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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Renesas UPD46364362BF1-E33-EQ1-A

Name: UPD46364362BF1-E33-EQ1-A
Brand: Renesas
SKU: UPD46364362BF1-E33-EQ1-A
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: UPD46364362BF1-E33-EQ1-A

Manufacturer:: Renesas

Category:: Memory

Package:: -

Datasheet:: UPD46364362BF1-E33-EQ1-A.pdf

Description:: DDR SRAM, 1MX36, 0.45NS

Quantity:: RFQ Add To RFQ list

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Product details

Overview

UPD46364362BF1-E33-EQ1-A from NEC Electronics (now Renesas) is a 1,048,576-word × 36-bit synchronous double data rate (DDR) SRAM with pipelined burst operation, 1.8 V core supply, HSTL I/O interface, and 300 MHz clock frequency (3.3 ns cycle time). It delivers 72 Mbit density in a 165-pin plastic BGA package and is used in high-speed networking packet buffers and FPGA co-processor memory subsystems.

For engineers reviewing the UPD46364362BF1-E33-EQ1-A datasheet, UPD46364362BF1-E33-EQ1-A pinout, UPD46364362BF1-E33-EQ1-A application, or UPD46364362BF1-E33-EQ1-A equivalent, key selection criteria include DDR timing compliance (K/K# and C/C# dual-clock architecture), user-programmable output impedance (35–70 Ω via ZQ), JTAG 1149.1 test access, and burst-2 linear addressing for low-latency memory transactions.

Technical Context

This device implements a synchronous DDR interface with separate input clocks (K/K#) for address/control/data registration and output clocks (C/C#) for precise data flight-time matching. Its internal PLL enables wide output data valid windows and supports future frequency scaling up to 300 MHz.

The architecture features pipelined double data rate operation, common data I/O bus, internally self-timed write control, and clock-stop capability with 20 μs recovery. All control inputs-including LD#, R/W#, and BW0#–BW3#-are registered on K's rising edge, and burst addressing advances A0 automatically per JEDEC DDR II SRAM conventions.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory organization	1,048,576 words × 36 bits = 36 Mbit total capacity
Clock frequency	300 MHz (3.3 ns cycle time); supports 250 MHz (4.0 ns) variant
Supply voltage	Core VDD = 1.8 ± 0.1 V; I/O VDDQ = 1.4–1.8 V (HSTL-compliant)
Interface standard	JEDEC HSTL Class I inputs/outputs with VREF reference
Burst mode	Fixed 2-word linear burst; A0 selects starting offset within burst
Output impedance	User-programmable 35–70 Ω via external ZQ resistor to ground
Operating temperature	0 °C to +70 °C (commercial grade, EQ1-A suffix)
JTAG support	IEEE 1149.1 compliant TAP (TMS, TCK, TDI, TDO) at 1.8 V I/O level

Pinout & Package

Package: 165-pin plastic BGA (13 × 15 mm, ball pitch 0.8 mm), lead-free, RoHS-compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A	Synchronous address input	Registered on K rising edge; A0 controls burst start offset (x18/x36 only)
DQ0–DQ35	Synchronous bidirectional data I/O	36-bit common bus; registered on K/K# edges (input), synchronized to C/C# (output)
K, K#	Input clock pair	Registers all inputs on rising edges; 180° phase alignment required for DDR timing
C, C#	Output clock pair	Controls output data timing; rising edges define first/second data valid windows
CQ, CQ#	Echo clock outputs	Tightly matched to DQ valid/hold; used as data-strobe indication independent of C/C# state
LD#	Synchronous load enable	Active-low; defines address and R/W direction for next burst transaction
R, W#	Read/write direction	High = read, low = write; sampled when LD# is asserted
BW0#–BW3#	Byte write enables	Four active-low signals controlling 9-bit byte writes across 36-bit DQ bus
ZQ	Output impedance calibration	Connect to external resistor to ground; sets DQ/CQ output drive strength (0.2 × RQ)
DLL#	PLL disable	Low disables PLL for debug; normal operation requires HIGH (tied to VDDQ)
VREF	HSTL input reference	Nominally VDDQ/2; provides threshold for HSTL-compatible input buffers
VDD, VDDQ, VSS	Power supplies	VDD = 1.8 V core; VDDQ = isolated 1.4–1.8 V I/O rail; VSS = ground
TMS, TCK, TDI, TDO	JTAG boundary-scan interface	IEEE 1149.1 compliant; 1.8 V I/O level; TCK must tie to VSS if unused

Key Features

Feature	Design Value
Pipelined DDR operation	Enables concurrent address setup and data transfer across two consecutive clock cycles, reducing effective latency per burst
Two-tick burst architecture	Minimizes DDR transaction overhead by limiting burst length to exactly two words-ideal for cache-line-aligned accesses
User-programmable output impedance	Calibrates DQ/CQ drive strength via external ZQ resistor, eliminating board-level termination resistors and improving signal integrity
Separate C/C# output clocks	Allows precise flight-time tuning between memory and controller; eliminates skew-induced timing violations in high-speed routing
Internally self-timed write control	Removes external write-pulse timing constraints; guarantees correct write completion regardless of clock jitter or skew
PLL-based wide data valid window	Extends output data hold time and simplifies timing closure at 300 MHz, enabling robust operation across voltage/temperature corners

