Renesas UPD46365362BF1-E50-EQ1-A
- Part No.:
- UPD46365362BF1-E50-EQ1-A
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
UPD46365362BF1-E50-EQ1-A.pdf
- Description:
- QDR SRAM, 1MX36,
- Quantity:
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Inventory:60,140
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Product details
Overview
UPD46365362BF1-E50-EQ1-A from Renesas Electronics is a 1,048,576-word × 36-bit synchronous Quad Data Rate II (QDR-II) SRAM with 1.8 V core supply, 3.3 ns clock cycle time (300 MHz), HSTL interface, and 165-pin plastic BGA (13 × 15) packaging. It supports concurrent read/write ports, burst-2 operation, and PLL-based output timing for high-speed networking buffer applications.
For engineers reviewing the UPD46365362BF1-E50-EQ1-A datasheet, UPD46365362BF1-E50-EQ1-A pinout, UPD46365362BF1-E50-EQ1-A application, or UPD46365362BF1-E50-EQ1-A equivalent, key selection considerations include its 36-bit wide data bus, dual-clock (K/K# and C/C#) DDR timing architecture, user-programmable output impedance (35–70 Ω), JTAG 1149.1 test port, and clock-stop capability with 20 μs recovery.
Technical Context
The UPD46365362BF1-E50-EQ1-A implements a true dual-port QDR-II architecture with physically separate read and write data paths, enabling simultaneous transactions without arbitration. Its internal PLL locks to the K clock input to generate precise C/C# output clocks and tightly matched CQ/CQ# echo clocks-critical for deterministic flight-time compensation in high-speed SerDes and packet buffer systems.
It uses full-CMOS six-transistor memory cells and integrates burst counters, address registers latched on K/K# rising edges, and HSTL Class I-compliant I/Os referenced to VREF = VDDQ/2. Byte write control (BW0#–BW3#) enables selective 9-bit sub-word writes within the 36-bit data width, supporting fine-grained memory updates in telecom line cards and FPGA co-processor buffers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Organization | 1,048,576 words × 36 bits = 36 Mbit total capacity; supports 36-bit parallel data path for high-throughput buffering |
| Clock frequency | 300 MHz (3.3 ns cycle time); enables 600 MT/s effective data rate per data line in DDR mode |
| Supply voltage | Core VDD = 1.8 ± 0.1 V; I/O VDDQ = 1.4–1.8 V; separates logic and output power domains for noise isolation |
| Interface standard | HSTL Class I compliant; ensures signal integrity at >250 MHz with controlled slew and termination reference (VREF) |
| Burst length | Fixed 2-word burst; delivers two consecutive data words per clock transition pair (K/K# or C/C#) |
| Operating temperature | 0 °C to +70 °C (commercial grade); validated for stable performance across ambient thermal gradients in rack-mounted systems |
| Package | 165-pin plastic BGA (13 × 15 mm); RoHS-compliant lead-free construction with 0.8 mm ball pitch |
Pinout & Package
UPD46365362BF1-E50-EQ1-A is housed in a 165-pin plastic BGA (13 × 15 mm, 0.8 mm pitch), with balls arranged in a grid indexed A–R (11 columns) × 1–11 (11 rows), excluding corner and center voids. The package supports automated optical inspection and high-density PCB routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Synchronous address inputs | 19-bit address bus registered on K rising edge for READ, K# rising edge for WRITE; enables 1M-word addressing |
| D0–D35 | Synchronous data inputs | 36-bit write data path; meets setup/hold relative to K/K# rising edges; supports byte-select via BW0#–BW3# |
| Q0–Q35 | Synchronous data outputs | 36-bit read data path synchronized to C/C# rising edges; echo-aligned with CQ/CQ# for timing margin assurance |
| K, K# | Input clock pair | Differential clock inputs; K latches READ controls/address, K# latches WRITE controls/address; 180° phase alignment required |
| C, C# | Output clock pair | User-controlled timing reference for output data; C# triggers first word, C triggers second word; may be tied HIGH to use K/K# instead |
| CQ, CQ# | Echo clock outputs | Output-synchronized clocks tightly matched to Q outputs (±0.1 ns); used as data-valid strobes at receiving device |
| R#, W# | Read/Write command inputs | Active-low synchronous commands; initiate burst-2 READ or WRITE on next K rising edge; both high = NOP |
| BW0#–BW3# | Byte write enable inputs | Four active-low signals controlling 9-bit sub-word writes (D0–D8, D9–D17, D18–D26, D27–D35); support partial-word updates |
| VDD, VDDQ, VSS | Power and ground | VDD (1.8 V core), VDDQ (1.4–1.8 V I/O), VSS (ground); dedicated balls per domain minimize switching noise coupling |
