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Renesas UPD46364365BF1-E40-EQ1-A

Part No.:
UPD46364365BF1-E40-EQ1-A
Manufacturer:
Renesas
Category:
Memory
Package:
-
Datasheet:
AetrixUPD46364365BF1-E40-EQ1-A.pdf
Description:
DDR SRAM, 1MX36, 0.45NS
Quantity:
Payment:
Payment
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Shipping

Inventory:368

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Product details

Overview

UPD46364365BF1-E40-EQ1-A from NEC Electronics (now Renesas) is a 1,048,576-word × 36-bit synchronous double data rate static RAM with HSTL interface, 4.0 ns clock cycle time (250 MHz), 1.8 V core supply, and 165-pin plastic BGA (13 × 15) packaging. It delivers pipelined DDR read/write operations per cycle for high-bandwidth buffering in network packet processors and FPGA co-processor memory subsystems.

For engineers reviewing the UPD46364365BF1-E40-EQ1-A datasheet, UPD46364365BF1-E40-EQ1-A pinout, UPD46364365BF1-E40-EQ1-A application, or UPD46364365BF1-E40-EQ1-A equivalent, key selection considerations include its 2-word burst architecture, separate I/O ports, user-programmable output impedance (35–70 Ω), echo clock (CQ/CQ#) timing alignment, and JTAG 1149.1 test port support.

Technical Context

This DDR II SRAM uses full-CMOS six-transistor memory cells and integrates a PLL-based timing engine that locks to K/K# input clocks to widen the output data valid window and enable future frequency scaling. Its dual-clock architecture separates input registration (K/K#) from output timing (C/C# or K/K#), allowing precise flight-time matching between clock and data paths.

The device implements synchronous load (LD#) control to define address and R/W direction per burst, supports byte-write masking via BW0#–BW3#, and features internally self-timed write control with clock-stop capability (20 μs recovery). All I/Os conform to JEDEC HSTL Class I standards with VREF-referenced inputs and programmable output termination via ZQ calibration.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization1,048,576 words × 36 bits (36 Mbit total density)
Clock Cycle Time4.0 ns - enables 250 MHz DDR operation with guaranteed timing margins at TA = 0–70°C
Core Supply Voltage1.8 V ± 0.1 V - requires tight regulation; VDDQ must not exceed VDD during operation
I/O InterfaceHSTL Class I - compatible with 1.5 V or 1.8 V VDDQ; uses VREF = VDDQ/2 reference
Package165-pin plastic BGA (13 × 15 mm) - thermal resistance θja = 16.5°C/W (4-layer board, still air)
Burst Mode2-word burst per clock cycle - reduces bus transaction overhead and simplifies controller logic
Output ImpedanceUser-programmable 35–70 Ω via ZQ pin - enables on-die termination matching to system trace impedance

Pinout & Package

165-pin plastic BGA (13 × 15 mm), top view, with index mark per package dimensions. Ball pitch: 0.8 mm. Thermal pad: none. RoHS-compliant lead-free finish (per EQ1-A suffix).

Pin/TerminalCircuit RoleDesign Meaning
K, K#Input clock pairRegisters all address/control/data on rising edges; 180° phase relationship required for jitter control
C, C#Output clock pairDefines output data timing reference; can be tied HIGH to use K/K# instead
CQ, CQ#Echo clock outputsTightly matched to Q outputs (±0.1 ns); used as data-valid indication independent of C/C# state
LD#Synchronous loadActive-low signal defining burst address and R/W direction; initiates 2-word transaction sequence
R, W#Read/write controlHigh = read, low = write; sampled only when LD# is asserted
BW0#–BW3#Byte write enablesFour active-low signals enabling 9-bit byte writes (D0–D8, D9–D17, D18–D26, D27–D35)
ZQImpedance calibrationConnect to external resistor to ground (175–350 Ω) to set Q/CQ/CQ# output impedance to 0.2×RQ
VREFHSTL input referenceNominally VDDQ/2; must be stable before clock application; supplies input buffer reference
TCK, TMS, TDI, TDOJTAG 1149.1 port1.8 V I/O level; TCK must be tied to VSS if unused; no TRST pin

