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Renesas UPD44645362AF5-E40-FQ1-A

Part No.:
UPD44645362AF5-E40-FQ1-A
Manufacturer:
Renesas
Category:
Memory
Package:
-
Datasheet:
AetrixUPD44645362AF5-E40-FQ1-A.pdf
Description:
STANDARD SRAM, 2MX36, 0.45NS
Quantity:
Payment:
Payment
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Inventory:343

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Product details

Overview

UPD44645362AF5-E40-FQ1-A from Renesas Electronics is a 2,097,152-word × 36-bit synchronous Quad Data Rate II (QDR II) SRAM with HSTL interface, 1.8 V core supply, and 4.0 ns clock cycle time (250 MHz). It features separate read/write data ports, DLL/PLL timing control, and 165-pin plastic BGA packaging. It serves as high-bandwidth buffer memory in network packet processors and FPGA-based telecom line cards.

For engineers reviewing the UPD44645362AF5-E40-FQ1-A datasheet, UPD44645362AF5-E40-FQ1-A pinout, UPD44645362AF5-E40-FQ1-A application, or UPD44645362AF5-E40-FQ1-A equivalent, key selection criteria include burst-2 DDR operation, user-programmable output impedance (35–70 Ω), clock-stop capability (20 μs recovery), dual input clocks (K/K#), and HSTL I/O compliance at 1.8 V.

Technical Context

This QDR II SRAM implements true concurrent read/write access using independent address/data paths and dual-clock domain synchronization-K/K# for write addressing and input data registration, C/C# for read data timing alignment. Its internal burst counter and echo clocks (CQ/CQ#) enable precise data-valid window control across PCB trace skew.

The device integrates a DLL/PLL for jitter-tolerant timing scaling and supports byte-write masking via four active-low BW0#–BW3# signals. All control inputs-including R#, W#, and BWx#-are registered on the rising edge of K, enforcing strict setup/hold timing relative to K, not K#.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 2,097,152 words × 36 bits = 72 Mbit total density; enables wide-data-path buffering without external width expansion
Clock Cycle Time 4.0 ns (250 MHz); defines minimum clock period for guaranteed timing closure in 250 MHz systems
Supply Voltages VDD = 1.8 ± 0.1 V (core), VDDQ = 1.4–1.8 V (I/O); decoupled supplies reduce noise coupling between logic and output drivers
I/O Interface HSTL Class I; compatible with ASIC/FPGA HSTL receivers; requires VREF = VDDQ/2 reference
Burst Operation Fixed 2-word burst; delivers two consecutive data words per clock transition-maximizes bus utilization at 100%
Output Impedance User-programmable 35–70 Ω via ZQ pin; matches common PCB trace impedances without external termination resistors
Package 165-pin plastic BGA (15 mm × 17 mm); supports high-density routing with 0.8 mm ball pitch

Pinout & Package

UPD44645362AF5-E40-FQ1-A is housed in a 165-pin plastic BGA (15 × 17 mm, 0.8 mm pitch), RoHS-compliant and lead-free. Pin assignments follow JEDEC-standard top-view layout with index mark at A1.

Pin/Terminal Circuit Role Design Meaning
A0–A19 Synchronous Address Input 20-bit address bus registered on K rising edge for READ, K# rising edge for WRITE; supports 2M-word addressing
D0–D35 Synchronous Data Input 36-bit parallel write data path; sampled on both K and K# rising edges during burst WRITE cycles
Q0–Q35 Synchronous Data Output 36-bit parallel read data path; aligned to C/C# rising edges (or K/K# if C/C# tied HIGH)
R#, W# Read/Write Control Active-low commands registered on K rising edge; enable concurrent READ/WRITE state machines
BW0#–BW3# Byte Write Select Four independent active-low masks enabling selective 9-bit byte writes within 36-bit word (e.g., BW0#=L writes D0–D8)
K, K# Input Clock Pair Differential input clocks; K rising edge latches READ control/address, K# rising edge latches WRITE control/address/data
C, C# Output Clock Pair User-controlled timing reference for Q outputs; C# rising edge clocks first data word, C rising edge clocks second
CQ, CQ# Echo Clock Output Output-synchronized clocks tightly matched to Q data edges; used as hardware data-valid strobes
ZQ Impedance Calibration Input Connect to resistor-to-ground to set Q/CQ/CQ# output impedance to 0.2×RQ; enables on-die termination tuning
DLL# DLL/PLL Disable Pull LOW to bypass DLL/PLL for low-frequency debug; must be HIGH (tied to VDDQ) for 250 MHz operation
VREF HSTL Reference Input Nominally VDDQ/2; sets switching threshold for all HSTL inputs (R#, W#, BWx#, K/K#, C/C#)
VDD, VDDQ, VSS Power/Ground VDD = 1.8 V core logic supply; VDDQ = 1.4–1.8 V I/O supply; separate planes required for noise isolation

