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Renesas UPD44325362BF5-E40X-FQ1-A

Part No.:
UPD44325362BF5-E40X-FQ1-A
Manufacturer:
Renesas
Category:
Memory
Package:
-
Datasheet:
AetrixUPD44325362BF5-E40X-FQ1-A.pdf
Description:
QDR SRAM, 1MX36, 0.45NS
Quantity:
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Inventory:634

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Product details

Overview

UPD44325362BF5-E40X-FQ1-A from Renesas Electronics is a 1,048,576-word × 36-bit synchronous Quad Data Rate II (QDR-II) SRAM with 4.0 ns clock cycle time (250 MHz), 1.8 V core supply, HSTL interface, and 165-pin plastic BGA (15 × 17) package. It supports concurrent read/write operations, two-word burst, and PLL-based output timing control for high-speed networking buffers and packet memory applications.

For engineers reviewing the UPD44325362BF5-E40X-FQ1-A datasheet, UPD44325362BF5-E40X-FQ1-A pinout, UPD44325362BF5-E40X-FQ1-A application, or UPD44325362BF5-E40X-FQ1-A equivalent, key selection criteria include its 36-bit wide I/O, dual-clock DDR timing (K/K# input, C/C# output), user-programmable output impedance (35–70 Ω), clock-stop capability (20 μs recovery), and JTAG 1149.1 test port compliance.

Technical Context

This QDR-II SRAM implements separate independent read and write data ports with full bus utilization in both DDR READ and WRITE modes. Its internal architecture includes a burst counter, synchronous address/data registers latched on K and K# rising edges, and echo clocks (CQ/CQ#) tightly matched to output data for precise timing alignment.

The device integrates a PLL for wide output data valid window and frequency scalability, supports HSTL Class I signaling, and features internally self-timed write control with programmable byte-write enable (BW0#–BW3#) for granular 9-bit sub-word writes. Clock-stop mode retains state and resumes normal operation within 20 μs after clock resumption.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization1,048,576 words × 36 bits = 36 Mbit total capacity; enables single-cycle access to wide data paths in packet processing engines.
Clock Cycle Time4.0 ns (250 MHz); defines minimum clock period for reliable DDR read/write transactions at industrial temperature range.
Supply VoltageVDD = 1.8 ± 0.1 V; powers core logic; VDDQ = 1.4–1.8 V powers I/O buffers; ensures compatibility with 1.8 V system rails and HSTL termination.
Interface StandardHSTL Class I compliant; provides low-voltage, high-speed differential signaling with controlled output impedance (35–70 Ω via ZQ pin).
Burst Length2-word burst; delivers two consecutive data words per clock cycle, optimizing bandwidth efficiency in burst-oriented architectures.
Operating TemperatureTA = 0 to 70°C; validated for commercial/industrial ambient conditions without derating; matches FQ1-A suffix designation.
Package165-pin plastic BGA (15 × 17 mm); surface-mount footprint with defined ball map for PCB layout and thermal management.

Pinout & Package

Package: 165-pin plastic BGA (15 × 17 mm), RoHS-compliant, lead-free finish (FQ1-A suffix). Pinout conforms to μPD44325362B specification with 36-bit data I/O (D0–D35, Q0–Q35), four byte-write controls (BW0#–BW3#), dual input clocks (K, K#), dual output clocks (C, C#), echo clocks (CQ, CQ#), JTAG TAP (TMS, TDI, TCK, TDO), and dedicated power/ground (VDD, VDDQ, VSS) and reference (VREF, ZQ) pins.

Pin/TerminalCircuit RoleDesign Meaning
K, K#Input clock pairRegisters address/control on K rising edge; registers write data on K# rising edge; 180° phase relationship required for timing integrity.
C, C#Output clock pairControls output timing of Q-data and CQ-echo; rising edges define first/second data valid windows; can be fixed HIGH to use K/K# as output reference.
D0–D35Synchronous data inputs36-bit parallel write data path; each bit registered on K/K# rising edges; BWx# selects active 9-bit byte groups.
Q0–Q35Synchronous data outputs36-bit parallel read data path; synchronized to C/C# (or K/K# if C/C# tied HIGH); high-impedance when deselected.
BW0#–BW3#Byte write enableFour active-low signals enabling independent 9-bit sub-word writes; combinations allow selective update of D0–D8, D9–D17, D18–D26, or D27–D35.
ZQOutput impedance calibrationConnects to external resistor to ground (RQ = 175–350 Ω) to set Q/CQ/CQ# output impedance to 0.2 × RQ; auto-calibrated every 20 μs.
DLL#PLL disableActive-low input; forces bypass of PLL for low-frequency debug; must be HIGH (tied to VDDQ) for normal 250 MHz operation.
TMS, TDI, TCK, TDOJTAG 1149.1 interfaceIEEE-standard boundary-scan test port; operates at 1.8 V I/O level; TCK must tie to VSS if unused.

