Renesas UPD44647186AF5-E30-FQ1
- Part No.:
- UPD44647186AF5-E30-FQ1
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
UPD44647186AF5-E30-FQ1.pdf
- Description:
- STANDARD SRAM, 4MX18, 0.45NS
- Quantity:
- Payment:

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Inventory:1,272
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Product details
Overview
UPD44647186AF5-E30-FQ1 from Renesas Electronics is a 4,194,304-word × 18-bit synchronous Quad Data Rate II+ (QDR II+) SRAM with 2.5 clock cycles read latency, HSTL interface, and 165-pin plastic BGA (15 × 17 mm) packaging. It operates at 1.8 V core supply, supports 333 MHz clock frequency (3.0 ns cycle time), and delivers concurrent read/write capability for high-bandwidth networking buffers and packet memory applications.
For engineers reviewing the UPD44647186AF5-E30-FQ1 datasheet, UPD44647186AF5-E30-FQ1 pinout, UPD44647186AF5-E30-FQ1 application, or UPD44647186AF5-E30-FQ1 equivalent, key selection criteria include its 2.5-cycle read latency timing, user-programmable on-die termination (ODT), QVLD data-valid signaling, burst-4 DDR operation, and compatibility with JTAG 1149.1 test infrastructure.
Technical Context
This QDR II+ SRAM uses dual-edge-triggered input clocks (K/K#) to register address/control on K↑ and data on both K↑ and K#↑, enabling true double-data-rate throughput. Its internal DLL/PLL ensures wide output data valid window and supports frequencies up to 500 MHz - though the UPD44647186AF5-E30-FQ1 variant is rated for 333 MHz (3.0 ns).
The device implements separate read and write data ports, allowing fully concurrent transactions without bus arbitration. It features echo clocks (CQ/CQ#) edge-aligned with output data and a dedicated QVLD signal to indicate valid Q outputs - all synchronized to the same clock domain as data.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 4,194,304 words × 18 bits (72 Mbit total density) |
| Read Latency | 2.5 clock cycles - fixed at power-on; determines minimum clock-to-output delay for read data |
| Clock Frequency | 333 MHz (3.0 ns cycle time) - defines maximum sustained bandwidth of 2.4 Gbps per data pin |
| Supply Voltage | 1.8 V ± 0.1 V core (VDD); 1.5–1.8 V I/O (VDDQ) - enables low-power, high-speed HSTL signaling |
| Interface Standard | HSTL Class I - requires VREF = VDDQ/2; supports impedance-matched, noise-immune DDR signaling |
| Burst Length | 4-word burst - reduces address bus toggling frequency by 75% versus single-word access |
| On-Die Termination | User-selectable ODT (ON/OFF at power-on) - sets D/BW# pin termination to 150 Ω (typ.) for improved signal integrity |
| Data Valid Signal | QVLD output - provides explicit, edge-aligned indication of valid Q0–Q17 data, simplifying capture logic |
Pinout & Package
UPD44647186AF5-E30-FQ1 is housed in a 165-pin plastic ball grid array (BGA) package measuring 15 mm × 17 mm with 0.8 mm pitch. The package supports automated assembly and thermal dissipation suitable for high-density routing in telecom and networking PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| K, K# | Input clock pair | Registers all synchronous inputs on rising edges; K# must be 180° out-of-phase with K for precise DDR timing |
| R#, W# | Read and write command inputs | Active-low commands that initiate burst-4 read or write cycles on next K edge; mutually exclusive in normal operation |
| BW0#, BW1# | Byte write enable inputs | Independent 9-bit byte masks for selective 18-bit write - enables partial-word updates without read-modify-write |
| D0–D17 | Synchronous data inputs | 18-bit parallel write data registered on K↑ and K#↑; aligned with burst address sequence |
| Q0–Q17 | Synchronous data outputs | 18-bit parallel read data delivered on K#↑, K↑, K#↑, K↑ (2.5-cycle latency); edge-aligned with CQ/CQ# |
| CQ, CQ# | Echo clock outputs | Single-ended clocks tightly matched to Q outputs; used as data-strobe references for receiver capture logic |
| QVLD | Data validity indicator | Asserted coincident with first valid Q word in burst; eliminates need for fixed-latency delay chains in FPGA capture logic |
| ODT | On-die termination control | High at power-on enables 150 Ω termination on D/BW# pins; state is latched and immutable after initialization |
