Renesas UPD46184095BF1-E40-EQ1-A
- Part No.:
- UPD46184095BF1-E40-EQ1-A
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
UPD46184095BF1-E40-EQ1-A.pdf
- Description:
- DDR SRAM, 2MX9, 0.45NS
- Quantity:
- Payment:

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Product details
Overview
UPD46184095BF1-E40-EQ1-A from Renesas Electronics is a 2,097,152-word × 9-bit synchronous DDR II SRAM with HSTL interface, 4.0 ns clock cycle time (250 MHz), 1.8 V core supply, and 165-pin plastic BGA (13 × 15) packaging. It delivers pipelined double data rate operation with separate read/write data ports and supports burst-2 transactions in high-speed networking and test equipment memory buffers.
For engineers reviewing the UPD46184095BF1-E40-EQ1-A datasheet, UPD46184095BF1-E40-EQ1-A pinout, UPD46184095BF1-E40-EQ1-A application, or UPD46184095BF1-E40-EQ1-A equivalent, key selection criteria include DDR timing compliance at 250 MHz, HSTL Class I output drive, user-programmable 35–70 Ω output impedance, echo clock (CQ/CQ#) synchronization, and JTAG 1149.1 test access for production validation.
Technical Context
This device implements a synchronous DDR architecture with dual-clock domain control: K/K# registers address/control/data on rising edges, while C/C# govern output timing with precise flight-time matching. Its internal PLL enables wide output data valid windows and supports future frequency scaling up to 300 MHz.
The memory array uses full-CMOS six-transistor cells and integrates a burst counter, independent read/write data paths, and internally self-timed write control. Clock-stop capability restores normal operation within 20 μs, and DLL# allows PLL bypass during debug without guaranteed AC/DC specs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 2,097,152 words × 9 bits (18 Mbit total); enables compact 9-bit-wide data path buffering in protocol accelerators. |
| Clock Cycle Time | 4.0 ns (250 MHz); defines maximum sustained transaction rate for burst-2 DDR reads/writes. |
| Supply Voltage | 1.8 V ± 0.1 V core (VDD); requires strict regulation to maintain timing margins and prevent PLL unlock. |
| I/O Interface | HSTL Class I compliant (JEDEC); ensures signal integrity on high-speed backplanes with matched termination. |
| Package | 165-pin plastic BGA (13 × 15 mm); thermal resistance θja = 16.5 °C/W (4-layer board, 0 m/s airflow). |
| Output Impedance | User-programmable 35–70 Ω via ZQ pin; allows dynamic bus impedance tuning to compensate for PCB trace variations. |
| Operating Temperature | 0 °C to +70 °C ambient; validated for commercial-grade embedded systems with stable thermal profiles. |
Pinout & Package
165-pin plastic BGA (13 × 15 mm grid, ball pitch 0.8 mm), top-view layout with index mark per package dimensions. Pin functions validated per R10DS0115EJ0200 Rev.2.00 Pages 3–6.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| K, K# | Input clock pair | Registers all synchronous inputs (address, R/W#, LD#, BW0#) and input data on rising edges; 180° phase alignment required. |
| C, C# | Output clock pair | Controls output timing reference: C# rising edge clocks first data word, C rising edge clocks second; can be tied HIGH to use K/K# instead. |
| CQ, CQ# | Echo clock outputs | Tightly matched to Q outputs (±0.1 ns); provides hardware-valid indication for receiving logic without added delay compensation. |
| D0–D8 | Synchronous data inputs | 9-bit parallel write data; registered on both K and K# rising edges during WRITE cycles. |
| Q0–Q8 | Synchronous data outputs | 9-bit parallel read data; delivered aligned to C/C# (or K/K# if C/C# = HIGH) rising edges in burst-2 sequence. |
| LD# | Synchronous load input | Active-low; latches address and R/W# direction on next K rising edge to initiate burst transaction. |
| R, W# | Read/Write control | Active-low write enable; sampled with LD# to define burst access type (HIGH = READ, LOW = WRITE). |
| BW0# | Byte write select | Active-low; enables writing of all 9 D-bits when LOW; HIGH disables write for entire burst. |
| ZQ | Output impedance calibration | Connects to external resistor to ground (175–350 Ω); sets Q/CQ/CQ# output impedance to 0.2×RQ every 20 μs post-power-up. |
