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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Renesas UPD46364185BF1-E40-EQ1-A

Name: UPD46364185BF1-E40-EQ1-A
Brand: Renesas
SKU: UPD46364185BF1-E40-EQ1-A
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: UPD46364185BF1-E40-EQ1-A

Manufacturer:: Renesas

Category:: Memory

Package:: -

Datasheet:: UPD46364185BF1-E40-EQ1-A.pdf

Description:: DDR SRAM, 2MX18, 0.45NS

Quantity:: RFQ Add To RFQ list

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Product details

Overview

UPD46364185BF1-E40-EQ1-A from NEC Electronics (now Renesas) is a 2,097,152-word × 18-bit synchronous DDR II SRAM with HSTL interface, 165-pin plastic BGA (13×15), 4.0 ns clock cycle time (250 MHz), and separate read/write data ports. It delivers pipelined double data rate operation for high-bandwidth buffering in network packet processors.

For engineers reviewing the UPD46364185BF1-E40-EQ1-A datasheet, UPD46364185BF1-E40-EQ1-A pinout, UPD46364185BF1-E40-EQ1-A application, or UPD46364185BF1-E40-EQ1-A equivalent, key selection criteria include DDR burst timing compliance, HSTL Class I output drive, user-programmable impedance (35–70 Ω), clock-stop capability (20 μs recovery), and JTAG 1149.1 test access.

Technical Context

This device implements a synchronous peripheral architecture with dual input clocks (K/K#) latching address/control on K's rising edge and data on both K and K# rising edges. Its internal PLL enables wide output data valid window and supports future frequency scaling up to 300 MHz.

The memory core uses full-CMOS six-transistor cells and integrates a burst counter for 2-word bursts per cycle. Output timing is synchronized either to dedicated C/C# output clocks (for flight-time matching) or to K/K# when C/C# are tied HIGH - enabling precise clock-data alignment at the receiving device.

Key Specifications

Parameter	Value and Actual Design Meaning
Organization	2,097,152-word × 18-bit (36 Mbit total)
Clock cycle time	4.0 ns - supports 250 MHz DDR operation with guaranteed setup/hold margins
Supply voltage	1.8 V ±0.1 V core (VDD); isolated 1.4–1.8 V I/O supply (VDDQ)
Interface standard	HSTL Class I compliant inputs/outputs - ensures signal integrity on high-speed buses
Package	165-pin plastic BGA (13 mm × 15 mm) - optimized for thermal dissipation and board density
Operating temperature	0 °C to +70 °C - validated for commercial industrial control and telecom infrastructure
Impedance control	User-programmable output impedance (35–70 Ω via ZQ pin) - matches system bus termination

Pinout & Package

165-pin plastic BGA (13 × 15 mm), top view, with index mark per package dimensions. Ball pitch: 0.8 mm.

Pin/Terminal	Circuit Role	Design Meaning
K, K#	Input clock pair	Registers address/control on K rising edge; registers write data on both K and K# rising edges - defines DDR timing reference
C, C#	Output clock pair	Synchronizes output data delivery; C# rising edge clocks first data word, C rising edge clocks second - enables precise flight-time matching
CQ, CQ#	Echo clock outputs	Tightly matched to Q outputs (±0.1 ns); provides data-valid indication independent of tristate state
LD#	Synchronous load	Active-low signal that defines bus cycle sequence (address + R/W direction) - initiates each 2-word burst transaction
R, W#	Read/write control	When LD# is low: HIGH = read, LOW = write - determines data flow direction per burst
BW0#, BW1#	Byte write enables	Active-low selects D0–D8 (BW0#=0,BW1#=1) or D9–D17 (BW0#=1,BW1#=0) - enables partial-word writes without masking logic
ZQ	Impedance calibration	Connects to external resistor to ground; sets Q/CQ/CQ# output impedance to 0.2 × RQ - compensates for VDDQ/temperature drift every 20 μs
DLL#	PLL disable	Active-low disables PLL for low-frequency debug; normal operation requires HIGH (tied to VDDQ) - AC/DC specs invalid when disabled
VREF	HSTL reference	Nominally VDDQ/2 - establishes threshold for HSTL input buffers; must be stable before clock activation
TCK, TMS, TDI, TDO	JTAG interface	IEEE 1149.1-compliant test access port - supports boundary-scan testing without functional interruption

