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Renesas UPD44647366AF5-E25X-FQ1

Part No.:
UPD44647366AF5-E25X-FQ1
Manufacturer:
Renesas
Category:
Memory
Package:
-
Datasheet:
AetrixUPD44647366AF5-E25X-FQ1.pdf
Description:
STANDARD SRAM, 2MX36, 0.45NS
Quantity:
Payment:
Payment
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Inventory:2,399

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Product details

Overview

UPD44647366AF5-E25X-FQ1 from Renesas Electronics is a 2,097,152-word × 36-bit synchronous QDR II+ SRAM with 2.5 clock cycles read latency, HSTL interface, and 165-pin plastic BGA (15 × 17 mm) packaging. It operates at 1.8 V core supply, supports 400 MHz clock frequency (2.5 ns cycle time), and delivers concurrent read/write ports for high-bandwidth networking buffer applications.

For engineers reviewing the UPD44647366AF5-E25X-FQ1 datasheet, UPD44647366AF5-E25X-FQ1 pinout, UPD44647366AF5-E25X-FQ1 application, or UPD44647366AF5-E25X-FQ1 equivalent, key selection criteria include burst-aligned DDR timing, user-programmable ODT (105–210 Ω), QVLD data-valid signaling, DLL/PLL-enabled 400 MHz operation, and JTAG 1149.1 test access.

Technical Context

This device implements a true dual-port synchronous architecture with independent read and write data paths, enabling full 100% bus utilization during concurrent transactions. Its burst counter and echo clocks (CQ/CQ#) align output data edges precisely to K/K# rising edges, supporting deterministic timing in packet buffering and switching fabric designs.

The on-die termination (ODT) is statically configured at power-on via the ODT pin and terminates D0–D35 and BW0#–BW3# pins to VDDQ/VSS with RTT = 0.6 × RQ (RQ = 175–350 Ω). The DLL/PLL locks to K clock input (190–500 MHz range) and enables stable 400 MHz operation with 2.5-cycle read latency - fixed per device variant, not user-selectable.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization2,097,152 words × 36 bits (72 M-bit total density)
Read LatencyFixed 2.5 clock cycles - determines minimum address-to-data delay in burst reads
Maximum Clock Frequency400 MHz (2.5 ns cycle time) - defines peak sustained bandwidth of 28.8 GB/s (36-bit × 2 × 400 MHz)
Supply VoltagesVDD = 1.8 ± 0.1 V (core); VDDQ = 1.5 or 1.8 V (I/O) - requires separate low-noise regulation
Interface StandardHSTL Class I - mandates VREF = VDDQ/2 reference and strict AC timing margins
Burst Operation4-word burst (two K/K# rising edges) - reduces address bus toggling and simplifies controller logic
On-Die TerminationUser-configurable ODT (ON/OFF at power-on); RTT = 105–210 Ω - eliminates external termination resistors on D/BW lines

Pinout & Package

Package: 165-pin plastic BGA (15 mm × 17 mm, 0.8 mm pitch), RoHS-compliant, lead-free.

Pin/Terminal Circuit Role Design Meaning
A0–A18Synchronous Address Input19-bit address registered on K/K# rising edge; used for 2M-word addressing
D0–D35Synchronous Data Input36-bit parallel write data; sampled across two consecutive K/K# edges
Q0–Q35Synchronous Data Output36-bit parallel read data; aligned to CQ/CQ# rising edges with QVLD assertion
R#, W#Command InputActive-low read/write strobes; initiate burst transactions on next K edge
BW0#–BW3#Byte Write SelectFour independent active-low enables for 9-bit byte writes within 36-bit word
K, K#Differential Input ClockSingle-ended pair (180° phase); registers all inputs on rising edges only
CQ, CQ#Echo Clock OutputSingle-ended outputs edge-aligned with Q outputs; used for data capture timing
QVLDData Valid IndicatorAsserted synchronously with first valid Q output in burst; replaces clock-edge inference
ODTODT Control InputStatic HIGH/LOW at power-on sets termination state for D/BW pins; no runtime change
ZQImpedance Calibration InputConnects to external 175–350 Ω resistor to ground; calibrates output drive strength
VDD, VDDQ, VSS, VREFPower & ReferenceVDD (core), VDDQ (I/O), VSS (ground), VREF = VDDQ/2 (HSTL input threshold)
TMS, TDI, TCK, TDOJTAG Test InterfaceIEEE 1149.1 compliant; supports boundary-scan and memory test

