Renesas UPD44325364BF5-E40-FQ1-A
- Part No.:
- UPD44325364BF5-E40-FQ1-A
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-FBGA
- Datasheet:
-
UPD44325364BF5-E40-FQ1-A.pdf
- Description:
- IC SRAM 36MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
UPD44325364BF5-E40-FQ1-A from Renesas Electronics is a 1,048,576-word × 36-bit synchronous Quad Data Rate II (QDR II) SRAM with 4-word burst operation, HSTL interface, and 1.8 V core supply. It delivers 250 MHz clock frequency (4.0 ns cycle time), supports concurrent read/write ports, and is packaged in a 165-pin plastic BGA (15 × 17 mm) for high-density memory subsystems in network packet buffers and FPGA co-processor caches.
For engineers reviewing the UPD44325364BF5-E40-FQ1-A datasheet, UPD44325364BF5-E40-FQ1-A pinout, UPD44325364BF5-E40-FQ1-A application, or UPD44325364BF5-E40-FQ1-A equivalent, key selection considerations include its 36-bit wide QDR II interface, 1.8 V/1.5 V dual-supply architecture, user-programmable output impedance (35–70 Ω), PLL-enabled timing margining, and JTAG 1149.1 test access support.
Technical Context
The UPD44325364BF5-E40-FQ1-A implements a true dual-port QDR II architecture with physically separate read and write data paths, enabling simultaneous read and write transactions without bus contention. Its internal burst counter and synchronous peripheral logic are clocked by differential K/K# inputs, while output timing is precisely controlled via C/C# echo clocks aligned to data edges.
It integrates a PLL for jitter-tolerant clock multiplication and wide data-valid windows, supports clock-stop mode with 20 μs recovery, and features byte-write enable signals (BW0#–BW3#) for granular 9-bit sub-word writes across its 36-bit data bus - all compliant with JEDEC HSTL Class I standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 1,048,576 words × 36 bits = 36 Mbit total capacity; enables single-cycle access to full 36-bit parallel data for high-throughput buffering. |
| Clock Frequency / Cycle Time | 250 MHz / 4.0 ns; defines maximum sustained data transfer rate of 1 Gbps per data line (36 Gbps aggregate). |
| Supply Voltages | VDD = 1.8 V ±0.1 V (core); VDDQ = 1.5 V nominal (I/O); ensures low-power operation while maintaining HSTL signal integrity. |
| Interface Standard | HSTL Class I compliant; guarantees compatible timing margins and termination behavior with ASIC/FPGA memory controllers using 1.5 V I/O rails. |
| Burst Operation | Fixed 4-word burst; reduces address bus toggling frequency by 75%, minimizing routing congestion and timing skew in high-speed layouts. |
| Output Impedance Control | User-programmable 35–70 Ω via ZQ pin; allows dynamic matching to PCB trace impedance without external resistors. |
| JTAG Support | IEEE 1149.1 compliant TAP controller; enables boundary-scan testing and in-system debug without dedicated test pads. |
Pinout & Package
Package: 165-pin plastic BGA (15 mm × 17 mm, 1.0 mm pitch), RoHS-compliant, lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A[0:17] | Synchronous Address Inputs | 18-bit address bus latched on rising edge of K; concatenated internally with 2 LSBs to generate fixed 4-word burst sequence (A, A+1, A+2, A+3). |
| D0–D35 | Synchronous Data Inputs | 36-bit write data path registered on both K and K# rising edges; supports full- or partial-word writes via BW0#–BW3#. |
| Q0–Q35 | Synchronous Data Outputs | 36-bit read data synchronized to C/C# rising edges; C# clocks first/third words, C clocks second/fourth words for precise flight-time alignment. |
| R#, W# | Read/Write Command Inputs | Active-low, edge-triggered controls; initiate burst read or write on next K rising edge; mutually exclusive (read takes precedence). |
| BW0#–BW3# | Byte Write Enables | Four independent active-low signals controlling 9-bit sub-word write segments (D0–D8, D9–D17, D18–D26, D27–D35). |
| K, K# | Differential Input Clock | Primary timing reference; registers all control and address inputs on K rising edge; registers write data on both K and K# rising edges. |
| C, C# | Differential Output Clock | User-controlled timing reference for output data; must be held HIGH if K/K# used directly for output timing; enables clock skew compensation. |
| CQ, CQ# | Echo Clock Outputs | Output-aligned copies of C/C#; provide deterministic data-valid indication with matched flight time to Q outputs. |
| ZQ | Impedance Calibration Input | Connects to external resistor to ground (RQ = 175–350 Ω); sets Q/CQ/CQ# output drive strength to 0.2×RQ for PCB trace matching. |
| DLL# | PLL Disable Input | Active-low; disables PLL for low-frequency debug; must be tied HIGH (e.g., to VDDQ) for normal 250 MHz operation. |
| TMS, TDI, TCK, TDO | JTAG Test Interface | IEEE 1149.1 boundary-scan port; operates at 1.8 V I/O level; TCK must be tied to VSS if unused. |
| VREF | HSTL Reference Voltage | Nominally VDDQ/2 (0.68–0.95 V); provides threshold reference for all HSTL input buffers including R#, W#, and address lines. |
