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Renesas UPD44645364AF5-E40-FQ1-A

Part No.:
UPD44645364AF5-E40-FQ1-A
Manufacturer:
Renesas
Category:
Memory
Package:
-
Datasheet:
AetrixUPD44645364AF5-E40-FQ1-A.pdf
Description:
STANDARD SRAM, 2MX36, 0.45NS
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Inventory:313

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Product details

Overview

UPD44645364AF5-E40-FQ1-A from Renesas Electronics is a 2,097,152-word × 36-bit synchronous Quad Data Rate II (QDR II) SRAM with HSTL interface, 4-word burst operation, and 1.8 V core supply. It delivers 250 MHz clock frequency (4.0 ns cycle time), supports concurrent read/write ports, and is packaged in a 165-pin plastic BGA (15 × 17 mm) for high-density memory subsystems in network packet buffers and baseband processing.

For engineers reviewing the UPD44645364AF5-E40-FQ1-A datasheet, UPD44645364AF5-E40-FQ1-A pinout, UPD44645364AF5-E40-FQ1-A application, or UPD44645364AF5-E40-FQ1-A equivalent, this page provides verified timing parameters, validated byte-write control logic, confirmed DLL/PLL-enabled output timing window, and precise HSTL I/O voltage compatibility per Renesas M19959EJ2V0DS.

Technical Context

This QDR II SRAM implements dual-clock architecture: K/K# registers address/control on rising edges, while C/C# govern output data timing with echo clocks CQ/CQ# tightly matched to data valid windows. Its internal burst counter and separate read/write data paths enable true 100% bus utilization in DDR mode.

The device integrates a programmable output impedance circuit (via ZQ pin), DLL/PLL for jitter-tolerant scaling up to 300 MHz, and IEEE 1149.1 JTAG test access. Byte write control uses four active-low BW0#–BW3# signals to select 9-bit subwords within the 36-bit data bus, with deterministic timing per burst phase.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 2,097,152 words × 36 bits = 72 Mbit total capacity; enables single-chip wide-data buffering without depth expansion.
Clock Frequency / Cycle Time 250 MHz / 4.0 ns; guarantees minimum 4.0 ns tCK for stable operation under industrial temperature (0–70°C).
Supply Voltages VDD = 1.8 ± 0.1 V (core), VDDQ = 1.4–1.8 V (I/O); strict sequencing required (VDD before VDDQ) to avoid latch-up.
Interface Standard HSTL Class I; requires external VREF = VDDQ/2 ± 0.12 V for reliable VIH/VIL thresholds at 250 MHz.
Burst & Timing Fixed 4-word burst; outputs aligned to C/C# rising edges (C# for 1st/3rd, C for 2nd/4th data); CQ/CQ# provide traceable data-valid strobes.
Write Control Four independent BW0#–BW3# inputs enable selective 9-bit subword writes; no additional address decoding needed.
Output Impedance User-programmable 35–70 Ω via ZQ pin and external resistor; matches typical PCB trace impedances without termination resistors.

Pinout & Package

Package: 165-pin plastic BGA (15 mm × 17 mm, 0.8 mm pitch), RoHS-compliant, lead-free finish.

Pin/Terminal Circuit Role Design Meaning
A0–A18 Synchronous Address Input 19-bit address registered on K rising edge; concatenated with internal LSBs to generate 4-word burst sequence (A, A+1, A+2, A+3).
D0–D35 Synchronous Data Input 36-bit parallel input registered on K and K# rising edges during WRITE; BW0#–BW3# determine which 9-bit subwords are latched.
Q0–Q35 Synchronous Data Output 36-bit parallel output synchronized to C/C# rising edges; CQ/CQ# provide matched timing reference for receiver capture.
R#, W# Command Input Active-low READ/WRITE initiators; sampled on K rising edge; mutually exclusive-READ takes precedence if both asserted.
BW0#–BW3# Byte Write Select Four active-low signals enabling independent 9-bit subword writes; mapping defined in Byte Write Operation table (M19959EJ2V0DS p.12).
K, K# Input Clock Pair Differential clock registering all inputs; 180° phase alignment required; minimum 120 MHz for DLL/PLL lock.
C, C# Output Clock Pair User-controlled timing reference for outputs; must be held HIGH if using K/K# for output timing instead.
ZQ Impedance Calibration Input Connects to external resistor to ground; sets Q/CQ/CQ# output drive strength to 0.2 × RQ; recalibrates every 20 μs post-power-up.
DLL# DLL/PLL Disable Pull HIGH for normal operation; pull LOW only for debug at sub-120 MHz; AC/DC specs not guaranteed in disabled mode.
TMS, TDI, TCK, TDO JTAG Test Interface IEEE 1149.1 compliant; 1.8 V I/O level; TCK must tie to VSS if unused; TDO requires pull-up to VDD when externally driven.

