Renesas UPD46365094BF1-E33-EQ1-A
- Part No.:
- UPD46365094BF1-E33-EQ1-A
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
UPD46365094BF1-E33-EQ1-A.pdf
- Description:
- QDR SRAM, 4MX9, 0.45NS
- Quantity:
- Payment:

- Shipping:

Inventory:1,084
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
UPD46365094BF1-E33-EQ1-A from Renesas Electronics is a 4,194,304-word × 9-bit synchronous quad data rate (QDR II) SRAM with 3.3 ns clock cycle time (300 MHz), 1.8 V core supply, HSTL interface, and 165-pin plastic BGA (13 × 15) packaging. It delivers concurrent read/write operations, four-word burst access, and PLL-based output timing control for high-bandwidth networking buffers and packet memory applications.
For engineers reviewing the UPD46365094BF1-E33-EQ1-A datasheet, UPD46365094BF1-E33-EQ1-A pinout, UPD46365094BF1-E33-EQ1-A application, or UPD46365094BF1-E33-EQ1-A equivalent, key selection considerations include its 4M × 9 organization, HSTL I/O compliance, DLL#-controlled PLL enable/disable, user-programmable output impedance (35–70 Ω), and support for independent read/write ports with echo clocks CQ/CQ#.
Technical Context
This QDR II SRAM uses dual-clock architecture: K/K# registers address/control on rising edges and latches input data across both edges, while C/C# govern output timing-enabling precise flight-time matching between clock and data. Its internal burst counter and address register support fixed four-word sequential access without external address incrementing.
The device integrates a PLL for wide output data valid window and frequency scalability, supports clock-stop mode with 20 μs recovery, and implements byte-write control via BW0# to manage all nine data bits. All I/Os comply with JEDEC HSTL Class I standards and use VREF = VDDQ/2 for input threshold referencing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 4,194,304 words × 9 bits - provides 36 Mbit density with parity bit support for error detection in mission-critical buffers |
| Clock Cycle Time | 3.3 ns - enables 300 MHz operation for high-throughput packet processing in switch fabric and line cards |
| Supply Voltage | 1.8 ± 0.1 V (VDD), 1.4–1.8 V (VDDQ) - low-voltage operation reduces power in thermally constrained systems |
| Interface Standard | HSTL Class I - ensures signal integrity at high speeds with controlled-impedance outputs and VREF-referenced inputs |
| Burst Length | 4-word - reduces address bus frequency by 75% versus single-word access, simplifying controller design |
| Output Impedance | User-programmable 35–70 Ω - allows dynamic tuning to match PCB trace impedance without external termination resistors |
| Operating Temperature | 0 °C to +70 °C - qualified for commercial-grade telecom and industrial embedded applications |
Pinout & Package
UPD46365094BF1-E33-EQ1-A is housed in a 165-pin plastic BGA package (13 × 15 mm, ball pitch 0.8 mm), lead-free compliant, with thermal pad exposed on underside for enhanced heat dissipation in high-power-density designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A[0–19] | Synchronous Address Input | 20-bit address bus registered on K rising edge; enables 4M-word addressing with internal LSBs for burst sequencing |
| D0–D8 | Synchronous Data Input | 9-bit parallel write data path; sampled on both K and K# rising edges during WRITE cycles |
| Q0–Q8 | Synchronous Data Output | 9-bit parallel read data path; synchronized to C/C# rising edges (or K/K# if C/C# tied HIGH) |
| R#, W# | Read/Write Command | Active-low, edge-triggered controls; R# initiates burst read, W# initiates burst write; both ignored when HIGH (NOP) |
| BW0# | Byte Write Enable | Active-low control for full 9-bit write; LOW enables D0–D8 write, HIGH disables all data writes during burst |
| K, K# | Input Clock Pair | Differential input clock; registers address/control on K↑, data on K↑ and K#↑; requires <180° phase alignment |
| C, C# | Output Clock Pair | Differential output clock; defines data valid timing window; C#↑ clocks first/third outputs, C↑ clocks second/fourth |
| CQ, CQ# | Echo Clock Output | Tightly matched to Q outputs; provides data-valid indication independent of C/C# state; continues running during tristate |
| VDD, VDDQ, VSS | Power/Ground | VDD (1.8 V core), VDDQ (1.5–1.8 V I/O), VSS (ground); separate supplies isolate noise-sensitive analog PLL and digital I/O paths |
