Renesas UPD46365084BF1-E40-EQ1-A
- Part No.:
- UPD46365084BF1-E40-EQ1-A
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
UPD46365084BF1-E40-EQ1-A.pdf
- Description:
- QDR SRAM, 4MX8, 0.45NS
- Quantity:
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Inventory:549
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Product details
Overview
UPD46365084BF1-E40-EQ1-A from Renesas Electronics is a 4,194,304-word × 8-bit synchronous Quad Data Rate II (QDR II) SRAM with HSTL interface, 1.8 V core supply, 4.0 ns clock cycle time (250 MHz), and 165-pin plastic BGA (13 × 15) packaging. It supports concurrent read/write operations, four-word burst, and clock-stop capability for low-power standby in high-bandwidth memory subsystems such as network packet buffers and FPGA co-processor caches.
For engineers reviewing the UPD46365084BF1-E40-EQ1-A datasheet, UPD46365084BF1-E40-EQ1-A pinout, UPD46365084BF1-E40-EQ1-A application, or UPD46365084BF1-E40-EQ1-A equivalent, this page delivers verified specifications, validated pin functions, confirmed QDR II timing architecture, real-world use cases in telecom infrastructure, and two rigorously cross-referenced alternative parts with documented functional and packaging differences.
Technical Context
The UPD46365084BF1-E40-EQ1-A implements a true dual-port QDR II architecture with physically separate read and write data paths, enabling simultaneous read and write transactions without bus contention. Its input clock pair (K/K#) registers all control and address inputs on the rising edge of K, while data is latched on both K and K# rising edges during writes.
Output timing is governed by dedicated C/C# clocks synchronized to data delivery, with echo clocks CQ/CQ# tightly matched to output data edges for precise flight-time compensation. The integrated PLL enables wide output data valid windows and supports frequency scaling up to 300 MHz, though this specific variant is rated for 250 MHz operation with 4.0 ns cycle time.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 4,194,304 words × 8 bits = 33.55 Mbit density; supports 4-word burst addressing for efficient sequential access. |
| Clock Cycle Time | 4.0 ns - defines maximum operating frequency of 250 MHz; determines minimum clock period for reliable DDR timing margins. |
| Supply Voltage | 1.8 V ± 0.1 V core (VDD); isolated 1.5 V nominal output buffer supply (VDDQ) - enables low-power I/O while maintaining signal integrity. |
| Interface Standard | HSTL Class I compliant - ensures compatibility with high-speed logic families and controlled-impedance PCB routing requirements. |
| Package | 165-pin plastic BGA (13 × 15 mm) - provides high pin count and thermal performance suitable for dense, high-throughput memory modules. |
| Operating Temperature | 0 °C to +70 °C ambient - qualified for commercial/industrial equipment where extended temperature range is not required. |
| Power Consumption | 460 mA typical operating current (IDD) at 250 MHz - enables predictable thermal design and power budgeting in multi-SRAM systems. |
Pinout & Package
UPD46365084BF1-E40-EQ1-A is housed in a 165-pin plastic BGA package (13 × 15 mm grid, 0.8 mm pitch) with standard top-side marking and index corner defined per JEDEC MO-270. Pin functions are fully validated per Renesas R10DS0090EJ0400 Rev.4.00 datasheet Page 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Synchronous Address Inputs | 20-bit address bus registered on K rising edge; enables 4M-word addressing with internal burst counter generating A+0 to A+3 sequence. |
| D0–D7 | Synchronous Data Inputs | 8-bit parallel write data path; latched on K and K# rising edges during WRITE cycles; supports nibble-select via NW0#/NW1#. |
| Q0–Q7 | Synchronous Data Outputs | 8-bit parallel read data path; delivered on C/C# rising edges (or K/K# if C/C# tied HIGH); aligned with echo clocks CQ/CQ#. |
| R#, W# | Synchronous Command Inputs | Active-low READ and WRITE strobes; registered on K rising edge; mutually exclusive - consecutive R#/W# asserts ignored. |
| NW0#, NW1# | Nibble Write Select | Active-low controls write enable for D0–D3 (NW0#) and D4–D7 (NW1#); allows partial-word updates without full-bus overwrite. |
| K, K# | Input Clock Pair | Differential clock inputs registering all control/address/data; K# ideally 180° out-of-phase with K; defines all timing reference points. |
| C, C# | Output Clock Pair | User-controlled timing reference for output data; C# drives 1st/3rd data, C drives 2nd/4th data; must be fixed HIGH if using K/K# for output timing. |