Key Features

Feature Design Value
Concurrent Read/Write PortsEnables simultaneous access to different memory locations - critical for full-duplex packet buffering in switches/routers
QVLD Data-Valid SignalEliminates need for echo-clock-based data capture timing margining - improves setup/hold reliability at 400 MHz
User-Programmable ODTReduces PCB routing complexity and signal integrity risk by integrating 105–210 Ω termination on D/BW lines
DLL/PLL Timing EngineExtends usable frequency range to 400 MHz while maintaining wide data-valid window - essential for jitter-tolerant system design
Four-Tick Burst ModeHalves effective address bus frequency versus single-word access - lowers controller logic overhead and EMI
Clock-Stop CapabilityEnters low-power state with <20 μs recovery - supports dynamic power gating in burst-oriented traffic patterns

Applications

Network Packet Buffering Switch Fabric Memory

Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches with line-rate throughput.

IC Role / Device Role / Timing Role: High-speed dual-port SRAM serving as shared buffer pool with independent read/write arbitration.

Use Value: 2.5-cycle latency and 400 MHz operation enable 28.8 GB/s sustained bandwidth - sufficient for 100 GbE switch fabric aggregation.

Use Scenario: Interconnecting multiple ASICs in modular chassis-based routers using centralized memory architecture.

IC Role / Device Role / Timing Role: QDR II+ SRAM acting as crossbar switch lookup and forwarding table cache with deterministic burst access.

Use Value: Concurrent read/write ports and QVLD eliminate pipeline stalls - ensures sub-100 ns latency for longest-prefix-match lookups.

Telecom Line Card Memory High-Performance Test Equipment

Use Scenario: Frame reassembly and jitter buffering in OTN/SONET transport equipment handling OC-192/STM-64 streams.

IC Role / Device Role / Timing Role: Synchronous burst-memory buffer synchronized to line clock via K/K# inputs.

Use Value: HSTL interface and DLL/PLL support clean signal integrity over backplane traces up to 20 inches at 400 MHz.

Use Scenario: Real-time waveform capture and pattern generation in automated test systems requiring deep memory depth.

IC Role / Device Role / Timing Role: High-density SRAM providing fast-access storage for stimulus/response vectors in ATE memory testers.

Use Value: 72 M-bit capacity and 4-word burst reduce address bus width - simplifies FPGA controller design and increases vector depth.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II+ SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C2665KV18-400BZXC (Infineon)Same 2M × 36 organization, 2.5-cycle latency, 400 MHz, 165-pin BGA; differs in ODT implementation (fixed 120 Ω) and lacks QVLDNo QVLD requires tighter echo-clock routing; fixed ODT limits impedance tuning flexibilitySelect when legacy Infineon ecosystem compatibility or cost sensitivity outweighs QVLD timing margin benefit
AS7C362000B-400BIN (Alliance Memory)Pin-compatible 2M × 36 QDR II+ part; identical 400 MHz speed but rated for industrial temp (−40°C to +85°C) vs. commercial (0°C to +70°C)Broader temperature range suits base station or outdoor telecom hardware where ambient exceeds 70°CSelect for extended temperature operation without redesign; verify VDDQ tolerance matches 1.5/1.8 V system rail

Compared with CY7C2665KV18-400BZXC and AS7C362000B-400BIN, UPD44647366AF5-E25X-FQ1 provides unique QVLD signaling for simplified data capture timing and user-selectable ODT impedance - offering superior signal integrity control in high-speed, noise-sensitive switch fabric designs.

