Renesas UPD44325362BF5-E40-FQ1
- Part No.:
- UPD44325362BF5-E40-FQ1
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-FBGA
- Datasheet:
-
UPD44325362BF5-E40-FQ1.pdf
- Description:
- IC SRAM 36MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
UPD44325362BF5-E40-FQ1 from Renesas Electronics is a 1,048,576-word × 36-bit synchronous Quad Data Rate II (QDR II) SRAM with 4.0 ns clock cycle time (250 MHz), HSTL interface, 1.8 V core supply, and 165-pin plastic BGA (15 × 17 mm) packaging. It supports concurrent read/write operations, two-word burst, and PLL-based output timing control for high-speed networking buffer applications.
For engineers reviewing the UPD44325362BF5-E40-FQ1 datasheet, UPD44325362BF5-E40-FQ1 pinout, UPD44325362BF5-E40-FQ1 application, or UPD44325362BF5-E40-FQ1 equivalent, key selection considerations include its 36-bit wide DDR interface, user-programmable output impedance (35–70 Ω), echo clock outputs (CQ/CQ#), JTAG 1149.1 test port, and clock-stop capability with 20 μs recovery.
Technical Context
This QDR II SRAM uses full-CMOS six-transistor memory cells and integrates dual-clock synchronous logic: K/K# for address/control/data input registration and C/C# for precise output data timing. Its architecture enables simultaneous independent read and write ports with 100% bus utilization in DDR mode.
The device implements an on-die PLL for jitter-tolerant operation and wide data-valid windows, supports byte-write masking via four BW# signals (BW0#–BW3#), and delivers synchronized echo clocks (CQ/CQ#) tightly matched to output data edges-critical for source-synchronous timing in high-speed packet buffers and FPGA interconnects.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 1,048,576 words × 36 bits = 36 Mbit total capacity; supports 2-word burst reads/writes per clock cycle |
| Clock Cycle Time | 4.0 ns (250 MHz); defines minimum clock period for guaranteed timing compliance at industrial temperature range |
| Supply Voltage | VDD = 1.7–1.9 V (core), VDDQ = 1.4–VDD V (I/O); enables low-power, noise-immune HSTL Class I signaling |
| Interface Standard | HSTL Class I compliant; ensures signal integrity at 250 MHz with controlled-impedance outputs (35–70 Ω) |
| Package | 165-pin plastic BGA (15 mm × 17 mm); provides 36 data inputs (D0–D35), 36 data outputs (Q0–Q35), and dedicated echo clocks (CQ/CQ#) |
| Operating Temperature | 0 °C to +70 °C (E-series); validated for stable operation in telecom line cards and industrial controllers |
| Power Consumption | IDD = 690 mA typical (250 MHz, TA = 0–70°C); includes concurrent read/write activity and PLL active |
Pinout & Package
UPD44325362BF5-E40-FQ1 is housed in a 165-pin plastic BGA (15 × 17 mm grid, ball pitch 0.8 mm), with power/ground distributed across interior rows and high-speed I/O (D/Q/CQ/C/C#/K/K#/R#/W#/BW0#–BW3#) placed on perimeter for optimal signal routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| K, K# | Input Clock Pair | Registers address, control, and write data on rising edges; K and K# must be 180° out-of-phase for proper DDR timing alignment |
| C, C# | Output Clock Pair | Controls output data timing; rising edges define valid windows for Q0–Q35 and CQ/CQ#; can be tied HIGH to use K/K# instead |
| CQ, CQ# | Echo Clock Outputs | Source-synchronous clocks tightly matched to Q outputs; used by receiving device for data capture without external delay compensation |
| R#, W# | Read/Write Enable | Active-low synchronous commands; initiate burst-2 transactions on next K edge; both high = NOP (high-Z outputs) |
| BW0#–BW3# | Byte Write Selects | Four independent active-low signals enabling selective 9-bit byte writes within 36-bit word; supports partial-word updates without read-modify-write |
| D0–D35 | Data Inputs | 36-bit synchronous write data bus; registered on K and K# rising edges; each byte mapped to one BW# signal |
| Q0–Q35 | Data Outputs | 36-bit synchronous read data bus; delivered on C/C# rising edges; output impedance programmable via ZQ pin |
| ZQ | Impedance Calibration | Connects to external resistor to ground (175–350 Ω) to calibrate Q/CQ/CQ# output drive strength; critical for signal integrity on 250 MHz buses |