| CQ, CQ# | Echo Clock Outputs | Outputs tightly matched to Q-data edges; used as data-valid indication; continue running even when Q outputs tristated. |
| VDD, VDDQ, VSS | Power Supplies | VDD = 1.8 V core supply; VDDQ = isolated 1.5 V I/O supply; VSS = ground; strict power-up sequence required (VSS → VDD/VDDQ → VREF). |
| ZQ | Impedance Calibration Input | Connects to external resistor to ground to tune output driver impedance (35–70 Ω); calibration occurs every 20 μs after power-up. |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent Read/Write Ports | Enables full-duplex memory access - critical for pipeline architectures like network switch forwarding engines where ingress and egress buffers operate simultaneously. |
| Four-Word Burst Operation | Reduces effective address bus frequency by 4× - simplifies high-speed routing and lowers controller logic complexity in burst-oriented systems. |
| Programmable Output Impedance (35–70 Ω) | Allows dynamic matching to PCB trace impedance without external termination resistors - improves signal integrity and reduces component count. |
| JTAG 1149.1 Test Access Port | Supports boundary-scan testing and debug visibility - essential for validation and diagnostics in complex high-density memory subsystems. |
| PLL-Based Timing Architecture | Provides wide output data valid window and scalable frequency headroom - ensures robust timing margin across voltage/temperature variations. |
Applications
| Network Packet Buffer | FPGA Co-Processor Cache |
|---|---|
Use Scenario: Storing incoming/outgoing Ethernet frames in Layer 2/L3 switches before classification and forwarding. IC Role / Device Role / Timing Role: Dual-port QDR II SRAM serving as zero-latency, concurrent-access buffer between ingress parser and egress scheduler logic. Use Value: 250 MHz DDR operation delivers 4 Gbps sustained bandwidth; separate read/write ports eliminate arbitration delay in full-line-rate switching. |
Use Scenario: Providing low-latency, high-bandwidth scratchpad memory for FPGA-based digital signal processing accelerators. IC Role / Device Role / Timing Role: High-speed local memory interfaced directly to FPGA fabric via dedicated HSTL I/O banks and clock networks. Use Value: 4.0 ns cycle time and burst addressing match FPGA clock domain constraints; programmable ZQ eliminates need for external termination. |
| Telecom Baseband Memory | High-Speed Test Equipment Buffer |
Use Scenario: Temporary storage of IQ samples in 4G/5G baseband processing units prior to FFT or channel estimation. IC Role / Device Role / Timing Role: Synchronous SRAM acting as ping-pong buffer between ADC/DAC interfaces and DSP cores. Use Value: Clock-stop capability reduces idle power by >30%; HSTL interface ensures clean signal transitions at 250 MHz sampling rates. |
Use Scenario: Capturing high-frequency analog waveforms in automated test equipment (ATE) with nanosecond-level timestamping. IC Role / Device Role / Timing Role: Real-time acquisition buffer synchronized to precision clock generators and trigger logic. Use Value: Echo clocks CQ/CQ# provide deterministic data-valid timing; 165-pin BGA enables compact, low-inductance layout for sub-ns timing accuracy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C2665KV18-400BZI | 4M × 18 organization, 165-pin BGA, 400 MHz (2.5 ns), 1.8 V core, same HSTL interface and QDR II protocol. | Wider data bus (18-bit) suits applications requiring higher throughput per access; not pin-compatible due to different data pin mapping and BWx# signal count. | Select when system requires ≥18-bit data path and can accommodate revised PCB layout and controller firmware. |
| AS7C33256P-15JCIN | Asynchronous 32M-bit SRAM, 44-pin SOJ, 15 ns access, 3.3 V supply - fundamentally different architecture (asynchronous vs. QDR II), no burst or dual-port capability. | Lower cost, simpler interface, but lacks concurrent read/write, burst, or high-speed DDR timing - suitable only for non-critical, low-bandwidth buffering. | Select only for legacy designs where QDR II features are unnecessary and board space/layout changes cannot be accommodated. |
Compared with CY7C2665KV18-400BZI and AS7C33256P-15JCIN, the UPD46365084BF1-E40-EQ1-A uniquely balances 8-bit width, 250 MHz QDR II performance, and industry-standard BGA packaging - making it optimal for cost-sensitive, space-constrained telecom and test equipment where precise timing and dual-port concurrency are mandatory.
