Renesas UPD44647366AF5-E25-FQ1-A
- Part No.:
- UPD44647366AF5-E25-FQ1-A
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
UPD44647366AF5-E25-FQ1-A.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165PBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,472
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Product details
Overview
UPD44647366AF5-E25-FQ1-A from Renesas Electronics is a 2,097,152-word × 36-bit synchronous Quad Data Rate II+ (QDR II+) SRAM with 2.5 clock cycles read latency, 400 MHz operation, HSTL interface, and 165-pin plastic BGA (15 × 17 mm) packaging. It delivers concurrent read/write ports, on-die termination (ODT), QVLD data-valid signaling, and DLL/PLL-based timing control for high-bandwidth networking and packet buffering applications.
For engineers reviewing the UPD44647366AF5-E25-FQ1-A datasheet, UPD44647366AF5-E25-FQ1-A pinout, UPD44647366AF5-E25-FQ1-A application, or UPD44647366AF5-E25-FQ1-A equivalent, key selection considerations include its 2M × 36 organization, 2.5-cycle read latency at 400 MHz, HSTL I/O compatibility, ODT enablement via dedicated ODT pin, and strict power-on sequencing requirements for DLL/PLL lock and impedance calibration.
Technical Context
This QDR II+ SRAM implements dual-edge-triggered synchronous architecture using K/K# input clocks and CQ/CQ# echo clocks to align output data valid windows. Its internal burst counter supports fixed 4-word bursts, enabling full bus utilization without address toggling between transfers.
The device integrates independent read and write data paths, user-programmable output impedance (35–70 Ω), and JTAG 1149.1 test access. Read latency is fixed at 2.5 clock cycles - not user-selectable - and write latency remains constant at 1.0 cycle regardless of read latency mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 2,097,152 words × 36 bits (72 Mbit total) |
| Read Latency | Fixed 2.5 clock cycles - determines minimum time from R# assertion to first valid Q output |
| Maximum Clock Frequency | 400 MHz - sets maximum sustained throughput of 3.2 GB/s (36-bit × 400 MHz × 2 edges) |
| I/O Interface | HSTL Class I - requires VREF = VDDQ/2 and compatible driver/receiver termination |
| Supply Voltages | VDD = 1.8 ± 0.1 V (core); VDDQ = 1.5 or 1.8 ± 0.1 V (I/O buffer supply) |
| Package | 165-pin plastic BGA (15 mm × 17 mm, 1.0 mm pitch) |
| On-Die Termination | ODT enabled via ODT pin at power-on - sets Dxx/BWx# termination to 0.6 × RQ (105–210 Ω range) |
Pinout & Package
UPD44647366AF5-E25-FQ1-A is housed in a 165-pin plastic BGA (15 × 17 mm, 1.0 mm pitch) with standard ball layout per Renesas datasheet M19962EJ2V0DS. Pin functions are defined for the 2M × 36 configuration, including 19 address inputs (A), 36 bidirectional data I/Os (D0–D35/Q0–Q35), four byte-write enables (BW0#–BW3#), and dedicated control signals (R#, W#, K/K#, CQ/CQ#, QVLD, ODT, ZQ, DLL#, VREF, TMS/TCK/TDI/TDO).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Synchronous Address Inputs | Registered on rising edge of K; define 2M-word location for burst-4 access |
| D0–D35 / Q0–Q35 | Bidirectional Data I/O | Separate read/write data paths; 36-bit wide; edge-aligned to K/K# and echoed by CQ/CQ# |
| BW0#–BW3# | Byte Write Enables | Active-low controls for 9-bit byte segments; enables partial writes without read-modify-write |
| R#, W# | Command Inputs | Edge-triggered read/write initiators; ignored if both asserted (NOP) |
| K, K# | Differential Input Clock | Single-ended pair (180° phase); registers all inputs on rising edges; drives DLL/PLL |
| CQ, CQ# | Echo Clock Outputs | Edge-aligned to Q outputs; used for data capture timing; stop when clock halts |
| QVLD | Data Valid Indicator | Asserted synchronously with first valid Q word in burst; replaces need for echo-clock-based strobing |
| ODT | On-Die Termination Control | High at power-on enables ODT on Dxx/BWx# pins; state fixed after initialization |
| ZQ | Impedance Calibration Reference | Connected to external resistor to ground (175–350 Ω); sets output and ODT impedance |
| DLL# | DLL/PLL Disable | Must be HIGH for normal operation; LOW bypasses DLL/PLL but invalidates AC specs |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent Read/Write Ports | Enables simultaneous access to different memory locations - critical for full-duplex packet buffering in switches/routers |