Applications

Network Packet Buffer	FPGA Co-Processor Memory
Use Scenario: High-throughput Ethernet switch ASIC buffering incoming/outgoing frames before classification and forwarding. IC Role / Device Role / Timing Role: Asynchronous-to-synchronous bridge with DDR II SRAM acting as deep, low-latency frame storage with deterministic 2-cycle burst reads/writes. Use Value: 36-bit bus width matches typical 32-bit+header packet word size; 300 MHz clock enables ≥9.6 Gbps sustained bandwidth for line-rate 10GbE processing.	Use Scenario: Offloading compute-intensive tasks (e.g., encryption, FFT) from host CPU to FPGA-accelerated subsystem. IC Role / Device Role / Timing Role: High-bandwidth local memory for FPGA logic fabric, interfaced via dedicated DDR controller IP with K/K# and C/C# clock domains. Use Value: Pipelined DDR operation and echo clocks (CQ/CQ#) simplify timing closure in FPGA design; HSTL interface ensures compatibility with Xilinx/Intel FPGA I/O banks.
Baseband Signal Processing	Industrial Real-Time Controller
Use Scenario: LTE/5G baseband unit performing channel estimation and equalization on multi-antenna RF streams. IC Role / Device Role / Timing Role: Low-latency scratchpad memory for FFT/IFFT coefficient storage and intermediate result buffering in DSP pipeline. Use Value: Burst-2 operation aligns with 128-point/256-point FFT radix-2 decomposition; 1.8 V supply reduces power in thermally constrained RF modules.	Use Scenario: Motion control system requiring deterministic microsecond-level response to encoder feedback and PWM updates. IC Role / Device Role / Timing Role: Deterministic-access memory for real-time task scheduler and PID loop state variables, accessed by dual-core ARM Cortex-R processor. Use Value: Clock-stop capability allows dynamic power gating during idle intervals without losing memory state; JTAG support enables in-system debug and firmware validation.

Network Packet Buffer

FPGA Co-Processor Memory

Use Scenario: High-throughput Ethernet switch ASIC buffering incoming/outgoing frames before classification and forwarding.

IC Role / Device Role / Timing Role: Asynchronous-to-synchronous bridge with DDR II SRAM acting as deep, low-latency frame storage with deterministic 2-cycle burst reads/writes.

Use Value: 36-bit bus width matches typical 32-bit+header packet word size; 300 MHz clock enables ≥9.6 Gbps sustained bandwidth for line-rate 10GbE processing.

Use Scenario: Offloading compute-intensive tasks (e.g., encryption, FFT) from host CPU to FPGA-accelerated subsystem.

IC Role / Device Role / Timing Role: High-bandwidth local memory for FPGA logic fabric, interfaced via dedicated DDR controller IP with K/K# and C/C# clock domains.

Use Value: Pipelined DDR operation and echo clocks (CQ/CQ#) simplify timing closure in FPGA design; HSTL interface ensures compatibility with Xilinx/Intel FPGA I/O banks.

Baseband Signal Processing

Industrial Real-Time Controller

Use Scenario: LTE/5G baseband unit performing channel estimation and equalization on multi-antenna RF streams.

IC Role / Device Role / Timing Role: Low-latency scratchpad memory for FFT/IFFT coefficient storage and intermediate result buffering in DSP pipeline.

Use Value: Burst-2 operation aligns with 128-point/256-point FFT radix-2 decomposition; 1.8 V supply reduces power in thermally constrained RF modules.

Use Scenario: Motion control system requiring deterministic microsecond-level response to encoder feedback and PWM updates.

IC Role / Device Role / Timing Role: Deterministic-access memory for real-time task scheduler and PID loop state variables, accessed by dual-core ARM Cortex-R processor.

Use Value: Clock-stop capability allows dynamic power gating during idle intervals without losing memory state; JTAG support enables in-system debug and firmware validation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR II SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY7C1551KV18	1M × 18-bit organization; 2.5 V core; no ZQ calibration; uses SSTL-2 interface	Requires level-shifting for 1.8 V systems; narrower bus limits throughput vs. 36-bit UPD46364362BF1-E33-EQ1-A	Select when legacy 2.5 V infrastructure exists and 18-bit bus width suffices
IS45S32800J	32 Mbit SDRAM (not SRAM); asynchronous command interface; 3.3 V I/O; no C/C# or CQ clocks	Lacks deterministic latency and DDR echo clocks; requires refresh and complex controller logic	Select only for cost-sensitive, non-real-time applications where latency variability is acceptable

Compared with CY7C1551KV18 and IS45S32800J, the UPD46364362BF1-E33-EQ1-A delivers higher bandwidth via its 36-bit bus and deterministic DDR II timing, while ZQ calibration and HSTL I/O reduce PCB complexity and improve signal integrity in 1.8 V systems.

