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Renesas UPD46365362BF1-E50-EQ1-A

Part No.:
UPD46365362BF1-E50-EQ1-A
Manufacturer:
Renesas
Category:
Memory
Package:
-
Datasheet:
AetrixUPD46365362BF1-E50-EQ1-A.pdf
Description:
QDR SRAM, 1MX36,
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:60,140

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Product details

Overview

UPD46365362BF1-E50-EQ1-A from Renesas Electronics is a 1,048,576-word × 36-bit synchronous Quad Data Rate II (QDR-II) SRAM with 1.8 V core supply, 3.3 ns clock cycle time (300 MHz), HSTL interface, and 165-pin plastic BGA (13 × 15) packaging. It supports concurrent read/write ports, burst-2 operation, and PLL-based output timing for high-speed networking buffer applications.

For engineers reviewing the UPD46365362BF1-E50-EQ1-A datasheet, UPD46365362BF1-E50-EQ1-A pinout, UPD46365362BF1-E50-EQ1-A application, or UPD46365362BF1-E50-EQ1-A equivalent, key selection considerations include its 36-bit wide data bus, dual-clock (K/K# and C/C#) DDR timing architecture, user-programmable output impedance (35–70 Ω), JTAG 1149.1 test port, and clock-stop capability with 20 μs recovery.

Technical Context

The UPD46365362BF1-E50-EQ1-A implements a true dual-port QDR-II architecture with physically separate read and write data paths, enabling simultaneous transactions without arbitration. Its internal PLL locks to the K clock input to generate precise C/C# output clocks and tightly matched CQ/CQ# echo clocks-critical for deterministic flight-time compensation in high-speed SerDes and packet buffer systems.

It uses full-CMOS six-transistor memory cells and integrates burst counters, address registers latched on K/K# rising edges, and HSTL Class I-compliant I/Os referenced to VREF = VDDQ/2. Byte write control (BW0#–BW3#) enables selective 9-bit sub-word writes within the 36-bit data width, supporting fine-grained memory updates in telecom line cards and FPGA co-processor buffers.

Key Specifications

ParameterValue and Actual Design Meaning
Organization1,048,576 words × 36 bits = 36 Mbit total capacity; supports 36-bit parallel data path for high-throughput buffering
Clock frequency300 MHz (3.3 ns cycle time); enables 600 MT/s effective data rate per data line in DDR mode
Supply voltageCore VDD = 1.8 ± 0.1 V; I/O VDDQ = 1.4–1.8 V; separates logic and output power domains for noise isolation
Interface standardHSTL Class I compliant; ensures signal integrity at >250 MHz with controlled slew and termination reference (VREF)
Burst lengthFixed 2-word burst; delivers two consecutive data words per clock transition pair (K/K# or C/C#)
Operating temperature0 °C to +70 °C (commercial grade); validated for stable performance across ambient thermal gradients in rack-mounted systems
Package165-pin plastic BGA (13 × 15 mm); RoHS-compliant lead-free construction with 0.8 mm ball pitch

Pinout & Package

UPD46365362BF1-E50-EQ1-A is housed in a 165-pin plastic BGA (13 × 15 mm, 0.8 mm pitch), with balls arranged in a grid indexed A–R (11 columns) × 1–11 (11 rows), excluding corner and center voids. The package supports automated optical inspection and high-density PCB routing.

Pin/TerminalCircuit RoleDesign Meaning
A0–A18Synchronous address inputs19-bit address bus registered on K rising edge for READ, K# rising edge for WRITE; enables 1M-word addressing
D0–D35Synchronous data inputs36-bit write data path; meets setup/hold relative to K/K# rising edges; supports byte-select via BW0#–BW3#
Q0–Q35Synchronous data outputs36-bit read data path synchronized to C/C# rising edges; echo-aligned with CQ/CQ# for timing margin assurance
K, K#Input clock pairDifferential clock inputs; K latches READ controls/address, K# latches WRITE controls/address; 180° phase alignment required
C, C#Output clock pairUser-controlled timing reference for output data; C# triggers first word, C triggers second word; may be tied HIGH to use K/K# instead
CQ, CQ#Echo clock outputsOutput-synchronized clocks tightly matched to Q outputs (±0.1 ns); used as data-valid strobes at receiving device
R#, W#Read/Write command inputsActive-low synchronous commands; initiate burst-2 READ or WRITE on next K rising edge; both high = NOP
BW0#–BW3#Byte write enable inputsFour active-low signals controlling 9-bit sub-word writes (D0–D8, D9–D17, D18–D26, D27–D35); support partial-word updates
VDD, VDDQ, VSSPower and groundVDD (1.8 V core), VDDQ (1.4–1.8 V I/O), VSS (ground); dedicated balls per domain minimize switching noise coupling
VREF, ZQReference and impedance controlVREF = VDDQ/2 sets HSTL input threshold; ZQ connects to external resistor for programmable output impedance (35–70 Ω)
DLL#, TMS/TCK/TDI/TDOPLL disable & JTAG portDLL# = LOW disables PLL for low-frequency debug; JTAG pins support IEEE 1149.1 boundary scan testing