| ZQ | Impedance calibration reference | Connected to external 250 Ω resistor to ground; calibrates output driver and ODT impedance across voltage/temperature |
| VDD, VDDQ, VSS | Power and ground | Separate core (VDD) and I/O (VDDQ) supplies decouple switching noise; 12 VSS balls ensure low-impedance return path |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent read/write ports | Enables full-duplex memory access - critical for pipeline buffering in switch fabric and packet processors |
| Programmable output impedance | User-adjustable 35–70 Ω drive strength via ZQ calibration - matches varying PCB trace impedances without external resistors |
| QVLD + echo clocks | Eliminates setup/hold uncertainty at receiver: QVLD and CQ/CQ# provide deterministic, jitter-tolerant data capture windows |
| On-die termination (ODT) | Reduces stub reflections and improves eye diagram margin on high-speed D/Q buses - especially beneficial in multi-drop topologies |
| JTAG 1149.1 test port | Enables boundary-scan testing of BGA solder joints and interconnects - essential for production testability of dense layouts |
| 20 μs clock-stop recovery | Allows dynamic clock gating during idle periods without system reset - lowers average power in bursty traffic scenarios |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing ingress/egress packets in Layer 2/L3 switches with strict latency budgets and variable frame sizes. IC Role / Device Role / Timing Role: Dual-port SRAM acting as elastic buffer between MAC and switching fabric; absorbs speed mismatches using concurrent R/W. Use Value: 2.5-cycle read latency and burst-4 operation deliver predictable 333 MHz throughput, while QVLD eliminates timing closure risk in FPGA-based packet engines. |
Use Scenario: Holding ATM cell headers, MPLS labels, and forwarding tables in carrier-grade optical line cards. IC Role / Device Role / Timing Role: High-reliability, low-jitter memory for real-time traffic shaping and policing functions requiring sub-10 ns access consistency. Use Value: HSTL interface and on-die termination maintain signal integrity across 15 cm backplane traces; DLL/PLL ensures stable timing at 333 MHz under temperature variation. |
| Baseband Processing Buffer | Test Equipment Pattern Memory |
Use Scenario: Temporary storage of IQ samples between ADC/DAC and DSP in 4G/5G radio units with tight synchronization requirements. IC Role / Device Role / Timing Role: Synchronous burst memory interfacing directly to FPGA fabric; clocked by recovered symbol clock with minimal skew. Use Value: Echo clocks (CQ/CQ#) and QVLD provide deterministic sampling points - enabling reliable capture without complex deskew logic in high-sample-rate designs. |
Use Scenario: Storing stimulus/response vectors in automated test equipment (ATE) for semiconductor validation at >300 MHz rates. IC Role / Device Role / Timing Role: Deterministic, low-jitter memory delivering repeatable timing margins for high-speed digital pattern generation and comparison. Use Value: Clock-stop capability allows precise test sequencing with zero-latency resume; JTAG support enables in-system verification of memory contents pre-test. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II+ SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C2665KV18-333BZI | Same 4M×18 organization, 333 MHz, 2.5-cycle latency; Cypress (now Infineon) QDR II+ with identical HSTL interface and 165-pin BGA | Qualified for industrial temperature range (−40°C to +85°C); Renesas part rated −25°C to +85°C per datasheet footnote | Select CY7C2665KV18-333BZI for extended temperature operation or when dual-sourcing is required |
| AS7C3256A-333BIN | Lower-density 128K×18 QDR II (not II+) SRAM; 333 MHz max, 2.0-cycle latency only; no QVLD or ODT support | Lacks echo clocks, QVLD, and programmable termination - requires external termination and fixed-latency capture logic | Choose AS7C3256A-333BIN only for cost-sensitive, lower-bandwidth applications where advanced QDR II+ features are unused |
Compared with UPD44647186AF5-E30-FQ1, the CY7C2665KV18-333BZI offers identical performance and pinout with broader temperature qualification, while the AS7C3256A-333BIN sacrifices QVLD, ODT, and echo clocks to reduce cost and complexity - making it suitable only where those features are unnecessary.
