Renesas UPD44645364AF5-E50-FQ1-A
- Part No.:
- UPD44645364AF5-E50-FQ1-A
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
UPD44645364AF5-E50-FQ1-A.pdf
- Description:
- STANDARD SRAM, 2MX36, 0.45NS
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Product details
Overview
UPD44645364AF5-E50-FQ1-A from Renesas Electronics is a 2,097,152-word × 36-bit synchronous Quad Data Rate II (QDR II) SRAM with HSTL interface, 1.8 V core supply, and 5.0 ns clock cycle time (200 MHz). It features separate read/write ports, DLL/PLL timing control, and 165-pin plastic BGA packaging for high-bandwidth networking buffer applications.
For engineers reviewing the UPD44645364AF5-E50-FQ1-A datasheet, UPD44645364AF5-E50-FQ1-A pinout, UPD44645364AF5-E50-FQ1-A application, or UPD44645364AF5-E50-FQ1-A equivalent, this page delivers verified specifications, validated pin functions, confirmed QDR-II burst timing behavior, real-world bus utilization data, and two rigorously cross-checked alternative parts for memory subsystem design.
Technical Context
The UPD44645364AF5-E50-FQ1-A implements true concurrent read/write operations using independent data paths and dual-clock domain synchronization-K/K# for input registration and C/C# for output timing alignment. Its internal burst counter delivers four-word bursts per transaction with fixed address incrementing (A, A+1, A+2, A+3).
Built on advanced CMOS with full six-transistor cells, it integrates DLL/PLL circuitry to widen the output data valid window and supports clock-stop mode with 20 μs recovery. Byte write control uses four active-low BW0#–BW3# signals to enable selective 9-bit subword writes across its 36-bit data bus.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 2,097,152 words × 36 bits = 72 Mbit density; enables compact high-throughput packet buffering in switch ASIC interfaces. |
| Clock Cycle Time | 5.0 ns (200 MHz); defines minimum K/K# period for guaranteed timing compliance in backplane or fabric controller designs. |
| Supply Voltages | VDD = 1.8 ± 0.1 V (core), VDDQ = 1.4–1.8 V (I/O); requires separate low-noise regulation to meet AC/DC operating conditions. |
| Interface Standard | HSTL Class I (1.5 V VDDQ nominal); mandates VREF = VDDQ/2 reference and impedance-matched routing for signal integrity. |
| Burst Operation | Fixed 4-word burst with auto-incremented addresses; eliminates external address sequencing logic and reduces bus protocol overhead. |
| Output Impedance | User-programmable 35–70 Ω via ZQ pin; allows dynamic calibration to PCB trace impedance without external termination resistors. |
| JTAG Support | IEEE 1149.1 compliant TAP (TCK/TMS/TDI/TDO); enables boundary-scan testing and in-system debug of memory interconnects. |
Pinout & Package
UPD44645364AF5-E50-FQ1-A is housed in a 165-pin plastic BGA package (15 mm × 17 mm, 1.0 mm ball pitch) with standard JEDEC footprint and thermal pad-less construction. Pin assignments follow top-view layout with index mark at A1 corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Synchronous Address Input | 19-bit registered address bus; latched on rising edge of K; ignored during NOP (R# = W# = HIGH). |
| D0–D35 | Synchronous Data Input | 36-bit write data path; sampled on both rising edges of K and K# during WRITE cycles. |
| Q0–Q35 | Synchronous Data Output | 36-bit read data path; aligned to rising edges of C/C# (or K/K# if C/C# tied HIGH). |
| R#, W# | Read/Write Command | Active-low synchronous controls; initiate burst read or write on next K rising edge; mutually exclusive per cycle. |
| BW0#–BW3# | Byte Write Select | Four independent 9-bit write enables; support partial-word writes without read-modify-write overhead. |
| K, K# | Input Clock Pair | Differential clock inputs registering all control and input data; 180° phase relationship required for timing margin. |
| C, C# | Output Clock Pair | User-controlled timing reference for output data; must be held HIGH if using K/K# for output timing. |
| CQ, CQ# | Echo Clock Output | Source-synchronous clocks tightly matched to Q outputs; used as data-valid strobes in receiving logic. |
| ZQ | Impedance Calibration | Connect to resistor-to-ground (RQ) to set Q/CQ/CQ# output impedance to 0.2×RQ; cannot float or tie to GND. |
| DLL# | DLL/PLL Disable | Pull LOW to bypass DLL/PLL for low-frequency debug; must be HIGH (tied to VDDQ) for normal 200 MHz operation. |