| VREF | HSTL Reference | Nominally VDDQ/2; sets input switching threshold for all address, control, and data inputs |
| ZQ | Impedance Calibration | Connect to external resistor to ground (RQ); calibrates Q/CQ/CQ# output impedance to 0.2 × RQ every 20 μs |
| DLL# | PLL Disable | LOW disables PLL for low-frequency debug; HIGH required for normal 300 MHz operation with guaranteed AC specs |
| TMS, TDI, TCK, TDO | JTAG Interface | IEEE 1149.1 test port; supports boundary-scan testing and device identification; operates at 1.8 V I/O level |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent Read/Write Ports | Independent address/data paths allow simultaneous burst read and write transactions-critical for full-duplex packet buffering |
| Four-Tick Burst Operation | Fixed 4-word sequential access eliminates external address generation logic and reduces controller complexity |
| PLL-Based Output Timing | Integrated PLL widens data valid window and enables future frequency scaling beyond 300 MHz without board redesign |
| Programmable Output Impedance | 35–70 Ω range allows real-time impedance matching to PCB traces-reducing reflections and improving signal integrity |
| Clock-Stop Capability | Enters low-power state with 20 μs recovery; supports dynamic power gating in burst-oriented traffic patterns |
| HSTL Class I Compliance | Meets JEDEC JESD8-6 specification for 1.5 V I/O; ensures interoperability with FPGA and ASIC memory controllers |
Applications
| High-Speed Network Switch Buffer | Telecom Line Card Packet Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet switches with non-blocking fabric. IC Role / Device Role / Timing Role: Acts as dual-port buffer memory with concurrent read/write access; echo clocks CQ/CQ# align data valid windows to receiving PHY/FPGA. Use Value: 300 MHz operation and 4-word burst deliver 10.8 GB/s effective bandwidth-meeting 40G/100G line-rate requirements. | Use Scenario: Holding ATM cell payloads and control metadata in OC-192/STM-64 SONET/SDH line interface units. IC Role / Device Role / Timing Role: Serves as QDR II packet memory interfacing to TI C64x+ DSP or Xilinx Virtex-5; uses C/C# for precise clock-data skew compensation. Use Value: HSTL I/O and programmable impedance ensure clean signal integrity over 10+ inch backplane traces at 300 MHz. |
| Baseband Processing Memory | Industrial Real-Time Control Buffer |
Use Scenario: Acting as shared memory between transmit/receive chains in LTE eNodeB baseband units with FPGA-based channel processors. IC Role / Device Role / Timing Role: Provides low-latency, deterministic-access memory for FFT/IFFT buffers and channel estimation tables; DLL# enables PLL bypass during system bring-up. Use Value: 3.3 ns cycle time and concurrent ports reduce memory arbitration latency-improving OFDM symbol processing throughput. | Use Scenario: Buffering sensor fusion data streams (IMU, GPS, camera) in autonomous vehicle domain controllers requiring deterministic response. IC Role / Device Role / Timing Role: Functions as time-critical FIFO memory between safety-critical MCU and high-speed ADC/DAC; clock-stop mode cuts standby current to 390 mA. Use Value: 0–70°C temperature rating and robust power-on sequence ensure reliable operation in automotive under-hood environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C2665KV18 | 4M × 18 organization, 250 MHz max (4.0 ns), same 165-pin BGA but different pinout; no ZQ calibration | Requires depth expansion for 9-bit parity support; lacks programmable impedance and echo clocks | Select when wider data bus needed and lower speed acceptable; verify layout compatibility due to pinout mismatch |
| AS7C36256A | 4M × 9, 200 MHz (5.0 ns), 3.3 V core, TSOP-II package; asynchronous interface, no burst or PLL | Not QDR-compatible; unsuitable for high-speed burst applications; requires full address bus and external timing control | Choose only for cost-sensitive, low-bandwidth legacy systems where QDR features are unnecessary |
Compared with CY7C2665KV18 and AS7C36256A, UPD46365094BF1-E33-EQ1-A uniquely combines 300 MHz QDR II performance, 9-bit parity-ready organization, on-die impedance tuning, and echo clock support-making it optimal for next-generation packet memory where timing precision and bandwidth density are critical.