| QVLD Output Signal | Eliminates need for echo-clock routing to receivers; simplifies PCB layout and timing closure for high-speed interfaces |
| User-Programmable Output Impedance | 35–70 Ω tuning via ZQ resistor matching - improves signal integrity across varying trace impedances and board stackups |
| On-Die Termination (ODT) | Reduces external termination components and stub reflections on Dxx/BWx# lines - lowers system BOM and improves noise margin |
| 4-Word Burst Operation | Minimizes address bus toggling and controller overhead - increases effective bandwidth utilization to 100% in streaming applications |
Applications
| Networking Packet Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: High-speed packet buffering in 10G/40G Ethernet switch fabric ASICs where ingress and egress traffic must be stored concurrently. IC Role / Device Role / Timing Role: Dual-port SRAM providing non-blocking read/write access with deterministic 2.5-cycle latency for flow control and queue management. Use Value: Enables real-time packet reordering and congestion avoidance without CPU intervention, leveraging burst-4 efficiency and QVLD-synchronized reads. |
Use Scenario: Buffering control-plane and user-plane data in LTE baseband processing units requiring low-latency, high-throughput memory access. IC Role / Device Role / Timing Role: QDR II+ SRAM acting as shared memory between DSP cores and FPGA accelerators with synchronized HSTL I/O timing. Use Value: Delivers 3.2 GB/s sustained bandwidth at 400 MHz, meeting TD-LTE frame processing deadlines while reducing external termination complexity via ODT. |
| Test Equipment Waveform Memory | Industrial Real-Time Controller Cache |
Use Scenario: Storing multi-channel digital waveform samples in high-resolution arbitrary waveform generators with simultaneous capture and playback. IC Role / Device Role / Timing Role: High-density SRAM serving as dual-port sample buffer - one port for DAC streaming, another for ADC acquisition. Use Value: 72 Mbit capacity and 400 MHz clock support allow >1 Gsample/s aggregate throughput, with QVLD ensuring precise sample alignment. |
Use Scenario: Deterministic instruction/data caching in safety-critical motion controllers where jitter-free memory access is required for servo loop execution. IC Role / Device Role / Timing Role: Low-jitter, clock-stop-capable SRAM providing guaranteed 2.5-cycle read response under variable load conditions. Use Value: Clock-stop capability restores operation within 20 μs after resume - maintains real-time determinism during power-gating events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II+ SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C2665KV18-400BZXC (Infineon) | 2M × 36, 2.5-cycle latency, 400 MHz, same 165-pin BGA; lacks QVLD and user-programmable impedance | Requires external echo-clock routing and fixed 50 Ω termination - less flexible for impedance-tuned layouts | Select when QVLD and ZQ tuning are unnecessary and Infineon ecosystem support is preferred |
| AS7C3256A-20JC (Alliance Memory) | 2M × 36, 2.5-cycle latency, 400 MHz, but uses SSTL-18 interface and 165-pin TFBGA; no ODT or DLL/PLL | Lower signal integrity margin at 400 MHz due to absence of DLL/PLL and ODT; incompatible HSTL voltage reference | Select only for cost-sensitive, lower-performance systems where HSTL compliance and advanced timing features are not required |
Compared with CY7C2665KV18-400BZXC and AS7C3256A-20JC, UPD44647366AF5-E25-FQ1-A provides superior signal integrity via QVLD timing assurance and programmable output impedance, while its integrated DLL/PLL ensures stable 400 MHz operation across voltage/temperature - making it optimal for high-reliability networking and test equipment.
Availability
UPD44647366AF5-E25-FQ1-A is available at Aetrix Electronics and suitable for networking packet buffering, telecom line card memory, test equipment waveform storage, and industrial real-time controller cache requiring stable component supply, long-lifecycle support, and lead-free RoHS-compliant packaging.
Supply support for UPD44647366AF5-E25-FQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
UPD44647366AF5-E25-FQ1-A belongs to Renesas' QDR II+ SRAM product line, engineered specifically for high-bandwidth, low-latency applications in networking equipment, base stations, and high-end test instrumentation where deterministic timing and signal integrity are critical.