Key Features

FeatureDesign Value
Pipelined DDR operationEnables concurrent read/write initiation each cycle without pipeline stalls, increasing effective bandwidth
Separate read/write data portsEliminates bus turnaround delay; supports simultaneous read and write access to different addresses
PLL-based timing engineWidens output data valid window and supports scalable clock frequencies up to 300 MHz (E33 variant)
Programmable output impedanceReduces signal integrity issues by matching trace impedance without external resistors on high-speed buses
Two-tick burst architectureMinimizes command overhead and simplifies controller FSM design versus longer burst lengths
Clock-stop mode with fast restartEnters low-power state within one cycle; resumes normal operation in ≤20 μs after clock resumption

Applications

Network Packet BufferingFPGA Co-Processor Memory

Use Scenario: Storing ingress/egress packet headers and metadata in multi-gigabit Ethernet switches and routers.

IC Role / Device Role / Timing Role: High-throughput, low-latency DDR II SRAM acting as first-level packet buffer with deterministic 250 MHz burst access.

Use Value: 36-bit wide I/O and 2-word burst reduce memory transactions by 50% vs. 18-bit devices, lowering controller complexity and latency.

Use Scenario: Providing shared scratchpad memory between FPGA fabric and embedded soft-core processors (e.g., MicroBlaze, Nios II).

IC Role / Device Role / Timing Role: Synchronous DDR II SRAM interfacing directly to FPGA I/O banks with HSTL-compatible signaling.

Use Value: Separate read/write ports and echo clocks (CQ/CQ#) enable precise timing closure in FPGA-to-SRAM paths without manual skew compensation.

Baseband Signal ProcessingReal-Time Video Frame Buffering

Use Scenario: Temporary storage of channelized IQ samples in LTE/5G baseband processing units.

IC Role / Device Role / Timing Role: Burst-mode DDR II SRAM synchronized to baseband clock domain for zero-wait-state sample buffering.

Use Value: Clock-stop capability allows dynamic power gating during idle frames, reducing average power consumption by >30% in bursty traffic.

Use Scenario: Line-locked frame buffering in broadcast-grade video scalers and format converters operating at 1080p60.

IC Role / Device Role / Timing Role: High-density, low-jitter DDR II SRAM delivering pixel data synchronized to video clock and sync signals.

Use Value: User-programmable output impedance (35–70 Ω) ensures clean eye diagrams over long PCB traces to video DACs or serializers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR II SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1551KV18-400BZI1M × 18 organization, 400 MHz (2.5 ns), 1.8 V core, 165-pin FBGA - narrower data bus, faster clockRequires depth expansion for 36-bit interfaces; higher speed may demand stricter layout controlsSelect when system needs higher clock rate and can accommodate two parallel devices for 36-bit width
IS42S32800F-6BL2M × 32 SDRAM (not SRAM), 166 MHz, 3.3 V I/O, 86-pin TSOP - asynchronous refresh, lower density efficiencyLacks true synchronous burst and echo clock; requires DRAM controller with refresh logicSelect only if cost sensitivity outweighs determinism requirements and system already supports SDRAM infrastructure

Compared with CY7C1551KV18-400BZI and IS42S32800F-6BL, UPD46364365BF1-E40-EQ1-A provides native 36-bit width and deterministic DDR II SRAM timing without refresh overhead, making it optimal for latency-critical, burst-oriented buffering where bus efficiency and timing predictability are prioritized over raw peak bandwidth.

Availability

UPD46364365BF1-E40-EQ1-A is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor memory, baseband signal processing, and real-time video frame buffering requiring stable component supply across industrial temperature ranges (0°C to 70°C).

