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Renesas UPD70F3210HGC-GAD-AX
- Part No.:
- UPD70F3210HGC-GAD-AX
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- -
- Datasheet:
-
UPD70F3210HGC-GAD-AX.pdf
- Description:
- 32-BIT, FLASH, V850 CPU
- Quantity:
- Payment:
- Shipping:
Inventory:3,770
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Product details
Overview
UPD70F3210HGC-GAD-AX from Renesas Electronics (formerly NEC Electronics) is a 32-bit V850ES/KF1 single-chip microcontroller featuring 128 KB on-chip flash memory, 8 KB RAM, and integrated peripherals including UART, CSI, I²C, 16-bit timers, 8-bit timers, and an 8-channel 10-bit ADC. It operates at up to 20 MHz and targets embedded control in industrial instrumentation and motor drive systems.
For engineers reviewing the UPD70F3210HGC-GAD-AX datasheet, UPD70F3210HGC-GAD-AX pinout, UPD70F3210HGC-GAD-AX application, or UPD70F3210HGC-GAD-AX equivalent, key selection criteria include its V850ES/KF1 core compatibility, 100-pin LQFP package, flash-based programmability, and support for real-time control with multiple timer/counter modules and serial interfaces.
Technical Context
The UPD70F3210HGC-GAD-AX implements the V850ES/KF1 32-bit RISC CPU core with Harvard architecture, supporting 16-/32-bit instructions and 3-stage pipeline execution. It integrates a 10-bit ADC with sample-and-hold, dual 16-bit timer/event counters (00–05), two 8-bit timers (50/51), and two 8-bit high-speed timers (H0/H1).
Peripherals include one asynchronous serial interface (UART), two clocked serial interfaces (CSI0 and CSIA), and an I²C bus interface compliant with Philips I²C Patent Rights. The device supports multiplexed and separate bus modes, with external memory expansion capability up to 4 MB via 16-bit data/24-bit address bus.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | V850ES/KF1 32-bit RISC core with 3-stage pipeline and 16-/32-bit instruction set |
| Max Clock Frequency | 20 MHz - enables deterministic real-time response for motor control loops and sensor sampling |
| Flash Memory | 128 KB - supports field-upgradable firmware without external memory |
| RAM | 8 KB - sufficient for stack, heap, and real-time task buffers in embedded control |
| ADC Resolution | 10-bit - provides 1024-level analog input quantization for precision sensor interfacing |
| Timer Channels | 16-bit × 6 + 8-bit × 2 + 8-bit high-speed × 2 - enables simultaneous PWM generation, pulse capture, and interval timing |
| Serial Interfaces | UART × 1, CSI × 2 (CSI0, CSIA), I²C × 1 - supports multi-protocol communication with sensors, displays, and host controllers |
Pinout & Package
UPD70F3210HGC-GAD-AX is housed in a 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) package with exposed thermal pad. Pin functions are defined per V850ES/KF1 specification, including dedicated power/ground pins, clock inputs (XT1, XT2), reset (RES), and configurable I/O ports P0–P9.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P00–P07 | Port 0 bidirectional I/O | General-purpose digital I/O with pull-up option; usable as UART TX/RX when configured |
| P10–P17 | Port 1 bidirectional I/O | Supports external interrupt inputs (INTP0–INTP7); also used for CSI0/CSIA signal lines |
| P30–P37 | Port 3 bidirectional I/O | Configurable as ADC input channels AN0–AN7; includes sample-and-hold control |
| P40–P47 | Port 4 bidirectional I/O | Provides 8-bit data bus (D0–D7) in multiplexed bus mode; also supports timer output (TO00–TO05) |
| P70–P77 | Port 7 bidirectional I/O | Address bus low (A0–A7) in multiplexed mode; also supports I²C SDA/SCL when configured |
| XT1/XT2 | Crystal oscillator input/output | Supports 1–20 MHz crystal or ceramic resonator for main system clock generation |
| VDD/VSS | Power supply/ground | Dual 3.0–3.6 V supply domains: VDD (core/I/O), VDDA (analog), with separate ground pins for noise isolation |
Key Features
| Feature | Design Value |
|---|---|
| V850ES/KF1 Core Compatibility | Binary-compatible with µPD703210 and µPD70F3210 family - enables reuse of toolchains and legacy firmware |