Availability
UPD44647186AF5-E30-FQ1 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and baseband processing applications requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.
Supply support for UPD44647186AF5-E30-FQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The UPD44647186AF5-E30-FQ1 belongs to Renesas' QDR II+ SRAM product line, designed specifically for high-throughput, low-latency memory subsystems in networking equipment, base stations, and test instrumentation.
FAQ
What is the read latency of the UPD44647186AF5-E30-FQ1, and can it be configured?
The UPD44647186AF5-E30-FQ1 has a fixed 2.5 clock cycles read latency, which is determined by the device variant and cannot be altered by user configuration. This latency is set at manufacturing and latched during power-on initialization - unlike some QDR II+ families offering selectable modes, the UPD44647186AF5-E30-FQ1 is strictly a 2.5-cycle device per its ordering code suffix "-E30" and datasheet specification.
Does the UPD44647186AF5-E30-FQ1 support on-die termination (ODT), and how is it enabled?
Yes, the UPD44647186AF5-E30-FQ1 supports on-die termination on its D0–D17 and BW0#/BW1# pins. ODT is enabled by holding the ODT pin HIGH during power-on sequence - it is latched at initialization and remains fixed throughout operation. When active, ODT sets termination resistance to 150 Ω (typ.), calibrated via the ZQ pin's external 250 Ω resistor to ground.
What is the function of the QVLD pin on the UPD44647186AF5-E30-FQ1, and how does it improve system timing?
The QVLD pin on the UPD44647186AF5-E30-FQ1 signals when output data Q0–Q17 is valid and stable. It is edge-aligned with the CQ/CQ# echo clocks, providing a deterministic strobe for capturing burst-read data. This eliminates reliance on fixed delay chains or PLL-based deskew, significantly simplifying timing closure in FPGA- or ASIC-based receivers interfacing to the UPD44647186AF5-E30-FQ1.
Can the UPD44647186AF5-E30-FQ1 operate with a 1.5 V VDDQ supply, and what are the implications?
Yes, the UPD44647186AF5-E30-FQ1 supports VDDQ = 1.5 V ± 0.1 V (in addition to 1.8 V), as specified in the QDR II+ standard. Using 1.5 V reduces I/O power consumption and eases termination design when interfacing with 1.5 V logic, but requires adjusting VREF to 0.75 V (VDDQ/2) and verifying HSTL Class I receiver compatibility in the connected controller.
How does the UPD44647186AF5-E30-FQ1 handle clock stop, and what is the recovery time?
The UPD44647186AF5-E30-FQ1 supports clock-stop mode: when K/K# are halted, internal state is preserved and outputs remain valid until resumed. Upon clock restart, normal operation resumes within 20 μs - no reset or reinitialization is required. This feature enables dynamic power gating in low-traffic intervals while maintaining data coherency in the UPD44647186AF5-E30-FQ1 memory array.
UPD44647186AF5-E30-FQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
UPD44647186AF5-E30-FQ1 FAQ
1.How can I place an order for UPD44647186AF5-E30-FQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD44647186AF5-E30-FQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD44647186AF5-E30-FQ1 reliable?
The price and inventory of UPD44647186AF5-E30-FQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44647186AF5-E30-FQ1 is usually 5 days.
3.What payment methods are accepted for UPD44647186AF5-E30-FQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD44647186AF5-E30-FQ1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UPD44647186AF5-E30-FQ1?
UPD44647186AF5-E30-FQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD44647186AF5-E30-FQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD44647186AF5-E30-FQ1?
For technical support, including UPD44647186AF5-E30-FQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44647186AF5-E30-FQ1 requirements.
6.How does Aetrix verify that UPD44647186AF5-E30-FQ1 is sourced from the original manufacturer or authorized distributors?
All UPD44647186AF5-E30-FQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44647186AF5-E30-FQ1 meets industry standards.
7.What is the process for return or replacement of UPD44647186AF5-E30-FQ1?
All UPD44647186AF5-E30-FQ1 units undergo pre-shipment inspection (PSI). If there is an issue with UPD44647186AF5-E30-FQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD44647186AF5-E30-FQ1 part is unused and in its original packaging.
Return procedure for UPD44647186AF5-E30-FQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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