Renesas UPD44325362BF5-E40Y-FQ1-A
- Part No.:
- UPD44325362BF5-E40Y-FQ1-A
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
UPD44325362BF5-E40Y-FQ1-A.pdf
- Description:
- QDR SRAM, 1MX36, 0.45NS
- Quantity:
- Payment:

- Shipping:

Inventory:4,554
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Product details
Overview
UPD44325362BF5-E40Y-FQ1-A from Renesas Electronics is a 1,048,576-word × 36-bit synchronous Quad Data Rate II (QDR II) SRAM with 2-word burst operation, 1.8 V core supply, HSTL interface, and 165-pin plastic BGA (15 × 17 mm) packaging. It delivers 250 MHz clock frequency (4.0 ns cycle time), supports −40°C to +85°C industrial temperature range, and enables concurrent read/write transactions in high-bandwidth networking and packet buffering applications.
For engineers reviewing the UPD44325362BF5-E40Y-FQ1-A datasheet, UPD44325362BF5-E40Y-FQ1-A pinout, UPD44325362BF5-E40Y-FQ1-A application, or UPD44325362BF5-E40Y-FQ1-A equivalent, key selection considerations include its 36-bit wide DDR interface, dual-clock timing architecture (K/K# input, C/C# output), user-programmable output impedance (35–70 Ω), JTAG 1149.1 test port, and PLL-enabled wide data valid window for system-level timing margin.
Technical Context
This QDR II SRAM implements separate independent read and write data ports with full bus utilization for simultaneous DDR READ and WRITE operations. Its internal architecture includes a burst counter, synchronous address/data registers latched on K and K# rising edges, and echo clocks (CQ/CQ#) tightly matched to output data for precise flight-time compensation.
The device uses HSTL Class I I/O with VREF = VDDQ/2 reference, supports clock-stop mode with 20 μs recovery, and integrates a PLL for scalable frequency operation down to 120 MHz. Output impedance is tuned via ZQ pin using an external resistor to ground, enabling system-level signal integrity optimization without layout changes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 1,048,576 words × 36 bits (36 M-bit total density) |
| Clock Frequency | 250 MHz (4.0 ns cycle time); validated across −40°C to +85°C |
| Supply Voltage | VDD = 1.8 ± 0.1 V; VDDQ = 1.4 V to 1.8 V (isolated I/O supply) |
| Interface Standard | HSTL Class I compliant inputs/outputs with VREF = VDDQ/2 reference |
| Package | 165-pin plastic BGA (15 mm × 17 mm, 0.8 mm pitch) |
| Burst Operation | Fixed 2-word burst per transaction; 100% bus utilization for DDR reads/writes |
| Timing Architecture | Dual-clock: K/K# for address/control/data registration; C/C# for output data synchronization |
Pinout & Package
UPD44325362BF5-E40Y-FQ1-A is housed in a 165-pin plastic BGA (15 × 17 mm, 0.8 mm pitch) with standard top-view ball grid layout. The package supports thermal dissipation with θja = 21.2°C/W (4-layer board, still air) and includes dedicated power/ground planes for VDD, VDDQ, and VSS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A[0:18] | Synchronous Address Input | 19-bit address registered on K rising edge for READ, K# rising edge for WRITE; enables 1M-word addressing |
| D[0:35] | Synchronous Data Input | 36-bit parallel input registered on K/K# rising edges during WRITE cycles |
| Q[0:35] | Synchronous Data Output | 36-bit parallel output synchronized to C/C# rising edges (or K/K# if C/C# tied HIGH) |
| R#, W# | Read/Write Control Input | Active-LOW signals initiating burst-aligned READ or WRITE; both HIGH = NOP |
| BW0#–BW3# | Byte Write Select Input | Four active-LOW signals enabling selective 9-bit byte writes within 36-bit word (D0–D8, D9–D17, D18–D26, D27–D35) |
| K, K# | Input Clock Pair | Differential clock inputs; K rising edge latches READ control/address, K# rising edge latches WRITE address/data |
| C, C# | Output Clock Pair | Differential clocks delivered with data; C# rising edge times first output word, C rising edge times second word |
| CQ, CQ# | Echo Clock Output | Output-synchronized clocks tightly matched to Q outputs; used as data-valid indication independent of C/C# state |