| DLL# | PLL Disable | Active-low input; forces bypass of internal PLL for low-frequency debug; must be HIGH (tied to VDDQ) for normal 250 MHz operation |
| TMS, TDI, TCK, TDO | JTAG Test Port | IEEE 1149.1-compliant boundary scan interface; operates at 1.8 V I/O level; TCK must tie to VSS if unused |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent Read/Write Ports | Enables full-duplex memory access-critical for real-time packet buffering where ingress and egress paths operate simultaneously |
| Two-Word Burst Operation | Reduces command overhead and maximizes bandwidth efficiency; delivers 72 bits per clock cycle (36-bit × 2) in DDR mode |
| User-Programmable Output Impedance | 35–70 Ω calibration via ZQ pin eliminates need for external series termination resistors on high-speed PCB traces |
| Source-Synchronous Echo Clocks (CQ/CQ#) | Eliminates flight-time skew between data and clock at receiver; enables reliable capture at 250 MHz without complex deskew circuitry |
| PLL-Based Timing Engine | Provides wide data-valid window and supports future frequency scaling up to 300 MHz while maintaining jitter tolerance |
| Clock-Stop Capability | Enters low-power state with 20 μs recovery; allows dynamic power gating during idle periods in bursty traffic scenarios |
Applications
| High-Speed Network Packet Buffer | FPGA-to-ASIC Interconnect Cache |
|---|---|
Use Scenario: Line-rate buffering in 10 GbE switch fabric ASICs handling variable-length Ethernet frames. IC Role / Device Role / Timing Role: Primary shared-memory buffer with concurrent read/write ports synchronized to 250 MHz system clocks. Use Value: 36-bit width matches common internal bus widths; echo clocks (CQ/CQ#) eliminate timing closure challenges on 15 cm FPGA-to-SRAM traces. |
Use Scenario: High-bandwidth data staging between Xilinx UltraScale+ FPGA and custom DSP ASIC in radar processing subsystem. IC Role / Device Role / Timing Role: Low-latency, burst-mode memory bridge supporting 250 MHz DDR transfers with deterministic 4.0 ns cycle timing. Use Value: Byte-write enable (BW0#–BW3#) allows partial-word updates without full-word read-modify-write, reducing latency by >30% in sparse update patterns. |
| Telecom Baseband Processing Memory | Industrial Real-Time Control FIFO |
Use Scenario: UMTS/LTE baseband processor requiring low-jitter, high-density memory for channel estimation and FFT coefficient storage. IC Role / Device Role / Timing Role: Synchronous SRAM providing deterministic 250 MHz access to multi-dimensional coefficient arrays. Use Value: PLL circuitry ensures stable output timing under voltage/temperature variation; HSTL I/O meets ETSI radiated emission limits. |
Use Scenario: Motion controller PLC executing servo loop updates at 20 kHz with jitter < 100 ns. IC Role / Device Role / Timing Role: Deterministic latency FIFO storing position/velocity commands between ARM Cortex-R5 and motor driver ASIC. Use Value: Clock-stop feature reduces standby current to 330 mA; 20 μs wake-up ensures no loop-cycle interruption during brief idle intervals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C2663KV18-400BZXC | 36 Mbit (1M × 36), 400 MHz (2.5 ns), 1.8 V core, 165-pin BGA; higher speed but wider voltage tolerance (VDD = 1.7–1.95 V) | Requires tighter layout for 400 MHz; lacks echo clock outputs (CQ/CQ#), increasing timing margin burden | Select when system clock exceeds 250 MHz and board-level deskew is feasible |
| AS7C336256P-15JIN | 36 Mbit (1M × 36), 15 ns async access, 3.3 V supply, 100-pin TQFP; asynchronous interface, no burst or DDR support | Suitable only for non-critical control-plane storage; cannot replace UPD44325362BF5-E40-FQ1 in data-path applications | Select only for legacy designs lacking DDR infrastructure or where timing determinism is not required |
Compared with CY7C2663KV18-400BZXC and AS7C336256P-15JIN, UPD44325362BF5-E40-FQ1 delivers optimal balance of 250 MHz performance, source-synchronous timing (CQ/CQ#), and industrial temperature support-enabling robust data-path implementation without added timing compensation circuitry.
