Renesas UPD44647366AF5-E25X-FQ1
- Part No.:
- UPD44647366AF5-E25X-FQ1
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
UPD44647366AF5-E25X-FQ1.pdf
- Description:
- STANDARD SRAM, 2MX36, 0.45NS
- Quantity:
- Payment:

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Inventory:2,399
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Product details
Overview
UPD44647366AF5-E25X-FQ1 from Renesas Electronics is a 2,097,152-word × 36-bit synchronous QDR II+ SRAM with 2.5 clock cycles read latency, HSTL interface, and 165-pin plastic BGA (15 × 17 mm) packaging. It operates at 1.8 V core supply, supports 400 MHz clock frequency (2.5 ns cycle time), and delivers concurrent read/write ports for high-bandwidth networking buffer applications.
For engineers reviewing the UPD44647366AF5-E25X-FQ1 datasheet, UPD44647366AF5-E25X-FQ1 pinout, UPD44647366AF5-E25X-FQ1 application, or UPD44647366AF5-E25X-FQ1 equivalent, key selection criteria include burst-aligned DDR timing, user-programmable ODT (105–210 Ω), QVLD data-valid signaling, DLL/PLL-enabled 400 MHz operation, and JTAG 1149.1 test access.
Technical Context
This device implements a true dual-port synchronous architecture with independent read and write data paths, enabling full 100% bus utilization during concurrent transactions. Its burst counter and echo clocks (CQ/CQ#) align output data edges precisely to K/K# rising edges, supporting deterministic timing in packet buffering and switching fabric designs.
The on-die termination (ODT) is statically configured at power-on via the ODT pin and terminates D0–D35 and BW0#–BW3# pins to VDDQ/VSS with RTT = 0.6 × RQ (RQ = 175–350 Ω). The DLL/PLL locks to K clock input (190–500 MHz range) and enables stable 400 MHz operation with 2.5-cycle read latency - fixed per device variant, not user-selectable.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 2,097,152 words × 36 bits (72 M-bit total density) |
| Read Latency | Fixed 2.5 clock cycles - determines minimum address-to-data delay in burst reads |
| Maximum Clock Frequency | 400 MHz (2.5 ns cycle time) - defines peak sustained bandwidth of 28.8 GB/s (36-bit × 2 × 400 MHz) |
| Supply Voltages | VDD = 1.8 ± 0.1 V (core); VDDQ = 1.5 or 1.8 V (I/O) - requires separate low-noise regulation |
| Interface Standard | HSTL Class I - mandates VREF = VDDQ/2 reference and strict AC timing margins |
| Burst Operation | 4-word burst (two K/K# rising edges) - reduces address bus toggling and simplifies controller logic |
| On-Die Termination | User-configurable ODT (ON/OFF at power-on); RTT = 105–210 Ω - eliminates external termination resistors on D/BW lines |
Pinout & Package
Package: 165-pin plastic BGA (15 mm × 17 mm, 0.8 mm pitch), RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Synchronous Address Input | 19-bit address registered on K/K# rising edge; used for 2M-word addressing |
| D0–D35 | Synchronous Data Input | 36-bit parallel write data; sampled across two consecutive K/K# edges |
| Q0–Q35 | Synchronous Data Output | 36-bit parallel read data; aligned to CQ/CQ# rising edges with QVLD assertion |
| R#, W# | Command Input | Active-low read/write strobes; initiate burst transactions on next K edge |
| BW0#–BW3# | Byte Write Select | Four independent active-low enables for 9-bit byte writes within 36-bit word |
| K, K# | Differential Input Clock | Single-ended pair (180° phase); registers all inputs on rising edges only |
| CQ, CQ# | Echo Clock Output | Single-ended outputs edge-aligned with Q outputs; used for data capture timing |
| QVLD | Data Valid Indicator | Asserted synchronously with first valid Q output in burst; replaces clock-edge inference |
| ODT | ODT Control Input | Static HIGH/LOW at power-on sets termination state for D/BW pins; no runtime change |
| ZQ | Impedance Calibration Input | Connects to external 175–350 Ω resistor to ground; calibrates output drive strength |
