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Renesas UPD44647186AF5-E25-FQ1-A

Part No.:
UPD44647186AF5-E25-FQ1-A
Manufacturer:
Renesas
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixUPD44647186AF5-E25-FQ1-A.pdf
Description:
IC SRAM 72MBIT PARALLEL 165PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:193

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Product details

Overview

UPD44647186AF5-E25-FQ1-A from Renesas Electronics is a 4,194,304-word × 18-bit synchronous quad data rate II+ (QDR II+) SRAM with 2.5 clock cycles read latency, HSTL interface, and 165-pin plastic BGA (15 × 17) packaging. It operates at 1.8 V core supply, supports 400 MHz clock frequency (2.5 ns cycle time), and delivers concurrent read/write capability for high-bandwidth networking and packet buffering applications.

For engineers reviewing the UPD44647186AF5-E25-FQ1-A datasheet, UPD44647186AF5-E25-FQ1-A pinout, UPD44647186AF5-E25-FQ1-A application, or UPD44647186AF5-E25-FQ1-A equivalent, key selection criteria include its 2.5-cycle read latency timing, user-programmable on-die termination (ODT), QVLD data-valid signal, dual-edge DDR operation, and JTAG 1149.1 test access compliance.

Technical Context

This QDR II+ SRAM uses full-CMOS six-transistor memory cells and integrates DLL/PLL circuitry to widen the output data valid window and support scaling to 500 MHz. Its synchronous peripheral logic latches all inputs-including address, R#, W#, BW0#/BW1#, and ODT-on the rising edges of complementary input clocks K and K#.

The device implements separate read and write data ports enabling true concurrent transactions, supports four-word burst operation to reduce address bus frequency, and features clock-stop capability with full functional recovery within 20 μs after clock resumption. Output impedance is user-tunable (35–70 Ω) via ZQ pin calibration.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization4,194,304 words × 18 bits (72 Mbit total density)
Read LatencyFixed 2.5 clock cycles - determines minimum delay between R# assertion and first valid Q output
Max Clock Frequency400 MHz - enables 800 MT/s per data pin in DDR mode
Supply Voltage1.8 V ± 0.1 V core (VDD); 1.5/1.8 V I/O (VDDQ) - requires tight regulation for HSTL signaling integrity
Interface StandardHSTL Class I - defines voltage thresholds, drive strength, and termination requirements for high-speed buses
Burst Length4-word burst - reduces address transition count and simplifies controller address generation logic
Package165-pin plastic BGA (15 mm × 17 mm) - requires controlled-impedance PCB layout with microvia escape routing

Pinout & Package

UPD44647186AF5-E25-FQ1-A is housed in a 165-pin plastic BGA (15 × 17 mm) package with 0.8 mm ball pitch. Pin assignments follow the x18 organization variant as documented in Renesas Data Sheet M19962EJ2V0DS (pages 5–6).

Pin/TerminalCircuit RoleDesign Meaning
A[0:19]Synchronous Address Input20-bit address registered on K/K# rising edges; used to select one of 4M locations for burst access
D[0:17]Synchronous Data Input18-bit parallel write data sampled across two K/K# rising edges during WRITE cycle
Q[0:17]Synchronous Data Output18-bit parallel read data aligned to K/K# rising edges with 2.5-cycle latency; edge-aligned to CQ/CQ#
R#, W#, BW0#, BW1#Control InputsActive-low commands: R# initiates read; W# initiates write; BW0#/BW1# enable byte-wise write masking for 9-bit subwords
K, K#, CQ, CQ#, QVLDClock & Timing SignalsK/K# are differential input clocks; CQ/CQ# are echo clocks tightly matched to Q outputs; QVLD indicates validity of Q data
ZQ, ODT, DLL#, VREFConfiguration & ReferenceZQ sets output impedance; ODT enables on-die termination on D/BW pins; DLL# disables DLL/PLL; VREF = VDDQ/2 reference for HSTL inputs
TMS, TDI, TCK, TDOJTAG InterfaceIEEE 1149.1-compliant test access port for boundary scan and debug; operates at 1.8 V I/O level