| VREF, ZQ | Reference and impedance control | VREF = VDDQ/2 sets HSTL input threshold; ZQ connects to external resistor for programmable output impedance (35–70 Ω) |
| DLL#, TMS/TCK/TDI/TDO | PLL disable & JTAG port | DLL# = LOW disables PLL for low-frequency debug; JTAG pins support IEEE 1149.1 boundary scan testing |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent read/write ports | Enables full 100% bus utilization-no arbitration delay between back-to-back READ and WRITE operations |
| PLL-based output timing | Generates jitter-tolerant C/C# and CQ/CQ# clocks, widening data valid window for reliable capture at 300 MHz |
| User-programmable output impedance | Adjusts Q/CQ/CQ# drive strength via ZQ resistor (175–350 Ω to ground) to match board trace impedance and reduce reflections |
| Two-tick burst operation | Delivers two data words per clock cycle pair-reducing command overhead and maximizing bandwidth efficiency in burst-limited protocols |
| Clock-stop capability | Enters low-power state with clocks halted; resumes normal operation within 20 μs after clock restart-ideal for dynamic power gating |
| JTAG 1149.1 test access | Supports production-level boundary scan testing of PCB interconnects without requiring functional test vectors |
Applications
| Packet Buffer in Network Switch ASIC | High-Speed FPGA Co-Processor Cache |
|---|---|
Use Scenario: Stores ingress/egress packet headers and payloads in multi-gigabit Ethernet line cards where latency and throughput are critical. IC Role / Device Role / Timing Role: Acts as a low-latency, dual-port buffer between switch fabric and MAC layers; provides concurrent read (forwarding) and write (ingest) at 600 MT/s per 36-bit lane. Use Value: Eliminates arbitration stalls with true dual-port architecture, enabling deterministic 2-cycle read latency and zero-cycle write turnaround-critical for cut-through switching. | Use Scenario: Serves as a high-bandwidth scratchpad memory for Xilinx or Intel FPGAs performing real-time video processing or radar FFT acceleration. IC Role / Device Role / Timing Role: Provides FPGA-accessible 36-bit-wide memory with HSTL I/O and echo clocks (CQ/CQ#) for precise data capture aligned to FPGA I/O timing constraints. Use Value: Matches FPGA I/O voltage (1.5–1.8 V) and timing margins; user-adjustable output impedance ensures clean signal integrity on dense FPGA carrier boards. |
| Baseband Processing in 4G/LTE Radio Unit | Real-Time Industrial Motion Controller Buffer |
Use Scenario: Buffers IQ samples between digital downconverters and channel estimation blocks in wireless base station remote radio heads. IC Role / Device Role / Timing Role: Functions as a synchronized FIFO with burst-2 reads/writes aligned to 30.72 MHz or 122.88 MHz sampling clocks via K/K# and C/C#. Use Value: PLL lock time <20 μs allows rapid clock domain reconfiguration during RF band switching; clock-stop mode reduces idle power by >50%. | Use Scenario: Stores position feedback and motion profile data for servo drives requiring microsecond-level deterministic response in CNC or robotics systems. IC Role / Device Role / Timing Role: Delivers jitter-free 36-bit position updates to real-time MCU or DSP via HSTL interface, synchronized to system timing engine using C/C# outputs. Use Value: Echo clocks (CQ/CQ#) eliminate flight-time uncertainty; tight ±0.1 ns data-to-echo skew guarantees sub-ns timing accuracy for closed-loop control loops. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR-II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C2663KV18-333BZC | 36-Mbit (1M × 36), 333 MHz max, 1.8 V core, 165-ball BGA; Cypress (now Infineon) part with identical organization and pinout | Same 36-bit width and burst-2 operation; differs in AC timing specs (e.g., TAVKH = 0.4 ns vs. 0.3 ns) and JTAG implementation | Select when existing design uses Infineon's QDR-II family or requires direct compatibility with CY7C2663KV18-333BZC layout and firmware |
| AS7C362000B-333BIN | 36-Mbit (1M × 36), 333 MHz, 1.8 V, 165-ball BGA; Alliance Memory part with JEDEC-standard HSTL I/O and same burst architecture | Matches core timing and pin functions but lacks DLL# pin and has different power-up sequence requirements | Choose for cost-sensitive industrial applications where full Renesas feature set (e.g., DLL disable, ZQ calibration) is not required |
Compared with CY7C2663KV18-333BZC and AS7C362000B-333BIN, the UPD46365362BF1-E50-EQ1-A offers tighter setup/hold timing (0.3 ns), integrated ZQ impedance tuning, and explicit clock-stop recovery (20 μs), making it preferable for latency-critical telecom and test equipment designs.
