Renesas UPD46365184BF1-E33-EQ1-A
- Part No.:
- UPD46365184BF1-E33-EQ1-A
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
UPD46365184BF1-E33-EQ1-A.pdf
- Description:
- QDR SRAM, 2MX18, 0.45NS
- Quantity:
- Payment:

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Inventory:795
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Product details
Overview
UPD46365184BF1-E33-EQ1-A from Renesas Electronics is a 2,097,152-word × 18-bit synchronous quad data rate (QDR II) SRAM with 1.8 V core supply, 3.3 ns clock cycle time (300 MHz), HSTL interface, and 165-pin plastic BGA (13 × 15) packaging. It supports concurrent read/write operations, four-word burst access, and PLL-based output timing control for high-speed networking buffers and packet memory applications.
For engineers reviewing the UPD46365184BF1-E33-EQ1-A datasheet, UPD46365184BF1-E33-EQ1-A pinout, UPD46365184BF1-E33-EQ1-A application, or UPD46365184BF1-E33-EQ1-A equivalent, key selection criteria include burst-mode DDR timing compliance, HSTL Class I I/O compatibility, 18-bit wide data path for SerDes interface buffering, and 165-ball BGA footprint alignment with QDR-II layout guidelines.
Technical Context
This QDR II SRAM uses dual-clock architecture: K/K# registers address/control/data on rising edges, while C/C# governs output data timing with echo clocks CQ/CQ# tightly matched to data valid windows. Its internal burst counter and separate read/write ports enable true concurrent transactions without arbitration overhead.
The device integrates a PLL for jitter-tolerant operation down to 120 MHz, user-programmable output impedance (35–70 Ω via ZQ pin), and clock-stop capability with 20 μs recovery. All I/Os comply with JEDEC HSTL Class I standards, and JTAG 1149.1 test access supports boundary-scan validation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Organization | 2,097,152 words × 18 bits - provides 36 Mbit density optimized for 18-bit SerDes or parallel bus interfaces requiring balanced width and speed. |
| Clock cycle time | 3.3 ns - enables 300 MHz DDR operation with 600 MT/s effective throughput per data line. |
| Supply voltage | 1.8 ± 0.1 V core (VDD), 1.4–1.8 V I/O (VDDQ) - mandates tight regulation and sequencing per power-on requirements. |
| Interface standard | HSTL Class I - ensures signal integrity at 300 MHz with controlled-impedance routing and termination matching. |
| Package | 165-pin plastic BGA (13 × 15 mm) - requires 0.8 mm pitch layout and thermal via design per Renesas QDR-II PCB guidelines. |
| Burst length | 4-word burst - reduces address bus frequency by 4× versus single-word access, simplifying controller logic. |
| Operating temperature | 0 °C to +70 °C - qualified for commercial/industrial ambient environments without derating. |
Pinout & Package
Package: 165-pin plastic BGA (13 × 15 mm), ball pitch 0.8 mm, lead-free finish. Thermal pad not present; mechanical mounting per JEDEC MO-270AB.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Synchronous address inputs | 19-bit address bus registered on K rising edge; supports 2M-word addressing with internal LSBs for burst sequence. |
| D0–D17 | Synchronous data inputs | 18-bit write data path registered on K and K# rising edges; two-edge sampling enables full DDR bandwidth utilization. |
| Q0–Q17 | Synchronous data outputs | 18-bit read data synchronized to C/C# rising edges; CQ/CQ# provide matched echo clocks for receiver capture timing. |
| R#, W# | Read/write command inputs | Active-low, registered on K rising edge; mutually exclusive-consecutive R#/W# asserts ignored per state machine rules. |
| BW0#, BW1# | Byte write select inputs | Enable selective 9-bit writes within 18-bit word; support partial updates without read-modify-write cycles. |
| K, K#, C, C#, CQ, CQ# | Clock and echo signals | K/K# drive input registration; C/C# control output timing; CQ/CQ# deliver data-valid strobes aligned to output data edges. |
| VDD, VDDQ, VSS, VREF, ZQ | Power and reference | VDD (1.8 V core), VDDQ (1.4–1.8 V I/O), VREF = VDDQ/2, ZQ tunes output impedance to system bus (175–350 Ω external resistor). |
