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Renesas UPD46185182BF1-E40Y-EQ1-A

Part No.:
UPD46185182BF1-E40Y-EQ1-A
Manufacturer:
Renesas
Category:
Memory
Package:
-
Datasheet:
AetrixUPD46185182BF1-E40Y-EQ1-A.pdf
Description:
QDR SRAM, 1MX18, 0.45NS
Quantity:
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Inventory:2,724

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Product details

Overview

UPD46185182BF1-E40Y-EQ1-A from Renesas Electronics is a 1,048,576-word × 18-bit synchronous QDR II SRAM with 4.0 ns clock cycle time (250 MHz), 1.8 V core supply, HSTL interface, and 165-pin plastic BGA (13 × 15) packaging. It supports concurrent read/write ports, burst-2 operation, and clock-stop mode for low-power standby in high-bandwidth networking buffers and packet memory applications.

For engineers reviewing the UPD46185182BF1-E40Y-EQ1-A datasheet, UPD46185182BF1-E40Y-EQ1-A pinout, UPD46185182BF1-E40Y-EQ1-A application, or UPD46185182BF1-E40Y-EQ1-A equivalent, key selection considerations include its −40°C to +85°C industrial temperature rating, user-programmable output impedance (35–70 Ω), JTAG 1149.1 test access, and dual-clock timing architecture using K/K# inputs and C/C# outputs for precise flight-time matching.

Technical Context

This QDR II SRAM implements separate independent read and write data ports with concurrent transaction capability, enabling full 100% bus utilization during DDR READ and WRITE operations. Its internal PLL provides a wide output data valid window and supports future frequency scaling up to 300 MHz.

The device uses two input clocks (K and K#) for precise DDR timing at rising edges only, and two output clocks (C and C#) to deliver clock and data together to the receiving device-ensuring tight skew matching. Internally self-timed write control and clock-stop capability (20 μs recovery) further optimize system-level timing and power management.

Key Specifications

ParameterValue and Actual Design Meaning
Organization1,048,576-word × 18-bit (18 Mbit total density)
Clock frequency250 MHz - enables 500 MT/s per data pin in burst-2 mode
Core supply voltage1.8 ± 0.1 V - compatible with modern low-voltage SoC interfaces
Operating temperature−40°C to +85°C - qualified for industrial embedded and telecom infrastructure
Interface standardHSTL Class I - ensures signal integrity at high-speed DDR data rates
Package165-pin plastic BGA (13 × 15 mm) - supports high-density PCB layouts
Output impedanceUser-programmable 35–70 Ω via ZQ pin - enables dynamic bus termination calibration

Pinout & Package

Package: 165-pin plastic BGA (13 × 15 mm), lead-free, top-view layout with index mark per package dimensions.

Pin/TerminalCircuit RoleDesign Meaning
A[0:18]Synchronous address inputRegistered on K rising edge for READ, K# rising edge for WRITE; enables 1M-word addressing
D0–D17Synchronous data input18-bit parallel write data registered on K/K# rising edges; supports byte-write via BW0#/BW1#
Q0–Q17Synchronous data output18-bit parallel read data synchronized to C/C# rising edges; echo-clocked via CQ/CQ#
K, K#Input clock pair180° out-of-phase clocks; K latches READ controls/addresses, K# latches WRITE addresses/data
C, C#Output clock pairDeliver timing reference for Q outputs; C# clocks first data word, C clocks second word
R#, W#Read/write strobesActive-low synchronous commands; both high = NOP (high-Z outputs)
BW0#, BW1#Byte write enablesIndependent 9-bit segment control: BW0# → D0–D8, BW1# → D9–D17
ZQImpedance calibration inputConnects to external resistor to ground to set Q/CQ/CQ# output impedance to 0.2 × RQ
DLL#PLL disablePull HIGH for normal operation; pull LOW to bypass PLL for debug at sub-120 MHz frequencies
VDD, VDDQPower suppliesVDD = 1.8 V core; VDDQ = 1.4–1.8 V I/O supply - isolated for noise reduction
VREFHSTL referenceNominally VDDQ/2; sets input threshold for all HSTL-compatible control/data signals
TMS, TDI, TCK, TDOJTAG 1149.1 portFully compliant boundary-scan test interface operating at 1.8 V I/O level