Availability
UPD44325362BF5-E40-FQ1 is available at Aetrix Electronics and suitable for high-speed network packet buffering, FPGA-to-ASIC interconnect caching, and telecom baseband processing requiring stable component supply across production lifecycles.
Supply support for UPD44325362BF5-E40-FQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.
The UPD44325362BF5-E40-FQ1 belongs to Renesas' QDR II SRAM product line, engineered specifically for deterministic, low-latency, high-bandwidth memory interfacing in networking and signal processing systems operating at 200–300 MHz.
FAQ
What is the maximum supported clock frequency for UPD44325362BF5-E40-FQ1?
The UPD44325362BF5-E40-FQ1 is rated for 250 MHz operation with a 4.0 ns clock cycle time. While faster variants (e.g., -E33/-E35) support up to 300 MHz, this specific part is characterized and guaranteed for stable timing only at ≤250 MHz across 0–70°C ambient temperature. Exceeding this frequency violates AC timing specifications and may cause data corruption.
Does UPD44325362BF5-E40-FQ1 support true concurrent read and write operations?
Yes, UPD44325362BF5-E40-FQ1 features physically separate read and write data ports (Q0–Q35 and D0–D35) and independent control logic, enabling simultaneous read and write transactions without arbitration delay. This is confirmed in the block diagram (Page 9) and truth table (Page 11), where R# and W# can be asserted concurrently.
How is output impedance calibrated on UPD44325362BF5-E40-FQ1?
Output impedance for Q, CQ, and CQ# drivers is calibrated using the ZQ pin. A resistor (175–350 Ω) is connected from ZQ to ground; the device measures this resistance and sets output drive strength to 0.2 × RQ. Calibration occurs automatically every 20 μs after power-up and tracks supply/temperature drift-no software intervention required.
Can UPD44325362BF5-E40-FQ1 operate without the internal PLL?
Yes-asserting DLL# = LOW disables the PLL and forces the device to operate using raw K/K# timing. However, AC/DC characteristics are not guaranteed in this mode, and it is intended only for low-frequency debugging. For normal 250 MHz operation, DLL# must be HIGH (tied to VDDQ via ≤10 kΩ resistor) to ensure PLL lock and jitter-tolerant timing.
What is the purpose of the CQ and CQ# pins on UPD44325362BF5-E40-FQ1?
CQ and CQ# are echo clock outputs synchronized to Q0–Q35 data edges. Their rising edges align tightly with data valid windows-providing the receiving device (e.g., FPGA) with a source-synchronous timing reference that compensates for PCB trace skew. This eliminates the need for static timing analysis or delay-locked loops on the receiver side.
UPD44325362BF5-E40-FQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-FBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- 4ns
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
UPD44325362BF5-E40-FQ1 FAQ
1.How can I place an order for UPD44325362BF5-E40-FQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD44325362BF5-E40-FQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD44325362BF5-E40-FQ1 reliable?
The price and inventory of UPD44325362BF5-E40-FQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44325362BF5-E40-FQ1 is usually 5 days.
3.What payment methods are accepted for UPD44325362BF5-E40-FQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD44325362BF5-E40-FQ1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UPD44325362BF5-E40-FQ1?
UPD44325362BF5-E40-FQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD44325362BF5-E40-FQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD44325362BF5-E40-FQ1?
For technical support, including UPD44325362BF5-E40-FQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44325362BF5-E40-FQ1 requirements.
6.How does Aetrix verify that UPD44325362BF5-E40-FQ1 is sourced from the original manufacturer or authorized distributors?
All UPD44325362BF5-E40-FQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44325362BF5-E40-FQ1 meets industry standards.
7.What is the process for return or replacement of UPD44325362BF5-E40-FQ1?
All UPD44325362BF5-E40-FQ1 units undergo pre-shipment inspection (PSI). If there is an issue with UPD44325362BF5-E40-FQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD44325362BF5-E40-FQ1 part is unused and in its original packaging.
Return procedure for UPD44325362BF5-E40-FQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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