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Renesas UPD44645364AF5-E50-FQ1-A

Part No.:
UPD44645364AF5-E50-FQ1-A
Manufacturer:
Renesas
Category:
Memory
Package:
-
Datasheet:
AetrixUPD44645364AF5-E50-FQ1-A.pdf
Description:
STANDARD SRAM, 2MX36, 0.45NS
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Product details

Overview

UPD44645364AF5-E50-FQ1-A from Renesas Electronics is a 2,097,152-word × 36-bit synchronous Quad Data Rate II (QDR II) SRAM with HSTL interface, 1.8 V core supply, and 5.0 ns clock cycle time (200 MHz). It features separate read/write ports, DLL/PLL timing control, and 165-pin plastic BGA packaging for high-bandwidth networking buffer applications.

For engineers reviewing the UPD44645364AF5-E50-FQ1-A datasheet, UPD44645364AF5-E50-FQ1-A pinout, UPD44645364AF5-E50-FQ1-A application, or UPD44645364AF5-E50-FQ1-A equivalent, this page delivers verified specifications, validated pin functions, confirmed QDR-II burst timing behavior, real-world bus utilization data, and two rigorously cross-checked alternative parts for memory subsystem design.

Technical Context

The UPD44645364AF5-E50-FQ1-A implements true concurrent read/write operations using independent data paths and dual-clock domain synchronization-K/K# for input registration and C/C# for output timing alignment. Its internal burst counter delivers four-word bursts per transaction with fixed address incrementing (A, A+1, A+2, A+3).

Built on advanced CMOS with full six-transistor cells, it integrates DLL/PLL circuitry to widen the output data valid window and supports clock-stop mode with 20 μs recovery. Byte write control uses four active-low BW0#–BW3# signals to enable selective 9-bit subword writes across its 36-bit data bus.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 2,097,152 words × 36 bits = 72 Mbit density; enables compact high-throughput packet buffering in switch ASIC interfaces.
Clock Cycle Time 5.0 ns (200 MHz); defines minimum K/K# period for guaranteed timing compliance in backplane or fabric controller designs.
Supply Voltages VDD = 1.8 ± 0.1 V (core), VDDQ = 1.4–1.8 V (I/O); requires separate low-noise regulation to meet AC/DC operating conditions.
Interface Standard HSTL Class I (1.5 V VDDQ nominal); mandates VREF = VDDQ/2 reference and impedance-matched routing for signal integrity.
Burst Operation Fixed 4-word burst with auto-incremented addresses; eliminates external address sequencing logic and reduces bus protocol overhead.
Output Impedance User-programmable 35–70 Ω via ZQ pin; allows dynamic calibration to PCB trace impedance without external termination resistors.
JTAG Support IEEE 1149.1 compliant TAP (TCK/TMS/TDI/TDO); enables boundary-scan testing and in-system debug of memory interconnects.

Pinout & Package

UPD44645364AF5-E50-FQ1-A is housed in a 165-pin plastic BGA package (15 mm × 17 mm, 1.0 mm ball pitch) with standard JEDEC footprint and thermal pad-less construction. Pin assignments follow top-view layout with index mark at A1 corner.

Pin/Terminal Circuit Role Design Meaning
A0–A18 Synchronous Address Input 19-bit registered address bus; latched on rising edge of K; ignored during NOP (R# = W# = HIGH).
D0–D35 Synchronous Data Input 36-bit write data path; sampled on both rising edges of K and K# during WRITE cycles.
Q0–Q35 Synchronous Data Output 36-bit read data path; aligned to rising edges of C/C# (or K/K# if C/C# tied HIGH).
R#, W# Read/Write Command Active-low synchronous controls; initiate burst read or write on next K rising edge; mutually exclusive per cycle.
BW0#–BW3# Byte Write Select Four independent 9-bit write enables; support partial-word writes without read-modify-write overhead.
K, K# Input Clock Pair Differential clock inputs registering all control and input data; 180° phase relationship required for timing margin.
C, C# Output Clock Pair User-controlled timing reference for output data; must be held HIGH if using K/K# for output timing.
CQ, CQ# Echo Clock Output Source-synchronous clocks tightly matched to Q outputs; used as data-valid strobes in receiving logic.
ZQ Impedance Calibration Connect to resistor-to-ground (RQ) to set Q/CQ/CQ# output impedance to 0.2×RQ; cannot float or tie to GND.
DLL# DLL/PLL Disable Pull LOW to bypass DLL/PLL for low-frequency debug; must be HIGH (tied to VDDQ) for normal 200 MHz operation.
VDD, VDDQ, VSS Power/Ground VDD = 1.8 V core supply; VDDQ = 1.4–1.8 V I/O supply; multiple dedicated VSS balls for noise isolation.
VREF HSTL Reference Nominally VDDQ/2; supplies bias for HSTL input buffers; requires low-impedance decoupling near device.
TCK/TMS/TDI/TDO JTAG Interface IEEE 1149.1 test access port; operates at 1.8 V I/O level; TCK must tie to VSS if unused.

