Renesas UPD46185182BF1-E40-EQ1-A
- Part No.:
- UPD46185182BF1-E40-EQ1-A
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
UPD46185182BF1-E40-EQ1-A.pdf
- Description:
- QDR SRAM, 1MX18, 0.45NS
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Product details
Overview
UPD46185182BF1-E40-EQ1-A from Renesas Electronics is a 1,048,576-word × 18-bit synchronous quad data rate (QDR II) SRAM with 4.0 ns clock cycle time, 250 MHz operation, 1.8 V core supply, HSTL interface, and 165-pin plastic BGA (13 × 15) packaging. It delivers concurrent read/write ports, burst-2 DDR operation, and PLL-based output timing control for high-bandwidth networking buffers.
For engineers reviewing the UPD46185182BF1-E40-EQ1-A datasheet, UPD46185182BF1-E40-EQ1-A pinout, UPD46185182BF1-E40-EQ1-A application, or UPD46185182BF1-E40-EQ1-A equivalent, key selection considerations include its 1M × 18 organization, 250 MHz QDR-II timing compliance, HSTL Class I I/O, user-programmable output impedance (35–70 Ω), and JTAG 1149.1 test access support.
Technical Context
This QDR II SRAM uses dual-clock architecture: K/K# for address/control/data registration on rising edges, and C/C# for precise output data timing with echo clocks CQ/CQ#. Its internal burst counter enables two-word transactions per clock cycle, achieving 100% bus utilization in both read and write modes.
The device integrates a PLL for wide output data valid window and frequency scalability, supports clock-stop mode with 20 μs recovery, and features independent read/write ports enabling simultaneous access-critical for packet buffering in switch fabric and memory controller applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Organization | 1,048,576 words × 18 bits - provides 18-Mbit density with byte-selectable 18-bit data path for efficient packet header + payload storage |
| Clock frequency | 250 MHz - enables 500 MT/s effective data rate per port under burst-2 QDR protocol |
| Cycle time | 4.0 ns - defines minimum clock period for reliable 250 MHz operation across industrial temperature range |
| Core supply | 1.8 V ± 0.1 V - low-voltage CMOS design reduces dynamic power and enables compatibility with 1.8 V system rails |
| I/O interface | HSTL Class I - ensures signal integrity at high speeds with controlled impedance and tight voltage thresholds (VREF ±0.1 V) |
| Package | 165-pin plastic BGA (13 × 15 mm) - standard footprint supporting high-density PCB layouts and thermal dissipation via solder-ball array |
| Operating temperature | 0 °C to +70 °C - qualified for commercial/industrial embedded systems requiring stable performance without extended temp grading |
Pinout & Package
165-pin plastic BGA (13 × 15 mm) package with bottom-side ball grid; mechanical index mark located at corner A1 per JEDEC MO-270B. Pin functions validated per Renesas R10DS0112EJ0200 Rev.2.00 datasheet Page 4.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A[0:18] | Synchronous address input | 19-bit address bus registered on K rising edge for READ, K# rising edge for WRITE; enables 1M-word addressing |
| D[0:17] | Synchronous data input | 18-bit parallel input path registered on K/K# rising edges; supports full-width or byte-write (BW0#/BW1#) writes |
| Q[0:17] | Synchronous data output | 18-bit parallel output synchronized to C/C# rising edges; echo clocks CQ/CQ# provide traceable data valid timing |
| K, K# | Input clock pair | Differential clock inputs - K latches READ controls/addresses, K# latches WRITE addresses/data; 180° phase alignment required |
| C, C# | Output clock pair | User-controlled timing reference for output data - C# triggers first word, C triggers second word of burst; can be tied HIGH to use K/K# instead |
| R#, W# | Read/write strobes | Active-low synchronous commands - R# initiates burst READ, W# initiates burst WRITE; both high = NOP (high-Z outputs) |
| BW0#, BW1# | Byte write enables | Independent 9-bit segment controls - BW0# selects D[0:8]/Q[0:8], BW1# selects D[9:17]/Q[9:17]; both high = no write |
| VDD, VDDQ | Power supplies | VDD = 1.8 V core logic supply; VDDQ = isolated 1.4–1.8 V I/O supply - decoupling prevents switching noise coupling into logic |
| VSS | Ground | Multiple dedicated ground balls distributed across array - minimizes ground bounce and supports HSTL signaling integrity |
| ZQ | Impedance calibration | Connects to external 240 Ω resistor to VSS - dynamically tunes Q/CQ/CQ# output drivers to match 50 Ω transmission lines |
| VREF | HSTL reference | Nominally VDDQ/2 - sets input threshold for all HSTL receivers; must be stable within ±0.1 V for valid logic detection |