Key Features

FeatureDesign Value
Concurrent read/write portsEnables full 100% bus utilization-no arbitration delay between back-to-back READ and WRITE operations
PLL-based output timingGenerates jitter-tolerant C/C# and CQ/CQ# clocks, widening data valid window for reliable capture at 300 MHz
User-programmable output impedanceAdjusts Q/CQ/CQ# drive strength via ZQ resistor (175–350 Ω to ground) to match board trace impedance and reduce reflections
Two-tick burst operationDelivers two data words per clock cycle pair-reducing command overhead and maximizing bandwidth efficiency in burst-limited protocols
Clock-stop capabilityEnters low-power state with clocks halted; resumes normal operation within 20 μs after clock restart-ideal for dynamic power gating
JTAG 1149.1 test accessSupports production-level boundary scan testing of PCB interconnects without requiring functional test vectors

Applications

Packet Buffer in Network Switch ASICHigh-Speed FPGA Co-Processor Cache

Use Scenario: Stores ingress/egress packet headers and payloads in multi-gigabit Ethernet line cards where latency and throughput are critical.

IC Role / Device Role / Timing Role: Acts as a low-latency, dual-port buffer between switch fabric and MAC layers; provides concurrent read (forwarding) and write (ingest) at 600 MT/s per 36-bit lane.

Use Value: Eliminates arbitration stalls with true dual-port architecture, enabling deterministic 2-cycle read latency and zero-cycle write turnaround-critical for cut-through switching.

Use Scenario: Serves as a high-bandwidth scratchpad memory for Xilinx or Intel FPGAs performing real-time video processing or radar FFT acceleration.

IC Role / Device Role / Timing Role: Provides FPGA-accessible 36-bit-wide memory with HSTL I/O and echo clocks (CQ/CQ#) for precise data capture aligned to FPGA I/O timing constraints.

Use Value: Matches FPGA I/O voltage (1.5–1.8 V) and timing margins; user-adjustable output impedance ensures clean signal integrity on dense FPGA carrier boards.

Baseband Processing in 4G/LTE Radio UnitReal-Time Industrial Motion Controller Buffer

Use Scenario: Buffers IQ samples between digital downconverters and channel estimation blocks in wireless base station remote radio heads.

IC Role / Device Role / Timing Role: Functions as a synchronized FIFO with burst-2 reads/writes aligned to 30.72 MHz or 122.88 MHz sampling clocks via K/K# and C/C#.

Use Value: PLL lock time <20 μs allows rapid clock domain reconfiguration during RF band switching; clock-stop mode reduces idle power by >50%.

Use Scenario: Stores position feedback and motion profile data for servo drives requiring microsecond-level deterministic response in CNC or robotics systems.

IC Role / Device Role / Timing Role: Delivers jitter-free 36-bit position updates to real-time MCU or DSP via HSTL interface, synchronized to system timing engine using C/C# outputs.

Use Value: Echo clocks (CQ/CQ#) eliminate flight-time uncertainty; tight ±0.1 ns data-to-echo skew guarantees sub-ns timing accuracy for closed-loop control loops.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR-II SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C2663KV18-333BZC36-Mbit (1M × 36), 333 MHz max, 1.8 V core, 165-ball BGA; Cypress (now Infineon) part with identical organization and pinoutSame 36-bit width and burst-2 operation; differs in AC timing specs (e.g., TAVKH = 0.4 ns vs. 0.3 ns) and JTAG implementationSelect when existing design uses Infineon's QDR-II family or requires direct compatibility with CY7C2663KV18-333BZC layout and firmware
AS7C362000B-333BIN36-Mbit (1M × 36), 333 MHz, 1.8 V, 165-ball BGA; Alliance Memory part with JEDEC-standard HSTL I/O and same burst architectureMatches core timing and pin functions but lacks DLL# pin and has different power-up sequence requirementsChoose for cost-sensitive industrial applications where full Renesas feature set (e.g., DLL disable, ZQ calibration) is not required

Compared with CY7C2663KV18-333BZC and AS7C362000B-333BIN, the UPD46365362BF1-E50-EQ1-A offers tighter setup/hold timing (0.3 ns), integrated ZQ impedance tuning, and explicit clock-stop recovery (20 μs), making it preferable for latency-critical telecom and test equipment designs.