Availability
UPD46365362BF1-E50-EQ1-A is available at Aetrix Electronics and suitable for high-speed networking equipment, FPGA-accelerated compute platforms, and real-time industrial control systems requiring stable component supply, long-term lifecycle support, and guaranteed RoHS-compliant sourcing.
Supply support for UPD46365362BF1-E50-EQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The UPD46365362BF1-E50-EQ1-A belongs to Renesas' QDR-II SRAM product line, engineered specifically for ultra-low-latency, high-bandwidth buffering in networking ASICs, FPGA co-processors, and baseband subsystems demanding deterministic DDR timing and robust signal integrity.
FAQ
What is the maximum operating frequency of the UPD46365362BF1-E50-EQ1-A?
The UPD46365362BF1-E50-EQ1-A supports a maximum clock frequency of 300 MHz, corresponding to a 3.3 ns clock cycle time. This is specified under commercial temperature conditions (0 °C to +70 °C) with VDD = 1.8 ± 0.1 V and VDDQ = 1.4–1.8 V. At this speed, it achieves 600 million transfers per second (MT/s) on each of its 36 data lines in DDR mode. The device also supports 250 MHz operation (4.0 ns cycle) for lower-power or thermally constrained deployments.
Does the UPD46365362BF1-E50-EQ1-A support independent read and write operations?
Yes, the UPD46365362BF1-E50-EQ1-A implements a true dual-port QDR-II architecture with physically separate read and write data paths (Q0–Q35 and D0–D35), allowing fully concurrent READ and WRITE transactions without arbitration or contention. This enables 100% bus utilization-critical for applications like packet buffering where ingress and egress traffic must be handled simultaneously at line rate.
How does the ZQ pin function on the UPD46365362BF1-E50-EQ1-A?
The ZQ pin on the UPD46365362BF1-E50-EQ1-A is an input used to calibrate output driver impedance for Q, CQ, and CQ# signals. It connects to an external precision resistor (typically 240 Ω) to ground, setting output impedance to 0.2 × RQ (e.g., 48 Ω). Calibration occurs automatically every 20 μs after power-up. Direct connection to VDDQ minimizes impedance; grounding or leaving ZQ floating is prohibited and will cause undefined behavior.
What is the role of the DLL# pin on the UPD46365362BF1-E50-EQ1-A?
The DLL# pin on the UPD46365362BF1-E50-EQ1-A disables the internal PLL when pulled LOW, allowing the device to operate at clock frequencies below the minimum PLL lock range (120 MHz) for board-level debugging or low-speed validation. During DLL# = LOW operation, read latency changes to 1.0 clock cycle, but AC/DC characteristics are not guaranteed. For normal operation, DLL# must be tied HIGH (e.g., to VDDQ via ≤10 kΩ resistor).
Can the UPD46365362BF1-E50-EQ1-A be used in industrial temperature applications?
No-the UPD46365362BF1-E50-EQ1-A is rated for commercial temperature range only (0 °C to +70 °C), as indicated by the "E" prefix (not "EY") in its ordering code. For extended temperature operation (−40 °C to +85 °C), Renesas offers the UPD46365362BF1-E50Y-EQ1-A variant. Using the -E50-EQ1-A outside its specified ambient range may result in timing violations, increased leakage current, or functional failure.
UPD46365362BF1-E50-EQ1-A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
UPD46365362BF1-E50-EQ1-A FAQ
1.How can I place an order for UPD46365362BF1-E50-EQ1-A through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD46365362BF1-E50-EQ1-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD46365362BF1-E50-EQ1-A reliable?
The price and inventory of UPD46365362BF1-E50-EQ1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD46365362BF1-E50-EQ1-A is usually 5 days.
3.What payment methods are accepted for UPD46365362BF1-E50-EQ1-A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD46365362BF1-E50-EQ1-A transactions.
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4.How is shipping managed for UPD46365362BF1-E50-EQ1-A?
UPD46365362BF1-E50-EQ1-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD46365362BF1-E50-EQ1-A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD46365362BF1-E50-EQ1-A?
For technical support, including UPD46365362BF1-E50-EQ1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD46365362BF1-E50-EQ1-A requirements.
6.How does Aetrix verify that UPD46365362BF1-E50-EQ1-A is sourced from the original manufacturer or authorized distributors?
All UPD46365362BF1-E50-EQ1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD46365362BF1-E50-EQ1-A meets industry standards.
7.What is the process for return or replacement of UPD46365362BF1-E50-EQ1-A?
All UPD46365362BF1-E50-EQ1-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD46365362BF1-E50-EQ1-A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD46365362BF1-E50-EQ1-A part is unused and in its original packaging.
Return procedure for UPD46365362BF1-E50-EQ1-A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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