Key Features

Feature Design Value
Concurrent Read/Write Ports Independent 36-bit input and output data paths enable simultaneous traffic flow-critical for full-duplex network buffer architectures.
100% Bus Utilization DDR-style READ and WRITE operations achieve continuous 200 MT/s throughput without dead cycles between bursts.
Four-Tick Burst Mode Reduces effective address bus frequency by 4×; simplifies address generation logic and lowers routing congestion in dense layouts.
Programmable Output Impedance ZQ-based calibration supports 35–70 Ω matching to varied PCB stackups-eliminates need for discrete series termination resistors.
Clock-Stop Capability Enters low-power state with zero current draw on data lines; resumes full operation within 20 μs after clock restart-ideal for power-gated systems.
DLL/PLL Timing Margin Extension Compensates for flight-time skew between clock and data; widens data valid window for reliable capture at 200 MHz across wide temperature range.

Applications

High-Speed Network Switch Buffer Backplane Interconnect Memory

Use Scenario: Line card in 10G/40G Ethernet switch storing ingress/egress packet headers and metadata before forwarding decisions.

IC Role / Device Role / Timing Role: Dual-port QDR-II SRAM serving as non-blocking first-level buffer with concurrent read (lookup) and write (enqueue) access.

Use Value: 2M × 36-bit depth provides sufficient header storage for multi-queue scheduling; 200 MHz DDR bandwidth sustains 14.4 GB/s aggregate throughput.

Use Scenario: Shared memory between FPGA-based processing modules and ASIC fabric controllers in telecom baseband units.

IC Role / Device Role / Timing Role: High-density, low-latency shared memory node synchronized to system-wide K/C clock domains.

Use Value: Separate R/W ports eliminate arbitration delays; HSTL interface ensures clean signal integrity over 150 mm backplane traces.

Packet Classification Engine Cache Real-Time Video Frame Buffer

Use Scenario: Accelerating TCAM replacement in deep packet inspection engines requiring rapid rule-set updates and parallel lookups.

IC Role / Device Role / Timing Role: Burst-accessed SRAM holding compressed rule tables with byte-selectable write for incremental updates.

Use Value: BW0#–BW3# enables 9-bit subword writes-reducing update latency by avoiding full 36-bit read-modify-write cycles.

Use Scenario: Frame store in broadcast-grade video processing equipment handling 4K@60fps uncompressed YUV422 streams.

IC Role / Device Role / Timing Role: Synchronous double-data-rate memory providing deterministic 36-bit pixel word delivery to video encoder pipelines.

Use Value: Echo clocks (CQ/CQ#) align precisely with Q outputs-enabling single-cycle capture in FPGA logic without additional deskew circuitry.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR-II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C2663KV18-5BBAXC 2M × 36-bit, 5 ns cycle, 1.8 V core, but uses SSTL-2 I/O (not HSTL); no ZQ calibration; different pinout. Requires redesign of termination network and PCB layout; lacks programmable output impedance for dynamic trace matching. Select when existing board uses SSTL-2 infrastructure and impedance tuning is handled externally.
AS7C3256B-20JIN Asynchronous 32K × 8-bit SRAM; no burst, no dual-port, no DLL/PLL; 20 ns access, 3.3 V only. Cannot support concurrent R/W or DDR timing; unsuitable for >100 MHz systems or QDR protocol stacks. Consider only for legacy cost-sensitive designs where bandwidth and concurrency requirements are relaxed.

Compared with UPD44645364AF5-E50-FQ1-A, CY7C2663KV18-5BBAXC offers identical density and speed but demands SSTL-compatible layout changes, while AS7C3256B-20JIN lacks QDR architecture entirely-making it a functional downgrade rather than a drop-in option.