| DLL# | PLL disable | Active-low pin - pull HIGH for normal PLL operation; drive LOW only during debug to bypass PLL (reduces RL to 1 cycle) |
| TMS, TDI, TCK, TDO | JTAG boundary scan | IEEE 1149.1 compliant test interface - enables production testing and in-system verification without intrusive probing |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent read/write ports | Enables full-duplex memory access - critical for switch fabric buffers where ingress packets are written while egress packets are read simultaneously |
| Two-tick burst operation | Guarantees 100% bus utilization per transaction - eliminates dead cycles between consecutive 18-bit transfers in high-throughput packet processing |
| User-programmable output impedance | 35–70 Ω tuning via ZQ pin - matches PCB trace impedance without external series resistors, reducing BOM count and layout complexity |
| PLL-based output timing | Widens data valid window and enables future frequency scaling - maintains timing margin as system clock rates increase beyond 250 MHz |
| Clock-stop capability | Enters low-power state with 20 μs resume latency - supports dynamic power gating in burst-oriented traffic patterns without firmware overhead |
| JTAG 1149.1 test access | Provides IEEE-standard boundary scan for interconnect testing and in-system debugging - eliminates need for bed-of-nails fixtures in manufacturing |
Applications
| Network Switch Buffer Memory | High-Speed Test Equipment Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payloads in Layer 2/L3 Ethernet switches operating at 10 Gbps+ line rates. IC Role / Device Role / Timing Role: Dual-port QDR II SRAM serving as shared buffer between ingress parser and egress scheduler, with concurrent reads/writes synchronized to 250 MHz clocks. Use Value: 1M × 18 organization supports 18-bit tag + 18-bit data per entry; burst-2 operation delivers 500 MT/s throughput matching SerDes lane bandwidth. | Use Scenario: Capturing high-speed digital waveforms in automated test equipment (ATE) with >200 MHz sampling rates. IC Role / Device Role / Timing Role: High-bandwidth capture memory interfacing directly to FPGA-based pattern generators and comparators using HSTL signaling. Use Value: HSTL Class I I/O ensures clean signal integrity at 250 MHz; programmable ZQ impedance eliminates board-level termination components. |
| Baseband Processor L2 Cache | Industrial Real-Time Controller Buffer |
Use Scenario: Acting as low-latency L2 cache for multi-core baseband processors in 4G/5G wireless infrastructure equipment. IC Role / Device Role / Timing Role: Synchronous SRAM providing deterministic 1-cycle read latency (RL=1 when DLL# = LOW) and burst-2 writes to accelerate FFT and channel estimation routines. Use Value: Clock-stop mode reduces idle power by >50% during processing gaps; JTAG support enables field-upgradable firmware validation. | Use Scenario: Buffering sensor fusion data streams (IMU, GPS, CAN) in autonomous mobile robots requiring sub-microsecond response times. IC Role / Device Role / Timing Role: Deterministic-access memory co-located with real-time MCU, using separate read/write ports to avoid arbitration delays in closed-loop control loops. Use Value: 0–70°C rating ensures reliability in factory-floor environments; 1.8 V supply simplifies power architecture alongside modern low-voltage MCUs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress CY7C2663KV18 | Same 1M × 18 organization, 250 MHz speed grade, and 165-pin BGA; differs in HSTL termination scheme (internal vs. external VREF dependency) | Requires external VREF generation; less tolerant of VDDQ variation during power sequencing | Select when existing board design already implements discrete VREF and requires Cypress's longer production lifecycle |
| Integrated Device Technology (IDT) 70V9289L15PF | 1M × 18 QDR II+ variant with 1.5 ns faster cycle time (3.3 ns @ 300 MHz); pin-compatible but higher power consumption (IDD = 690 mA vs. 610 mA) | Supports higher-frequency backplanes but demands stricter thermal management and tighter power delivery | Select when system clock exceeds 250 MHz and board layout accommodates increased heat dissipation |
Compared with CY7C2663KV18 and 70V9289L15PF, UPD46185182BF1-E40-EQ1-A offers tighter VREF tolerance (±0.1 V), integrated ZQ calibration, and lower standby current (310 mA), making it optimal for cost-sensitive, thermally constrained, and power-aware designs where 250 MHz performance suffices.