Key Features

FeatureDesign Value
Concurrent read/write portsEnables simultaneous access to same memory array-critical for full-duplex packet buffering in switch fabric ASICs.
User-programmable output impedance35–70 Ω tuning via ZQ pin eliminates need for external series resistors and improves signal integrity across varied PCB trace impedances.
Two-tick burst operationDelivers two data words per clock cycle with no dead cycles-maximizes DDR bus utilization to 100% in both read and write directions.
PLL-based output timingGenerates wide data valid window and supports future frequency scaling; locks within 20 μs and tolerates ≤0.2 ns clock jitter (TKC var).
Clock-stop capabilityEnters low-power retention state with zero latency restart (20 μs recovery); ideal for dynamic power gating in energy-sensitive systems.

Applications

High-Speed Network SwitchingTelecom Line Card Buffering

Use Scenario: Storing and forwarding Ethernet/SONET/OTN packet headers and payloads in multi-gigabit line cards.

IC Role / Device Role / Timing Role: QDR-II SRAM acts as dual-port packet buffer memory with independent read/write ports synchronized to line-rate clocks.

Use Value: 36-bit width and 250 MHz operation support 9 Gbps aggregate throughput per port-matching OC-192/STM-64 interface rates.

Use Scenario: Temporary storage of voice-over-IP (VoIP) packets and control-plane messages in carrier-grade media gateways.

IC Role / Device Role / Timing Role: Serves as low-latency, deterministic-access memory for real-time packet queuing and scheduling engines.

Use Value: Clock-stop mode reduces standby current to 420 mA while preserving data-enabling rapid wake-up for bursty VoIP traffic.

ASIC/FPGA Co-Processing MemoryRadar Signal Processing Buffer

Use Scenario: Offloading high-bandwidth memory tasks from FPGA logic fabric to dedicated SRAM in compute-accelerated designs.

IC Role / Device Role / Timing Role: Provides wide, low-latency memory interface for FPGA-based DMA controllers performing scatter-gather transfers.

Use Value: HSTL I/O and 1.8 V supply match modern FPGA I/O banks; 165-pin BGA allows dense, short-trace routing for <100 ps skew.

Use Scenario: Capturing and buffering digitized RF samples in phased-array radar front-ends prior to FFT processing.

IC Role / Device Role / Timing Role: Acts as ping-pong buffer memory synchronized to ADC sampling clock and DSP processing clock domains.

Use Value: Dual-clock architecture (K/K# for write, C/C# for read) isolates capture and analysis timing domains-eliminating metastability risk.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR-II SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C2663KV18-400BAXI36 Mbit (1M × 36), 400 MHz (2.5 ns), 1.8 V core, 165-pin BGA; Cypress QDR-II+ with enhanced jitter tolerance and lower IDD.Supports higher clock rate and tighter AC specs; requires updated timing constraints and may need VREF adjustment.Select when >250 MHz bandwidth is required and system layout accommodates tighter setup/hold margins.
AS7C3361024A-400BIN36 Mbit (1M × 36), 400 MHz (2.5 ns), 1.8 V core, 165-pin BGA; Alliance Memory QDR-II+ with identical pinout but different DC characteristics.Drop-in replacement for some designs; differs in standby current (ISB1 = 380 mA vs. 420 mA) and output drive strength.Consider for cost-sensitive volume production where 250 MHz margin is sufficient and qualification testing confirms compatibility.

Compared with UPD44325362BF5-E40X-FQ1-A, CY7C2663KV18-400BAXI delivers 60% higher bandwidth but demands stricter board-level signal integrity; AS7C3361024A-400BIN offers pin-compatible QDR-II+ migration path with minor power and timing recalibration.

Availability

UPD44325362BF5-E40X-FQ1-A is available at Aetrix Electronics and suitable for high-speed network switching, telecom line card buffering, and ASIC/FPGA co-processing applications requiring stable component supply, long-term lifecycle support, and guaranteed RoHS-compliant sourcing.