Availability

UPD44647366AF5-E25X-FQ1 is available at Aetrix Electronics and suitable for network packet buffering, switch fabric memory, and telecom line card memory requiring stable component supply, long-lifecycle support, and guaranteed RoHS-compliant sourcing.

Supply support for UPD44647366AF5-E25X-FQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The UPD44647366AF5-E25X-FQ1 belongs to Renesas' QDR II+ SRAM product line, engineered specifically for high-bandwidth, low-latency buffering in networking and telecommunications equipment where deterministic DDR timing and signal integrity are critical.

FAQ

What is the exact memory organization and density of UPD44647366AF5-E25X-FQ1?

UPD44647366AF5-E25X-FQ1 is organized as 2,097,152 words × 36 bits, delivering a total density of 72 M-bit (9 MB). This configuration is optimized for 36-bit datapath systems such as network processors and switch ASICs requiring wide, burst-oriented memory access.

Does UPD44647366AF5-E25X-FQ1 support both 1.5 V and 1.8 V I/O supply voltages?

Yes, UPD44647366AF5-E25X-FQ1 supports VDDQ = 1.5 ± 0.1 V or 1.8 ± 0.1 V, allowing flexible integration into mixed-voltage systems. The core VDD remains fixed at 1.8 ± 0.1 V. System design must ensure VDDQ does not exceed VDD by more than 0.5 V during power-up/down sequences.

How is read latency configured on UPD44647366AF5-E25X-FQ1?

UPD44647366AF5-E25X-FQ1 has fixed 2.5 clock cycles read latency - it is not user-configurable. This variant is distinct from the 2.0-cycle version (e.g., UPD44647364AF5-E25X-FQ1) and cannot be changed via mode registers or pins.

What is the function of the QVLD pin on UPD44647366AF5-E25X-FQ1?

The QVLD pin on UPD44647366AF5-E25X-FQ1 is a synchronous data-valid indicator that asserts coincident with the first valid data output (Q0–Q35) in a read burst. It is edge-aligned with CQ/CQ# and eliminates reliance on echo-clock timing margins for reliable data capture.

Can the ODT setting on UPD44647366AF5-E25X-FQ1 be changed after power-on?

No. The ODT state (ON/OFF) of UPD44647366AF5-E25X-FQ1 is latched at power-on based on the logic level of the ODT pin and cannot be modified during operation. To enable ODT, ODT must be held HIGH before stable clock is applied; otherwise, it remains disabled.

UPD44647366AF5-E25X-FQ1 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
-
Memory Format:
-
Technology:
-
Memory Size:
-
Memory Organization:
-
Memory Interface:
-
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

UPD44647366AF5-E25X-FQ1 FAQ

1.How can I place an order for UPD44647366AF5-E25X-FQ1 through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD44647366AF5-E25X-FQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD44647366AF5-E25X-FQ1 reliable?

The price and inventory of UPD44647366AF5-E25X-FQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD44647366AF5-E25X-FQ1 is usually 5 days.

3.What payment methods are accepted for UPD44647366AF5-E25X-FQ1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD44647366AF5-E25X-FQ1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UPD44647366AF5-E25X-FQ1?

UPD44647366AF5-E25X-FQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD44647366AF5-E25X-FQ1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD44647366AF5-E25X-FQ1?

For technical support, including UPD44647366AF5-E25X-FQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD44647366AF5-E25X-FQ1 requirements.

6.How does Aetrix verify that UPD44647366AF5-E25X-FQ1 is sourced from the original manufacturer or authorized distributors?

All UPD44647366AF5-E25X-FQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD44647366AF5-E25X-FQ1 meets industry standards.

7.What is the process for return or replacement of UPD44647366AF5-E25X-FQ1?

All UPD44647366AF5-E25X-FQ1 units undergo pre-shipment inspection (PSI). If there is an issue with UPD44647366AF5-E25X-FQ1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD44647366AF5-E25X-FQ1 part is unused and in its original packaging.

Return procedure for UPD44647366AF5-E25X-FQ1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

UPD44647366AF5-E25X-FQ1 Tags

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