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Renesas UPD44644182AF5-E40-FQ1-A

Part No.:
UPD44644182AF5-E40-FQ1-A
Manufacturer:
Renesas
Category:
Memory
Package:
-
Datasheet:
AetrixUPD44644182AF5-E40-FQ1-A.pdf
Description:
DDR SRAM, 4MX18, 0.45NS
Quantity:
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Payment
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Inventory:4,985

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Product details

Overview

UPD44644182AF5-E40-FQ1-A from Renesas Electronics is a 4,194,304-word × 18-bit synchronous double data rate (DDR II) SRAM with HSTL interface, 4.0 ns clock cycle time (250 MHz), 1.8 V core supply, and 165-pin plastic BGA (15 × 17 mm) packaging. It supports pipelined DDR operation, two-tick burst, DLL/PLL timing control, and user-programmable output impedance (35–70 Ω), targeting high-speed memory buffering in telecom and networking equipment.

For engineers reviewing the UPD44644182AF5-E40-FQ1-A datasheet, UPD44644182AF5-E40-FQ1-A pinout, UPD44644182AF5-E40-FQ1-A application, or UPD44644182AF5-E40-FQ1-A equivalent, key selection criteria include its 4M×18 organization, HSTL I/O compatibility, 250 MHz DDR timing, burst-2 synchronous access, and JTAG 1149.1 test port support for system-level validation.

Technical Context

This DDR II SRAM uses full-CMOS six-transistor memory cells and integrates synchronous peripheral circuitry including a burst counter, DLL/PLL for wide output data valid window, and echo clocks (CQ/CQ#) tightly matched to data outputs. All inputs are registered on the rising edges of complementary input clocks K/K#, while outputs are synchronized to C/C# or fall back to K/K# when C/C# are held high.

The device implements internally self-timed write control, clock-stop capability (20 μs recovery), and programmable output impedance via ZQ calibration. Its 18-bit bidirectional data bus (DQ0–DQ17) supports byte-write control via BW0#/BW1#, and address A0 enables random burst-start alignment - all operating under strict HSTL Class I DC/AC specifications and JEDEC-compliant timing constraints.

Key Specifications

Parameter Value and Actual Design Meaning
Organization 4,194,304-word × 18-bit - provides 72 Mbit density with wide data path for burst-2 transfers without external multiplexing.
Clock Cycle Time 4.0 ns - enables 250 MHz DDR operation, supporting 500 MT/s effective data rate per DQ line.
Supply Voltage VDD = 1.8 ± 0.1 V - requires tight regulation; VDDQ = 1.4–1.8 V supports HSTL-compatible I/O drive strength and noise margin.
Interface Standard HSTL Class I - ensures signal integrity at high speed with controlled slew, defined VIH/VIL thresholds, and termination reference VREF = VDDQ/2.
Package 165-pin plastic BGA (15 × 17 mm) - surface-mount footprint with 0.8 mm pitch, optimized for high-density PCB layouts and thermal dissipation.
Burst Mode 2-word linear burst - reduces command overhead and simplifies controller logic versus longer bursts or random-access patterns.
Output Impedance User-programmable 35–70 Ω via ZQ pin - enables dynamic on-die termination matching to PCB trace impedance without external resistors.

Pinout & Package

UPD44644182AF5-E40-FQ1-A is housed in a 165-pin plastic BGA (15 × 17 mm, 0.8 mm pitch) with standard top-side marking and index corner. Pin functions follow JEDEC-compliant HSTL signaling conventions and include dedicated echo clocks (CQ/CQ#), dual input/output clocks (K/K#, C/C#), and byte-write controls (BW0#, BW1#).