| VDD, VDDQ, VSS | Power/Ground Supplies | VDD = 1.8 V core; VDDQ = 1.5 V I/O; strict power-up sequence required (VSS → VDD → VDDQ → VREF → VIN) to prevent latch-up. |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent Read/Write Ports | Independent physical data paths eliminate arbitration delay; enables real-time packet buffering where ingress traffic is written while egress traffic is read simultaneously. |
| 4-Word Burst Architecture | Reduces effective address bus frequency to 1/4 system clock; relaxes layout constraints on address routing and timing closure in >200 MHz designs. |
| Programmable Output Impedance | ZQ pin calibrates driver strength to match PCB trace impedance (35–70 Ω); eliminates need for external series termination resistors and saves board space. |
| Dual Clock Domains (K/K# + C/C#) | Input clock (K/K#) controls registration; output clock (C/C#) controls data launch; decouples controller-to-SRAM and SRAM-to-controller timing paths for robust signal integrity. |
| PLL-Based Timing Margining | Integrated PLL widens data-valid window and enables future frequency scaling; locks within 20 μs after stable clock applied; supports minimum 120 MHz input clock. |
| Byte-Write Granularity | Four BW# signals enable selective 9-bit sub-word writes without read-modify-write cycles; critical for efficient metadata updates in networking and telecom applications. |
Applications
| Packet Buffer Memory | FPGA Co-Processor Cache |
|---|---|
Use Scenario: High-speed Ethernet switch ASIC stores incoming frames in temporary buffer before classification and forwarding. IC Role / Device Role / Timing Role: UPD44325364BF5-E40-FQ1-A serves as the primary 36-bit-wide QDR II packet buffer, accepting 10 Gbps ingress traffic via burst writes and servicing 10 Gbps egress reads concurrently. Use Value: 36-bit bus width and 250 MHz operation deliver 9 Gbps sustained bandwidth per port, meeting line-rate buffering requirements for 10GbE without interleaving or multiple devices. | Use Scenario: FPGA-based video processing pipeline requires low-latency access to frame metadata and coefficient tables during real-time encoding. IC Role / Device Role / Timing Role: UPD44325364BF5-E40-FQ1-A acts as a tightly coupled instruction/data cache for FPGA soft-core processors, interfaced directly to AXI-QDR bridge logic. Use Value: Concurrent read/write capability eliminates pipeline stalls during coefficient table updates, while HSTL signaling ensures setup/hold compliance at 250 MHz with FPGA I/O banks. |
| Telecom Line Card Buffer | High-Performance Test Equipment Memory |
Use Scenario: Optical transport network (OTN) line card buffers SONET/SDH overhead bytes and payload pointers for error correction and grooming. IC Role / Device Role / Timing Role: UPD44325364BF5-E40-FQ1-A functions as a dual-ported scratchpad memory, storing pointer arrays and status flags updated by one processor and read by another. Use Value: Independent R#/W# command lines and separate Q/D buses allow lock-free inter-processor communication, reducing software synchronization overhead by >40% versus shared SDRAM. | Use Scenario: Automated test equipment (ATE) captures high-speed digital waveforms at 500 MS/s and performs real-time pattern analysis. IC Role / Device Role / Timing Role: UPD44325364BF5-E40-FQ1-A provides the acquisition buffer memory, receiving parallel 36-bit samples from ADC front-end and feeding them to pattern-matching logic. Use Value: 4-word burst mode reduces sample address generation complexity; clock-stop capability enables deterministic pause/resume during trigger event capture without data loss. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C2665KV18-400BZXC | 2M × 18 organization (36 Mbit), 400 MHz (2.5 ns), 1.8 V core, 1.5 V I/O; same 165-pin BGA package but different pinout and BW signal mapping. | Higher speed but narrower 18-bit bus; requires two devices for 36-bit width, increasing PCB area and power vs. single UPD44325364BF5-E40-FQ1-A. | Select when system clock exceeds 250 MHz and board layout accommodates dual-device stacking or interleaving. |
| AS7C3364B-20JIN | 1M × 36 organization, 200 MHz (5.0 ns), 3.3 V only; uses SSTL-2 interface, not HSTL; 165-pin BGA with incompatible power and signal pin assignments. | Lacks PLL, clock-stop, and programmable impedance; requires level-shifting for 1.8 V systems and offers no timing margining for high-speed routing. | Select only for cost-sensitive, lower-speed (<200 MHz) legacy 3.3 V designs where HSTL compatibility and advanced features are unnecessary. |
Compared with CY7C2665KV18-400BZXC and AS7C3364B-20JIN, the UPD44325364BF5-E40-FQ1-A uniquely delivers 36-bit width, HSTL compliance, and integrated impedance tuning in a single 250 MHz device - optimizing board area, signal integrity, and design flexibility for modern packet-processing systems.
