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Renesas UPD46185364BF1-E40-EQ1-A

Part No.:
UPD46185364BF1-E40-EQ1-A
Manufacturer:
Renesas
Category:
Memory
Package:
-
Datasheet:
AetrixUPD46185364BF1-E40-EQ1-A.pdf
Description:
QDR SRAM, 512KX36, 0.45NS
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Inventory:565

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Product details

Overview

UPD46185364BF1-E40-EQ1-A from Renesas Electronics is a 524,288-word × 36-bit (18-Mbit) synchronous Quad Data Rate II (QDR II) SRAM with HSTL interface, 4-word burst operation, and 1.8 V core supply. It delivers 250 MHz clock frequency (4.0 ns cycle time), supports concurrent read/write ports, and is packaged in a 165-pin plastic BGA (13 × 15 mm) for high-density memory subsystems in network packet buffers and FPGA co-processor caches.

For engineers reviewing the UPD46185364BF1-E40-EQ1-A datasheet, UPD46185364BF1-E40-EQ1-A pinout, UPD46185364BF1-E40-EQ1-A application, or UPD46185364BF1-E40-EQ1-A equivalent, this page provides verified timing parameters, burst control logic, byte-write enable mapping, HSTL I/O compliance, and QDR II-specific clocking architecture - all validated against Renesas R10DS0113EJ0200 Rev.2.00.

Technical Context

This QDR II SRAM employs dual-clock architecture: K/K# registers address/control on rising edges, while C/C# govern output data timing with precise flight-time matching. Its internal burst counter and separate read/write data paths enable true concurrent transactions without arbitration delay.

The device integrates a PLL for jitter-tolerant operation down to 120 MHz, user-programmable output impedance (35–70 Ω via ZQ pin), and clock-stop capability with 20 μs recovery. All I/Os comply with JEDEC HSTL Class I, and write operations support granular 9-bit byte writes via BW0#–BW3# signals.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 524,288 words × 36 bits = 18 Mbit total capacity; enables wide-data-path buffering for 32-bit+ bus systems.
Clock Frequency / Cycle Time 250 MHz / 4.0 ns; defines maximum sustained throughput of 1 Gb/s per data pin in burst mode.
Supply Voltages VDD = 1.8 ± 0.1 V (core); VDDQ = 1.4–1.8 V (I/O); ensures low-power operation while maintaining HSTL signal integrity.
Interface Standard HSTL Class I compliant; guarantees compatible termination, voltage thresholds, and timing margins with ASIC/FPGA memory controllers.
Burst Operation Fixed 4-word burst per transaction; reduces address bus toggling by 75% versus single-word access, lowering EMI and controller overhead.
Write Granularity Four independent 9-bit byte write enables (BW0#–BW3#); allows partial-word updates without read-modify-write cycles.
Operating Temperature 0°C to +70°C (commercial grade); validated for stable performance in telecom line cards and industrial compute modules.

Pinout & Package

Package: 165-pin plastic BGA (13 mm × 15 mm, 1.0 mm pitch), lead-free, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
K, K# Input clock pair Registers address, control, and input data on rising edges; K# must be 180° out-of-phase for setup/hold compliance.
C, C# Output clock pair Controls output data timing: C# clocks first/third data, C clocks second/fourth; enables precise skew matching to receiving device.
D0–D35 Synchronous data inputs 36-bit parallel write path; each nibble mapped to one BWx# signal for selective byte update.
Q0–Q35 Synchronous data outputs 36-bit parallel read path; outputs aligned to C/C# edges for deterministic flight time and setup margin.
BW0#–BW3# Byte write enables Active-low controls for four 9-bit segments; enables partial writes without disturbing adjacent bytes in same burst.
ZQ Output impedance calibration Connects to external resistor to ground to set Q/CQ/CQ# output impedance to 0.2×RQ (35–70 Ω range).
DLL# PLL disable Pull HIGH for normal operation; pull LOW only for debug at sub-120 MHz clocks (AC/DC specs not guaranteed).
TMS, TDI, TCK, TDO JTAG 1149.1 test port 1.8 V I/O level; supports boundary-scan testing and in-system programming when enabled.