Key Features

Feature	Design Value
Pipelined DDR operation	Delivers two data words per clock cycle with zero wait states - doubles effective bandwidth over single-data-rate SRAM
Separate I/O ports	Independent D0–D17 (input) and Q0–Q17 (output) buses - eliminates read-modify-write overhead in FIFO and buffer applications
Two-tick burst mode	Fixed 2-word burst length minimizes command overhead and simplifies controller logic - reduces latency vs. variable-length bursts
Clock-stop capability	Enters low-power state with no data loss; resumes normal operation within 20 μs after clock restart - enables dynamic power gating
HSTL Class I interface	Guaranteed 1.4–1.8 V VDDQ-compatible signaling with controlled slew and termination - ensures signal integrity at 250 MHz
Internally self-timed write	Eliminates external write-pulse generation; write completion is fully managed by internal timing - simplifies system-level timing closure

Applications

Network Packet Buffering	High-Speed Test Equipment Memory
Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet switches and routers. IC Role / Device Role / Timing Role: DDR II SRAM acting as a synchronous, low-latency, burst-access buffer between MAC and switching fabric. Use Value: 250 MHz DDR operation delivers 9 Gbps sustained throughput (18-bit × 250 MHz × 2), meeting line-rate buffering requirements for 10GbE.	Use Scenario: Capturing high-fidelity waveform samples in automated test equipment (ATE) with nanosecond timing resolution. IC Role / Device Role / Timing Role: High-speed acquisition memory synchronized to precision clock sources via K/K# and C/C#. Use Value: Echo clocks (CQ/CQ#) provide sub-300 ps data-valid timing references - enabling accurate timestamping without external delay compensation.
FPGA Co-Processor Cache	Industrial Motion Controller Buffer
Use Scenario: Serving as a tightly coupled instruction/data cache for FPGA-based soft-core processors executing real-time control algorithms. IC Role / Device Role / Timing Role: Low-latency, burst-capable SRAM interfaced directly to FPGA I/O banks configured for HSTL. Use Value: Separate read/write ports allow concurrent instruction fetch and data writeback - eliminating pipeline stalls in deterministic control loops.	Use Scenario: Buffering position feedback and motion command streams in servo drives requiring jitter-free execution at 20 kHz update rates. IC Role / Device Role / Timing Role: Deterministic-access memory with clock-stop support for synchronized axis coordination during idle periods. Use Value: 20 μs clock-resume latency ensures sub-microsecond response to motion trigger events - preserving real-time determinism.

Network Packet Buffering

High-Speed Test Equipment Memory

Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet switches and routers.

IC Role / Device Role / Timing Role: DDR II SRAM acting as a synchronous, low-latency, burst-access buffer between MAC and switching fabric.

Use Value: 250 MHz DDR operation delivers 9 Gbps sustained throughput (18-bit × 250 MHz × 2), meeting line-rate buffering requirements for 10GbE.

Use Scenario: Capturing high-fidelity waveform samples in automated test equipment (ATE) with nanosecond timing resolution.

IC Role / Device Role / Timing Role: High-speed acquisition memory synchronized to precision clock sources via K/K# and C/C#.

Use Value: Echo clocks (CQ/CQ#) provide sub-300 ps data-valid timing references - enabling accurate timestamping without external delay compensation.

FPGA Co-Processor Cache

Industrial Motion Controller Buffer

Use Scenario: Serving as a tightly coupled instruction/data cache for FPGA-based soft-core processors executing real-time control algorithms.

IC Role / Device Role / Timing Role: Low-latency, burst-capable SRAM interfaced directly to FPGA I/O banks configured for HSTL.

Use Value: Separate read/write ports allow concurrent instruction fetch and data writeback - eliminating pipeline stalls in deterministic control loops.

Use Scenario: Buffering position feedback and motion command streams in servo drives requiring jitter-free execution at 20 kHz update rates.

IC Role / Device Role / Timing Role: Deterministic-access memory with clock-stop support for synchronized axis coordination during idle periods.

Use Value: 20 μs clock-resume latency ensures sub-microsecond response to motion trigger events - preserving real-time determinism.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR II SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY7C1551KV18-250BZI	2M × 18-bit QDR II+ SRAM; 250 MHz; 165-pin FBGA; 1.8 V core; differential LVDS outputs	QDR II+ supports simultaneous read/write; higher peak bandwidth but requires differential routing and more complex controller	Select for systems needing true concurrent access; avoid if HSTL compatibility or simple burst control is required
IS45S16160J-25BLI	2M × 16-bit SDRAM; 250 MHz; 54-pin TSOP; 3.3 V; asynchronous refresh management	SDRAM requires periodic refresh and command sequencing; lower pin count but higher latency and software overhead	Select for cost-sensitive designs with relaxed timing constraints; avoid for deterministic low-latency buffering

Compared with CY7C1551KV18-250BZI and IS45S16160J-25BLI, UPD46364185BF1-E40-EQ1-A offers native HSTL compatibility, simpler burst control (no command bus), and guaranteed 20 μs clock-stop recovery - making it optimal for deterministic, high-throughput buffering where controller simplicity and timing predictability are critical.

