Renesas UPD46185094BF1-E33-EQ1-A
- Part No.:
- UPD46185094BF1-E33-EQ1-A
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
UPD46185094BF1-E33-EQ1-A.pdf
- Description:
- QDR SRAM, 2MX9, 0.45NS
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Product details
Overview
UPD46185094BF1-E33-EQ1-A from Renesas Electronics is a 2,097,152-word × 9-bit synchronous Quad Data Rate II (QDR-II) SRAM with 1.8 V core supply, 3.3 ns clock cycle time (300 MHz), HSTL interface, and 165-pin plastic BGA (13 × 15) packaging. It supports 4-word burst reads/writes, separate read/write ports, and concurrent transactions for high-bandwidth networking buffers.
For engineers reviewing the UPD46185094BF1-E33-EQ1-A datasheet, UPD46185094BF1-E33-EQ1-A pinout, UPD46185094BF1-E33-EQ1-A application, or UPD46185094BF1-E33-EQ1-A equivalent, key selection criteria include DDR timing compliance, HSTL I/O voltage tolerance, burst-addressing behavior, output impedance programmability (35–70 Ω), and PLL-enabled clock skew matching via C/C# and CQ/CQ#.
Technical Context
This QDR-II SRAM uses dual-clock architecture: K/K# registers address/control/data on rising edges, while C/C# control output data timing with precise flight-time alignment. Its internal burst counter and synchronous peripheral logic enable full bus utilization during both READ and WRITE operations without turnaround cycles.
The device integrates a PLL for jitter-tolerant operation down to 120 MHz, user-programmable output impedance via ZQ calibration, and independent read/write data paths supporting simultaneous access. Clock-stop mode suspends operation with 20 μs recovery, and JTAG 1149.1 test access enables boundary-scan verification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Organization | 2,097,152 words × 9 bits = 18 Mbit density with byte-wide + parity configuration |
| Cycle time / Frequency | 3.3 ns / 300 MHz - defines maximum sustained burst throughput of 2.4 GB/s (9-bit × 4 words × 300 MHz) |
| Supply voltage | 1.8 ± 0.1 V core (VDD); isolated 1.5 V nominal (VDDQ) for HSTL I/O buffers |
| Interface standard | HSTL Class I compliant - ensures signal integrity at high speeds with controlled-impedance termination |
| Package | 165-pin plastic BGA (13 × 15 mm) - supports high-density routing and thermal dissipation in telecom line cards |
| Burst operation | Fixed 4-word burst - reduces external address bus frequency by 4× versus single-word access |
| Timing reference | Dual-clock domain: K/K# for input registration; C/C# for output data alignment - enables precise flight-time matching |
Pinout & Package
UPD46185094BF1-E33-EQ1-A is housed in a 165-pin plastic BGA (13 × 15 mm grid, 0.8 mm pitch) with exposed thermal pad. Pin functions are defined per top-view layout in Renesas datasheet R10DS0113EJ0200 Rev.2.00 Page 4.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Synchronous address inputs | 19-bit address bus registered on K rising edge; supports 2M-word addressing with internal LSBs for burst sequencing |
| D0–D8 | Synchronous data inputs | 9-bit write data path; latched on K and K# rising edges during WRITE cycle |
| Q0–Q8 | Synchronous data outputs | 9-bit read data path; aligned to C/C# rising edges (or K/K# if C/C# tied HIGH) |
| R#, W# | Read/Write command inputs | Active-low synchronous controls; registered on K rising edge; mutually exclusive per cycle |
| BW0# | Byte write select | Active-low control enabling full 9-bit write; LOW = write D0–D8, HIGH = no write |
| K, K# | Input clock pair | Differential 300 MHz input clock; registers all synchronous inputs on K rising edge; K# 180° out-of-phase |
| C, C# | Output clock pair | User-controlled timing reference for output data; C# drives 1st/3rd data, C drives 2nd/4th data in burst |
| CQ, CQ# | Echo clock outputs | Tightly matched to Q outputs; provides data-valid indication; continues running even when Q tristates |
| ZQ | Impedance calibration input | Connects to external resistor to ground to set output driver impedance (35–70 Ω); auto-calibrates every 20 μs |