| On-Chip Flash Programming | Supports in-system programming via PG-FP3 programmer - eliminates need for socketed EPROM emulators |
| Multi-Mode Bus Interface | Configurable as multiplexed (AD0–AD15) or separate (D0–D15/A0–A23) bus - simplifies migration between compact and expandable system designs |
| Dedicated ADC Input Pins | 8-channel 10-bit ADC with dedicated P30–P37 pins and internal sample-and-hold - reduces external signal conditioning requirements |
| I²C Bus Interface | Full-duplex I²C master/slave with Philips patent license - enables direct connection to standard I²C sensors and EEPROMs |
Applications
| Industrial Motor Control | Factory Automation Sensor Hub |
|---|---|
Use Scenario: Closed-loop speed and position control of BLDC motors in HVAC blowers and conveyor drives. IC Role / Device Role / Timing Role: Real-time execution of FOC (Field-Oriented Control) algorithms using 16-bit timers for PWM generation and ADC for current sensing. Use Value: Integrated 10-bit ADC and six 16-bit timers eliminate external signal conditioning and timing ICs, reducing BOM count by ≥3 components. | Use Scenario: Aggregation and preprocessing of temperature, pressure, and proximity sensor data in PLC remote I/O modules. IC Role / Device Role / Timing Role: Central controller managing I²C sensor reads, UART diagnostics, and local alarm logic with millisecond-level response. Use Value: On-chip 128 KB flash stores sensor calibration tables and firmware updates; UART/CSI interfaces enable seamless integration with Modbus RTU gateways. |
| Embedded Power Supply Monitor | Medical Diagnostic Equipment Subsystem |
Use Scenario: Monitoring rail voltages, fan RPM, and thermal shutdown thresholds in telecom rectifiers and UPS units. IC Role / Device Role / Timing Role: Standalone supervisor IC replacement with programmable thresholds and event logging via UART. Use Value: 8 KB RAM supports circular buffer for fault-event history; 20 MHz operation ensures sub-100 µs response to overvoltage interrupts. | Use Scenario: Signal conditioning and timing coordination for ultrasound transducer array drivers in portable imaging devices. IC Role / Device Role / Timing Role: Synchronization source for analog front-end clocks and trigger sequencing for pulsed excitation waveforms. Use Value: Dual 8-bit high-speed timers (H0/H1) generate precise 1–5 MHz trigger pulses with <±20 ns jitter, meeting Class II medical timing accuracy requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| UPD70F3214HGC-GAD-AX | Same V850ES/KG1 core, 256 KB flash, 12 KB RAM, identical 100-pin LQFP package | Higher memory capacity supports larger protocol stacks (e.g., CANopen, EtherCAT) and dual-bank firmware updates | Select when firmware size exceeds 128 KB or field update safety requires A/B bank switching |
| UPD70F3217HGC-GAD-AX | V850ES/KJ1 core variant with enhanced peripheral set: additional UART, extra 16-bit timer, and extended I/O drive strength | Better suited for multi-interface gateway applications requiring concurrent UART + CSI + I²C traffic | Select when system requires ≥2 UARTs or higher-drive GPIO for direct LED/display driving |
Compared with UPD70F3210HGC-GAD-AX, UPD70F3214HGC-GAD-AX offers double flash/RAM for complex control logic, while UPD70F3217HGC-GAD-AX adds interface concurrency and drive capability - both retain pin compatibility and toolchain alignment but require validation of peripheral register mapping differences.
Availability
UPD70F3210HGC-GAD-AX is available at Aetrix Electronics and suitable for industrial motor control, factory automation sensor hubs, and embedded power supply monitoring requiring stable component supply across long-lifecycle production programs.
Supply support for UPD70F3210HGC-GAD-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader formed from the merger of NEC Electronics, Renesas Technology, and Hitachi Semiconductor, specializing in microcontrollers, analog, and power solutions.