Pin/Terminal Circuit Role Design Meaning
A0–A Synchronous address inputs Registered on K rising edge; A0 enables burst-start address alignment for x18/x36 devices - critical for deterministic latency in burst-2 mode.
DQ0–DQ17 Bidirectional data I/O DDR-synchronized to C/C# or K/K#; supports simultaneous read/write within same burst cycle when combined with BW0#/BW1#.
K, K# Input clock pair Registers all control and address inputs on rising edge of K; K# must be ~180° out-of-phase - defines fundamental timing reference for all operations.
C, C# Output clock pair Delivers data-aligned timing reference to receiving device; rising edge of C# clocks first data word, C clocks second - enables precise flight-time compensation.
BW0#, BW1# Byte write enable Selects 9-bit sub-banks for partial writes: 00 = full 18-bit, 01 = DQ0–DQ8, 10 = DQ9–DQ17, 11 = no write - eliminates need for external masking logic.
ZQ Impedance calibration input Connects to external resistor to ground (RQ = 175–350 Ω); calibrates DQ/CQ/CQ# output drivers every 20 μs to maintain 35–70 Ω match across voltage/temperature.
LD# Synchronous load strobe Active-low; initiates bus cycle definition (address + R/W direction) on next K rising edge - separates address setup from data transfer timing.
R, W# Read/write direction Sampled during LD# low phase; HIGH = read, LOW = write - decouples control decision from clock edge timing for robust setup/hold compliance.

Key Features

Feature Design Value
Pipelined DDR operation Enables concurrent address registration and data transfer across successive clock cycles - increases sustained bandwidth without increasing clock frequency.
Two-tick burst mode Reduces command-to-data latency to one clock period for both words, minimizing bus turnaround and simplifying controller state machines.
DLL/PLL timing circuitry Extends output data valid window and supports future frequency scaling up to 300 MHz - maintains timing margin as system clocks increase.
JTAG 1149.1 test access port Provides boundary-scan capability for interconnect testing and in-system debugging without requiring additional test pads or probes.
Programmable output impedance Eliminates need for discrete series termination resistors by enabling on-die impedance tuning - reduces BOM count and improves signal fidelity.

Applications

Telecom Line Cards Network Packet Buffers

Use Scenario: High-speed packet buffering in OC-192/STM-64 line interface modules handling 10 Gbps serial data streams.

IC Role / Device Role / Timing Role: Synchronous DDR II SRAM serving as first-level ingress/egress buffer with burst-2 alignment to match ATM or Ethernet frame boundaries.

Use Value: 250 MHz DDR interface delivers 9 Gbps aggregate bandwidth (18 bits × 500 MT/s), meeting real-time packet queuing requirements without FIFO bottlenecks.

Use Scenario: Temporary storage of fragmented IP packets in Layer 3 switches prior to reassembly and forwarding.

IC Role / Device Role / Timing Role: Burst-mode memory providing low-latency, deterministic access to packet headers and payloads using HSTL signaling for noise immunity.

Use Value: Programmable 35–70 Ω output impedance matches 50 Ω PCB traces, reducing reflections and jitter - critical for error-free 250 MHz DDR signaling over 8+ inch routes.

Baseband Processing Units Test & Measurement Equipment

Use Scenario: Real-time symbol buffering in 4G/LTE baseband processors performing channel estimation and equalization.

IC Role / Device Role / Timing Role: Dual-port-capable DDR II SRAM acting as ping-pong buffer between ADC/DAC interfaces and DSP cores.

Use Value: Clock-stop capability allows power gating during idle intervals with only 20 μs wake-up latency - improving average power efficiency in bursty wireless workloads.

Use Scenario: Acquisition memory in high-bandwidth oscilloscopes capturing multi-GHz analog waveforms at 1 GS/s+ sampling rates.

IC Role / Device Role / Timing Role: High-density, low-jitter memory storing digitized samples with precise echo-clock (CQ/CQ#) synchronization to sampling clock.

Use Value: Echo clocks CQ/CQ# track DQ output edges with <100 ps skew - enabling accurate time-of-flight calibration and eliminating deskew firmware overhead.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C2665KV18 4M×18, 3.3 ns (300 MHz), 1.8 V core, but uses SSTL-2 interface instead of HSTL - different VREF and termination requirements. Designed for FPGA-based systems with SSTL-2 I/O banks; incompatible with HSTL-only controllers without level-shifting. Select only if host controller supports SSTL-2 and board layout accommodates separate VREF routing.
IS42S16400F 4M×16 SDRAM (not DDR II SRAM), 143 MHz, 3.3 V I/O - asynchronous refresh, no echo clocks, no burst-2 native support. Targets cost-sensitive embedded systems where deterministic latency is less critical than density/cost; lacks DLL/PLL and ZQ calibration. Use only in non-real-time applications with software-managed refresh and tolerance for variable access latency.

Compared with CY7C2665KV18 and IS42S16400F, UPD44644182AF5-E40-FQ1-A uniquely combines HSTL I/O, echo-clock timing, and on-die impedance tuning - making it optimal for high-reliability, low-jitter DDR II buffering where signal integrity and deterministic timing dominate cost or density considerations.