Availability

UPD46365362BF1-E50-EQ1-A is available at Aetrix Electronics and suitable for high-speed networking equipment, FPGA-accelerated compute platforms, and real-time industrial control systems requiring stable component supply, long-term lifecycle support, and guaranteed RoHS-compliant sourcing.

Supply support for UPD46365362BF1-E50-EQ1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The UPD46365362BF1-E50-EQ1-A belongs to Renesas' QDR-II SRAM product line, engineered specifically for ultra-low-latency, high-bandwidth buffering in networking ASICs, FPGA co-processors, and baseband subsystems demanding deterministic DDR timing and robust signal integrity.

FAQ

What is the maximum operating frequency of the UPD46365362BF1-E50-EQ1-A?

The UPD46365362BF1-E50-EQ1-A supports a maximum clock frequency of 300 MHz, corresponding to a 3.3 ns clock cycle time. This is specified under commercial temperature conditions (0 °C to +70 °C) with VDD = 1.8 ± 0.1 V and VDDQ = 1.4–1.8 V. At this speed, it achieves 600 million transfers per second (MT/s) on each of its 36 data lines in DDR mode. The device also supports 250 MHz operation (4.0 ns cycle) for lower-power or thermally constrained deployments.

Does the UPD46365362BF1-E50-EQ1-A support independent read and write operations?

Yes, the UPD46365362BF1-E50-EQ1-A implements a true dual-port QDR-II architecture with physically separate read and write data paths (Q0–Q35 and D0–D35), allowing fully concurrent READ and WRITE transactions without arbitration or contention. This enables 100% bus utilization-critical for applications like packet buffering where ingress and egress traffic must be handled simultaneously at line rate.

How does the ZQ pin function on the UPD46365362BF1-E50-EQ1-A?

The ZQ pin on the UPD46365362BF1-E50-EQ1-A is an input used to calibrate output driver impedance for Q, CQ, and CQ# signals. It connects to an external precision resistor (typically 240 Ω) to ground, setting output impedance to 0.2 × RQ (e.g., 48 Ω). Calibration occurs automatically every 20 μs after power-up. Direct connection to VDDQ minimizes impedance; grounding or leaving ZQ floating is prohibited and will cause undefined behavior.

What is the role of the DLL# pin on the UPD46365362BF1-E50-EQ1-A?

The DLL# pin on the UPD46365362BF1-E50-EQ1-A disables the internal PLL when pulled LOW, allowing the device to operate at clock frequencies below the minimum PLL lock range (120 MHz) for board-level debugging or low-speed validation. During DLL# = LOW operation, read latency changes to 1.0 clock cycle, but AC/DC characteristics are not guaranteed. For normal operation, DLL# must be tied HIGH (e.g., to VDDQ via ≤10 kΩ resistor).

Can the UPD46365362BF1-E50-EQ1-A be used in industrial temperature applications?

No-the UPD46365362BF1-E50-EQ1-A is rated for commercial temperature range only (0 °C to +70 °C), as indicated by the "E" prefix (not "EY") in its ordering code. For extended temperature operation (−40 °C to +85 °C), Renesas offers the UPD46365362BF1-E50Y-EQ1-A variant. Using the -E50-EQ1-A outside its specified ambient range may result in timing violations, increased leakage current, or functional failure.

UPD46365362BF1-E50-EQ1-A Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
-
Memory Format:
-
Technology:
-
Memory Size:
-
Memory Organization:
-
Memory Interface:
-
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

UPD46365362BF1-E50-EQ1-A FAQ

1.How can I place an order for UPD46365362BF1-E50-EQ1-A through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD46365362BF1-E50-EQ1-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD46365362BF1-E50-EQ1-A reliable?

The price and inventory of UPD46365362BF1-E50-EQ1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD46365362BF1-E50-EQ1-A is usually 5 days.

3.What payment methods are accepted for UPD46365362BF1-E50-EQ1-A?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD46365362BF1-E50-EQ1-A transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UPD46365362BF1-E50-EQ1-A?

UPD46365362BF1-E50-EQ1-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD46365362BF1-E50-EQ1-A order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD46365362BF1-E50-EQ1-A?

For technical support, including UPD46365362BF1-E50-EQ1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD46365362BF1-E50-EQ1-A requirements.

6.How does Aetrix verify that UPD46365362BF1-E50-EQ1-A is sourced from the original manufacturer or authorized distributors?

All UPD46365362BF1-E50-EQ1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD46365362BF1-E50-EQ1-A meets industry standards.

7.What is the process for return or replacement of UPD46365362BF1-E50-EQ1-A?

All UPD46365362BF1-E50-EQ1-A units undergo pre-shipment inspection (PSI). If there is an issue with UPD46365362BF1-E50-EQ1-A, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD46365362BF1-E50-EQ1-A part is unused and in its original packaging.

Return procedure for UPD46365362BF1-E50-EQ1-A:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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