Availability

UPD46364185BF1-E40-EQ1-A is available at Aetrix Electronics and suitable for network packet buffering, high-speed test equipment memory, and FPGA co-processor cache applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for UPD46364185BF1-E40-EQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics (formerly NEC Electronics) is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The μPD46364xxB family was designed specifically for high-bandwidth, low-latency synchronous buffering in networking and test equipment - emphasizing DDR timing precision, HSTL interoperability, and robust thermal performance in BGA packaging.

FAQ

What is the maximum guaranteed operating frequency for UPD46364185BF1-E40-EQ1-A?

The UPD46364185BF1-E40-EQ1-A is rated for 250 MHz operation with a 4.0 ns clock cycle time. This is verified across the full 0 °C to +70 °C temperature range and 1.7–1.9 V VDD supply. While the -E33 variant supports 300 MHz, the -E40 suffix explicitly denotes the 250 MHz speed grade - exceeding this violates AC timing specifications.

Does UPD46364185BF1-E40-EQ1-A require external termination resistors?

Yes, UPD46364185BF1-E40-EQ1-A requires external termination: 50 Ω series resistors on C/C# and CQ/CQ# lines, and 250 Ω pull-up/down resistors on D/Q lines referenced to VREF. The ZQ pin calibrates output driver impedance but does not eliminate the need for proper board-level termination to meet HSTL Class I signal integrity requirements.

How does the clock-stop feature work in UPD46364185BF1-E40-EQ1-A?

When K/K# clocks stop, UPD46364185BF1-E40-EQ1-A retains all stored data and enters a low-power state. Normal operation resumes within 20 μs after clocks restart - provided DLL# remains HIGH and VDD/VDDQ remain stable. During stop, outputs go high-Z, but internal state (including burst counters and PLL lock) is preserved.

Can UPD46364185BF1-E40-EQ1-A operate without using the C/C# output clocks?

Yes. When C and C# are tied HIGH, UPD46364185BF1-E40-EQ1-A uses K/K# as the output timing reference instead. Data and echo clocks then align to K/K# rising edges. This simplifies layout but forfeits flight-time matching - acceptable for shorter traces or when system-level skew compensation is handled elsewhere.

What is the purpose of the ZQ pin on UPD46364185BF1-E40-EQ1-A?

The ZQ pin on UPD46364185BF1-E40-EQ1-A enables dynamic output impedance calibration. Connected to an external resistor to ground (typically 240 Ω), it adjusts Q, CQ, and CQ# driver strength to maintain 35–70 Ω output impedance - compensating for VDDQ and temperature variations every 20 μs after power-up.

UPD46364185BF1-E40-EQ1-A Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: *

Package/Case:: -

Packaging:: Bulk

Product Status:: Active

Programmable:: Not Verified

Memory Type:: -

Memory Format:: -

Technology:: -

Memory Size:: -

Memory Organization:: -

Memory Interface:: -

Clock Frequency:: -

Write Cycle Time - Word, Page:: -

Access Time:: -

Voltage - Supply:: -

Operating Temperature:: -

Grade:: -

Qualification:: -

Mounting Type:: -

Supplier Device Package:: -

UPD46364185BF1-E40-EQ1-A FAQ

1.How can I place an order for UPD46364185BF1-E40-EQ1-A through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD46364185BF1-E40-EQ1-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD46364185BF1-E40-EQ1-A reliable?

The price and inventory of UPD46364185BF1-E40-EQ1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD46364185BF1-E40-EQ1-A is usually 5 days.

3.What payment methods are accepted for UPD46364185BF1-E40-EQ1-A?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD46364185BF1-E40-EQ1-A transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UPD46364185BF1-E40-EQ1-A?

UPD46364185BF1-E40-EQ1-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD46364185BF1-E40-EQ1-A order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD46364185BF1-E40-EQ1-A?

For technical support, including UPD46364185BF1-E40-EQ1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD46364185BF1-E40-EQ1-A requirements.

6.How does Aetrix verify that UPD46364185BF1-E40-EQ1-A is sourced from the original manufacturer or authorized distributors?

All UPD46364185BF1-E40-EQ1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD46364185BF1-E40-EQ1-A meets industry standards.

7.What is the process for return or replacement of UPD46364185BF1-E40-EQ1-A?

All UPD46364185BF1-E40-EQ1-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD46364185BF1-E40-EQ1-A, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD46364185BF1-E40-EQ1-A part is unused and in its original packaging.

Return procedure for UPD46364185BF1-E40-EQ1-A:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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