The V850ES series was designed for cost-sensitive, high-reliability embedded control applications in industrial equipment and automotive subsystems, emphasizing flash-based programmability, real-time performance, and peripheral integration.
FAQ
What is the maximum operating frequency of the UPD70F3210HGC-GAD-AX?
The UPD70F3210HGC-GAD-AX operates at a maximum CPU clock frequency of 20 MHz when driven by an external crystal or resonator connected to XT1/XT2 pins. This frequency is supported across the full 3.0–3.6 V supply range and ambient temperature of −40°C to +85°C, enabling deterministic timing for real-time control tasks such as motor commutation and ADC sampling.
Does the UPD70F3210HGC-GAD-AX support in-system programming?
Yes, the UPD70F3210HGC-GAD-AX supports in-system programming via its on-chip flash memory using the PG-FP3 Flash Memory Programmer and compatible FA-80GC-8BT adapter. The device implements standard V850ES/KF1 flash programming protocols, allowing firmware updates without removing the IC from the PCB - critical for field-deployed industrial equipment maintenance.
Which serial communication interfaces are integrated into the UPD70F3210HGC-GAD-AX?
The UPD70F3210HGC-GAD-AX integrates three serial interfaces: one asynchronous serial interface (UART), two clocked serial interfaces (CSI0 and CSIA), and one I²C bus interface. CSI0 and CSIA support master/slave operation with programmable clock polarity and phase, while the I²C interface complies with Philips I²C Patent Rights and supports standard-mode (100 kbps) and fast-mode (400 kbps) operation.
What is the ADC resolution and channel count of the UPD70F3210HGC-GAD-AX?
The UPD70F3210HGC-GAD-AX features an 8-channel, 10-bit successive-approximation ADC with dedicated input pins P30–P37. It includes an internal sample-and-hold circuit and supports conversion times as fast as 1.5 µs per channel, delivering 1024-level quantization suitable for precision analog sensor interfacing in industrial and medical applications.
Is the UPD70F3210HGC-GAD-AX pin-compatible with other V850ES family members?
The UPD70F3210HGC-GAD-AX shares the same 100-pin LQFP package and pinout with other V850ES/KF1 variants including µPD703210 and µPD70F3210Y(A), enabling drop-in replacement within the KF1 subgroup. However, it is not pin-compatible with V850ES/KG1 or V850ES/KJ1 derivatives due to differences in peripheral signal allocation and power pin distribution.
UPD70F3210HGC-GAD-AX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- -
- Series:
- *
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- -
- Core Size:
- -
- Speed:
- -
- Connectivity:
- -
- Peripherals:
- -
- Number of I/O:
- -
- Program Memory Size:
- -
- Program Memory Type:
- -
- EEPROM Size:
- -
- RAM Size:
- -
- Voltage - Supply (Vcc/Vdd):
- -
- Data Converters:
- -
- Oscillator Type:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
UPD70F3210HGC-GAD-AX FAQ
1.How can I place an order for UPD70F3210HGC-GAD-AX through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD70F3210HGC-GAD-AX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD70F3210HGC-GAD-AX reliable?
The price and inventory of UPD70F3210HGC-GAD-AX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD70F3210HGC-GAD-AX is usually 5 days.
3.What payment methods are accepted for UPD70F3210HGC-GAD-AX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD70F3210HGC-GAD-AX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UPD70F3210HGC-GAD-AX?
UPD70F3210HGC-GAD-AX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD70F3210HGC-GAD-AX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD70F3210HGC-GAD-AX?
For technical support, including UPD70F3210HGC-GAD-AX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD70F3210HGC-GAD-AX requirements.
6.How does Aetrix verify that UPD70F3210HGC-GAD-AX is sourced from the original manufacturer or authorized distributors?
All UPD70F3210HGC-GAD-AX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD70F3210HGC-GAD-AX meets industry standards.
7.What is the process for return or replacement of UPD70F3210HGC-GAD-AX?
All UPD70F3210HGC-GAD-AX units undergo pre-shipment inspection (PSI). If there is an issue with UPD70F3210HGC-GAD-AX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD70F3210HGC-GAD-AX part is unused and in its original packaging.
Return procedure for UPD70F3210HGC-GAD-AX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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