| ZQ | Impedance Calibration Input | Connects to external resistor to ground (175–350 Ω) to set Q/CQ/CQ# output impedance to 35–70 Ω |
| DLL# | PLL Disable Input | Active-LOW disables PLL for low-frequency debug; must be HIGH (tied to VDDQ) for normal 250 MHz operation |
| TMS, TDI, TCK, TDO | JTAG 1149.1 Test Port | IEEE-compliant boundary-scan interface operating at 1.8 V I/O level; TCK must tie to VSS if unused |
| VREF | HSTL Reference Input | Internal reference for input buffers; nominally VDDQ/2; requires stable 0.68–0.95 V supply |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent Read/Write Ports | Independent 36-bit read and write data paths enable simultaneous access without arbitration delay |
| 2-Word Burst DDR Operation | Guarantees 100% bus utilization per transaction-no dead cycles between consecutive bursts |
| User-Programmable Output Impedance | ZQ pin allows real-time 35–70 Ω tuning to match PCB trace impedance, reducing signal reflections |
| PLL-Based Timing Margin Enhancement | Integrated PLL widens output data valid window and supports future frequency scaling up to 300 MHz |
| Clock-Stop Capability | Enters low-power state with 20 μs recovery to full operation-enables dynamic power gating in burst-idle periods |
| JTAG 1149.1 Test Access | Full boundary-scan support simplifies board-level testing and interconnect validation in dense routing environments |
Applications
| High-Speed Packet Buffering | Network Switch Fabric Memory |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet switches. IC Role / Device Role / Timing Role: Primary buffer memory interfacing directly to SERDES PHYs and switch ASICs via HSTL buses. Use Value: 36-bit width and 250 MHz DDR operation deliver 18 Gbps sustained bandwidth-matching 10G/25G line rates without interleaving. |
Use Scenario: Providing shared memory for crossbar arbitration and header lookup in modular chassis switches. IC Role / Device Role / Timing Role: Dual-port SRAM acting as central queue manager with concurrent read (scheduler) and write (ingress) access. Use Value: Independent read/write ports eliminate contention, enabling deterministic latency for priority queuing and traffic shaping logic. |
| Telecom Baseband Processing | Test Equipment Pattern Memory |
|
Use Scenario: Holding channelization codes and symbol buffers in 4G/LTE baseband units. IC Role / Device Role / Timing Role: High-reliability SRAM supporting burst-aligned FFT/IFFT data movement under industrial temperature stress. Use Value: −40°C to +85°C rating and clock-stop mode ensure uninterrupted operation during thermal cycling in outdoor radio units. |
Use Scenario: Storing stimulus/response patterns in automated test equipment for SoC validation. IC Role / Device Role / Timing Role: Deterministic-access memory providing glitch-free pattern delivery synchronized to tester clocks. Use Value: Echo clocks (CQ/CQ#) provide sub-nanosecond data-valid alignment-critical for <100 ps setup/hold compliance in ATE systems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C2663KV18-400BZI | 36 M-bit (1M × 36), 400 MHz (2.5 ns), -40°C to +85°C, 165-pin BGA; higher speed but tighter timing margins | Requires faster PCB layout (shorter traces, stricter impedance control) and higher power (IDD = 830 mA @ 400 MHz) | Select when system clock exceeds 250 MHz and timing closure is achievable; verify DLL lock stability at target frequency. |
| AS7C3361024A-20BIN | 36 M-bit (1M × 36), 200 MHz (5.0 ns), -40°C to +85°C, 165-pin BGA; slower but lower IDD (570 mA @ 200 MHz) | Reduces power and thermal load but limits peak bandwidth to 14.4 Gbps; suitable for cost-sensitive, lower-throughput designs | Select when 250 MHz is not required and thermal/power constraints dominate; no change to pinout or control logic. |
Compared with CY7C2663KV18-400BZI and AS7C3361024A-20BIN, UPD44325362BF5-E40Y-FQ1-A provides optimal balance of 250 MHz performance, industrial temperature reliability, and 35–70 Ω programmable drive strength-making it ideal for mid-range telecom and test equipment where timing margin and thermal robustness are prioritized over maximum speed.