| TMS, TDI, TCK, TDO | JTAG 1149.1 interface | 1.8 V I/O-level test access port; TCK must tie to VSS if unused; supports boundary-scan testing of interconnects. |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent read/write ports | Enables simultaneous memory access without arbitration delay-critical for full-duplex packet buffering in switches/routers. |
| Four-tick burst operation | Delivers 4 words per address cycle, reducing address bus frequency by 75% and easing controller timing closure. |
| User-programmable output impedance | ZQ pin adjusts Q/CQ/CQ# driver strength (35–70 Ω) to match PCB trace impedance-minimizes reflections at 300 MHz. |
| PLL-based output timing | Widens data valid window and supports future frequency scaling up to 300 MHz without external clock clean-up circuitry. |
| Clock-stop capability | Enters low-power state with 20 μs recovery-enables dynamic power gating during idle periods in burst-oriented traffic patterns. |
Applications
| High-Speed Network Switch Buffer | Telecom Line Card Packet Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payloads in Layer 2/L3 switching ASICs with strict latency budgets. IC Role / Device Role / Timing Role: Dual-port QDR II SRAM serving as shared buffer between ingress parser and egress scheduler, operating at 300 MHz DDR with concurrent reads/writes. Use Value: 18-bit width matches common SerDes lane groupings; 4-word burst delivers 72-bit chunks per cycle-matching typical packet header sizes and minimizing bus turns. | Use Scenario: Temporary storage of ATM cells or Ethernet frames in carrier-grade optical line cards with multi-gigabit backplane interfaces. IC Role / Device Role / Timing Role: High-bandwidth, low-latency memory for frame assembly/disassembly engines, synchronized to line-rate clocks via K/K# and C/C#. Use Value: HSTL Class I I/O ensures signal integrity across long traces; PLL tolerance to clock jitter maintains timing margin under variable backplane conditions. |
| Baseband Processor Shared Memory | FPGA-Based Protocol Accelerator |
Use Scenario: Inter-processor communication buffer between DSP cores and RF front-end controllers in 4G/LTE baseband units. IC Role / Device Role / Timing Role: Asymmetric memory resource providing dedicated 18-bit paths for control metadata (Q0–Q8) and payload data (Q9–Q17) with independent timing. Use Value: Separate R#/W# commands and byte-write BW0#/BW1# allow fine-grained updates-reducing power vs. full-word writes during control register manipulation. | Use Scenario: Offloading TCP/IP checksum, encryption, or packet classification tasks in FPGA-accelerated servers using external memory for lookup tables and context storage. IC Role / Device Role / Timing Role: High-throughput memory mapped to FPGA Avalon-MM or AXI interface, leveraging burst mode to sustain >4 GB/s sustained bandwidth. Use Value: JTAG 1149.1 support enables in-system verification of memory subsystem timing and interconnect integrity during FPGA firmware bring-up. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C2665KV18 | 2M × 18, 3.3 ns, 1.8 V, 165-pin BGA - identical organization and timing but Cypress-specific HSTL implementation and different ZQ calibration behavior. | Requires revalidation of output impedance tuning and PLL lock stability under same board-level noise conditions. | Select when existing Cypress QDR-II design reuse or qualification history is prioritized over Renesas-specific features like DLL# debug disable. |
| AS7C3620018B | 2M × 18, 4.0 ns, 250 MHz max, 1.8 V, 165-pin BGA - slower cycle time, no integrated PLL, fixed 50 Ω output drive. | Suitable only where 250 MHz bandwidth suffices and jitter-sensitive applications do not require PLL-based timing margin. | Choose for cost-sensitive designs where reduced performance headroom is acceptable and simplified power delivery (no VREF/ZQ tuning) is preferred. |
Compared with CY7C2665KV18 and AS7C3620018B, UPD46365184BF1-E33-EQ1-A delivers higher bandwidth (300 MHz vs. 250 MHz), programmable impedance for board-specific tuning, and PLL-based jitter tolerance-making it optimal for next-generation networking silicon interfacing.
