Renesas UPD44325184BF5-E33-FQ1
- Part No.:
- UPD44325184BF5-E33-FQ1
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
UPD44325184BF5-E33-FQ1.pdf
- Description:
- QDR SRAM, 2MX18, 0.45NS
- Quantity:
- Payment:

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Product details
Overview
UPD44325184BF5-E33-FQ1 from Renesas Electronics is a 2,097,152-word × 18-bit synchronous quad data rate (QDR II) SRAM with 3.3 ns clock cycle time (300 MHz), 1.8 V core supply, HSTL interface, and 165-pin plastic BGA (15 × 17) package. It supports concurrent read/write operations, four-word burst, and PLL-based output timing for high-speed networking buffer applications.
For engineers reviewing the UPD44325184BF5-E33-FQ1 datasheet, UPD44325184BF5-E33-FQ1 pinout, UPD44325184BF5-E33-FQ1 application, or UPD44325184BF5-E33-FQ1 equivalent, key selection criteria include QDR II burst timing compliance, HSTL-1 I/O compatibility, 18-bit wide data path, 300 MHz operation under 0–70°C ambient, and impedance-programmable outputs via ZQ pin.
Technical Context
This QDR II SRAM uses dual-clock architecture: K/K# registers address/control on rising edges and latches input data across both K and K# edges, while C/C# control output timing with precise flight-time matching. Its internal burst counter and separate read/write data ports enable true concurrent transactions without arbitration delay.
The device integrates a PLL for jitter-tolerant output data valid window extension and supports clock-stop mode with 20 μs recovery. User-programmable output impedance (35–70 Ω) via external ZQ resistor enables dynamic bus termination matching to system trace impedance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 2,097,152 words × 18 bits = 36 Mbit total density; supports 18-bit parallel data path for high-throughput packet buffering. |
| Clock Cycle Time | 3.3 ns (300 MHz); defines minimum clock period for full-speed operation in high-bandwidth switch fabric interfaces. |
| Supply Voltage | VDD = 1.7–1.9 V; VDDQ = 1.4–VDD V; strict 1.8 V nominal core ensures low-power, noise-immune operation in dense PCB layouts. |
| I/O Interface | HSTL Class I compliant; matches JEDEC JESD8-6; enables direct interfacing with FPGA/ASIC memory controllers without level-shifting. |
| Burst Operation | Fixed 4-word burst per transaction; reduces address bus frequency by 4×, simplifying controller design and minimizing routing congestion. |
| Operating Temperature | 0°C to +70°C ambient; validated for commercial-grade telecom and industrial embedded systems with stable thermal profiles. |
| Package | 165-pin plastic BGA (15 × 17 mm); RoHS-compliant lead-free construction with standard 0.8 mm ball pitch for manufacturable assembly. |
Pinout & Package
165-pin plastic BGA (15 × 17 mm), 0.8 mm ball pitch, RoHS-compliant lead-free construction. Pin mapping follows μPD44325184B-specific top-view arrangement with dedicated address, data, control, clock, and power balls.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A[0:18] | Synchronous Address Input | 19-bit registered address bus; latched on rising edge of K; enables 2M-word addressing with internal LSBs for burst sequencing. |
| D[0:17] | Synchronous Data Input | 18-bit write data path; registered on rising edges of both K and K#; supports byte-write via BW0#/BW1# for partial-word updates. |
| Q[0:17] | Synchronous Data Output | 18-bit read data path; synchronized to C/C# rising edges (or K/K# if C/C# tied HIGH); delivers burst data with echo clock alignment. |
| K, K# | Input Clock Pair | Differential input clock; registers all control and address inputs on K rising edge; K# phase-aligned for dual-edge data capture. |
| C, C# | Output Clock Pair | User-controlled timing reference; C# clocks first/third output words, C clocks second/fourth; enables flight-time skew compensation. |
| R#, W# | Read/Write Command | Active-low synchronous commands; initiate burst read or write on next K rising edge; mutually exclusive per cycle (read takes precedence). |
| BW0#, BW1# | Byte Write Select | Active-low controls 9-bit byte segments; BW0#=LOW writes D[0:8], BW1#=LOW writes D[9:17]; both LOW enables full 18-bit write. |