Key Features

Feature Design Value
Concurrent Read/Write Ports Independent address/data paths allow simultaneous 36-bit READ and 36-bit WRITE-no arbitration delay in pipeline buffers
DDR Burst-2 Operation Two data words delivered per clock cycle on both READ and WRITE; achieves 100% theoretical bus utilization
DLL/PLL Timing Engine Compensates for clock skew and jitter; extends data valid window for reliable sampling at 250 MHz across temperature/voltage
Programmable Output Impedance ZQ pin adjusts Q/CQ/CQ# driver strength to match 35–70 Ω PCB traces-eliminates need for external series termination
IEEE 1149.1 JTAG Support Full boundary-scan test access (TMS, TCK, TDI, TDO) at 1.8 V I/O level; enables in-system verification without functional test vectors
Low-Power Clock Stop Enters ultra-low-power standby when clocks halt; resumes full operation within 20 μs-ideal for bursty traffic patterns

Applications

Network Packet Buffering FPGA Co-Processor Cache

Use Scenario: Storing ingress/egress packet headers and payloads in 10G/25G Ethernet switch ASICs.

IC Role / Device Role / Timing Role: High-throughput, low-latency shared memory between ingress parser and egress scheduler engines.

Use Value: 36-bit width + 250 MHz DDR operation delivers 18 Gbps sustained bandwidth-meets line-rate buffering for 25G interfaces.

Use Scenario: Acting as instruction/data cache for soft-core processors (e.g., MicroBlaze) embedded in Xilinx Ultrascale+ FPGAs.

IC Role / Device Role / Timing Role: Off-chip synchronous memory with deterministic 4.0 ns cycle time and zero-wait-state burst reads.

Use Value: Dual-port concurrency eliminates memory contention between CPU fetch and DMA write operations-improves real-time determinism.

Telecom Line Card FIFO High-Speed Test Equipment Memory

Use Scenario: Buffering serialized OTN (OTU-2/OTU-3) frames between framer and mapper ICs in optical transport terminals.

IC Role / Device Role / Timing Role: Elastic store with precise clock domain crossing using C/C# output clocks synchronized to system timing.

Use Value: Echo clocks (CQ/CQ#) provide sub-nanosecond-aligned data-valid strobes-reduces setup/hold margin requirements in retimer designs.

Use Scenario: Capturing high-speed digital waveforms in automated test equipment (ATE) channel cards.

IC Role / Device Role / Timing Role: Deep, wide memory buffer capturing parallel 36-bit samples at 250 MS/s with minimal latency.

Use Value: User-programmable output impedance ensures clean signal integrity on long probe cables-reduces reflection-induced bit errors.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C2663KV18-400BZXC 2M × 36-bit, 400 MHz (2.5 ns), 1.5 V core, 165-pin FBGA; higher speed but tighter voltage tolerance (1.425–1.575 V) Requires stricter power delivery; not drop-in compatible due to different VDD/VDDQ architecture and AC timing Select only if 400 MHz bandwidth is mandatory and power design accommodates 1.5 V core regulation
AS7C33256P-15JIN 2M × 32-bit, 15 ns async SRAM, 3.3 V, 100-pin TQFP; no QDR interface, no burst, no DLL Lower bandwidth (≈320 Mbps), no concurrent access, unsuitable for DDR timing-critical systems Consider only for cost-sensitive, non-real-time control-plane buffering where QDR features are unused

Compared with CY7C2663KV18-400BZXC, UPD44645362AF5-E40-FQ1-A offers relaxed 1.8 V core supply and proven 250 MHz stability in telecom thermal environments; versus AS7C33256P-15JIN, it delivers 56× higher effective bandwidth and deterministic timing essential for data-plane applications.