| VDD, VDDQ, VSS, VREF | Power & Reference | VDD (core), VDDQ (I/O), VSS (ground), VREF = VDDQ/2 (HSTL input threshold) |
| TMS, TDI, TCK, TDO | JTAG Test Interface | IEEE 1149.1 compliant; supports boundary-scan and memory test |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent Read/Write Ports | Enables simultaneous access to different memory locations - critical for full-duplex packet buffering in switches/routers |
| QVLD Data-Valid Signal | Eliminates need for echo-clock-based data capture timing margining - improves setup/hold reliability at 400 MHz |
| User-Programmable ODT | Reduces PCB routing complexity and signal integrity risk by integrating 105–210 Ω termination on D/BW lines |
| DLL/PLL Timing Engine | Extends usable frequency range to 400 MHz while maintaining wide data-valid window - essential for jitter-tolerant system design |
| Four-Tick Burst Mode | Halves effective address bus frequency versus single-word access - lowers controller logic overhead and EMI |
| Clock-Stop Capability | Enters low-power state with <20 μs recovery - supports dynamic power gating in burst-oriented traffic patterns |
Applications
| Network Packet Buffering | Switch Fabric Memory |
|---|---|
Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches with line-rate throughput. IC Role / Device Role / Timing Role: High-speed dual-port SRAM serving as shared buffer pool with independent read/write arbitration. Use Value: 2.5-cycle latency and 400 MHz operation enable 28.8 GB/s sustained bandwidth - sufficient for 100 GbE switch fabric aggregation. |
Use Scenario: Interconnecting multiple ASICs in modular chassis-based routers using centralized memory architecture. IC Role / Device Role / Timing Role: QDR II+ SRAM acting as crossbar switch lookup and forwarding table cache with deterministic burst access. Use Value: Concurrent read/write ports and QVLD eliminate pipeline stalls - ensures sub-100 ns latency for longest-prefix-match lookups. |
| Telecom Line Card Memory | High-Performance Test Equipment |
Use Scenario: Frame reassembly and jitter buffering in OTN/SONET transport equipment handling OC-192/STM-64 streams. IC Role / Device Role / Timing Role: Synchronous burst-memory buffer synchronized to line clock via K/K# inputs. Use Value: HSTL interface and DLL/PLL support clean signal integrity over backplane traces up to 20 inches at 400 MHz. |
Use Scenario: Real-time waveform capture and pattern generation in automated test systems requiring deep memory depth. IC Role / Device Role / Timing Role: High-density SRAM providing fast-access storage for stimulus/response vectors in ATE memory testers. Use Value: 72 M-bit capacity and 4-word burst reduce address bus width - simplifies FPGA controller design and increases vector depth. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II+ SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C2665KV18-400BZXC (Infineon) | Same 2M × 36 organization, 2.5-cycle latency, 400 MHz, 165-pin BGA; differs in ODT implementation (fixed 120 Ω) and lacks QVLD | No QVLD requires tighter echo-clock routing; fixed ODT limits impedance tuning flexibility | Select when legacy Infineon ecosystem compatibility or cost sensitivity outweighs QVLD timing margin benefit |
| AS7C362000B-400BIN (Alliance Memory) | Pin-compatible 2M × 36 QDR II+ part; identical 400 MHz speed but rated for industrial temp (−40°C to +85°C) vs. commercial (0°C to +70°C) | Broader temperature range suits base station or outdoor telecom hardware where ambient exceeds 70°C | Select for extended temperature operation without redesign; verify VDDQ tolerance matches 1.5/1.8 V system rail |
Compared with CY7C2665KV18-400BZXC and AS7C362000B-400BIN, UPD44647366AF5-E25X-FQ1 provides unique QVLD signaling for simplified data capture timing and user-selectable ODT impedance - offering superior signal integrity control in high-speed, noise-sensitive switch fabric designs.