Supply support for UPD44325362BF5-E40X-FQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The μPD44325xxx series belongs to Renesas' QDR-II SRAM product line, engineered specifically for high-bandwidth, low-latency packet memory in networking and communications equipment operating at OC-192/STM-64 line rates and beyond.

FAQ

What is the maximum supported clock frequency for UPD44325362BF5-E40X-FQ1-A?

The UPD44325362BF5-E40X-FQ1-A is rated for a 4.0 ns clock cycle time, corresponding to a maximum clock frequency of 250 MHz under commercial temperature conditions (0 to 70°C). This rating is confirmed in the Ordering Information table on page 2 of R10DS0038EJ0200 Rev.2.00, where the "-E40" suffix explicitly denotes the 4.0 ns speed grade. Operation above this frequency violates AC timing specifications and risks data corruption.

Does UPD44325362BF5-E40X-FQ1-A support true concurrent read and write operations?

Yes, UPD44325362BF5-E40X-FQ1-A supports true concurrent read and write operations using separate independent data ports. As stated in the Features section (page 1), it provides "Separate independent read and write data ports with concurrent transactions." The block diagram (page 9) shows distinct read and write data paths feeding into the memory array, and the Truth Table (page 11) confirms that READ and WRITE cycles can be initiated independently on successive clock edges without conflict.

How is output impedance calibrated on UPD44325362BF5-E40X-FQ1-A?

Output impedance on UPD44325362BF5-E40X-FQ1-A is calibrated via the ZQ pin, which connects to an external resistor (RQ) to ground. Per the Pin Description (page 8), the device sets Q, CQ, and CQ# output impedance to 0.2 × RQ, where RQ must be 175–350 Ω to achieve the specified 35–70 Ω range. Calibration occurs automatically every 20 μs after power-up to compensate for voltage and temperature drift, and the ZQ pin must never be left unconnected or tied directly to GND.

What is the function of the DLL# pin on UPD44325362BF5-E40X-FQ1-A?

The DLL# pin on UPD44325362BF5-E40X-FQ1-A is an active-low PLL disable input. When DLL# = LOW, the internal PLL is bypassed, allowing debug operation at frequencies below the minimum PLL lock threshold (120 MHz). For normal 250 MHz operation, DLL# must be held HIGH-typically tied to VDDQ through a ≤10 kΩ resistor-as specified in the Pin Description (page 8) and Power-On Sequence (page 10).

Is UPD44325362BF5-E40X-FQ1-A compatible with JTAG boundary-scan testing?

Yes, UPD44325362BF5-E40X-FQ1-A includes a fully compliant IEEE 1149.1 JTAG test access port with TMS, TDI, TCK, and TDO pins operating at 1.8 V I/O level. The Pin Description (page 8) confirms these signals are present and functional. If JTAG is unused, TCK must be tied to VSS, while TMS and TDI may be left unconnected-ensuring robust testability without requiring additional level-shifting circuitry.

UPD44325362BF5-E40X-FQ1-A Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
-
Memory Format:
-
Technology:
-
Memory Size:
-
Memory Organization:
-
Memory Interface:
-
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

UPD44325362BF5-E40X-FQ1-A FAQ

1.How can I place an order for UPD44325362BF5-E40X-FQ1-A through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD44325362BF5-E40X-FQ1-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD44325362BF5-E40X-FQ1-A reliable?

The price and inventory of UPD44325362BF5-E40X-FQ1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44325362BF5-E40X-FQ1-A is usually 5 days.

3.What payment methods are accepted for UPD44325362BF5-E40X-FQ1-A?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD44325362BF5-E40X-FQ1-A transactions.

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4.How is shipping managed for UPD44325362BF5-E40X-FQ1-A?

UPD44325362BF5-E40X-FQ1-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD44325362BF5-E40X-FQ1-A order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD44325362BF5-E40X-FQ1-A?

For technical support, including UPD44325362BF5-E40X-FQ1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44325362BF5-E40X-FQ1-A requirements.

6.How does Aetrix verify that UPD44325362BF5-E40X-FQ1-A is sourced from the original manufacturer or authorized distributors?

All UPD44325362BF5-E40X-FQ1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44325362BF5-E40X-FQ1-A meets industry standards.

7.What is the process for return or replacement of UPD44325362BF5-E40X-FQ1-A?

All UPD44325362BF5-E40X-FQ1-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD44325362BF5-E40X-FQ1-A, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD44325362BF5-E40X-FQ1-A part is unused and in its original packaging.

Return procedure for UPD44325362BF5-E40X-FQ1-A:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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