Renesas UPD46365362BF1-E33-EQ1-A

Overview

UPD46365362BF1-E33-EQ1-A from Renesas Electronics is a 1,048,576-word × 36-bit synchronous Quad Data Rate II (QDR II) SRAM with 300 MHz clock frequency, 1.8 V core supply, HSTL interface, and 165-pin plastic BGA (13 × 15) package. It supports concurrent read/write ports, two-word burst operation, and PLL-based output timing for high-speed networking buffer applications.

For engineers reviewing the UPD46365362BF1-E33-EQ1-A datasheet, UPD46365362BF1-E33-EQ1-A pinout, UPD46365362BF1-E33-EQ1-A application, or UPD46365362BF1-E33-EQ1-A equivalent, key selection considerations include its 36-bit wide data bus, 3.3 ns cycle time, dual-clock (K/K# and C/C#) timing architecture, user-programmable output impedance, and JTAG 1149.1 test port support.

Technical Context

This QDR II SRAM uses full-CMOS six-transistor memory cells and integrates synchronous peripheral circuitry with a burst counter. All inputs are registered on the rising edges of complementary input clocks K and K#, while output data is synchronized to C and C# rising edges - enabling precise flight-time matching between clock and data.

The device implements separate independent read and write data paths, supports 100% bus utilization in DDR mode, and features internally self-timed write control with clock-stop capability (20 μs recovery). Its PLL circuitry provides a wide output data valid window and enables future frequency scaling up to 300 MHz.

Key Specifications

Pinout & Package

UPD46365362BF1-E33-EQ1-A is housed in a 165-pin plastic BGA (13 × 15 mm) with ball pitch of 0.8 mm. The package supports automated optical inspection (AOI) and X-ray void detection, and complies with JEDEC MO-245 standards.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Compared with CY7C2663KV18-333BZXC and AS7C336000B-333BIN, UPD46365362BF1-E33-EQ1-A uniquely combines 300 MHz performance with user-programmable output impedance, integrated JTAG, and PLL disable for hardware debug - making it optimal for high-reliability telecom and networking systems requiring field serviceability and signal integrity control.

Availability

UPD46365362BF1-E33-EQ1-A is available at Aetrix Electronics and suitable for high-speed network switch buffers, telecom line card memory, baseband processing memory, and FPGA co-processor cache applications requiring stable component supply, long-term lifecycle support, and guaranteed lead-free compliance.

Supply support for UPD46365362BF1-E33-EQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, infrastructure, and IoT applications.

UPD46365362BF1-E33-EQ1-A belongs to Renesas' QDR II SRAM product line, engineered specifically for high-bandwidth, low-latency buffer memory in networking and communications infrastructure equipment.

FAQ

What is the maximum clock frequency supported by UPD46365362BF1-E33-EQ1-A?

UPD46365362BF1-E33-EQ1-A supports a maximum clock frequency of 300 MHz, corresponding to a 3.3 ns clock cycle time. This rating is specified under commercial temperature conditions (0 °C to +70 °C) with 1.8 V ±0.1 V core supply and proper signal integrity implementation. Operation above this frequency is not guaranteed and may violate setup/hold timing margins.

Does UPD46365362BF1-E33-EQ1-A support independent read and write operations?

Yes, UPD46365362BF1-E33-EQ1-A implements physically separate read and write data paths, enabling true concurrent read and write transactions to different addresses without arbitration delay. This architecture is fundamental to its role in high-throughput packet buffering and real-time signal processing applications where deterministic latency is required.

How is output impedance calibrated on UPD46365362BF1-E33-EQ1-A?

UPD46365362BF1-E33-EQ1-A uses the ZQ pin to calibrate output driver impedance. A single external resistor (RQ) is connected from ZQ to ground; the device sets Q, CQ, and CQ# output impedance to 0.2 × RQ. Calibration occurs automatically every 20 μs after power-up and tracks supply voltage and temperature drift, enabling robust signal integrity across varying operating conditions.

What is the function of the DLL# pin on UPD46365362BF1-E33-EQ1-A?

The DLL# pin on UPD46365362BF1-E33-EQ1-A disables the internal PLL when driven LOW, allowing the device to operate at reduced clock frequencies for board-level debug and validation. In this mode, read latency becomes 1 clock cycle, but AC/DC characteristics are not guaranteed. For normal operation, DLL# must be tied HIGH (e.g., to VDDQ via ≤10 kΩ resistor).

Which interface standard does UPD46365362BF1-E33-EQ1-A comply with for its I/O signals?

UPD46365362BF1-E33-EQ1-A complies with JEDEC HSTL Class I specifications for all I/O signals, including address, control, data, and clock inputs/outputs. This ensures compatibility with FPGA and ASIC I/O banks configured for HSTL, supports 1.5 V or 1.8 V VDDQ operation, and guarantees defined voltage thresholds, drive strength, and timing behavior at 300 MHz.