ1-A
  • UPD44325182BF5-E40-FQ1-A PDF
  • UPD44325182BF5-E40-FQ1-A Datasheet
  • UPD44325182BF5-E40-FQ1-A Specifications
  • UPD44325182BF5-E40-FQ1-A Images
  • Renesas
  • Renesas UPD44325182BF5-E40-FQ1-A
  • Buy UPD44325182BF5-E40-FQ1-A
  • UPD44325182BF5-E40-FQ1-A Price
  • UPD44325182BF5-E40-FQ1-A Distributor
  • UPD44325182BF5-E40-FQ1-A Supplier
  • UPD44325182BF5-E40-FQ1-A Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER