Renesas UPD46365182BF1-E40-EQ1-A
- Part No.:
- UPD46365182BF1-E40-EQ1-A
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
UPD46365182BF1-E40-EQ1-A.pdf
- Description:
- QDR SRAM, 2MX18, 0.45NS
- Quantity:
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Inventory:878
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Product details
Overview
UPD46365182BF1-E40-EQ1-A from Renesas Electronics is a 2,097,152-word × 18-bit synchronous quad data rate (QDR II) SRAM with 4.0 ns clock cycle time (250 MHz), 1.8 V core supply, HSTL interface, and 165-pin plastic BGA (13 × 15) package. It supports concurrent read/write operations, burst-2 DDR transactions, and is used in high-speed networking buffers and packet-forwarding engines.
For engineers reviewing the UPD46365182BF1-E40-EQ1-A datasheet, UPD46365182BF1-E40-EQ1-A pinout, UPD46365182BF1-E40-EQ1-A application, or UPD46365182BF1-E40-EQ1-A equivalent, key selection considerations include its 2M × 18 organization, 250 MHz QDR-II timing, dual-clock (K/K# and C/C#) architecture, HSTL I/O compliance, and user-programmable output impedance (35–70 Ω).
Technical Context
This QDR II SRAM employs separate read and write data ports with independent address latching on K (read) and K# (write) rising edges. Its internal PLL enables wide output data valid window and supports future frequency scaling up to 300 MHz.
The device delivers synchronized output data aligned to C/C# rising edges (or K/K# if C/C# are tied HIGH), includes echo clocks (CQ/CQ#) tightly matched to data for precise timing validation, and features JTAG 1149.1 test access for boundary-scan verification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 2,097,152 words × 18 bits - provides 36 Mbit density optimized for 18-bit datapath systems like network switch ASIC interfaces. |
| Clock Cycle Time | 4.0 ns - supports 250 MHz operation with guaranteed timing margins per JEDEC QDR-II spec. |
| Supply Voltage | 1.8 V ± 0.1 V core (VDD); 1.4–1.8 V I/O (VDDQ) - enables low-power, high-speed operation compatible with 1.8 V logic families. |
| I/O Interface | HSTL Class I - ensures signal integrity at 250 MHz with controlled impedance and tight AC timing. |
| Package | 165-pin plastic BGA (13 × 15 mm) - standard footprint for high-density PCB layouts in telecom and storage applications. |
| Burst Operation | 2-word burst - delivers two consecutive data words per clock cycle, achieving 100% bus utilization in DDR read/write. |
| Output Impedance | User-programmable 35–70 Ω via ZQ pin - allows dynamic matching to system trace impedance without external termination resistors. |
Pinout & Package
Package: 165-pin plastic BGA (13 × 15 mm), RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Synchronous Address Input | 20-bit address registered on K rising edge for READ, K# rising edge for WRITE; supports 2M-word addressing. |
| D0–D17 | Synchronous Data Input | 18-bit parallel input latched on K and K# rising edges during WRITE cycles. |
| Q0–Q17 | Synchronous Data Output | 18-bit parallel output synchronized to C/C# rising edges (or K/K# if C/C# = HIGH). |
| R#, W# | Read/Write Control | Active-low commands initiating burst-2 READ or WRITE; both high = NOP (high-Z outputs). |
| K, K# | Input Clock Pair | Differential input clocks; K rising edge latches READ address/control, K# rising edge latches WRITE address/data. |
| C, C# | Output Clock Pair | User-controlled timing reference for output data; C# rising edge clocks first word, C rising edge clocks second word. |
| CQ, CQ# | Echo Clock Output | Output-aligned clocks tightly matched to Q outputs (±0.1 ns variation), used for data valid window detection. |
| ZQ | Impedance Calibration Input | Connects to external resistor to ground to set output driver impedance (0.2 × RQ); enables on-die termination tuning. |