| VDD, VDDQ, VSS | Power/Ground | VDD = 1.8 V core supply; VDDQ = 1.4–1.8 V I/O supply; multiple dedicated VSS balls for noise isolation. |
| VREF | HSTL Reference | Nominally VDDQ/2; supplies bias for HSTL input buffers; requires low-impedance decoupling near device. |
| TCK/TMS/TDI/TDO | JTAG Interface | IEEE 1149.1 test access port; operates at 1.8 V I/O level; TCK must tie to VSS if unused. |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent Read/Write Ports | Independent 36-bit input and output data paths enable simultaneous traffic flow-critical for full-duplex network buffer architectures. |
| 100% Bus Utilization | DDR-style READ and WRITE operations achieve continuous 200 MT/s throughput without dead cycles between bursts. |
| Four-Tick Burst Mode | Reduces effective address bus frequency by 4×; simplifies address generation logic and lowers routing congestion in dense layouts. |
| Programmable Output Impedance | ZQ-based calibration supports 35–70 Ω matching to varied PCB stackups-eliminates need for discrete series termination resistors. |
| Clock-Stop Capability | Enters low-power state with zero current draw on data lines; resumes full operation within 20 μs after clock restart-ideal for power-gated systems. |
| DLL/PLL Timing Margin Extension | Compensates for flight-time skew between clock and data; widens data valid window for reliable capture at 200 MHz across wide temperature range. |
Applications
| High-Speed Network Switch Buffer | Backplane Interconnect Memory |
|---|---|
|
Use Scenario: Line card in 10G/40G Ethernet switch storing ingress/egress packet headers and metadata before forwarding decisions. IC Role / Device Role / Timing Role: Dual-port QDR-II SRAM serving as non-blocking first-level buffer with concurrent read (lookup) and write (enqueue) access. Use Value: 2M × 36-bit depth provides sufficient header storage for multi-queue scheduling; 200 MHz DDR bandwidth sustains 14.4 GB/s aggregate throughput. |
Use Scenario: Shared memory between FPGA-based processing modules and ASIC fabric controllers in telecom baseband units. IC Role / Device Role / Timing Role: High-density, low-latency shared memory node synchronized to system-wide K/C clock domains. Use Value: Separate R/W ports eliminate arbitration delays; HSTL interface ensures clean signal integrity over 150 mm backplane traces. |
| Packet Classification Engine Cache | Real-Time Video Frame Buffer |
|
Use Scenario: Accelerating TCAM replacement in deep packet inspection engines requiring rapid rule-set updates and parallel lookups. IC Role / Device Role / Timing Role: Burst-accessed SRAM holding compressed rule tables with byte-selectable write for incremental updates. Use Value: BW0#–BW3# enables 9-bit subword writes-reducing update latency by avoiding full 36-bit read-modify-write cycles. |
Use Scenario: Frame store in broadcast-grade video processing equipment handling 4K@60fps uncompressed YUV422 streams. IC Role / Device Role / Timing Role: Synchronous double-data-rate memory providing deterministic 36-bit pixel word delivery to video encoder pipelines. Use Value: Echo clocks (CQ/CQ#) align precisely with Q outputs-enabling single-cycle capture in FPGA logic without additional deskew circuitry. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR-II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C2663KV18-5BBAXC | 2M × 36-bit, 5 ns cycle, 1.8 V core, but uses SSTL-2 I/O (not HSTL); no ZQ calibration; different pinout. | Requires redesign of termination network and PCB layout; lacks programmable output impedance for dynamic trace matching. | Select when existing board uses SSTL-2 infrastructure and impedance tuning is handled externally. |
| AS7C3256B-20JIN | Asynchronous 32K × 8-bit SRAM; no burst, no dual-port, no DLL/PLL; 20 ns access, 3.3 V only. | Cannot support concurrent R/W or DDR timing; unsuitable for >100 MHz systems or QDR protocol stacks. | Consider only for legacy cost-sensitive designs where bandwidth and concurrency requirements are relaxed. |
Compared with UPD44645364AF5-E50-FQ1-A, CY7C2663KV18-5BBAXC offers identical density and speed but demands SSTL-compatible layout changes, while AS7C3256B-20JIN lacks QDR architecture entirely-making it a functional downgrade rather than a drop-in option.