Key Features

FeatureDesign Value
Concurrent Read/Write PortsEnables simultaneous access to independent memory locations without arbitration delay - critical for full-duplex packet buffers
User-Programmable ODTON/OFF selection at power-on via ODT pin; RTT = 0.6 × RQ (105–210 Ω range) eliminates need for external termination resistors
Q Valid (QVLD) SignalEdge-aligned with CQ/CQ# outputs - provides unambiguous data-valid indication for high-speed capture without setup/hold margin uncertainty
DLL/PLL Timing EngineExtends data valid window across process/voltage/temperature variations and enables stable operation up to 500 MHz
Four-Tick Burst OperationReduces address bus toggling by 75% versus single-word access - lowers EMI and simplifies controller address sequencing logic

Applications

High-Speed Network Packet BufferingTelecom Line Card Memory

Use Scenario: Storing ingress/egress packets in 10G/40G Ethernet switch ASICs where deterministic latency and zero-contention throughput are required.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as a non-blocking FIFO buffer with independent read/write ports synchronized to system clock domain.

Use Value: 2.5-cycle read latency and concurrent transaction capability ensure line-rate packet processing without backpressure or pipeline stalls.

Use Scenario: Serving as shared memory for multiple DSPs and network processors on carrier-grade optical transport (OTN) line cards.

IC Role / Device Role / Timing Role: High-density, low-latency memory resource supporting burst-mode data transfers between heterogeneous processors and framer ICs.

Use Value: 72-Mbit capacity and HSTL interface deliver sufficient bandwidth and signal integrity for OC-192/STM-64 framing and overhead processing.

Baseband Processing in Wireless InfrastructureTest & Measurement Equipment Memory

Use Scenario: Buffering IQ samples between ADC/DAC and FPGA-based digital pre-distortion (DPD) engines in massive MIMO radio units.

IC Role / Device Role / Timing Role: Synchronous burst-access memory providing deterministic read/write turnaround for real-time signal path alignment.

Use Value: Clock-stop capability allows dynamic power gating during idle periods while maintaining state, reducing average power in bursty RF workloads.

Use Scenario: Capturing high-speed waveform data in digital storage oscilloscopes and logic analyzers requiring deep memory with nanosecond-level timing precision.

IC Role / Device Role / Timing Role: High-speed acquisition memory interfacing directly to sampling ADCs and pattern generators via HSTL buses.

Use Value: QVLD signal and echo clocks eliminate timing ambiguity in data capture, enabling reliable sampling at 400 MHz effective rate.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II+ SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C2665KV18-400BZXC4M × 18, 2.5-cycle latency, 400 MHz, same 165-pin BGA but Cypress-specific pinout and ODT implementationRequires board-level redesign due to non-identical pin mapping (e.g., VREF location, BW# placement)Select when existing Cypress-based designs require second-source qualification and layout revision is acceptable
AS7C34098A-400BIN4M × 18, 2.5-cycle latency, 400 MHz, but uses SSTL-2 interface and different power sequencing requirementsNot suitable for HSTL-only systems; requires VDDQ = 2.5 V and lacks QVLD signalConsider only if system already uses SSTL-2 infrastructure and can accommodate alternate timing validation

Compared with CY7C2665KV18-400BZXC and AS7C34098A-400BIN, UPD44647186AF5-E25-FQ1-A offers native HSTL compatibility, integrated QVLD for simplified capture logic, and Renesas' validated DLL/PLL performance at 400 MHz - making it optimal for new high-speed networking designs requiring minimal timing margin risk.

Availability

UPD44647186AF5-E25-FQ1-A is available at Aetrix Electronics and suitable for high-speed networking equipment, telecom line cards, wireless baseband units, and test & measurement instruments requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for UPD44647186AF5-E25-FQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.

