Renesas UPD46364365BF1-E40-EQ1-A
- Part No.:
- UPD46364365BF1-E40-EQ1-A
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
UPD46364365BF1-E40-EQ1-A.pdf
- Description:
- DDR SRAM, 1MX36, 0.45NS
- Quantity:
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Inventory:368
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Product details
Overview
UPD46364365BF1-E40-EQ1-A from NEC Electronics (now Renesas) is a 1,048,576-word × 36-bit synchronous double data rate static RAM with HSTL interface, 4.0 ns clock cycle time (250 MHz), 1.8 V core supply, and 165-pin plastic BGA (13 × 15) packaging. It delivers pipelined DDR read/write operations per cycle for high-bandwidth buffering in network packet processors and FPGA co-processor memory subsystems.
For engineers reviewing the UPD46364365BF1-E40-EQ1-A datasheet, UPD46364365BF1-E40-EQ1-A pinout, UPD46364365BF1-E40-EQ1-A application, or UPD46364365BF1-E40-EQ1-A equivalent, key selection considerations include its 2-word burst architecture, separate I/O ports, user-programmable output impedance (35–70 Ω), echo clock (CQ/CQ#) timing alignment, and JTAG 1149.1 test port support.
Technical Context
This DDR II SRAM uses full-CMOS six-transistor memory cells and integrates a PLL-based timing engine that locks to K/K# input clocks to widen the output data valid window and enable future frequency scaling. Its dual-clock architecture separates input registration (K/K#) from output timing (C/C# or K/K#), allowing precise flight-time matching between clock and data paths.
The device implements synchronous load (LD#) control to define address and R/W direction per burst, supports byte-write masking via BW0#–BW3#, and features internally self-timed write control with clock-stop capability (20 μs recovery). All I/Os conform to JEDEC HSTL Class I standards with VREF-referenced inputs and programmable output termination via ZQ calibration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 1,048,576 words × 36 bits (36 Mbit total density) |
| Clock Cycle Time | 4.0 ns - enables 250 MHz DDR operation with guaranteed timing margins at TA = 0–70°C |
| Core Supply Voltage | 1.8 V ± 0.1 V - requires tight regulation; VDDQ must not exceed VDD during operation |
| I/O Interface | HSTL Class I - compatible with 1.5 V or 1.8 V VDDQ; uses VREF = VDDQ/2 reference |
| Package | 165-pin plastic BGA (13 × 15 mm) - thermal resistance θja = 16.5°C/W (4-layer board, still air) |
| Burst Mode | 2-word burst per clock cycle - reduces bus transaction overhead and simplifies controller logic |
| Output Impedance | User-programmable 35–70 Ω via ZQ pin - enables on-die termination matching to system trace impedance |
Pinout & Package
165-pin plastic BGA (13 × 15 mm), top view, with index mark per package dimensions. Ball pitch: 0.8 mm. Thermal pad: none. RoHS-compliant lead-free finish (per EQ1-A suffix).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| K, K# | Input clock pair | Registers all address/control/data on rising edges; 180° phase relationship required for jitter control |
| C, C# | Output clock pair | Defines output data timing reference; can be tied HIGH to use K/K# instead |
| CQ, CQ# | Echo clock outputs | Tightly matched to Q outputs (±0.1 ns); used as data-valid indication independent of C/C# state |
| LD# | Synchronous load | Active-low signal defining burst address and R/W direction; initiates 2-word transaction sequence |
| R, W# | Read/write control | High = read, low = write; sampled only when LD# is asserted |
| BW0#–BW3# | Byte write enables | Four active-low signals enabling 9-bit byte writes (D0–D8, D9–D17, D18–D26, D27–D35) |
| ZQ | Impedance calibration | Connect to external resistor to ground (175–350 Ω) to set Q/CQ/CQ# output impedance to 0.2×RQ |
| VREF | HSTL input reference | Nominally VDDQ/2; must be stable before clock application; supplies input buffer reference |
| TCK, TMS, TDI, TDO | JTAG 1149.1 port | 1.8 V I/O level; TCK must be tied to VSS if unused; no TRST pin |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined DDR operation | Enables concurrent read/write initiation each cycle without pipeline stalls, increasing effective bandwidth |
| Separate read/write data ports | Eliminates bus turnaround delay; supports simultaneous read and write access to different addresses |
| PLL-based timing engine | Widens output data valid window and supports scalable clock frequencies up to 300 MHz (E33 variant) |
| Programmable output impedance | Reduces signal integrity issues by matching trace impedance without external resistors on high-speed buses |
| Two-tick burst architecture | Minimizes command overhead and simplifies controller FSM design versus longer burst lengths |
| Clock-stop mode with fast restart | Enters low-power state within one cycle; resumes normal operation in ≤20 μs after clock resumption |
Applications
| Network Packet Buffering | FPGA Co-Processor Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and metadata in multi-gigabit Ethernet switches and routers. IC Role / Device Role / Timing Role: High-throughput, low-latency DDR II SRAM acting as first-level packet buffer with deterministic 250 MHz burst access. Use Value: 36-bit wide I/O and 2-word burst reduce memory transactions by 50% vs. 18-bit devices, lowering controller complexity and latency. | Use Scenario: Providing shared scratchpad memory between FPGA fabric and embedded soft-core processors (e.g., MicroBlaze, Nios II). IC Role / Device Role / Timing Role: Synchronous DDR II SRAM interfacing directly to FPGA I/O banks with HSTL-compatible signaling. Use Value: Separate read/write ports and echo clocks (CQ/CQ#) enable precise timing closure in FPGA-to-SRAM paths without manual skew compensation. |
| Baseband Signal Processing | Real-Time Video Frame Buffering |
Use Scenario: Temporary storage of channelized IQ samples in LTE/5G baseband processing units. IC Role / Device Role / Timing Role: Burst-mode DDR II SRAM synchronized to baseband clock domain for zero-wait-state sample buffering. Use Value: Clock-stop capability allows dynamic power gating during idle frames, reducing average power consumption by >30% in bursty traffic. | Use Scenario: Line-locked frame buffering in broadcast-grade video scalers and format converters operating at 1080p60. IC Role / Device Role / Timing Role: High-density, low-jitter DDR II SRAM delivering pixel data synchronized to video clock and sync signals. Use Value: User-programmable output impedance (35–70 Ω) ensures clean eye diagrams over long PCB traces to video DACs or serializers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1551KV18-400BZI | 1M × 18 organization, 400 MHz (2.5 ns), 1.8 V core, 165-pin FBGA - narrower data bus, faster clock | Requires depth expansion for 36-bit interfaces; higher speed may demand stricter layout controls | Select when system needs higher clock rate and can accommodate two parallel devices for 36-bit width |
| IS42S32800F-6BL | 2M × 32 SDRAM (not SRAM), 166 MHz, 3.3 V I/O, 86-pin TSOP - asynchronous refresh, lower density efficiency | Lacks true synchronous burst and echo clock; requires DRAM controller with refresh logic | Select only if cost sensitivity outweighs determinism requirements and system already supports SDRAM infrastructure |
Compared with CY7C1551KV18-400BZI and IS42S32800F-6BL, UPD46364365BF1-E40-EQ1-A provides native 36-bit width and deterministic DDR II SRAM timing without refresh overhead, making it optimal for latency-critical, burst-oriented buffering where bus efficiency and timing predictability are prioritized over raw peak bandwidth.