| ZQ | Impedance Calibration Input | Connects to external resistor to ground; sets Q/CQ/CQ# output impedance to 0.2 × RQ; supports 35–70 Ω tuning for signal integrity. |
| VDD, VDDQ, VSS | Power Supplies | VDD = 1.8 V core; VDDQ = isolated 1.5 V (or 1.8 V) I/O supply; VSS = common ground; decoupling required per JEDEC guidelines. |
| CQ, CQ# | Echo Clock Output | Output-synchronized clocks tightly matched to Q data edges; used as data-valid strobes at receiving end; continue running during tristate. |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent Read/Write Ports | Independent 18-bit read and write data paths enable simultaneous access-critical for full-duplex packet buffering in network processors. |
| PLL-Based Output Timing | Integrated PLL widens data valid window and supports future frequency scaling up to 300 MHz without external timing margining. |
| Four-Tick Burst Architecture | Fixed 4-word burst reduces effective address bus frequency by 75%, lowering controller complexity and PCB routing density. |
| User-Programmable Output Impedance | ZQ pin allows real-time 35–70 Ω output driver tuning to match PCB trace impedance-eliminates need for external series resistors. |
| IEEE 1149.1 JTAG Support | Full boundary-scan test access (TMS, TDI, TCK, TDO) enables production testability and debug visibility in high-density systems. |
Applications
| High-Speed Network Switch Buffer | Telecom Line Card Packet Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet switches with line-rate forwarding. IC Role / Device Role / Timing Role: Dual-port QDR II SRAM serving as shared buffer between ingress parser and egress scheduler; operates at 300 MHz with zero wait-state latency. Use Value: Concurrent read/write eliminates arbitration stalls, enabling sustained 6 Gbps (18-bit × 300 MHz) throughput per port for non-blocking fabric designs. | Use Scenario: Buffering ATM or IP cells in carrier-grade DSLAMs and OLT line cards requiring deterministic latency and burst resilience. IC Role / Device Role / Timing Role: High-density 36 Mbit memory providing deep FIFO storage for traffic shaping and QoS queuing engines. Use Value: 4-word burst and HSTL interface ensure sub-ns timing margins against FPGA memory controllers, reducing jitter-induced cell loss. |
| Baseband Processor L2 Cache | Industrial Real-Time Control FIFO |
Use Scenario: Off-chip L2 cache extension for multicore baseband processors in 4G/LTE femtocells handling real-time channel decoding. IC Role / Device Role / Timing Role: Low-latency, high-bandwidth memory co-located with processor die; accessed via dedicated AXI/QDR bridge logic. Use Value: 3.3 ns cycle time and clock-stop capability support burst-mode processing with 20 μs wake-up-enabling aggressive power gating. | Use Scenario: Deterministic data staging between motion controller ASIC and servo drive interface in CNC machines. IC Role / Device Role / Timing Role: Synchronous FIFO buffer ensuring jitter-free transfer of position setpoints and encoder feedback at 10 kHz update rates. Use Value: Separate read/write ports and HSTL signaling guarantee <1 ns skew between command and data paths-meeting IEC 61800-3 EMC requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C2663KV18 | 2M × 18, 300 MHz, 1.8 V, 165-ball BGA; Cypress (now Infineon) QDR II+ variant with enhanced DLL and lower IDD. | Supports QDR II+ features including programmable burst length and extended temperature range (−40°C to +85°C). | Preferred for new designs requiring extended temp range or tighter AC timing specs; requires minor layout review due to different pinout. |
| AS7C33618B | 2M × 18, 250 MHz, 1.8 V, 165-ball BGA; Alliance Memory QDR II drop-in replacement with identical pinout and timing. | Limited to 4.0 ns cycle time (250 MHz); no clock-stop or ZQ calibration; simpler feature set. | Cost-optimized alternative for non-critical 250 MHz applications where full QDR II feature set is unused. |
Compared with UPD44325184BF5-E33-FQ1, CY7C2663KV18 offers higher reliability margins and extended temperature support but requires firmware adaptation for QDR II+ modes, while AS7C33618B provides pin-compatible cost reduction at the expense of 17% bandwidth and missing impedance tuning.
