Renesas UPD46185092BF1-E40-EQ1-A
- Part No.:
- UPD46185092BF1-E40-EQ1-A
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
UPD46185092BF1-E40-EQ1-A.pdf
- Description:
- QDR SRAM, 2MX9, 0.45NS
- Quantity:
- Payment:

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Inventory:239
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Product details
Overview
UPD46185092BF1-E40-EQ1-A from NEC Electronics (now Renesas) is a 2,097,152-word × 9-bit synchronous Quad Data Rate II (QDR II) SRAM with 1.8 V core supply, 4.0 ns clock cycle time (250 MHz), HSTL interface, and 165-pin plastic BGA (13 × 15) packaging. It delivers concurrent read/write ports, burst-2 operation, and PLL-based output timing for high-bandwidth networking buffers.
For engineers reviewing the UPD46185092BF1-E40-EQ1-A datasheet, UPD46185092BF1-E40-EQ1-A pinout, UPD46185092BF1-E40-EQ1-A application, or UPD46185092BF1-E40-EQ1-A equivalent, key selection criteria include its QDR II dual-port architecture, 250 MHz DDR timing compliance, HSTL Class I I/O, user-programmable output impedance (35–70 Ω), and JTAG 1149.1 test access support.
Technical Context
This device implements a true synchronous dual-port QDR II interface: address/control inputs latch on K rising edge for reads and K# rising edge for writes; data outputs align to C/C# rising edges with echo clocks (CQ/CQ#) tightly matched to data valid windows. The integrated PLL enables wide data valid windows and supports future frequency scaling up to 300 MHz.
It features separate independent read and write data paths enabling concurrent transactions, internally self-timed write control, clock-stop capability (20 μs recovery), and byte-write select (BW0#) for selective 9-bit lane updates. All I/O uses HSTL signaling referenced to VREF = VDDQ/2, meeting JEDEC HSTL Class I standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Organization | 2,097,152 words × 9 bits (18 Mbit total density) |
| Clock frequency | 250 MHz - defines maximum sustained DDR transaction rate of 500 MT/s per data pin |
| Core supply voltage | 1.8 ± 0.1 V - requires tight regulation; VDDQ must not exceed VDD during operation |
| Interface standard | HSTL Class I - mandates VREF = VDDQ/2 reference and supports 35–70 Ω programmable output impedance |
| Burst length | 2-word burst - fixed double-word transfer per clock cycle, optimizing bus utilization |
| Package | 165-pin plastic BGA (13 × 15 mm) - surface-mount footprint with 0.8 mm ball pitch |
| Operating temperature | 0 °C to +70 °C - commercial-grade thermal range per EQ1 suffix |
Pinout & Package
UPD46185092BF1-E40-EQ1-A is housed in a 165-pin plastic BGA (13 × 15 mm, 0.8 mm pitch) with exposed thermal pad. Pin functions are defined per top-view layout in datasheet page 3; all signals are synchronous and registered on K/K# rising edges.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A[0:19] | Synchronous address input | 20-bit address bus latched on K rising edge for reads, K# for writes; unused when R# = W# = HIGH (NOP) |
| D0–D8 | Synchronous data input | 9-bit write data path; sampled on both K and K# rising edges during burst write |
| Q0–Q8 | Synchronous data output | 9-bit read data path; aligned to C/C# rising edges (or K/K# if C/C# tied HIGH) |
| R#, W# | Read/write command inputs | Active-low, registered on K rising edge; enable concurrent read/write operations when asserted independently |
| K, K# | Input clock pair | Differential clock inputs (180° phase); K drives read control, K# drives write control and data input |
| C, C# | Output clock pair | User-controlled timing reference for output data; C# clocks first word, C clocks second word of burst |
| CQ, CQ# | Echo clock outputs | Output-synchronized clocks tightly matched to Q0–Q8 valid/hold windows (±0.1 ns design tolerance) |
| ZQ | Impedance calibration input | Connects to external resistor to ground to set Q/CQ/CQ# output impedance to 0.2 × RQ (35–70 Ω range) |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent read/write ports | Enables full-duplex memory access without arbitration delay-critical for packet buffering in switch fabric designs |