Supply support for UPD46364365BF1-E40-EQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation (formerly NEC Electronics) is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The μPD46364xxx DDR II SRAM product line was designed specifically for high-speed, low-latency buffering in communications infrastructure and programmable logic systems requiring deterministic burst access and HSTL-compatible signaling.

FAQ

What is the maximum guaranteed clock frequency for UPD46364365BF1-E40-EQ1-A?

The UPD46364365BF1-E40-EQ1-A is rated for a 4.0 ns clock cycle time, supporting guaranteed operation at 250 MHz across the full commercial temperature range (0°C to 70°C). This rating is validated per AC Characteristics Table on page 17 of R10DS0092EJ0400 Rev.4.00. Operation above 250 MHz requires the -E33 variant (3.3 ns, 300 MHz).

Does UPD46364365BF1-E40-EQ1-A require external termination resistors?

No. UPD46364365BF1-E40-EQ1-A supports on-die termination via the ZQ pin. Connecting ZQ to a precision resistor (175–350 Ω) to ground calibrates Q, CQ, and CQ# output impedance to 35–70 Ω, eliminating the need for external series or parallel termination resistors on data and echo clock lines.

How does the echo clock (CQ/CQ#) function in UPD46364365BF1-E40-EQ1-A?

The CQ and CQ# outputs in UPD46364365BF1-E40-EQ1-A are synchronous echo clocks tightly matched to data outputs (±0.1 ns variation). They provide a hardware-valid timing reference independent of C/C# state and remain active even when Q outputs are tristated, enabling robust data capture in high-speed receivers without relying solely on C/C#.

Can UPD46364365BF1-E40-EQ1-A operate without the PLL enabled?

Yes. Pulling DLL# low disables the PLL, allowing operation at reduced clock frequencies (<120 MHz) for debug or low-power modes. However, AC/DC characteristics are not guaranteed in this mode, and read latency changes to 1.0 clock cycle. For production operation, DLL# must be tied HIGH (e.g., to VDDQ via ≤10 kΩ resistor).

What is the purpose of the LD# (Load) signal in UPD46364365BF1-E40-EQ1-A?

The LD# signal in UPD46364365BF1-E40-EQ1-A is a synchronous load strobe that defines the start of each 2-word burst transaction. When asserted low, it latches the current address and R/W# state, initiating either a read or write burst. It replaces conventional address strobes and simplifies controller logic by embedding burst definition into a single control signal.

UPD46364365BF1-E40-EQ1-A Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
-
Memory Format:
-
Technology:
-
Memory Size:
-
Memory Organization:
-
Memory Interface:
-
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

UPD46364365BF1-E40-EQ1-A FAQ

1.How can I place an order for UPD46364365BF1-E40-EQ1-A through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD46364365BF1-E40-EQ1-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD46364365BF1-E40-EQ1-A reliable?

The price and inventory of UPD46364365BF1-E40-EQ1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD46364365BF1-E40-EQ1-A is usually 5 days.

3.What payment methods are accepted for UPD46364365BF1-E40-EQ1-A?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD46364365BF1-E40-EQ1-A transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UPD46364365BF1-E40-EQ1-A?

UPD46364365BF1-E40-EQ1-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD46364365BF1-E40-EQ1-A order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD46364365BF1-E40-EQ1-A?

For technical support, including UPD46364365BF1-E40-EQ1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD46364365BF1-E40-EQ1-A requirements.

6.How does Aetrix verify that UPD46364365BF1-E40-EQ1-A is sourced from the original manufacturer or authorized distributors?

All UPD46364365BF1-E40-EQ1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD46364365BF1-E40-EQ1-A meets industry standards.

7.What is the process for return or replacement of UPD46364365BF1-E40-EQ1-A?

All UPD46364365BF1-E40-EQ1-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD46364365BF1-E40-EQ1-A, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD46364365BF1-E40-EQ1-A part is unused and in its original packaging.

Return procedure for UPD46364365BF1-E40-EQ1-A:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

UPD46364365BF1-E40-EQ1-A Tags

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