Availability
UPD46185182BF1-E40-EQ1-A is available at Aetrix Electronics and suitable for network switch buffer memory, high-speed test equipment memory, baseband processor L2 cache, and industrial real-time controller buffer applications requiring stable component supply, long-term manufacturability, and guaranteed lead-free compliance.
Supply support for UPD46185182BF1-E40-EQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, infrastructure, and IoT applications.
The UPD46185182BF1-E40-EQ1-A belongs to Renesas' QDR II SRAM product line, engineered specifically for high-bandwidth, low-latency buffering in networking, telecommunications, and test instrumentation systems demanding deterministic dual-port access and HSTL signal integrity.
FAQ
What is the maximum clock frequency supported by UPD46185182BF1-E40-EQ1-A?
The UPD46185182BF1-E40-EQ1-A is rated for 250 MHz operation with a 4.0 ns clock cycle time. This speed grade is validated across the full 0 °C to +70 °C operating temperature range and complies with QDR II timing specifications including setup/hold margins and burst-2 data validity windows. The device's PLL supports future scaling, but 250 MHz is the guaranteed maximum frequency for this specific speed bin.
Does UPD46185182BF1-E40-EQ1-A support true dual-port operation with simultaneous read and write?
Yes, UPD46185182BF1-E40-EQ1-A supports true concurrent read and write operations via physically separate data paths: D[0:17] for input and Q[0:17] for output. Its architecture allows initiation of a READ cycle on R# while a WRITE cycle is active on W#, enabling full-duplex memory access essential for switch fabric and packet buffer applications.
How is output impedance calibrated on UPD46185182BF1-E40-EQ1-A?
Output impedance calibration on UPD46185182BF1-E40-EQ1-A is performed via the ZQ pin, which connects to an external 240 Ω resistor to VSS. This configures Q, CQ, and CQ# drivers for 50 Ω nominal output impedance (0.2 × RQ). Calibration occurs automatically every 20 μs after power-up and adapts to voltage/temperature drift, eliminating need for manual trimming or fixed series resistors.
What is the role of the DLL# pin on UPD46185182BF1-E40-EQ1-A?
The DLL# pin on UPD46185182BF1-E40-EQ1-A disables the internal PLL when driven LOW, allowing operation at frequencies below the minimum PLL lock range (120 MHz). In this mode, read latency reduces to 1 clock cycle, but AC/DC characteristics are not guaranteed. For all production operation, DLL# must be tied HIGH (e.g., to VDDQ via ≤10 kΩ) to enable full QDR II timing compliance.
Is UPD46185182BF1-E40-EQ1-A compatible with JTAG boundary scan testing?
Yes, UPD46185182BF1-E40-EQ1-A implements IEEE 1149.1 JTAG boundary scan with dedicated TMS, TDI, TCK, and TDO pins. It supports standard instruction register loading, data register access, and interconnect testing. Pins operate at 1.8 V I/O level; TCK must be tied to VSS if JTAG is unused, and TDO should be pulled up to VDD when externally driven.
UPD46185182BF1-E40-EQ1-A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
UPD46185182BF1-E40-EQ1-A FAQ
1.How can I place an order for UPD46185182BF1-E40-EQ1-A through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD46185182BF1-E40-EQ1-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD46185182BF1-E40-EQ1-A reliable?
The price and inventory of UPD46185182BF1-E40-EQ1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD46185182BF1-E40-EQ1-A is usually 5 days.
3.What payment methods are accepted for UPD46185182BF1-E40-EQ1-A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD46185182BF1-E40-EQ1-A transactions.
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD46185182BF1-E40-EQ1-A?
For technical support, including UPD46185182BF1-E40-EQ1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD46185182BF1-E40-EQ1-A requirements.
6.How does Aetrix verify that UPD46185182BF1-E40-EQ1-A is sourced from the original manufacturer or authorized distributors?
All UPD46185182BF1-E40-EQ1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD46185182BF1-E40-EQ1-A meets industry standards.
7.What is the process for return or replacement of UPD46185182BF1-E40-EQ1-A?
All UPD46185182BF1-E40-EQ1-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD46185182BF1-E40-EQ1-A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD46185182BF1-E40-EQ1-A part is unused and in its original packaging.
Return procedure for UPD46185182BF1-E40-EQ1-A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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