| PLL-based output timing | Widens data valid window and supports scalable clock frequencies up to 300 MHz while maintaining timing margin |
| User-programmable output impedance | 35–70 Ω tuning via ZQ pin eliminates need for external series termination resistors on high-speed traces |
| Two-tick burst operation | Guarantees 100% bus utilization per clock cycle-no dead cycles between consecutive DDR transfers |
| JTAG 1149.1 test access | Enables boundary-scan testing and debug visibility without requiring additional probe points on dense BGA layouts |
Applications
| High-Speed Network Switch Buffer | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and metadata in multi-gigabit Ethernet switches with sub-10 ns latency requirements. IC Role / Device Role / Timing Role: Dual-port QDR II SRAM serving as shared buffer between ingress parser and egress scheduler, synchronized to 250 MHz system clock. Use Value: Concurrent read/write eliminates arbitration stalls; 250 MHz DDR bandwidth delivers 4.5 Gbps aggregate throughput across 9-bit data bus. | Use Scenario: Buffering real-time voice and control packets in carrier-grade DSLAM and OLT line cards operating at extended temperature. IC Role / Device Role / Timing Role: High-reliability packet memory interfacing with FPGA-based traffic managers using HSTL I/O for noise immunity on backplane traces. Use Value: HSTL Class I compliance ensures signal integrity over 15 cm traces; 0–70°C rating matches telecom environmental specs. |
| Baseband Processor Cache | Test Equipment Pattern Memory |
Use Scenario: Acting as low-latency instruction/data cache for multi-core baseband processors in 4G/LTE femtocells. IC Role / Device Role / Timing Role: Burst-2 SRAM providing deterministic 2-cycle read latency (RL = 2.0) synchronized to processor's QDR interface. Use Value: Clock-stop capability allows power gating during idle periods with only 20 μs wake-up latency-reducing average power by >40%. | Use Scenario: Storing high-speed digital stimulus and expected response patterns in automated test equipment (ATE) channel cards. IC Role / Device Role / Timing Role: Deterministic QDR II memory delivering precise 250 MHz pattern sequences to DUT pins with sub-nanosecond jitter alignment. Use Value: CQ/CQ# echo clocks provide hardware-verified data valid timing, eliminating setup/hold uncertainty in 1 Gbps+ pattern generation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C2663KV18-400BZC | 2M × 18 organization, 400 MHz (2.5 ns), same 165-pin BGA but higher speed grade and wider bus | Requires redesign of data bus width and timing constraints; suited for systems needing >2× bandwidth | Select when 18-bit interface and 400 MHz operation are required; not drop-in compatible due to bus width and AC timing differences |
| AS7C3256A-15JCIN | Asynchronous 32K × 8 SRAM, 15 ns access, SOJ-32 package, no QDR interface or PLL | Lacks burst, concurrency, and DDR timing-only suitable for non-critical control-plane storage | Choose only for cost-sensitive, low-speed control memory where QDR features are unnecessary |
Compared with CY7C2663KV18-400BZC and AS7C3256A-15JCIN, UPD46185092BF1-E40-EQ1-A uniquely balances 250 MHz QDR II performance, 9-bit narrow bus efficiency, and commercial-temperature reliability in a mature 165-pin BGA-making it optimal for cost-constrained, high-throughput packet buffering where 18-bit width or asynchronous operation are unsuitable.
Availability
UPD46185092BF1-E40-EQ1-A is available at Aetrix Electronics and suitable for high-speed network switch buffers, telecom line card memory, baseband processor caches, and ATE pattern memory requiring stable component supply, long-lifecycle support, and verified QDR II timing compliance.
Supply support for UPD46185092BF1-E40-EQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation (formerly NEC Electronics) is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.