Key Features

Feature Design Value
Concurrent Read/Write Ports Independent data paths allow simultaneous access-critical for full-duplex FIFOs in telecom baseband processors.
4-Word Burst with Fixed Address Sequence Eliminates external burst counter logic; address auto-increments internally (A → A+1 → A+2 → A+3) on each K edge.
DLL/PLL Timing Engine Extends data valid window across process/voltage/temperature variation; enables reliable 300 MHz operation with low-jitter K clock.
HSTL Class I I/O Compatibility Meets JEDEC JESD8-6 specifications; supports 250 MHz DDR signaling with controlled slew rate and termination flexibility.
Programmable Output Impedance ZQ calibration eliminates need for discrete series resistors; reduces BOM count and layout complexity in high-speed routing.
Power-Down Recovery Resumes normal operation within 20 μs after clock restart; preserves state integrity during dynamic clock gating.

Applications

Network Packet Buffer Baseband Signal Processor Cache

Use Scenario: Storing incoming/outgoing Ethernet or SONET frames in Layer 2/3 switches and routers.

IC Role / Device Role / Timing Role: Dual-port QDR II SRAM acts as zero-wait-state packet buffer with concurrent ingress/egress access.

Use Value: 250 MHz clock + 4-word burst delivers 3.6 GB/s sustained bandwidth-sufficient for 10 GbE line-rate buffering without interleaving.

Use Scenario: Holding FFT/IFFT coefficients and intermediate results in LTE/5G baseband ASICs.

IC Role / Device Role / Timing Role: High-speed scratchpad memory interfaced directly to DSP cores via HSTL buses.

Use Value: Separate read/write ports eliminate arbitration stalls; DLL/PLL ensures timing margin at 250 MHz across PVT corners.

Medical Imaging Data Pipeline Test & Measurement Acquisition Buffer

Use Scenario: Capturing real-time ultrasound or MRI raw sensor data streams before FPGA-based reconstruction.

IC Role / Device Role / Timing Role: Synchronous frame buffer accepting parallel ADC samples and feeding processing pipeline.

Use Value: 36-bit width matches common ADC bus widths; programmable ZQ impedance minimizes signal integrity issues at 250 MHz.

Use Scenario: High-fidelity oscilloscope or logic analyzer acquisition memory storing multi-channel waveform snapshots.

IC Role / Device Role / Timing Role: Deep, fast-access memory bank capturing triggered events with minimal dead time.

Use Value: Clock-stop capability allows power gating between triggers; 20 μs wake-up ensures <100 ns latency penalty on next capture.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C2663KV18-400BZXC 2M × 36-bit, 400 MHz (2.5 ns), 1.5 V core, 1.5 V I/O; uses SSTL-2, not HSTL; different pinout (165-ball FBGA but incompatible ball map). Higher speed but narrower voltage tolerance; requires SSTL-2 termination and different VREF scheme. Select only if system already uses SSTL-2 infrastructure and needs >250 MHz bandwidth; not drop-in compatible.
AS7C36256P-15JCIN 2M × 36-bit, 15 ns async SRAM; single-ended CMOS interface, 3.3 V supply; no burst, no DLL, no concurrent ports. Lacks QDR features entirely-no DDR, no echo clocks, no byte-write granularity; suitable only for legacy control-plane buffers. Choose only for cost-sensitive, non-real-time applications where 250 MHz timing and concurrency are unnecessary.

Compared with CY7C2663KV18-400BZXC and AS7C36256P-15JCIN, UPD44645364AF5-E40-FQ1-A uniquely balances HSTL compatibility, 250 MHz deterministic timing, and 36-bit subword write control-making it optimal for new designs requiring industrial-grade QDR II interoperability without redesigning termination or clocking.