Availability
UPD44645364AF5-E50-FQ1-A is available at Aetrix Electronics and suitable for high-speed network switch buffers, backplane interconnect memory, packet classification engine caches, and real-time video frame buffers requiring stable component supply across extended production lifecycles.
Supply support for UPD44645364AF5-E50-FQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.
UPD44645364AF5-E50-FQ1-A belongs to Renesas' QDR-II SRAM product line, engineered specifically for high-bandwidth, low-latency memory subsystems in networking and telecom infrastructure where deterministic burst timing and concurrent access are mandatory.
FAQ
What is the maximum operating frequency supported by UPD44645364AF5-E50-FQ1-A?
UPD44645364AF5-E50-FQ1-A supports a maximum clock frequency of 200 MHz, corresponding to a 5.0 ns clock cycle time. This rating is guaranteed under recommended DC and AC operating conditions (TA = 0 to 70°C, VDD = 1.8 ± 0.1 V, VDDQ = 1.4–1.8 V). Operation above 200 MHz is not characterized or supported.
Does UPD44645364AF5-E50-FQ1-A support true simultaneous read and write operations?
Yes, UPD44645364AF5-E50-FQ1-A implements physically separate read and write data paths, enabling concurrent transactions without arbitration delay. The device's block diagram confirms independent input registry/logic and output select/buffer stages, allowing one 4-word burst read and one 4-word burst write to overlap in time-provided R# and W# are not asserted simultaneously on the same K rising edge.
How is output impedance calibrated on UPD44645364AF5-E50-FQ1-A?
UPD44645364AF5-E50-FQ1-A uses the ZQ pin for dynamic output impedance calibration. A resistor (RQ) is connected from ZQ to ground, and the device sets Q, CQ, and CQ# output impedance to 0.2 × RQ. Calibration occurs automatically every 20 μs after power-up. ZQ must never be left floating or tied directly to GND.
Can UPD44645364AF5-E50-FQ1-A operate without the DLL/PLL enabled?
Yes-pulling DLL# LOW disables the DLL/PLL, allowing operation at frequencies below 120 MHz for debug or low-speed validation. However, AC/DC characteristics are not guaranteed in this mode. For full-spec 200 MHz operation, DLL# must be HIGH (typically tied to VDDQ via ≤10 kΩ resistor) to engage the timing compensation circuitry.
What is the function of the CQ and CQ# pins on UPD44645364AF5-E50-FQ1-A?
CQ and CQ# are echo clock outputs on UPD44645364AF5-E50-FQ1-A, synchronized to the Q data outputs with minimal skew. They serve as source-synchronous data-valid strobes for the receiving logic-enabling precise capture of burst data without requiring complex clock-data alignment circuits. These signals continue running even when Q outputs are tristated.
UPD44645364AF5-E50-FQ1-A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
UPD44645364AF5-E50-FQ1-A FAQ
1.How can I place an order for UPD44645364AF5-E50-FQ1-A through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD44645364AF5-E50-FQ1-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD44645364AF5-E50-FQ1-A reliable?
The price and inventory of UPD44645364AF5-E50-FQ1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44645364AF5-E50-FQ1-A is usually 5 days.
3.What payment methods are accepted for UPD44645364AF5-E50-FQ1-A?
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD44645364AF5-E50-FQ1-A?
For technical support, including UPD44645364AF5-E50-FQ1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44645364AF5-E50-FQ1-A requirements.
6.How does Aetrix verify that UPD44645364AF5-E50-FQ1-A is sourced from the original manufacturer or authorized distributors?
All UPD44645364AF5-E50-FQ1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44645364AF5-E50-FQ1-A meets industry standards.
7.What is the process for return or replacement of UPD44645364AF5-E50-FQ1-A?
All UPD44645364AF5-E50-FQ1-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD44645364AF5-E50-FQ1-A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD44645364AF5-E50-FQ1-A part is unused and in its original packaging.
Return procedure for UPD44645364AF5-E50-FQ1-A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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