Availability
UPD46365184BF1-E33-EQ1-A is available at Aetrix Electronics and suitable for high-speed network switch buffers, telecom line card packet memory, and FPGA-based protocol accelerators requiring stable component supply, long-term lifecycle support, and guaranteed lead-free compliance.
Supply support for UPD46365184BF1-E33-EQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor manufacturer specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.
The UPD46365184BF1-E33-EQ1-A belongs to Renesas' QDR II SRAM product line, engineered specifically for high-bandwidth, low-latency packet buffering in networking infrastructure equipment operating at OC-192/STM-64 line rates and beyond.
FAQ
What is the maximum guaranteed clock frequency for UPD46365184BF1-E33-EQ1-A?
The UPD46365184BF1-E33-EQ1-A is rated for a 3.3 ns clock cycle time, supporting guaranteed operation at 300 MHz DDR (600 MT/s). This specification is validated across the full 0 °C to +70 °C operating temperature range with 1.8 V ±0.1 V supply. Operation above 300 MHz is not characterized and may violate setup/hold timing margins.
Does UPD46365184BF1-E33-EQ1-A support true concurrent read and write operations?
Yes, UPD46365184BF1-E33-EQ1-A implements physically separate read and write data ports with independent address latching. The device's internal architecture allows simultaneous read and write transactions to different addresses without arbitration delay, enabling full-duplex memory access essential for packet buffering applications.
How is output impedance calibrated on UPD46365184BF1-E33-EQ1-A?
Output impedance for Q, CQ, and CQ# drivers is calibrated using the ZQ pin. A precision resistor (175–350 Ω) connected from ZQ to ground sets nominal output impedance to 0.2 × RQ. Calibration occurs automatically every 20 μs after power-up and tracks supply/temperature drift. Direct connection to VDDQ minimizes impedance.
What is the function of DLL# on UPD46365184BF1-E33-EQ1-A?
DLL# is the PLL disable input. When pulled LOW, the internal PLL is bypassed, allowing operation at frequencies below the PLL's minimum lock range (120 MHz) for debug or low-speed validation. For normal 300 MHz operation, DLL# must be HIGH (tied to VDDQ via ≤10 kΩ resistor) to enable PLL-based timing margin.
Can UPD46365184BF1-E33-EQ1-A operate with C and C# tied HIGH?
Yes, tying C and C# HIGH forces output data synchronization to K and K# rising edges instead of C/C#. This mode eliminates need for external C/C# generation but forfeits flight-time compensation and clock skew matching benefits. Data valid window narrows, limiting maximum reliable frequency in this configuration.
UPD46365184BF1-E33-EQ1-A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
UPD46365184BF1-E33-EQ1-A FAQ
1.How can I place an order for UPD46365184BF1-E33-EQ1-A through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD46365184BF1-E33-EQ1-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD46365184BF1-E33-EQ1-A reliable?
The price and inventory of UPD46365184BF1-E33-EQ1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD46365184BF1-E33-EQ1-A is usually 5 days.
3.What payment methods are accepted for UPD46365184BF1-E33-EQ1-A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD46365184BF1-E33-EQ1-A transactions.
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4.How is shipping managed for UPD46365184BF1-E33-EQ1-A?
UPD46365184BF1-E33-EQ1-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD46365184BF1-E33-EQ1-A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD46365184BF1-E33-EQ1-A?
For technical support, including UPD46365184BF1-E33-EQ1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD46365184BF1-E33-EQ1-A requirements.
6.How does Aetrix verify that UPD46365184BF1-E33-EQ1-A is sourced from the original manufacturer or authorized distributors?
All UPD46365184BF1-E33-EQ1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD46365184BF1-E33-EQ1-A meets industry standards.
7.What is the process for return or replacement of UPD46365184BF1-E33-EQ1-A?
All UPD46365184BF1-E33-EQ1-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD46365184BF1-E33-EQ1-A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD46365184BF1-E33-EQ1-A part is unused and in its original packaging.
Return procedure for UPD46365184BF1-E33-EQ1-A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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