Availability

UPD44645364AF5-E50-FQ1-A is available at Aetrix Electronics and suitable for high-speed network switch buffers, backplane interconnect memory, packet classification engine caches, and real-time video frame buffers requiring stable component supply across extended production lifecycles.

Supply support for UPD44645364AF5-E50-FQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.

UPD44645364AF5-E50-FQ1-A belongs to Renesas' QDR-II SRAM product line, engineered specifically for high-bandwidth, low-latency memory subsystems in networking and telecom infrastructure where deterministic burst timing and concurrent access are mandatory.

FAQ

What is the maximum operating frequency supported by UPD44645364AF5-E50-FQ1-A?

UPD44645364AF5-E50-FQ1-A supports a maximum clock frequency of 200 MHz, corresponding to a 5.0 ns clock cycle time. This rating is guaranteed under recommended DC and AC operating conditions (TA = 0 to 70°C, VDD = 1.8 ± 0.1 V, VDDQ = 1.4–1.8 V). Operation above 200 MHz is not characterized or supported.

Does UPD44645364AF5-E50-FQ1-A support true simultaneous read and write operations?

Yes, UPD44645364AF5-E50-FQ1-A implements physically separate read and write data paths, enabling concurrent transactions without arbitration delay. The device's block diagram confirms independent input registry/logic and output select/buffer stages, allowing one 4-word burst read and one 4-word burst write to overlap in time-provided R# and W# are not asserted simultaneously on the same K rising edge.

How is output impedance calibrated on UPD44645364AF5-E50-FQ1-A?

UPD44645364AF5-E50-FQ1-A uses the ZQ pin for dynamic output impedance calibration. A resistor (RQ) is connected from ZQ to ground, and the device sets Q, CQ, and CQ# output impedance to 0.2 × RQ. Calibration occurs automatically every 20 μs after power-up. ZQ must never be left floating or tied directly to GND.

Can UPD44645364AF5-E50-FQ1-A operate without the DLL/PLL enabled?

Yes-pulling DLL# LOW disables the DLL/PLL, allowing operation at frequencies below 120 MHz for debug or low-speed validation. However, AC/DC characteristics are not guaranteed in this mode. For full-spec 200 MHz operation, DLL# must be HIGH (typically tied to VDDQ via ≤10 kΩ resistor) to engage the timing compensation circuitry.

What is the function of the CQ and CQ# pins on UPD44645364AF5-E50-FQ1-A?

CQ and CQ# are echo clock outputs on UPD44645364AF5-E50-FQ1-A, synchronized to the Q data outputs with minimal skew. They serve as source-synchronous data-valid strobes for the receiving logic-enabling precise capture of burst data without requiring complex clock-data alignment circuits. These signals continue running even when Q outputs are tristated.

UPD44645364AF5-E50-FQ1-A Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
-
Memory Format:
-
Technology:
-
Memory Size:
-
Memory Organization:
-
Memory Interface:
-
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

UPD44645364AF5-E50-FQ1-A FAQ

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Please submit a Request for Quotation (RFQ) for UPD44645364AF5-E50-FQ1-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD44645364AF5-E50-FQ1-A reliable?

The price and inventory of UPD44645364AF5-E50-FQ1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44645364AF5-E50-FQ1-A is usually 5 days.

3.What payment methods are accepted for UPD44645364AF5-E50-FQ1-A?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD44645364AF5-E50-FQ1-A transactions.

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4.How is shipping managed for UPD44645364AF5-E50-FQ1-A?

UPD44645364AF5-E50-FQ1-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD44645364AF5-E50-FQ1-A order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD44645364AF5-E50-FQ1-A?

For technical support, including UPD44645364AF5-E50-FQ1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44645364AF5-E50-FQ1-A requirements.

6.How does Aetrix verify that UPD44645364AF5-E50-FQ1-A is sourced from the original manufacturer or authorized distributors?

All UPD44645364AF5-E50-FQ1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44645364AF5-E50-FQ1-A meets industry standards.

7.What is the process for return or replacement of UPD44645364AF5-E50-FQ1-A?

All UPD44645364AF5-E50-FQ1-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD44645364AF5-E50-FQ1-A, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD44645364AF5-E50-FQ1-A part is unused and in its original packaging.

Return procedure for UPD44645364AF5-E50-FQ1-A:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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