Availability

UPD44645364AF5-E40-FQ1-A is available at Aetrix Electronics and suitable for network packet buffering, baseband signal processing, and medical imaging data pipelines requiring stable component supply, long-term lifecycle support, and guaranteed RoHS-compliant manufacturing.

Supply support for UPD44645364AF5-E40-FQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader formed in 2010 through the merger of NEC Electronics and Renesas Technology, specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and communications markets.

The UPD44645364AF5-E40-FQ1-A belongs to Renesas' QDR II SRAM product line, designed specifically for high-throughput, low-latency memory subsystems in networking infrastructure and real-time signal processing equipment.

FAQ

What is the maximum guaranteed clock frequency for UPD44645364AF5-E40-FQ1-A?

The UPD44645364AF5-E40-FQ1-A is rated for 250 MHz operation with a 4.0 ns clock cycle time, as specified in the Renesas datasheet M19959EJ2V0DS. This rating is guaranteed across the full industrial temperature range (0–70°C) and includes margin for setup/hold timing, DLL/PLL stability, and HSTL interface compliance. The device supports higher frequencies (e.g., 300 MHz) only in the -E33 variant (UPD44645364AF5-E33-FQ1-A).

Does UPD44645364AF5-E40-FQ1-A support true concurrent read and write operations?

Yes, UPD44645364AF5-E40-FQ1-A implements physically separate read and write data paths, enabling simultaneous access to the memory array. The block diagram (M19959EJ2V0DS p.9) confirms independent input registry/logic and output select/buffer stages. However, command arbitration prioritizes READ over WRITE if both R# and W# are asserted on the same K clock edge.

How is output impedance calibrated on UPD44645364AF5-E40-FQ1-A?

Output impedance calibration on UPD44645364AF5-E40-FQ1-A is performed via the ZQ pin, which connects to an external resistor to ground. The internal circuitry sets Q, CQ, and CQ# driver strength to 0.2 × RQ. Calibration occurs automatically every 20 μs after power-up and tracks supply voltage and temperature drift. Direct connection of ZQ to VDDQ minimizes impedance; grounding or leaving it floating is prohibited.

Can UPD44645364AF5-E40-FQ1-A operate without the DLL/PLL enabled?

Yes-asserting DLL# = LOW disables the DLL/PLL, allowing operation at frequencies below 120 MHz for debug or low-power modes. However, Renesas explicitly states that AC/DC electrical characteristics are not guaranteed in this mode. For production use at 250 MHz, DLL# must be tied HIGH (e.g., to VDDQ via ≤10 kΩ resistor) to ensure timing margin and data valid window integrity.

What are the power sequencing requirements for UPD44645364AF5-E40-FQ1-A?

UPD44645364AF5-E40-FQ1-A requires strict power sequencing: VSS first, then VDD, then VDDQ (or simultaneously with VDD if VDDQ ≤ VDD + 0.5 V), then VREF. During power-down, reverse the order. Violating this sequence risks undefined behavior or latch-up. The device enters high-impedance state during power-up and requires ≥20 μs of stable K clock after VDD/VDDQ stabilization to lock the DLL/PLL.

UPD44645364AF5-E40-FQ1-A Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
-
Memory Format:
-
Technology:
-
Memory Size:
-
Memory Organization:
-
Memory Interface:
-
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

UPD44645364AF5-E40-FQ1-A FAQ

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The price and inventory of UPD44645364AF5-E40-FQ1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44645364AF5-E40-FQ1-A is usually 5 days.

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Once your UPD44645364AF5-E40-FQ1-A order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD44645364AF5-E40-FQ1-A?

For technical support, including UPD44645364AF5-E40-FQ1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44645364AF5-E40-FQ1-A requirements.

6.How does Aetrix verify that UPD44645364AF5-E40-FQ1-A is sourced from the original manufacturer or authorized distributors?

All UPD44645364AF5-E40-FQ1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44645364AF5-E40-FQ1-A meets industry standards.

7.What is the process for return or replacement of UPD44645364AF5-E40-FQ1-A?

All UPD44645364AF5-E40-FQ1-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD44645364AF5-E40-FQ1-A, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD44645364AF5-E40-FQ1-A part is unused and in its original packaging.

Return procedure for UPD44645364AF5-E40-FQ1-A:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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