Availability

UPD46364362BF1-E33-EQ1-A is available at Aetrix Electronics and suitable for high-speed networking equipment, FPGA-accelerated computing platforms, baseband signal processing units, and industrial real-time controllers requiring stable component supply and long-term lifecycle support.

Supply support for UPD46364362BF1-E33-EQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation (formerly NEC Electronics) is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.

The UPD46364362BF1-E33-EQ1-A belongs to Renesas' DDR II SRAM product line, designed specifically for deterministic, low-latency, high-bandwidth memory applications in networking, telecom infrastructure, and FPGA-based acceleration systems.

FAQ

What is the maximum operating frequency of the UPD46364362BF1-E33-EQ1-A?

The UPD46364362BF1-E33-EQ1-A is rated for 300 MHz operation with a 3.3 ns clock cycle time. This frequency is guaranteed under commercial temperature conditions (0 °C to +70 °C) and 1.8 V ±0.1 V supply. The device also supports a 250 MHz (4.0 ns) variant denoted by the -E40 suffix, but the UPD46364362BF1-E33-EQ1-A specifically targets the 300 MHz performance bin.

Does the UPD46364362BF1-E33-EQ1-A require external termination resistors?

No, the UPD46364362BF1-E33-EQ1-A does not require external series or parallel termination resistors on DQ, CQ, or CQ# lines. Its output impedance is programmable via the ZQ pin, which calibrates drive strength to match the system bus (typically 50 Ω), eliminating discrete terminations and reducing PCB area and BOM cost.

How does the burst addressing work in the UPD46364362BF1-E33-EQ1-A?

The UPD46364362BF1-E33-EQ1-A implements fixed 2-word linear burst addressing. When LD# is asserted, the A0 input determines whether the burst starts at the loaded address (A0 = 0) or the next sequential address (A0 = 1). This allows random access within the 2-word burst window and is essential for efficient cache-line or packet-header/data alignment in networking applications.

Can the UPD46364362BF1-E33-EQ1-A operate without its PLL enabled?

Yes-the UPD46364362BF1-E33-EQ1-A can operate with the PLL disabled by pulling DLL# LOW. In this mode, read latency reduces to 1.0 clock cycle, but AC/DC electrical characteristics are not guaranteed. For production use, DLL# must be HIGH (tied to VDDQ), as the PLL is required to meet timing specifications at 300 MHz and ensure stable C/C# and CQ/CQ# generation.

What is the purpose of the C and C# output clocks in the UPD46364362BF1-E33-EQ1-A?

The C and C# output clocks in the UPD46364362BF1-E33-EQ1-A provide a user-controllable timing reference for output data. Their rising edges define the valid windows for the first and second burst words, respectively. This decouples data timing from the input clock (K/K#), enabling precise flight-time compensation and eliminating skew-related setup/hold violations in high-speed point-to-point links.

UPD46364362BF1-E33-EQ1-A Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: *

Package/Case:: -

Packaging:: Bulk

Product Status:: Active

Programmable:: Not Verified

Memory Type:: -

Memory Format:: -

Technology:: -

Memory Size:: -

Memory Organization:: -

Memory Interface:: -

Clock Frequency:: -

Write Cycle Time - Word, Page:: -

Access Time:: -

Voltage - Supply:: -

Operating Temperature:: -

Grade:: -

Qualification:: -

Mounting Type:: -

Supplier Device Package:: -

UPD46364362BF1-E33-EQ1-A FAQ

1.How can I place an order for UPD46364362BF1-E33-EQ1-A through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD46364362BF1-E33-EQ1-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD46364362BF1-E33-EQ1-A reliable?

The price and inventory of UPD46364362BF1-E33-EQ1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD46364362BF1-E33-EQ1-A is usually 5 days.

3.What payment methods are accepted for UPD46364362BF1-E33-EQ1-A?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD46364362BF1-E33-EQ1-A transactions.

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4.How is shipping managed for UPD46364362BF1-E33-EQ1-A?

UPD46364362BF1-E33-EQ1-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD46364362BF1-E33-EQ1-A order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD46364362BF1-E33-EQ1-A?

For technical support, including UPD46364362BF1-E33-EQ1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD46364362BF1-E33-EQ1-A requirements.

6.How does Aetrix verify that UPD46364362BF1-E33-EQ1-A is sourced from the original manufacturer or authorized distributors?

All UPD46364362BF1-E33-EQ1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD46364362BF1-E33-EQ1-A meets industry standards.

7.What is the process for return or replacement of UPD46364362BF1-E33-EQ1-A?

All UPD46364362BF1-E33-EQ1-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD46364362BF1-E33-EQ1-A, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD46364362BF1-E33-EQ1-A part is unused and in its original packaging.

Return procedure for UPD46364362BF1-E33-EQ1-A:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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