Availability
UPD46364365BF1-E40-EQ1-A is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor memory, baseband signal processing, and real-time video frame buffering requiring stable component supply across industrial temperature ranges (0°C to 70°C).
Supply support for UPD46364365BF1-E40-EQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation (formerly NEC Electronics) is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The μPD46364xxx DDR II SRAM product line was designed specifically for high-speed, low-latency buffering in communications infrastructure and programmable logic systems requiring deterministic burst access and HSTL-compatible signaling.
FAQ
What is the maximum guaranteed clock frequency for UPD46364365BF1-E40-EQ1-A?
The UPD46364365BF1-E40-EQ1-A is rated for a 4.0 ns clock cycle time, supporting guaranteed operation at 250 MHz across the full commercial temperature range (0°C to 70°C). This rating is validated per AC Characteristics Table on page 17 of R10DS0092EJ0400 Rev.4.00. Operation above 250 MHz requires the -E33 variant (3.3 ns, 300 MHz).
Does UPD46364365BF1-E40-EQ1-A require external termination resistors?
No. UPD46364365BF1-E40-EQ1-A supports on-die termination via the ZQ pin. Connecting ZQ to a precision resistor (175–350 Ω) to ground calibrates Q, CQ, and CQ# output impedance to 35–70 Ω, eliminating the need for external series or parallel termination resistors on data and echo clock lines.
How does the echo clock (CQ/CQ#) function in UPD46364365BF1-E40-EQ1-A?
The CQ and CQ# outputs in UPD46364365BF1-E40-EQ1-A are synchronous echo clocks tightly matched to data outputs (±0.1 ns variation). They provide a hardware-valid timing reference independent of C/C# state and remain active even when Q outputs are tristated, enabling robust data capture in high-speed receivers without relying solely on C/C#.
Can UPD46364365BF1-E40-EQ1-A operate without the PLL enabled?
Yes. Pulling DLL# low disables the PLL, allowing operation at reduced clock frequencies (<120 MHz) for debug or low-power modes. However, AC/DC characteristics are not guaranteed in this mode, and read latency changes to 1.0 clock cycle. For production operation, DLL# must be tied HIGH (e.g., to VDDQ via ≤10 kΩ resistor).
What is the purpose of the LD# (Load) signal in UPD46364365BF1-E40-EQ1-A?
The LD# signal in UPD46364365BF1-E40-EQ1-A is a synchronous load strobe that defines the start of each 2-word burst transaction. When asserted low, it latches the current address and R/W# state, initiating either a read or write burst. It replaces conventional address strobes and simplifies controller logic by embedding burst definition into a single control signal.
UPD46364365BF1-E40-EQ1-A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
UPD46364365BF1-E40-EQ1-A FAQ
1.How can I place an order for UPD46364365BF1-E40-EQ1-A through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD46364365BF1-E40-EQ1-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD46364365BF1-E40-EQ1-A reliable?
The price and inventory of UPD46364365BF1-E40-EQ1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD46364365BF1-E40-EQ1-A is usually 5 days.
3.What payment methods are accepted for UPD46364365BF1-E40-EQ1-A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD46364365BF1-E40-EQ1-A transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UPD46364365BF1-E40-EQ1-A?
UPD46364365BF1-E40-EQ1-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD46364365BF1-E40-EQ1-A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD46364365BF1-E40-EQ1-A?
For technical support, including UPD46364365BF1-E40-EQ1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD46364365BF1-E40-EQ1-A requirements.
6.How does Aetrix verify that UPD46364365BF1-E40-EQ1-A is sourced from the original manufacturer or authorized distributors?
All UPD46364365BF1-E40-EQ1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD46364365BF1-E40-EQ1-A meets industry standards.
7.What is the process for return or replacement of UPD46364365BF1-E40-EQ1-A?
All UPD46364365BF1-E40-EQ1-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD46364365BF1-E40-EQ1-A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD46364365BF1-E40-EQ1-A part is unused and in its original packaging.
Return procedure for UPD46364365BF1-E40-EQ1-A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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