FAQ
What is the read latency of UPD44647366AF5-E25-FQ1-A, and is it configurable?
UPD44647366AF5-E25-FQ1-A has a fixed 2.5 clock cycles read latency - it is not user-configurable. This value is hardwired per device variant and corresponds to the "2.5" suffix in the part number. The datasheet confirms latency is determined at manufacturing and cannot be altered via register settings or pin strapping. For designs requiring 2.0-cycle latency, UPD44647364AF5-E25-FQ1-A must be selected instead.
Does UPD44647366AF5-E25-FQ1-A support on-die termination (ODT), and how is it enabled?
Yes, UPD44647366AF5-E25-FQ1-A supports ODT on D0–D35 and BW0#–BW3# pins. ODT is enabled by holding the ODT pin HIGH during power-on initialization - the state is latched and cannot be changed afterward. When active, ODT sets termination resistance to 0.6 × RQ (105–210 Ω), where RQ is the external resistor connected from ZQ to ground (175–350 Ω). The ODT pin must be tied to VDDQ via ≤10 kΩ resistor for reliable activation.
What is the function of the QVLD pin on UPD44647366AF5-E25-FQ1-A, and how does it differ from CQ/CQ#?
The QVLD pin on UPD44647364AF5-E25-FQ1-A (and thus UPD44647366AF5-E25-FQ1-A) indicates validity of output data Q0–Q35 and is edge-aligned with CQ/CQ#. Unlike CQ/CQ#, which run freely and stop only when K/K# halt, QVLD asserts only during active read bursts and provides unambiguous data-ready signaling without requiring echo-clock routing to the receiver. This reduces PCB routing complexity and improves timing margin in high-speed systems.
What are the power sequencing requirements for UPD44647366AF5-E25-FQ1-A during startup?
UPD44647366AF5-E25-FQ1-A requires strict power-on sequencing: VSS first, then VDD, followed by VDDQ (simultaneous with or after VDD, but VDDQ must not exceed VDD by >0.5 V), then VREF, and finally stable K/K# clock for ≥20 μs to lock the DLL/PLL. Failure to follow this sequence risks undefined behavior, failed impedance calibration, or inability to achieve specified AC performance. The DLL# pin must be held HIGH throughout startup.
Can UPD44647366AF5-E25-FQ1-A operate with a 1.5 V VDDQ supply, and what are the implications?
Yes, UPD44647366AF5-E25-FQ1-A supports VDDQ = 1.5 ± 0.1 V (or 1.8 ± 0.1 V) per its datasheet. Using 1.5 V reduces I/O power consumption and heat generation but requires compatible HSTL Class I drivers/receivers rated for 1.5 V operation. VREF must be set to VDDQ/2 (i.e., 0.75 V), and ZQ calibration remains valid as long as the external RQ resistor matches the 1.5 V VDDQ condition per the ODT DC parameter table.
UPD44647366AF5-E25-FQ1-A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II+
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 400 MHz
- Write Cycle Time - Word, Page:
- 2.5ns
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-PBGA (13x15)
UPD44647366AF5-E25-FQ1-A FAQ
1.How can I place an order for UPD44647366AF5-E25-FQ1-A through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD44647366AF5-E25-FQ1-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD44647366AF5-E25-FQ1-A reliable?
The price and inventory of UPD44647366AF5-E25-FQ1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44647366AF5-E25-FQ1-A is usually 5 days.
3.What payment methods are accepted for UPD44647366AF5-E25-FQ1-A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD44647366AF5-E25-FQ1-A transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UPD44647366AF5-E25-FQ1-A?
UPD44647366AF5-E25-FQ1-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD44647366AF5-E25-FQ1-A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD44647366AF5-E25-FQ1-A?
For technical support, including UPD44647366AF5-E25-FQ1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44647366AF5-E25-FQ1-A requirements.
6.How does Aetrix verify that UPD44647366AF5-E25-FQ1-A is sourced from the original manufacturer or authorized distributors?
All UPD44647366AF5-E25-FQ1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44647366AF5-E25-FQ1-A meets industry standards.
7.What is the process for return or replacement of UPD44647366AF5-E25-FQ1-A?
All UPD44647366AF5-E25-FQ1-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD44647366AF5-E25-FQ1-A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD44647366AF5-E25-FQ1-A part is unused and in its original packaging.
Return procedure for UPD44647366AF5-E25-FQ1-A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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