| VREF | HSTL input reference | Nominally VDDQ/2; supplies bias for HSTL input buffers; must be stable before clock application. |
| VDD, VDDQ | Power supplies | VDD = 1.8 V core; VDDQ = 1.4–1.8 V I/O supply; VDDQ must not exceed VDD during operation. |
| TCK, TMS, TDI, TDO | JTAG 1149.1 interface | IEEE-compliant boundary-scan test port; TCK max 20 MHz; TDO requires pull-up to VDD if externally driven. |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined DDR operation | Enables concurrent address setup and data transfer across successive bursts, increasing effective bandwidth without raising clock frequency. |
| Separate read/write data ports | Eliminates bus turnaround delay; supports simultaneous read-after-write or interleaved access patterns in FIFO-like applications. |
| Two-tick burst mode | Minimizes DDR transaction overhead for small payloads-ideal for packet header buffering and descriptor management. |
| Programmable output impedance (35–70 Ω) | Allows real-time calibration to match varying PCB trace impedances, reducing signal reflections and eye closure. |
| PLL-based wide data valid window | Extends setup/hold margin for downstream receivers, easing timing closure in multi-drop or long-trace DDR interfaces. |
| Clock-stop with 20 μs recovery | Supports low-power idle states in burst-oriented systems; rapid resumption avoids reinitialization delays. |
Applications
| Network Packet Buffering | High-Speed Test Equipment Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2 switches with deep buffer requirements. IC Role / Device Role / Timing Role: Dedicated 9-bit-wide DDR II SRAM acting as frame payload buffer; synchronized to switch fabric clock via K/K# and C/C#. Use Value: Burst-2 operation matches typical 64-byte minimum frame alignment; HSTL I/O ensures clean signal integrity at 250 MHz on dense backplane traces. |
Use Scenario: Capturing high-resolution waveform samples in automated test equipment (ATE) with deterministic latency. IC Role / Device Role / Timing Role: High-bandwidth sample memory interfacing directly to ADC/DAC controllers using separate read/write ports. Use Value: Pipelined DDR and echo clocks (CQ/CQ#) guarantee sub-nanosecond timing correlation between sample capture and timestamping logic. |
| Protocol Accelerator Cache | Industrial Motion Controller Buffer |
|
Use Scenario: Caching TCP/IP or PCIe transaction descriptors in embedded protocol offload engines. IC Role / Device Role / Timing Role: Low-latency descriptor store accessed via burst-2 reads/writes; LD#-controlled load minimizes command overhead. Use Value: 4.0 ns cycle time supports >200 million descriptors/sec throughput; programmable ZQ impedance adapts to aging PCB interconnects. |
Use Scenario: Buffering position feedback and motion profile data in real-time servo drives with tight jitter constraints. IC Role / Device Role / Timing Role: Deterministic memory subsystem synchronized to motion controller's master clock (K/K#) and output timing (C/C#). Use Value: Clock-stop capability enables microsecond-level power gating between motion segments; 0–70°C rating suits enclosed cabinet environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress CY7C2665KV18 | 1M × 18 organization, 3.3 ns cycle (300 MHz), same 165-pin BGA but non-JTAG; no echo clock (CQ/CQ#) or ZQ calibration. | Requires wider data bus (18-bit) and lacks hardware data-valid signaling; less suitable for 9-bit-aligned protocols. | Select only if 18-bit bus width and higher speed are mandatory and echo clock timing is handled externally. |
| ISSI IS61WV102418BLL | 1M × 18, 5.5 ns cycle (180 MHz), 119-pin TSOPII; asynchronous interface, no DDR timing, no PLL or burst control. | Lower performance, no DDR features; incompatible with burst-2 or HSTL timing requirements. | Consider only for cost-sensitive, non-critical buffering where DDR timing and signal integrity are not required. |
Compared with UPD46184095BF1-E40-EQ1-A, CY7C2665KV18 offers higher speed but sacrifices echo clock precision and impedance tuning, while IS61WV102418BLL lacks DDR architecture entirely-making UPD46184095BF1-E40-EQ1-A uniquely suited for deterministic, high-fidelity 9-bit DDR buffering.