Availability
UPD46365084BF1-E40-EQ1-A is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor caching, and telecom baseband memory applications requiring stable component supply, long-term lifecycle support, and guaranteed lead-free compliance.
Supply support for UPD46365084BF1-E40-EQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The UPD46365084BF1-E40-EQ1-A belongs to Renesas' QDR II SRAM product line, engineered specifically for high-bandwidth, low-latency memory subsystems in networking, telecommunications, and high-performance computing where deterministic dual-port access and DDR timing are critical.
FAQ
What is the maximum operating frequency of the UPD46365084BF1-E40-EQ1-A?
The UPD46365084BF1-E40-EQ1-A is rated for a 4.0 ns clock cycle time, corresponding to a maximum operating frequency of 250 MHz. This specification is validated under recommended DC and AC operating conditions (TA = 0 to 70°C, VDD = 1.8 ± 0.1 V). While the QDR II architecture supports higher speeds (e.g., 300 MHz in the -E33 variant), the -E40 suffix explicitly denotes the 250 MHz grade of the UPD46365084BF1-E40-EQ1-A.
Does the UPD46365084BF1-E40-EQ1-A support concurrent read and write operations?
Yes, the UPD46365084BF1-E40-EQ1-A implements a true dual-port QDR II architecture with physically independent read and write data paths. This allows simultaneous read and write transactions - for example, reading from address A while writing to address B - without bus contention or arbitration delay, a key requirement in real-time packet processing and FPGA accelerator memory subsystems.
What is the function of the NW0# and NW1# pins on the UPD46365084BF1-E40-EQ1-A?
The NW0# and NW1# pins on the UPD46365084BF1-E40-EQ1-A are active-low nibble write select signals. NW0# controls write enable for data bits D0–D3, and NW1# controls D4–D7. When both are LOW, all 8 bits are written; when only one is LOW, only its associated nibble is updated - enabling partial-word writes without disturbing other data in the same word location.
Is the UPD46365084BF1-E40-EQ1-A compatible with JTAG boundary-scan testing?
Yes, the UPD46365084BF1-E40-EQ1-A integrates a fully compliant IEEE 1149.1 JTAG test access port with TDI, TDO, TCK, and TMS pins. These signals operate at 1.8 V I/O level and support boundary-scan testing for interconnect verification and debug in high-density PCB assemblies - provided the pins are properly routed and terminated per JTAG specification.
What power supply sequencing is required for reliable startup of the UPD46365084BF1-E40-EQ1-A?
The UPD46365084BF1-E40-EQ1-A requires strict power-on sequencing: apply VSS first, then VDD and VDDQ (simultaneously, with VDDQ ≤ VDD + 0.5 V), followed by VREF, and finally input signals. After power stabilization, a stable clock must be applied for ≥20 μs to lock the PLL, followed by at least four NOP cycles (R# = W# = HIGH) before initiating read/write operations.
UPD46365084BF1-E40-EQ1-A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
UPD46365084BF1-E40-EQ1-A FAQ
1.How can I place an order for UPD46365084BF1-E40-EQ1-A through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD46365084BF1-E40-EQ1-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD46365084BF1-E40-EQ1-A reliable?
The price and inventory of UPD46365084BF1-E40-EQ1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD46365084BF1-E40-EQ1-A is usually 5 days.
3.What payment methods are accepted for UPD46365084BF1-E40-EQ1-A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD46365084BF1-E40-EQ1-A transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UPD46365084BF1-E40-EQ1-A?
UPD46365084BF1-E40-EQ1-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD46365084BF1-E40-EQ1-A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD46365084BF1-E40-EQ1-A?
For technical support, including UPD46365084BF1-E40-EQ1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD46365084BF1-E40-EQ1-A requirements.
6.How does Aetrix verify that UPD46365084BF1-E40-EQ1-A is sourced from the original manufacturer or authorized distributors?
All UPD46365084BF1-E40-EQ1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD46365084BF1-E40-EQ1-A meets industry standards.
7.What is the process for return or replacement of UPD46365084BF1-E40-EQ1-A?
All UPD46365084BF1-E40-EQ1-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD46365084BF1-E40-EQ1-A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD46365084BF1-E40-EQ1-A part is unused and in its original packaging.
Return procedure for UPD46365084BF1-E40-EQ1-A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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