Key Features

FeatureDesign Value
Concurrent read/write portsEnables simultaneous access to same memory array without arbitration delay - critical for packet buffering in switches/routers
Two-tick burst operationFixed 2-word burst per transaction reduces command overhead and doubles effective bandwidth vs. single-word access
Internally self-timed write controlEliminates need for external write-enable timing margining - simplifies controller design and improves reliability
Clock-stop capabilityEnters low-power state with 20 μs recovery; retains data and configuration - ideal for bursty traffic patterns
JTAG 1149.1 test accessSupports IEEE-standard boundary-scan testing and in-system debugging without additional test points
Separate VDD/VDDQ suppliesIsolates core logic noise from I/O drivers - maintains signal integrity at 250 MHz DDR rates

Applications

Network Packet BufferHigh-Speed Test Equipment Memory

Use Scenario: Storing ingress/egress packet headers and payloads in Layer 2/3 Ethernet switches with line-rate forwarding.

IC Role / Device Role / Timing Role: Dual-port QDR II SRAM acting as shared buffer between ingress parser and egress scheduler, synchronized to 250 MHz system clocks.

Use Value: Concurrent read/write eliminates arbitration stalls, enabling full 500 MT/s throughput per 18-bit port - matches 10 GbE line rate requirements.

Use Scenario: Capturing high-fidelity waveform samples in automated test equipment (ATE) with nanosecond-level timing resolution.

IC Role / Device Role / Timing Role: Burst-mode acquisition memory interfaced to high-speed ADCs and pattern generators via HSTL buses.

Use Value: 4.0 ns cycle time and echo-clocked CQ/CQ# outputs provide deterministic 0.3 ns data-valid window - essential for sub-nanosecond sampling accuracy.

Telecom Baseband ProcessingReal-Time Video Frame Buffer

Use Scenario: Temporary storage of OFDM symbol data in LTE/5G baseband units during FFT/IFFT processing pipelines.

IC Role / Device Role / Timing Role: Low-latency, low-jitter memory supporting parallel read/write of complex I/Q sample pairs at 250 MHz.

Use Value: Clock-stop mode reduces active power by >50% during symbol guard intervals while maintaining instant wake-up - extends thermal headroom in dense RF modules.

Use Scenario: Interfacing between image sensor interface (CSI-2) and video processor in broadcast-grade cameras requiring zero-frame-drop recording.

IC Role / Device Role / Timing Role: Synchronized frame buffer with independent read (processor) and write (sensor) ports operating at pixel clock rates.

Use Value: User-programmable 35–70 Ω output impedance compensates for PCB trace variations - ensures clean 1.8 V HSTL eye diagrams across 18-bit parallel video buses.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress CY7C2663KV18Same 1M × 18 organization, 250 MHz speed grade, but uses 165-pin FBGA with different pinout and no ZQ calibrationRequires PCB redesign due to incompatible pin mapping and absence of programmable impedanceSelect when legacy Cypress ecosystem compatibility is required and board layout flexibility exists
Integrated Device Technology IDT72V2115L15PF1M × 18 QDR II+ variant with 1.5 ns faster cycle time (167 MHz min), enhanced DLL, and identical 165-pin BGA footprintHigher performance margin for future frequency scaling; requires updated timing constraints in controller firmwareSelect when system demands tighter jitter tolerance (<0.15 ns) or longer-term roadmap alignment with QDR II+ standards

Compared with CY7C2663KV18, UPD46185182BF1-E40Y-EQ1-A offers on-die impedance tuning via ZQ for improved signal integrity across varying board stackups; compared with IDT72V2115L15PF, it provides broader industrial temperature support (−40°C to +85°C vs. 0°C to +70°C) at lower cost, with identical pin compatibility but relaxed AC timing margins.