Availability
UPD44647366AF5-E25X-FQ1 is available at Aetrix Electronics and suitable for network packet buffering, switch fabric memory, and telecom line card memory requiring stable component supply, long-lifecycle support, and guaranteed RoHS-compliant sourcing.
Supply support for UPD44647366AF5-E25X-FQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The UPD44647366AF5-E25X-FQ1 belongs to Renesas' QDR II+ SRAM product line, engineered specifically for high-bandwidth, low-latency buffering in networking and telecommunications equipment where deterministic DDR timing and signal integrity are critical.
FAQ
What is the exact memory organization and density of UPD44647366AF5-E25X-FQ1?
UPD44647366AF5-E25X-FQ1 is organized as 2,097,152 words × 36 bits, delivering a total density of 72 M-bit (9 MB). This configuration is optimized for 36-bit datapath systems such as network processors and switch ASICs requiring wide, burst-oriented memory access.
Does UPD44647366AF5-E25X-FQ1 support both 1.5 V and 1.8 V I/O supply voltages?
Yes, UPD44647366AF5-E25X-FQ1 supports VDDQ = 1.5 ± 0.1 V or 1.8 ± 0.1 V, allowing flexible integration into mixed-voltage systems. The core VDD remains fixed at 1.8 ± 0.1 V. System design must ensure VDDQ does not exceed VDD by more than 0.5 V during power-up/down sequences.
How is read latency configured on UPD44647366AF5-E25X-FQ1?
UPD44647366AF5-E25X-FQ1 has fixed 2.5 clock cycles read latency - it is not user-configurable. This variant is distinct from the 2.0-cycle version (e.g., UPD44647364AF5-E25X-FQ1) and cannot be changed via mode registers or pins.
What is the function of the QVLD pin on UPD44647366AF5-E25X-FQ1?
The QVLD pin on UPD44647366AF5-E25X-FQ1 is a synchronous data-valid indicator that asserts coincident with the first valid data output (Q0–Q35) in a read burst. It is edge-aligned with CQ/CQ# and eliminates reliance on echo-clock timing margins for reliable data capture.
Can the ODT setting on UPD44647366AF5-E25X-FQ1 be changed after power-on?
No. The ODT state (ON/OFF) of UPD44647366AF5-E25X-FQ1 is latched at power-on based on the logic level of the ODT pin and cannot be modified during operation. To enable ODT, ODT must be held HIGH before stable clock is applied; otherwise, it remains disabled.
UPD44647366AF5-E25X-FQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
UPD44647366AF5-E25X-FQ1 FAQ
1.How can I place an order for UPD44647366AF5-E25X-FQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD44647366AF5-E25X-FQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD44647366AF5-E25X-FQ1 reliable?
The price and inventory of UPD44647366AF5-E25X-FQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44647366AF5-E25X-FQ1 is usually 5 days.
3.What payment methods are accepted for UPD44647366AF5-E25X-FQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD44647366AF5-E25X-FQ1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UPD44647366AF5-E25X-FQ1?
UPD44647366AF5-E25X-FQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD44647366AF5-E25X-FQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD44647366AF5-E25X-FQ1?
For technical support, including UPD44647366AF5-E25X-FQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44647366AF5-E25X-FQ1 requirements.
6.How does Aetrix verify that UPD44647366AF5-E25X-FQ1 is sourced from the original manufacturer or authorized distributors?
All UPD44647366AF5-E25X-FQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44647366AF5-E25X-FQ1 meets industry standards.
7.What is the process for return or replacement of UPD44647366AF5-E25X-FQ1?
All UPD44647366AF5-E25X-FQ1 units undergo pre-shipment inspection (PSI). If there is an issue with UPD44647366AF5-E25X-FQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD44647366AF5-E25X-FQ1 part is unused and in its original packaging.
Return procedure for UPD44647366AF5-E25X-FQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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