| DLL# | PLL Disable | Active-low input disabling internal PLL; used for debug at sub-120 MHz frequencies (RL = 1 cycle, AC specs not guaranteed). |
| VREF | HSTL Reference | Nominally VDDQ/2 reference for HSTL input buffers; must be stable before clock application. |
| TMS, TDI, TCK, TDO | JTAG Test Interface | IEEE 1149.1 compliant boundary-scan port operating at 1.8 V I/O level. |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent Read/Write Ports | Independent address/data paths enable simultaneous memory access-critical for full-duplex packet buffering in switch fabric designs. |
| Two-Tick Burst Operation | Delivers two data words per clock cycle with no dead cycles, maximizing bandwidth efficiency in DDR protocols. |
| Programmable Output Impedance | On-die termination calibrated via ZQ pin eliminates need for external series resistors and reduces layout complexity. |
| PLL-Based Timing Margin Enhancement | Internal PLL widens data valid window and supports scalable clock frequencies up to 300 MHz without redesign. |
| Clock-Stop Capability | Enters low-power state when clocks halt; resumes normal operation within 20 μs after clock restart-enables dynamic power gating. |
| HSTL Class I Compliance | Meets JEDEC JESD8-6 specification for 1.8 V I/O, ensuring signal integrity and interoperability with FPGA/ASIC memory controllers. |
Applications
| Network Packet Buffer | High-Speed Switch Fabric |
|---|---|
Use Scenario: Temporary storage of variable-length Ethernet frames in line-rate forwarding engines. IC Role / Device Role / Timing Role: Dual-port QDR II SRAM serving as ingress/egress buffer with zero-latency concurrent access. Use Value: 250 MHz burst-2 operation delivers 9 Gbps sustained bandwidth, eliminating bottlenecks in 10G+ switch ASIC data paths. | Use Scenario: Shared memory for crossbar arbitration and cell-based switching in multi-gigabit routers. IC Role / Device Role / Timing Role: High-density, low-latency memory providing deterministic read/write timing for traffic shaping logic. Use Value: HSTL I/O and echo clocks (CQ/CQ#) enable sub-nanosecond timing closure in 13×15 mm BGA layout. |
| Telecom Line Card Cache | Storage Controller FIFO |
Use Scenario: Real-time caching of SONET/SDH overhead bytes and payload descriptors in optical transport modules. IC Role / Device Role / Timing Role: Synchronous SRAM acting as descriptor cache with burst-2 reads aligned to frame boundaries. Use Value: 4.0 ns cycle time and clock-stop support reduce power by >40% during idle periods without sacrificing latency. | Use Scenario: Command queue between host processor and NVMe/SAS controller in enterprise SSDs. IC Role / Device Role / Timing Role: Low-jitter, high-throughput buffer decoupling asynchronous host writes from serialized flash access. Use Value: Separate read/write ports and 18-bit width match common storage command structures, minimizing glue logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C2665KV18-400BZI | 400 MHz (2.5 ns), 2M × 18, same 165-pin BGA but Cypress-specific pinout and VDDQ range (1.4–1.6 V) | Higher speed grade; requires tighter layout control for 400 MHz timing closure | Select for bandwidth-critical designs needing >250 MHz operation; verify clock tree skew and VDDQ regulation. |
| IS42S16160F-6BL | Synchronous DRAM (SDRAM), not QDR; 16M × 16, 166 MHz, different command protocol and burst length | Lacks concurrent read/write; requires refresh and more complex controller logic | Consider only if cost sensitivity outweighs performance-requires full controller redesign and sacrifices deterministic latency. |
Compared with CY7C2665KV18-400BZI, UPD46365182BF1-E40-EQ1-A offers lower power at 250 MHz and broader VDDQ tolerance, while IS42S16160F-6BL lacks true QDR architecture and cannot support simultaneous access-making UPD46365182BF1-E40-EQ1-A the optimal choice for deterministic, high-throughput buffering.