The UPD44647186AF5-E25-FQ1-A belongs to Renesas' QDR II+ SRAM product line, engineered specifically for high-bandwidth, low-latency applications in networking infrastructure and real-time signal processing systems.

FAQ

What is the exact memory organization and density of UPD44647186AF5-E25-FQ1-A?

UPD44647186AF5-E25-FQ1-A is organized as 4,194,304 words × 18 bits, delivering a total density of 72 Mbit. This configuration supports efficient 18-bit or 36-bit data paths common in packet processing and DSP applications. The part number suffix "186" explicitly denotes the x18 organization and 2.5-cycle read latency variant within the μPD44647 family.

Does UPD44647186AF5-E25-FQ1-A support both 1.5 V and 1.8 V I/O supply (VDDQ)?

Yes, UPD44647186AF5-E25-FQ1-A supports VDDQ at either 1.5 V ± 0.1 V or 1.8 V ± 0.1 V, as specified in the QDR II+ standard. This flexibility allows interoperability with both legacy 1.5 V HSTL systems and newer 1.8 V implementations. The core VDD remains fixed at 1.8 V ± 0.1 V regardless of VDDQ selection.

How is on-die termination (ODT) configured on UPD44647186AF5-E25-FQ1-A?

ODT on UPD44647186AF5-E25-FQ1-A is enabled or disabled solely at power-on based on the logic state of the ODT pin: HIGH enables ODT (RTT = 0.6 × RQ), LOW or open disables it. Once set, the ODT state cannot be changed dynamically. The ZQ pin must be connected to a 175–350 Ω resistor to ground to calibrate output impedance.

What is the function and timing relationship of the QVLD signal on UPD44647186AF5-E25-FQ1-A?

QVLD on UPD44647186AF5-E25-FQ1-A is an output that indicates when Q[0:17] data is valid. It is edge-aligned with the CQ and CQ# echo clocks - not with K/K# - providing precise, jitter-immune data-valid timing for high-speed capture logic. QVLD asserts one cycle before the first Q word appears and remains asserted for the full 4-word burst duration.

Can UPD44647186AF5-E25-FQ1-A operate with stopped clock, and what is the recovery time?

Yes, UPD44647186AF5-E25-FQ1-A supports clock-stop mode: when K/K# halt, internal state is preserved and outputs remain stable. Normal operation resumes within 20 μs after clock restart, provided DLL# remains HIGH and stable clock is applied for ≥20 μs to re-lock the DLL/PLL. No reset sequence is required.

UPD44647186AF5-E25-FQ1-A Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II+
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
400 MHz
Write Cycle Time - Word, Page:
2.5ns
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-PBGA (13x15)

UPD44647186AF5-E25-FQ1-A FAQ

1.How can I place an order for UPD44647186AF5-E25-FQ1-A through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD44647186AF5-E25-FQ1-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD44647186AF5-E25-FQ1-A reliable?

The price and inventory of UPD44647186AF5-E25-FQ1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44647186AF5-E25-FQ1-A is usually 5 days.

3.What payment methods are accepted for UPD44647186AF5-E25-FQ1-A?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD44647186AF5-E25-FQ1-A transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UPD44647186AF5-E25-FQ1-A?

UPD44647186AF5-E25-FQ1-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD44647186AF5-E25-FQ1-A order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD44647186AF5-E25-FQ1-A?

For technical support, including UPD44647186AF5-E25-FQ1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44647186AF5-E25-FQ1-A requirements.

6.How does Aetrix verify that UPD44647186AF5-E25-FQ1-A is sourced from the original manufacturer or authorized distributors?

All UPD44647186AF5-E25-FQ1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44647186AF5-E25-FQ1-A meets industry standards.

7.What is the process for return or replacement of UPD44647186AF5-E25-FQ1-A?

All UPD44647186AF5-E25-FQ1-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD44647186AF5-E25-FQ1-A, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD44647186AF5-E25-FQ1-A part is unused and in its original packaging.

Return procedure for UPD44647186AF5-E25-FQ1-A:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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