Availability
UPD46365094BF1-E33-EQ1-A is available at Aetrix Electronics and suitable for high-speed network switch buffers, telecom line card packet memory, and baseband processing memory requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for UPD46365094BF1-E33-EQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, infrastructure, and IoT applications.
The UPD46365094BF1-E33-EQ1-A belongs to Renesas' QDR II SRAM product line, engineered specifically for high-bandwidth, low-latency packet buffering in networking and communications equipment where deterministic burst access and precise timing control are essential.
FAQ
What is the memory organization and total capacity of UPD46365094BF1-E33-EQ1-A?
UPD46365094BF1-E33-EQ1-A has a 4,194,304-word × 9-bit organization, delivering 36 Mbit (4.5 Mbyte) of synchronous static RAM. The 9-bit width supports 8-bit data plus 1-bit parity for error detection in mission-critical networking applications. This configuration is distinct from the x8, x18, and x36 variants in the same family.
Does UPD46365094BF1-E33-EQ1-A support concurrent read and write operations?
Yes, UPD46365094BF1-E33-EQ1-A supports true concurrent read and write operations through independent address and data paths. During a burst cycle, it can accept a new write command while delivering read data from a prior request-enabling full-duplex packet buffering without arbitration delay. This capability is confirmed in the block diagram and truth table of the official datasheet.
What is the function of the CQ and CQ# pins on UPD46365094BF1-E33-EQ1-A?
The CQ and CQ# pins on UPD46365094BF1-E33-EQ1-A are synchronous echo clock outputs tightly matched to the Q0–Q8 data outputs. They provide a hardware-accurate data-valid indication for the receiving controller, enabling precise setup/hold margin verification. Unlike C/C#, CQ/CQ# continue running even when outputs are tristated, supporting robust timing analysis in high-speed systems.
How does the ZQ pin affect output impedance calibration on UPD46365094BF1-E33-EQ1-A?
The ZQ pin on UPD46365094BF1-E33-EQ1-A connects to an external resistor (RQ) to ground, allowing automatic calibration of Q, CQ, and CQ# output impedance to 0.2 × RQ. Calibration occurs every 20 μs after power-up to compensate for voltage/temperature drift. Direct connection to VDDQ minimizes impedance; grounding or leaving ZQ floating is prohibited per datasheet specifications.
Can UPD46365094BF1-E33-EQ1-A operate without the PLL enabled?
Yes, UPD46365094BF1-E33-EQ1-A can operate with the PLL disabled by holding DLL# LOW, enabling low-frequency debugging below 120 MHz. However, AC/DC electrical characteristics are not guaranteed in this mode. For full-spec 300 MHz operation-including timing margins and jitter tolerance-DLL# must be held HIGH (typically tied to VDDQ via ≤10 kΩ resistor) to activate the PLL.
UPD46365094BF1-E33-EQ1-A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
UPD46365094BF1-E33-EQ1-A FAQ
1.How can I place an order for UPD46365094BF1-E33-EQ1-A through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD46365094BF1-E33-EQ1-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD46365094BF1-E33-EQ1-A reliable?
The price and inventory of UPD46365094BF1-E33-EQ1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD46365094BF1-E33-EQ1-A is usually 5 days.
3.What payment methods are accepted for UPD46365094BF1-E33-EQ1-A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD46365094BF1-E33-EQ1-A transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UPD46365094BF1-E33-EQ1-A?
UPD46365094BF1-E33-EQ1-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD46365094BF1-E33-EQ1-A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD46365094BF1-E33-EQ1-A?
For technical support, including UPD46365094BF1-E33-EQ1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD46365094BF1-E33-EQ1-A requirements.
6.How does Aetrix verify that UPD46365094BF1-E33-EQ1-A is sourced from the original manufacturer or authorized distributors?
All UPD46365094BF1-E33-EQ1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD46365094BF1-E33-EQ1-A meets industry standards.
7.What is the process for return or replacement of UPD46365094BF1-E33-EQ1-A?
All UPD46365094BF1-E33-EQ1-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD46365094BF1-E33-EQ1-A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD46365094BF1-E33-EQ1-A part is unused and in its original packaging.
Return procedure for UPD46365094BF1-E33-EQ1-A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
UPD46365094BF1-E33-EQ1-A Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