Key Features

Feature Design Value
Concurrent read/write ports Enables simultaneous memory access-e.g., real-time packet forwarding while updating lookup tables-without arbitration stalls.
100% bus utilization DDR operation Eliminates idle cycles between reads/writes; achieves full theoretical bandwidth during back-to-back burst sequences.
User-programmable output impedance Calibrates drive strength to match PCB trace impedance, reducing reflections and improving signal integrity across varied layouts.
Internally self-timed write control Removes external write pulse timing constraints; simplifies controller design and improves reliability across voltage/temperature corners.
Four-tick burst addressing Reduces address bus frequency by 4× versus single-word access, lowering routing complexity and dynamic power in high-speed designs.
Clock-stop capability with 20 μs recovery Permits dynamic power gating during idle periods while guaranteeing deterministic restart latency for real-time applications.

Applications

Network Packet Buffering FPGA Co-Processor Cache

Use Scenario: Storing ingress/egress packet headers and metadata in 10G/25G Ethernet switch ASICs.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer with concurrent read/write ports enabling parallel header parsing and forwarding decisions.

Use Value: 250 MHz QDR II interface delivers 3.6 GB/s aggregate bandwidth (36 bits × 250 MHz × 2 transitions/cycle), meeting line-rate requirements.

Use Scenario: Offloading compute-intensive tasks (e.g., encryption, FFT) from host CPU using tightly coupled FPGA accelerators.

IC Role / Device Role / Timing Role: Shared scratchpad memory with deterministic 4.0 ns cycle time and burst-aligned access for pipelined dataflow.

Use Value: 4-word burst reduces address bus activity by 75%, minimizing FPGA pin count and routing congestion in compact form factors.

Telecom Line Card Memory High-Speed Test Equipment Buffer

Use Scenario: Buffering protocol translation tables and session state in multi-service edge routers.

IC Role / Device Role / Timing Role: Dual-port SRAM supporting simultaneous table lookups (read) and state updates (write) under strict real-time deadlines.

Use Value: Concurrent ports eliminate serialization bottlenecks, enabling >1M lookups/sec with sub-10 ns latency variation across temperature.

Use Scenario: Capturing high-fidelity analog waveform samples at 1 GS/s in automated test equipment (ATE).

IC Role / Device Role / Timing Role: High-speed capture buffer synchronized to system clock with precise echo clock (CQ/CQ#) for data valid window alignment.

Use Value: CQ/CQ# outputs track Q outputs with <100 ps skew, enabling reliable sampling window detection at 250 MHz clock rates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C2663KV18-400BZC 512K × 36, 400 MHz (2.5 ns), 1.8 V core, 165-pin BGA; higher speed but tighter timing margins and higher IDD (820 mA @ 400 MHz). Requires faster PCB layout, stricter power delivery, and more aggressive thermal management than UPD46185364BF1-E40-EQ1-A. Select when system clock exceeds 250 MHz and timing closure permits tighter setup/hold windows.
AS7C331024P-25BIN 1M × 36, 250 MHz, 3.3 V core, 165-pin BGA; asynchronous interface, no burst or QDR timing, lower density per pin count. Lacks concurrent ports, burst operation, and HSTL I/O; suitable only for non-real-time buffering where latency is not critical. Select only if legacy 3.3 V infrastructure exists and QDR II features (C/C#, CQ, BWx#) are unnecessary.

Compared with CY7C2663KV18-400BZC and AS7C331024P-25BIN, UPD46185364BF1-E40-EQ1-A offers optimal balance of 250 MHz performance, 1.8 V low-power operation, and full QDR II feature set-including echo clocks, byte-write enables, and clock-stop-without demanding ultra-high-speed layout or voltage scaling.

Availability

UPD46185364BF1-E40-EQ1-A is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor cache, and telecom line card memory requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for UPD46185364BF1-E40-EQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.

The UPD46185364BF1-E40-EQ1-A belongs to Renesas' QDR II SRAM product line, engineered for high-throughput, low-latency memory subsystems in networking and high-performance computing where deterministic burst timing and concurrent access are critical.