The UPD46185092BF1-E40-EQ1-A belongs to Renesas' QDR II SRAM product line, engineered specifically for high-bandwidth, low-latency packet buffering in networking infrastructure where deterministic dual-port DDR access and HSTL signal integrity are critical.
FAQ
What is the maximum guaranteed clock frequency for UPD46185092BF1-E40-EQ1-A?
The UPD46185092BF1-E40-EQ1-A is rated for 250 MHz operation with a 4.0 ns clock cycle time (TKHKH ≤ 4.0 ns). This is validated across 0 °C to +70 °C ambient temperature and 1.8 ± 0.1 V supply. While the -E33 variant supports 300 MHz, the -E40 suffix explicitly denotes the 250 MHz speed grade; exceeding this violates AC timing specifications.
Does UPD46185092BF1-E40-EQ1-A support true concurrent read and write operations?
Yes, UPD46185092BF1-E40-EQ1-A supports true concurrent read and write operations via independent read and write data ports. When R# and W# are asserted in the same clock cycle, the device executes a read from the address latched on K and a write to the address latched on K#, with no internal arbitration delay-enabling full-duplex memory access essential for switch fabric buffers.
How is output impedance controlled on UPD46185092BF1-E40-EQ1-A?
Output impedance on UPD46185092BF1-E40-EQ1-A is controlled via the ZQ pin: connecting an external resistor RQ from ZQ to ground sets Q, CQ, and CQ# output impedance to 0.2 × RQ. With RQ = 175–350 Ω, impedance ranges from 35–70 Ω. Direct connection to VDDQ minimizes impedance; ZQ must never be left floating or tied to VSS.
What is the role of C and C# pins on UPD46185092BF1-E40-EQ1-A?
The C and C# pins on UPD46185092BF1-E40-EQ1-A serve as user-controlled output timing references: C# rising edge clocks the first word of the 2-word burst, and C rising edge clocks the second word. If unused, C and C# must be tied HIGH to default output timing to K/K# edges; leaving them unconnected or toggling them unpredictably violates timing guarantees.
Is UPD46185092BF1-E40-EQ1-A compatible with JTAG boundary-scan testing?
Yes, UPD46185092BF1-E40-EQ1-A integrates a IEEE 1149.1-compliant test access port (TAP) with TCK, TMS, TDI, and TDO pins. All JTAG signals operate at 1.8 V I/O level. For non-JTAG use, TMS and TDI may be left unconnected, but TCK must be tied to VSS to prevent unintended test mode entry.
UPD46185092BF1-E40-EQ1-A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
UPD46185092BF1-E40-EQ1-A FAQ
1.How can I place an order for UPD46185092BF1-E40-EQ1-A through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD46185092BF1-E40-EQ1-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD46185092BF1-E40-EQ1-A reliable?
The price and inventory of UPD46185092BF1-E40-EQ1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD46185092BF1-E40-EQ1-A is usually 5 days.
3.What payment methods are accepted for UPD46185092BF1-E40-EQ1-A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD46185092BF1-E40-EQ1-A transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UPD46185092BF1-E40-EQ1-A?
UPD46185092BF1-E40-EQ1-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD46185092BF1-E40-EQ1-A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD46185092BF1-E40-EQ1-A?
For technical support, including UPD46185092BF1-E40-EQ1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD46185092BF1-E40-EQ1-A requirements.
6.How does Aetrix verify that UPD46185092BF1-E40-EQ1-A is sourced from the original manufacturer or authorized distributors?
All UPD46185092BF1-E40-EQ1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD46185092BF1-E40-EQ1-A meets industry standards.
7.What is the process for return or replacement of UPD46185092BF1-E40-EQ1-A?
All UPD46185092BF1-E40-EQ1-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD46185092BF1-E40-EQ1-A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD46185092BF1-E40-EQ1-A part is unused and in its original packaging.
Return procedure for UPD46185092BF1-E40-EQ1-A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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