| VDD, VDDQ, VSS | Power/ground terminals | VDD = 1.8 V core supply; VDDQ = isolated 1.5 V I/O supply; VSS = common ground plane |
| VREF | HSTL reference input | Nominally VDDQ/2 (0.75 V); sets switching threshold for all HSTL inputs including R#, W#, K, C |
| TMS, TDI, TCK, TDO | JTAG 1149.1 interface | IEEE-compliant test access port operating at 1.8 V I/O level; supports boundary-scan testing |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write data ports | Enables true concurrent read and write operations without bus contention or turnaround penalty |
| PLL-based clock deskew | Generates stable C/C# and CQ/CQ# outputs with minimal skew, ensuring reliable data capture at 300 MHz |
| User-programmable output impedance | 35–70 Ω range via ZQ calibration eliminates need for external series resistors on high-speed traces |
| Four-tick burst addressing | Reduces external address bus toggling by 75%, lowering EMI and simplifying controller logic |
| Clock-stop capability | Enters low-power state immediately upon clock halt; resumes full operation within 20 μs after clock restart |
| HSTL Class I I/O compliance | Guarantees interoperability with industry-standard FPGA and ASIC memory controllers using HSTL signaling |
Applications
| Packet Buffer in Switch Fabric | Line Card Memory in 10G/25G Ethernet |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payloads in multi-port network switches with strict latency budgets. IC Role / Device Role / Timing Role: High-throughput, low-latency shared memory buffer interfacing directly to switch fabric ASICs via HSTL buses. Use Value: Concurrent read/write ports deliver 2.4 GB/s sustained bandwidth, eliminating pipeline stalls during back-to-back packet processing. | Use Scenario: Serving as frame buffer and descriptor memory in modular optical line cards requiring deterministic access timing. IC Role / Device Role / Timing Role: Synchronous QDR-II SRAM providing burst-aligned data delivery synchronized to C/C# clocks for precise PHY alignment. Use Value: Echo clocks CQ/CQ# provide hardware-validated data-valid windows, reducing timing margin requirements in 10G+ SerDes subsystems. |
| Baseband Processing in Wireless BTS | Real-Time Video Frame Buffer |
Use Scenario: Holding channelized IQ samples and FFT intermediate results in LTE/5G baseband units with tight real-time deadlines. IC Role / Device Role / Timing Role: Low-jitter, burst-access memory supporting parallel read/write streams from multiple DSP cores. Use Value: PLL circuitry maintains stable output timing across temperature and voltage variation, preserving symbol timing accuracy. | Use Scenario: Acting as dual-port frame buffer for HD/4K video pipelines where encoder and display engines access same memory concurrently. IC Role / Device Role / Timing Role: Asymmetric 9-bit organization accommodates 8-bit pixel data plus 1-bit metadata (e.g., alpha or error flag). Use Value: 9-bit width avoids padding overhead in YUV422 or RGB565 formats, improving effective memory utilization by 12.5% vs. 8-bit-only devices. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR-II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C2665KV18-333BZXC | 2M × 18 organization, 165-pin BGA, 333 MHz max, 1.8 V core, HSTL I/O | Wider data bus (18-bit) requires different controller interface; higher density but lower pin efficiency for 9-bit use cases | Select when system needs wider burst payload or dual-byte alignment; not drop-in due to pinout and address mapping differences |
| AS7C3256B-33PCN | 32K × 8 async SRAM, 28-pin SOIC, 3.3 V, no burst or QDR timing | Lacks synchronous interface, burst operation, and dual-port capability; suitable only for low-speed control-plane buffering | Choose only for non-critical, low-bandwidth applications where QDR-II features are unnecessary and cost is primary constraint |
Compared with CY7C2665KV18-333BZXC and AS7C3256B-33PCN, UPD46185094BF1-E33-EQ1-A delivers optimal balance of 9-bit data width, 300 MHz QDR-II timing, and BGA packaging for high-speed packet buffering-avoiding over-provisioned width or under-specified asynchronous performance.