Availability
UPD44325184BF5-E33-FQ1 is available at Aetrix Electronics and suitable for high-speed network switch buffers, telecom line card packet memory, and industrial real-time control FIFOs requiring stable component supply across multi-year production cycles.
Supply support for UPD44325184BF5-E33-FQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The μPD44325xxx family targets high-performance packet buffering in networking and telecom equipment, delivering QDR II architecture optimized for deterministic latency, concurrent access, and HSTL interoperability with FPGA-based controllers.
FAQ
What is the maximum guaranteed clock frequency for UPD44325184BF5-E33-FQ1?
The UPD44325184BF5-E33-FQ1 is rated for 300 MHz operation with a 3.3 ns clock cycle time, validated across 0°C to +70°C ambient temperature and 1.7–1.9 V VDD supply. This frequency is guaranteed per the R10DS0039EJ0200 datasheet Rev.2.00 timing specifications under standard HSTL loading conditions.
Does UPD44325184BF5-E33-FQ1 support independent read and write operations simultaneously?
Yes, UPD44325184BF5-E33-FQ1 implements true concurrent read and write ports with separate 18-bit data paths. The device allows overlapping read and write bursts without arbitration delay, provided R# and W# are not asserted on the same K clock edge-read commands take precedence when both are active.
How is output impedance calibrated on UPD44325184BF5-E33-FQ1?
UPD44325184BF5-E33-FQ1 uses the ZQ pin to calibrate output driver impedance. A precision resistor (RQ) is connected from ZQ to ground, setting Q, CQ, and CQ# output impedance to 0.2 × RQ. Supported range is 35–70 Ω, corresponding to RQ = 175–350 Ω, with automatic recalibration every 20 μs after power-up.
What is the function of the C and C# pins on UPD44325184BF5-E33-FQ1?
The C and C# pins on UPD44325184BF5-E33-FQ1 serve as user-controlled output clocks. C# times the first and third words of a 4-word burst, while C times the second and fourth. They enable precise flight-time matching between clock and data at the receiver, and must be held HIGH if K/K# are used instead for output timing.
Can UPD44325184BF5-E33-FQ1 operate with stopped clocks, and what is the recovery time?
Yes, UPD44325184BF5-E33-FQ1 supports clock-stop mode: when K/K# are halted, the device retains state and resumes normal operation within 20 μs after clock restart. During stop, C/C# and CQ/CQ# also halt, but output drivers remain in last state-not tristated-ensuring deterministic behavior in low-power states.
UPD44325184BF5-E33-FQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
UPD44325184BF5-E33-FQ1 FAQ
1.How can I place an order for UPD44325184BF5-E33-FQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD44325184BF5-E33-FQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD44325184BF5-E33-FQ1 reliable?
The price and inventory of UPD44325184BF5-E33-FQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44325184BF5-E33-FQ1 is usually 5 days.
3.What payment methods are accepted for UPD44325184BF5-E33-FQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD44325184BF5-E33-FQ1 transactions.
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4.How is shipping managed for UPD44325184BF5-E33-FQ1?
UPD44325184BF5-E33-FQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD44325184BF5-E33-FQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD44325184BF5-E33-FQ1?
For technical support, including UPD44325184BF5-E33-FQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44325184BF5-E33-FQ1 requirements.
6.How does Aetrix verify that UPD44325184BF5-E33-FQ1 is sourced from the original manufacturer or authorized distributors?
All UPD44325184BF5-E33-FQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44325184BF5-E33-FQ1 meets industry standards.
7.What is the process for return or replacement of UPD44325184BF5-E33-FQ1?
All UPD44325184BF5-E33-FQ1 units undergo pre-shipment inspection (PSI). If there is an issue with UPD44325184BF5-E33-FQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD44325184BF5-E33-FQ1 part is unused and in its original packaging.
Return procedure for UPD44325184BF5-E33-FQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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