Availability

UPD46185182BF1-E40Y-EQ1-A is available at Aetrix Electronics and suitable for network packet buffering, high-speed test instrumentation, telecom baseband processing, and real-time video frame storage requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for UPD46185182BF1-E40Y-EQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor manufacturer specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The UPD46185182BF1-E40Y-EQ1-A belongs to Renesas' QDR II SRAM product line, engineered specifically for high-throughput, low-latency memory subsystems in networking, test equipment, and communications infrastructure where concurrent access and precise timing control are critical.

FAQ

What is the maximum operating frequency supported by the UPD46185182BF1-E40Y-EQ1-A?

The UPD46185182BF1-E40Y-EQ1-A is rated for 250 MHz operation with a 4.0 ns clock cycle time. While the datasheet notes PLL support up to 300 MHz (3.3 ns), this speed grade is only guaranteed for the -E33Y variant. The -E40Y suffix explicitly denotes the 250 MHz specification, and operation beyond this violates AC timing guarantees.

Does the UPD46185182BF1-E40Y-EQ1-A support true simultaneous read and write operations?

Yes, the UPD46185182BF1-E40Y-EQ1-A features physically separate read and write data ports with independent address paths, allowing concurrent read and write transactions to different memory locations without arbitration delay. This is confirmed by the block diagram showing dual register banks and the truth table specifying independent R# and W# control.

How does the ZQ pin function on the UPD46185182BF1-E40Y-EQ1-A?

The ZQ pin on the UPD46185182BF1-E40Y-EQ1-A is an input used for output driver impedance calibration. When connected to a precision resistor (typically 240 Ω) to ground, it configures Q, CQ, and CQ# output impedance to 0.2 × RQ (e.g., 48 Ω). Direct connection to VDDQ minimizes impedance; it must never be left floating or tied to VSS.

What is the purpose of the DLL# pin on the UPD46185182BF1-E40Y-EQ1-A?

The DLL# pin disables the internal PLL when pulled LOW, allowing the UPD46185182BF1-E40Y-EQ1-A to operate at frequencies below 120 MHz for board-level debug. During normal operation, DLL# must be pulled HIGH (e.g., via ≤10 kΩ to VDDQ); AC/DC characteristics are not guaranteed in DLL-bypass mode.

Can the UPD46185182BF1-E40Y-EQ1-A be used in systems requiring JTAG boundary-scan testing?

Yes, the UPD46185182BF1-E40Y-EQ1-A integrates a fully compliant IEEE 1149.1 JTAG test access port (TMS, TDI, TCK, TDO) operating at 1.8 V I/O levels. These pins support boundary-scan testing and in-system programming without requiring external level shifters or additional circuitry.

UPD46185182BF1-E40Y-EQ1-A Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
-
Memory Format:
-
Technology:
-
Memory Size:
-
Memory Organization:
-
Memory Interface:
-
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

UPD46185182BF1-E40Y-EQ1-A FAQ

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Please submit a Request for Quotation (RFQ) for UPD46185182BF1-E40Y-EQ1-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of UPD46185182BF1-E40Y-EQ1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD46185182BF1-E40Y-EQ1-A is usually 5 days.

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UPD46185182BF1-E40Y-EQ1-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD46185182BF1-E40Y-EQ1-A order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD46185182BF1-E40Y-EQ1-A?

For technical support, including UPD46185182BF1-E40Y-EQ1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD46185182BF1-E40Y-EQ1-A requirements.

6.How does Aetrix verify that UPD46185182BF1-E40Y-EQ1-A is sourced from the original manufacturer or authorized distributors?

All UPD46185182BF1-E40Y-EQ1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD46185182BF1-E40Y-EQ1-A meets industry standards.

7.What is the process for return or replacement of UPD46185182BF1-E40Y-EQ1-A?

All UPD46185182BF1-E40Y-EQ1-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD46185182BF1-E40Y-EQ1-A, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD46185182BF1-E40Y-EQ1-A part is unused and in its original packaging.

Return procedure for UPD46185182BF1-E40Y-EQ1-A:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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