Availability

UPD44645362AF5-E40-FQ1-A is available at Aetrix Electronics and suitable for network infrastructure, FPGA acceleration, and high-speed test equipment requiring stable component supply, long-lifecycle support, and RoHS-compliant BGA packaging.

Supply support for UPD44645362AF5-E40-FQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

UPD44645362AF5-E40-FQ1-A belongs to Renesas' QDR II SRAM product line, engineered for high-bandwidth, low-latency buffering in networking and communications systems demanding synchronous DDR operation and precise timing control.

FAQ

What is the maximum operating frequency supported by UPD44645362AF5-E40-FQ1-A?

UPD44645362AF5-E40-FQ1-A supports a maximum clock cycle time of 4.0 ns, corresponding to 250 MHz operation. This rating is guaranteed under specified conditions: VDD = 1.8 ± 0.1 V, TA = 0–70°C, and proper DLL/PLL enablement (DLL# = HIGH). Operation above 250 MHz is not characterized or supported.

Does UPD44645362AF5-E40-FQ1-A support true concurrent read and write operations?

Yes, UPD44645362AF5-E40-FQ1-A implements physically separate read and write data paths with independent address registers. This allows simultaneous 36-bit READ and 36-bit WRITE transactions without arbitration delay-critical for pipeline buffering in packet processing applications.

How is output impedance calibrated on UPD44645362AF5-E40-FQ1-A?

UPD44645362AF5-E40-FQ1-A uses the ZQ pin for on-die output impedance calibration. Connecting ZQ to a precision resistor (RQ) to ground sets Q, CQ, and CQ# driver impedance to 0.2 × RQ. The device auto-calibrates every 20 μs after power-up to compensate for voltage/temperature drift.

What are the power sequencing requirements for UPD44645362AF5-E40-FQ1-A?

UPD44645362AF5-E40-FQ1-A requires strict power sequencing: VSS first, then VDD, followed by VDDQ (VDDQ ≤ VDD + 0.5 V), then VREF. During power-down, reverse the order. Violating this sequence risks undefined behavior or latch-up. DLL# must be held HIGH after VDD/VDDQ stabilize.

Can UPD44645362AF5-E40-FQ1-A operate without the DLL/PLL enabled?

UPD44645362AF5-E40-FQ1-A can operate with DLL# pulled LOW to bypass the DLL/PLL, but only at reduced frequencies below TKHKH (MAX.)-and AC/DC characteristics are not guaranteed. For rated 250 MHz operation, DLL# must be HIGH (tied to VDDQ via ≤10 kΩ resistor).

UPD44645362AF5-E40-FQ1-A Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
-
Memory Format:
-
Technology:
-
Memory Size:
-
Memory Organization:
-
Memory Interface:
-
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

UPD44645362AF5-E40-FQ1-A FAQ

1.How can I place an order for UPD44645362AF5-E40-FQ1-A through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD44645362AF5-E40-FQ1-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD44645362AF5-E40-FQ1-A reliable?

The price and inventory of UPD44645362AF5-E40-FQ1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44645362AF5-E40-FQ1-A is usually 5 days.

3.What payment methods are accepted for UPD44645362AF5-E40-FQ1-A?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD44645362AF5-E40-FQ1-A transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UPD44645362AF5-E40-FQ1-A?

UPD44645362AF5-E40-FQ1-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD44645362AF5-E40-FQ1-A order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD44645362AF5-E40-FQ1-A?

For technical support, including UPD44645362AF5-E40-FQ1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44645362AF5-E40-FQ1-A requirements.

6.How does Aetrix verify that UPD44645362AF5-E40-FQ1-A is sourced from the original manufacturer or authorized distributors?

All UPD44645362AF5-E40-FQ1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44645362AF5-E40-FQ1-A meets industry standards.

7.What is the process for return or replacement of UPD44645362AF5-E40-FQ1-A?

All UPD44645362AF5-E40-FQ1-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD44645362AF5-E40-FQ1-A, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD44645362AF5-E40-FQ1-A part is unused and in its original packaging.

Return procedure for UPD44645362AF5-E40-FQ1-A:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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