Availability
UPD44325362BF5-E40Y-FQ1-A is available at Aetrix Electronics and suitable for high-speed packet buffering, network switch fabric memory, and telecom baseband processing requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for UPD44325362BF5-E40Y-FQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The UPD44325362BF5-E40Y-FQ1-A belongs to Renesas' QDR II SRAM product line, engineered specifically for high-bandwidth, low-latency buffer applications in networking equipment, base stations, and test instrumentation where deterministic DDR timing and industrial-grade reliability are critical.
FAQ
What is the operating temperature range for UPD44325362BF5-E40Y-FQ1-A?
UPD44325362BF5-E40Y-FQ1-A is rated for industrial operation from −40°C to +85°C ambient temperature. This range is confirmed in the Ordering Information table (Page 3, "E**Y series") and validated in DC Characteristics 2 (Page 16), where supply current and voltage thresholds are specified across this full span. The device maintains full functionality-including PLL lock, burst timing, and impedance calibration-within these limits.
Does UPD44325362BF5-E40Y-FQ1-A support true dual-port operation?
Yes, UPD44325362BF5-E40Y-FQ1-A supports true concurrent read and write operations via physically separate data paths: Q[0:35] outputs for reads and D[0:35] inputs for writes. As stated in the Features section (Page 1), it provides "separate independent read and write data ports with concurrent transactions," and the Block Diagram (Page 9) shows distinct read and write register banks feeding the same memory array without arbitration logic.
How is output impedance calibrated on UPD44325362BF5-E40Y-FQ1-A?
Output impedance is calibrated using the ZQ pin: connecting an external resistor (175–350 Ω) from ZQ to ground sets Q, CQ, and CQ# driver impedance to 35–70 Ω (0.2 × RQ). This calibration runs automatically every 20 μs after power-up (Page 8). Direct connection of ZQ to VDDQ minimizes impedance; ZQ must never be left floating or tied to VSS.
What clocking scheme does UPD44325362BF5-E40Y-FQ1-A use for data output timing?
UPD44325362BF5-E40Y-FQ1-A uses a selectable dual-clock scheme: C and C# rising edges define output timing by default (C# for first word, C for second), but if C and C# are fixed HIGH, K and K# rising edges control output timing instead. This is explicitly defined in the Pin Description (Page 7) and Truth Table (Page 11), ensuring flexibility for system clock topology.
Is JTAG boundary-scan supported on UPD44325362BF5-E40Y-FQ1-A?
Yes, UPD44325362BF5-E40Y-FQ1-A includes full IEEE 1149.1 JTAG test access with TMS, TDI, TCK, and TDO pins operating at 1.8 V I/O level (Page 8). TCK must be tied to VSS if JTAG is unused; all other JTAG pins may be left unconnected. The feature enables production test, interconnect verification, and in-system debugging without additional probe points.
UPD44325362BF5-E40Y-FQ1-A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
UPD44325362BF5-E40Y-FQ1-A FAQ
1.How can I place an order for UPD44325362BF5-E40Y-FQ1-A through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD44325362BF5-E40Y-FQ1-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD44325362BF5-E40Y-FQ1-A reliable?
The price and inventory of UPD44325362BF5-E40Y-FQ1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44325362BF5-E40Y-FQ1-A is usually 5 days.
3.What payment methods are accepted for UPD44325362BF5-E40Y-FQ1-A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD44325362BF5-E40Y-FQ1-A transactions.
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4.How is shipping managed for UPD44325362BF5-E40Y-FQ1-A?
UPD44325362BF5-E40Y-FQ1-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD44325362BF5-E40Y-FQ1-A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD44325362BF5-E40Y-FQ1-A?
For technical support, including UPD44325362BF5-E40Y-FQ1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44325362BF5-E40Y-FQ1-A requirements.
6.How does Aetrix verify that UPD44325362BF5-E40Y-FQ1-A is sourced from the original manufacturer or authorized distributors?
All UPD44325362BF5-E40Y-FQ1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44325362BF5-E40Y-FQ1-A meets industry standards.
7.What is the process for return or replacement of UPD44325362BF5-E40Y-FQ1-A?
All UPD44325362BF5-E40Y-FQ1-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD44325362BF5-E40Y-FQ1-A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD44325362BF5-E40Y-FQ1-A part is unused and in its original packaging.
Return procedure for UPD44325362BF5-E40Y-FQ1-A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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