Availability
UPD44325364BF5-E40-FQ1-A is available at Aetrix Electronics and suitable for high-speed packet buffering, FPGA co-processor caching, telecom line card memory, and automated test equipment requiring stable component supply and long-term industrial temperature support (0°C to 70°C).
Supply support for UPD44325364BF5-E40-FQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, infrastructure, and IoT applications.
The UPD44325364BF5-E40-FQ1-A belongs to Renesas' QDR II SRAM product line, engineered specifically for high-bandwidth, low-latency memory subsystems in networking, telecommunications, and test instrumentation where deterministic burst access and concurrent dual-port operation are critical.
FAQ
What is the operating temperature range for UPD44325364BF5-E40-FQ1-A?
The UPD44325364BF5-E40-FQ1-A is rated for commercial temperature operation from 0°C to 70°C ambient, as indicated by the "FQ1-A" suffix in the part number. This variant does not support extended industrial temperature (−40°C to +85°C), which is designated by the "Y" suffix (e.g., UPD44325364BF5-E40Y-FQ1-A). Thermal derating is not specified beyond this range.
Does UPD44325364BF5-E40-FQ1-A support true simultaneous read and write operations?
Yes, the UPD44325364BF5-E40-FQ1-A implements a true dual-port QDR II architecture with physically independent read and write data paths. It allows concurrent read and write transactions on the same clock cycle - for example, reading Q0–Q35 while writing new data to D0–D35 - provided R# and W# are asserted in non-overlapping K-clock cycles as defined in the truth table.
How is output impedance calibrated on UPD44325364BF5-E40-FQ1-A?
Output impedance calibration on the UPD44325364BF5-E40-FQ1-A is performed via the ZQ pin, which connects to an external resistor (RQ) to ground. The device sets Q, CQ, and CQ# output drive strength to 0.2 × RQ, supporting 35–70 Ω range with RQ = 175–350 Ω. Calibration occurs automatically every 20 μs after power-up and adjusts for voltage/temperature drift.
Can UPD44325364BF5-E40-FQ1-A operate without its PLL enabled?
Yes, the UPD44325364BF5-E40-FQ1-A can operate with the PLL disabled by asserting DLL# LOW, allowing use at frequencies below 120 MHz for debug or low-speed validation. However, AC/DC electrical characteristics are not guaranteed in this mode, and full 250 MHz performance - including wide data-valid window and jitter tolerance - requires DLL# tied HIGH (e.g., to VDDQ) to enable the PLL.
What is the purpose of the C and C# pins on UPD44325364BF5-E40-FQ1-A?
The C and C# pins on UPD44325364BF5-E40-FQ1-A serve as user-controllable output clocks that define the timing reference for data output edges. C# clocks the first and third words of a 4-word burst; C clocks the second and fourth. When C/C# are held HIGH, output data instead aligns to K/K# edges - but for optimal timing margin and flight-time matching, C/C# should be actively driven.
UPD44325364BF5-E40-FQ1-A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-FBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- 4ns
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
UPD44325364BF5-E40-FQ1-A FAQ
1.How can I place an order for UPD44325364BF5-E40-FQ1-A through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD44325364BF5-E40-FQ1-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD44325364BF5-E40-FQ1-A reliable?
The price and inventory of UPD44325364BF5-E40-FQ1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44325364BF5-E40-FQ1-A is usually 5 days.
3.What payment methods are accepted for UPD44325364BF5-E40-FQ1-A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD44325364BF5-E40-FQ1-A transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UPD44325364BF5-E40-FQ1-A?
UPD44325364BF5-E40-FQ1-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD44325364BF5-E40-FQ1-A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD44325364BF5-E40-FQ1-A?
For technical support, including UPD44325364BF5-E40-FQ1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44325364BF5-E40-FQ1-A requirements.
6.How does Aetrix verify that UPD44325364BF5-E40-FQ1-A is sourced from the original manufacturer or authorized distributors?
All UPD44325364BF5-E40-FQ1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44325364BF5-E40-FQ1-A meets industry standards.
7.What is the process for return or replacement of UPD44325364BF5-E40-FQ1-A?
All UPD44325364BF5-E40-FQ1-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD44325364BF5-E40-FQ1-A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD44325364BF5-E40-FQ1-A part is unused and in its original packaging.
Return procedure for UPD44325364BF5-E40-FQ1-A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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