Availability
UPD46365182BF1-E40-EQ1-A is available at Aetrix Electronics and suitable for high-speed networking equipment, telecom infrastructure, and storage controller designs requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for UPD46365182BF1-E40-EQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.
The UPD46365182BF1-E40-EQ1-A belongs to Renesas' QDR II SRAM product line, engineered specifically for deterministic, low-latency, high-bandwidth buffering in packet-switched networks and real-time data path applications.
FAQ
What is the maximum operating frequency supported by UPD46365182BF1-E40-EQ1-A?
The UPD46365182BF1-E40-EQ1-A is rated for 250 MHz operation with a 4.0 ns clock cycle time. While its QDR II architecture supports up to 300 MHz (3.3 ns) in the -E33 variant, the -E40 suffix confirms this specific part is characterized and guaranteed for 250 MHz across 0°C to 70°C ambient temperature.
Does UPD46365182BF1-E40-EQ1-A support concurrent read and write operations?
Yes, UPD46365182BF1-E40-EQ1-A features fully independent read and write data ports. It can execute a READ transaction on one port while simultaneously performing a WRITE on the other, enabling true full-duplex memory access essential for switch fabric and packet buffer applications.
How is output impedance calibrated on UPD46365182BF1-E40-EQ1-A?
Output impedance calibration on UPD46365182BF1-E40-EQ1-A is performed via the ZQ pin. A resistor (RQ) is connected from ZQ to ground; the device sets Q, CQ, and CQ# output impedance to 0.2 × RQ. The calibration runs automatically every 20 μs after power-up to compensate for voltage and temperature drift.
What happens when DLL# is pulled LOW on UPD46365182BF1-E40-EQ1-A?
When DLL# is pulled LOW, the internal PLL is disabled, allowing operation at clock frequencies below 120 MHz. However, AC/DC electrical characteristics are not guaranteed, and read latency changes from 2.0 to 1.0 clock cycles. This mode is intended solely for board-level debug-not production use.
Can UPD46365182BF1-E40-EQ1-A be used with a single-ended clock source?
No-UPD46365182BF1-E40-EQ1-A requires differential clock pairs: K/K# for input registration and C/C# for output timing. Single-ended drive violates setup/hold timing and may cause metastability. The device expects 180° phase alignment between each pair, with strict jitter limits (TKC var ≤ 0.2 ns).
UPD46365182BF1-E40-EQ1-A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
UPD46365182BF1-E40-EQ1-A FAQ
1.How can I place an order for UPD46365182BF1-E40-EQ1-A through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD46365182BF1-E40-EQ1-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD46365182BF1-E40-EQ1-A reliable?
The price and inventory of UPD46365182BF1-E40-EQ1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD46365182BF1-E40-EQ1-A is usually 5 days.
3.What payment methods are accepted for UPD46365182BF1-E40-EQ1-A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD46365182BF1-E40-EQ1-A transactions.
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4.How is shipping managed for UPD46365182BF1-E40-EQ1-A?
UPD46365182BF1-E40-EQ1-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD46365182BF1-E40-EQ1-A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD46365182BF1-E40-EQ1-A?
For technical support, including UPD46365182BF1-E40-EQ1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD46365182BF1-E40-EQ1-A requirements.
6.How does Aetrix verify that UPD46365182BF1-E40-EQ1-A is sourced from the original manufacturer or authorized distributors?
All UPD46365182BF1-E40-EQ1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD46365182BF1-E40-EQ1-A meets industry standards.
7.What is the process for return or replacement of UPD46365182BF1-E40-EQ1-A?
All UPD46365182BF1-E40-EQ1-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD46365182BF1-E40-EQ1-A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD46365182BF1-E40-EQ1-A part is unused and in its original packaging.
Return procedure for UPD46365182BF1-E40-EQ1-A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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