Availability

UPD44644182AF5-E40-FQ1-A is available at Aetrix Electronics and suitable for telecom infrastructure, network packet processing, and high-speed test equipment requiring stable component supply, long-lifecycle support, and guaranteed traceable sourcing.

Supply support for UPD44644182AF5-E40-FQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.

UPD44644182AF5-E40-FQ1-A belongs to Renesas' DDR II SRAM product line, engineered specifically for high-speed, low-latency synchronous buffering in telecom and networking systems demanding HSTL compatibility and precise timing control.

FAQ

What is the maximum operating frequency supported by UPD44644182AF5-E40-FQ1-A?

UPD44644182AF5-E40-FQ1-A supports a maximum clock cycle time of 4.0 ns, corresponding to 250 MHz DDR operation (500 MT/s effective data rate). While the device family also offers 3.3 ns (300 MHz) and 5.0 ns (200 MHz) variants, this specific part is rated for 250 MHz under standard operating conditions (TA = 0–70°C, VDD = 1.8 ± 0.1 V).

Does UPD44644182AF5-E40-FQ1-A require external termination resistors?

No - UPD44644182AF5-E40-FQ1-A features user-programmable output impedance (35–70 Ω) calibrated via the ZQ pin and an external resistor to ground. This eliminates the need for discrete series termination resistors on DQ, CQ, and CQ# lines, simplifying PCB layout and improving signal integrity across voltage and temperature variations.

How does the burst-2 operation work in UPD44644182AF5-E40-FQ1-A?

UPD44644182AF5-E40-FQ1-A performs fixed 2-word linear bursts. When LD# goes low and R,W# is sampled, the internal burst counter advances A0 to generate the second address. Data appears on DQ0–DQ17 in two consecutive cycles aligned to C#/C rising edges - reducing command overhead and enabling predictable latency for streaming applications.

Can UPD44644182AF5-E40-FQ1-A operate without the DLL/PLL enabled?

Yes - pulling DLL# low disables the DLL/PLL, allowing operation at frequencies below 120 MHz using basic clock-edge registration. However, AC/DC characteristics are not guaranteed in this mode. For full specification compliance at 250 MHz, DLL# must be tied HIGH (e.g., to VDDQ via ≤10 kΩ resistor) to engage the timing circuitry.

What is the role of the CQ and CQ# pins on UPD44644182AF5-E40-FQ1-A?

CQ and CQ# are synchronous echo clock outputs on UPD44644182AF5-E40-FQ1-A, whose rising edges are tightly matched (<100 ps skew) to the corresponding DQ data outputs. They provide a hardware-valid timing reference for the receiving device - enabling precise capture without requiring complex deskew algorithms or external delay elements.

UPD44644182AF5-E40-FQ1-A Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
-
Memory Format:
-
Technology:
-
Memory Size:
-
Memory Organization:
-
Memory Interface:
-
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

UPD44644182AF5-E40-FQ1-A FAQ

1.How can I place an order for UPD44644182AF5-E40-FQ1-A through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD44644182AF5-E40-FQ1-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD44644182AF5-E40-FQ1-A reliable?

The price and inventory of UPD44644182AF5-E40-FQ1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44644182AF5-E40-FQ1-A is usually 5 days.

3.What payment methods are accepted for UPD44644182AF5-E40-FQ1-A?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD44644182AF5-E40-FQ1-A transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UPD44644182AF5-E40-FQ1-A?

UPD44644182AF5-E40-FQ1-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD44644182AF5-E40-FQ1-A order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD44644182AF5-E40-FQ1-A?

For technical support, including UPD44644182AF5-E40-FQ1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44644182AF5-E40-FQ1-A requirements.

6.How does Aetrix verify that UPD44644182AF5-E40-FQ1-A is sourced from the original manufacturer or authorized distributors?

All UPD44644182AF5-E40-FQ1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44644182AF5-E40-FQ1-A meets industry standards.

7.What is the process for return or replacement of UPD44644182AF5-E40-FQ1-A?

All UPD44644182AF5-E40-FQ1-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD44644182AF5-E40-FQ1-A, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD44644182AF5-E40-FQ1-A part is unused and in its original packaging.

Return procedure for UPD44644182AF5-E40-FQ1-A:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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