Availability
UPD46184095BF1-E40-EQ1-A is available at Aetrix Electronics and suitable for network packet buffering, high-speed test equipment memory, protocol accelerator cache, and industrial motion controller buffer applications requiring stable component supply, long-term lifecycle support, and guaranteed commercial-temperature performance.
Supply support for UPD46184095BF1-E40-EQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The μPD46184095B product line delivers high-density, low-latency DDR II SRAMs optimized for deterministic data buffering in high-speed communications and real-time control systems.
FAQ
What is the maximum operating frequency supported by UPD46184095BF1-E40-EQ1-A?
The UPD46184095BF1-E40-EQ1-A is rated for a 4.0 ns clock cycle time, corresponding to a maximum operating frequency of 250 MHz. This specification is validated across the full commercial temperature range (0 °C to +70 °C) and includes margin for setup/hold timing compliance under worst-case voltage and process corners. Operation above 250 MHz is not guaranteed and requires use of the faster -E33 variant.
Does UPD46184095BF1-E40-EQ1-A support JTAG boundary-scan testing?
Yes, UPD46184095BF1-E40-EQ1-A implements a IEEE 1149.1-compliant Test Access Port (TAP) with dedicated TCK, TMS, TDI, and TDO pins. The JTAG interface operates at up to 20 MHz and supports basic boundary-scan functionality for production test and board-level diagnostics. TAP reset occurs automatically on power-up, and no external TRST pin is provided.
How does the ZQ pin function in UPD46184095BF1-E40-EQ1-A?
The ZQ pin on UPD46184095BF1-E40-EQ1-A enables dynamic output impedance calibration. When connected to an external resistor (175–350 Ω) to ground, it sets Q, CQ, and CQ# driver impedance to 0.2×RQ. Calibration occurs automatically every 20 μs after power-up and tracks supply voltage and temperature drift, ensuring consistent signal integrity across operating conditions.
Can UPD46184095BF1-E40-EQ1-A operate without its internal PLL enabled?
Yes-asserting DLL# LOW disables the internal PLL, allowing operation at frequencies below the minimum PLL lock threshold (120 MHz). In this mode, read latency reduces to 1.0 clock cycle, but AC/DC electrical characteristics are not guaranteed. For full-specification operation at 250 MHz, DLL# must be held HIGH (tied to VDDQ via ≤10 kΩ resistor).
What is the purpose of the CQ and CQ# outputs on UPD46184095BF1-E40-EQ1-A?
CQ and CQ# are synchronous echo clock outputs tightly matched (±0.1 ns) to the Q data outputs. They provide hardware-level data-valid timing references for downstream logic-eliminating the need for external delay lines or complex clock-data recovery circuits. CQ# aligns with the first burst word, and CQ aligns with the second, enabling precise latch timing in high-speed receivers.
UPD46184095BF1-E40-EQ1-A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
UPD46184095BF1-E40-EQ1-A FAQ
1.How can I place an order for UPD46184095BF1-E40-EQ1-A through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD46184095BF1-E40-EQ1-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD46184095BF1-E40-EQ1-A reliable?
The price and inventory of UPD46184095BF1-E40-EQ1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD46184095BF1-E40-EQ1-A is usually 5 days.
3.What payment methods are accepted for UPD46184095BF1-E40-EQ1-A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD46184095BF1-E40-EQ1-A transactions.
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4.How is shipping managed for UPD46184095BF1-E40-EQ1-A?
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Once your UPD46184095BF1-E40-EQ1-A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD46184095BF1-E40-EQ1-A?
For technical support, including UPD46184095BF1-E40-EQ1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD46184095BF1-E40-EQ1-A requirements.
6.How does Aetrix verify that UPD46184095BF1-E40-EQ1-A is sourced from the original manufacturer or authorized distributors?
All UPD46184095BF1-E40-EQ1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD46184095BF1-E40-EQ1-A meets industry standards.
7.What is the process for return or replacement of UPD46184095BF1-E40-EQ1-A?
All UPD46184095BF1-E40-EQ1-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD46184095BF1-E40-EQ1-A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD46184095BF1-E40-EQ1-A part is unused and in its original packaging.
Return procedure for UPD46184095BF1-E40-EQ1-A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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