FAQ

What is the memory organization and total capacity of UPD46185364BF1-E40-EQ1-A?

UPD46185364BF1-E40-EQ1-A is organized as 524,288 words × 36 bits, delivering 18,874,368 bits (18 Mbit) of total storage. This configuration supports 32-bit or wider data buses with native 36-bit granularity, eliminating bit-packing overhead in packet-processing and DSP applications. The device uses a full CMOS six-transistor memory cell fabricated in advanced CMOS technology.

Does UPD46185364BF1-E40-EQ1-A support concurrent read and write operations?

Yes, UPD46185364BF1-E40-EQ1-A features physically separate read and write data ports, enabling true concurrent transactions without arbitration delay. During a single clock cycle, it can accept new write data on D0–D35 while simultaneously delivering previously requested read data on Q0–Q35 - a key requirement for real-time network buffering and FPGA-accelerated compute pipelines.

What are the required power supply voltages and sequencing for UPD46185364BF1-E40-EQ1-A?

UPD46185364BF1-E40-EQ1-A requires VDD = 1.8 ± 0.1 V (core) and VDDQ = 1.4–1.8 V (I/O). Per Renesas R10DS0113EJ0200, power-up sequence must follow: VSS → VDD/VDDQ (simultaneous, ΔV ≤ 0.5 V) → VREF → VIN. Power-down reverses this order. DLL# must be held HIGH after power stabilization, and ≥20 μs stable clock is required before issuing the first NOP command.

How does the byte write functionality work on UPD46185364BF1-E40-EQ1-A?

UPD46185364BF1-E40-EQ1-A implements four active-low byte write enables: BW0#, BW1#, BW2#, and BW3#. Each controls a distinct 9-bit segment of the 36-bit data bus (D0–D8, D9–D17, D18–D26, D27–D35). When asserted LOW during a WRITE cycle, the corresponding byte is updated; all HIGH disables writes entirely. This eliminates need for read-modify-write sequences in partial updates.

What is the role of CQ and CQ# pins on UPD46185364BF1-E40-EQ1-A?

CQ and CQ# are synchronous echo clock outputs tightly matched to Q0–Q35 data edges. Their rising edges indicate valid data windows - CQ# aligns with first/third output words, CQ with second/fourth - enabling precise latch timing at the receiving device. Unlike C/C#, CQ/CQ# continue running even when Q outputs tristate, providing robust data-valid signaling independent of output enable state.

UPD46185364BF1-E40-EQ1-A Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
-
Memory Format:
-
Technology:
-
Memory Size:
-
Memory Organization:
-
Memory Interface:
-
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

UPD46185364BF1-E40-EQ1-A FAQ

1.How can I place an order for UPD46185364BF1-E40-EQ1-A through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD46185364BF1-E40-EQ1-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD46185364BF1-E40-EQ1-A reliable?

The price and inventory of UPD46185364BF1-E40-EQ1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD46185364BF1-E40-EQ1-A is usually 5 days.

3.What payment methods are accepted for UPD46185364BF1-E40-EQ1-A?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD46185364BF1-E40-EQ1-A transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UPD46185364BF1-E40-EQ1-A?

UPD46185364BF1-E40-EQ1-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD46185364BF1-E40-EQ1-A order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD46185364BF1-E40-EQ1-A?

For technical support, including UPD46185364BF1-E40-EQ1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD46185364BF1-E40-EQ1-A requirements.

6.How does Aetrix verify that UPD46185364BF1-E40-EQ1-A is sourced from the original manufacturer or authorized distributors?

All UPD46185364BF1-E40-EQ1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD46185364BF1-E40-EQ1-A meets industry standards.

7.What is the process for return or replacement of UPD46185364BF1-E40-EQ1-A?

All UPD46185364BF1-E40-EQ1-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD46185364BF1-E40-EQ1-A, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD46185364BF1-E40-EQ1-A part is unused and in its original packaging.

Return procedure for UPD46185364BF1-E40-EQ1-A:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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