Availability
UPD46185094BF1-E33-EQ1-A is available at Aetrix Electronics and suitable for packet buffering in network switches, line card memory in 10G/25G Ethernet systems, and real-time baseband processing requiring stable component supply and long-term lifecycle support.
Supply support for UPD46185094BF1-E33-EQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor manufacturer specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.
The UPD46185094BF1-E33-EQ1-A belongs to Renesas' QDR-II SRAM product line, engineered specifically for high-bandwidth, low-latency buffering in networking infrastructure and wireless base stations where deterministic burst access and HSTL compatibility are critical.
FAQ
What is the exact memory organization and total capacity of UPD46185094BF1-E33-EQ1-A?
UPD46185094BF1-E33-EQ1-A is organized as 2,097,152 words × 9 bits, delivering 18,874,368 bits (18 Mbit) of total storage. The 9-bit width supports 8-bit data plus 1-bit parity or metadata, making it suitable for applications requiring error detection or extended control signaling without padding overhead.
Does UPD46185094BF1-E33-EQ1-A support true concurrent read and write operations?
Yes, UPD46185094BF1-E33-EQ1-A features physically separate read and write data ports (Q0–Q8 and D0–D8), enabling simultaneous read and write transactions without bus arbitration or turnaround cycles. This architecture sustains full 300 MHz throughput on both ports, essential for full-duplex packet buffering.
How does the ZQ pin function in UPD46185094BF1-E33-EQ1-A, and what external component is required?
The ZQ pin on UPD46185094BF1-E33-EQ1-A connects to an external precision resistor (typically 100 Ω) to ground, enabling automatic calibration of output driver impedance between 35 Ω and 70 Ω. This eliminates the need for discrete series termination resistors and adapts to voltage/temperature drift every 20 μs after power-up.
What clocking scheme does UPD46185094BF1-E33-EQ1-A use to ensure timing reliability at 300 MHz?
UPD46185094BF1-E33-EQ1-A employs a dual-clock architecture: K/K# registers inputs, while C/C# govern output data timing. Its integrated PLL locks to K and generates tightly matched C/C# and echo clocks CQ/CQ#, minimizing skew and ensuring robust data capture at 300 MHz-even under voltage/temperature variation.
Is UPD46185094BF1-E33-EQ1-A compatible with standard HSTL Class I interfaces?
Yes, UPD46185094BF1-E33-EQ1-A fully complies with JEDEC HSTL Class I specifications. Its VREF input is internally referenced to VDDQ/2 (~0.75 V), and its VOH/VOL levels meet HSTL thresholds across temperature and voltage ranges, ensuring interoperability with Xilinx Virtex, Intel Stratix, and other HSTL-capable FPGAs and ASICs.
UPD46185094BF1-E33-EQ1-A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
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UPD46185094BF1-E33-EQ1-A FAQ
1.How can I place an order for UPD46185094BF1-E33-EQ1-A through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD46185094BF1-E33-EQ1-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD46185094BF1-E33-EQ1-A reliable?
The price and inventory of UPD46185094BF1-E33-EQ1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD46185094BF1-E33-EQ1-A is usually 5 days.
3.What payment methods are accepted for UPD46185094BF1-E33-EQ1-A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD46185094BF1-E33-EQ1-A transactions.
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4.How is shipping managed for UPD46185094BF1-E33-EQ1-A?
UPD46185094BF1-E33-EQ1-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD46185094BF1-E33-EQ1-A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD46185094BF1-E33-EQ1-A?
For technical support, including UPD46185094BF1-E33-EQ1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD46185094BF1-E33-EQ1-A requirements.
6.How does Aetrix verify that UPD46185094BF1-E33-EQ1-A is sourced from the original manufacturer or authorized distributors?
All UPD46185094BF1-E33-EQ1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD46185094BF1-E33-EQ1-A meets industry standards.
7.What is the process for return or replacement of UPD46185094BF1-E33-EQ1-A?
All UPD46185094BF1-E33-EQ1-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD46185094BF1-E33-EQ1-A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD46185094BF1-E33-EQ1-A part is unused and in its original packaging.
Return procedure for UPD46185094BF1-E33-EQ1-A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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