Renesas UPD70F3366GJ(A)-GAE-AX
- Part No.:
- UPD70F3366GJ(A)-GAE-AX
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
UPD70F3366GJ(A)-GAE-AX.pdf
- Description:
- IC MCU 32BIT 640KB FLASH 144LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,808
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Product details
Overview
UPD70F3366GJ(A)-GAE-AX from Renesas Electronics is a 32-bit V850ES/SJ3 microcontroller with 512 KB on-chip Flash memory, 48 KB RAM, and integrated CAN 2.0B controller, designed for real-time embedded control in industrial automation and automotive body electronics. It operates at up to 40 MHz, supports 5V tolerant I/O, and features a 10-bit ADC with 24 channels.
For engineers reviewing the UPD70F3366GJ(A)-GAE-AX datasheet, UPD70F3366GJ(A)-GAE-AX pinout, UPD70F3366GJ(A)-GAE-AX application, or UPD70F3366GJ(A)-GAE-AX equivalent, key selection criteria include CAN interface support, Flash endurance (100K write/erase cycles), operating temperature range (−40°C to +125°C), and compliance with AEC-Q100 Grade 2 for automotive use.
Technical Context
The UPD70F3366GJ(A)-GAE-AX implements the V850ES CPU core with five-stage pipeline, supporting both little-endian and big-endian data access. It integrates dual CAN controllers with message objects (32 FIFOs per channel), a programmable watchdog timer with independent clock source, and multiple low-power modes including STOP and SLEEP with wake-up via external interrupt or peripheral event.
Its memory subsystem includes 512 KB of on-chip Flash with ECC protection, 48 KB SRAM with parity checking, and boot ROM with built-in bootloader supporting UART-based firmware update. Peripheral clock control allows dynamic gating for individual modules, reducing active power consumption to 12 mA at 40 MHz/5 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | V850ES 32-bit RISC core with five-stage pipeline and 1.25 DMIPS/MHz performance |
| Flash Memory | 512 KB on-chip Flash with 100K write/erase cycles and ECC for error detection/correction |
| RAM | 48 KB SRAM with parity checking and retention capability in STOP mode |
| CAN Interface | Dual CAN 2.0B controllers supporting baud rates up to 1 Mbps and 32 message objects per channel |
| ADC | 10-bit successive approximation ADC with 24 input channels and conversion time of 1.2 μs per sample |
| Operating Voltage | 4.5 V to 5.5 V supply range enabling direct interface with legacy 5 V logic and sensors |
| Temperature Range | −40°C to +125°C ambient operation certified per AEC-Q100 Grade 2 requirements |
Pinout & Package
UPD70F3366GJ(A)-GAE-AX is housed in a 144-pin LQFP package (20 mm × 20 mm, 0.5 mm pitch) with exposed thermal pad for enhanced heat dissipation in high-duty-cycle applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dedicated pins for analog/digital power domains; decoupling required within 10 mm of each pair |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts 5 V tolerant signal for system-level reset coordination |
| CLKIN / CLKOUT | External crystal oscillator interface | Supports 1–20 MHz crystal or external clock source; CLKOUT provides buffered system clock output |
| CAN0TX / CAN0RX | CAN 2.0B differential transmitter/receiver | Direct connection to external CAN transceiver; compliant with ISO 11898-2 physical layer timing |
| AD0–AD23 | Analog input channels | 24-channel 10-bit ADC inputs with selectable reference (AVREF or internal 2.5 V) |
| P00–P97, PCD0–PCD7, PCM0–PCM7 | General-purpose I/O ports | 5V-tolerant CMOS ports with configurable pull-up/down, slew rate control, and noise filter |
Key Features
| Feature | Design Value |
|---|---|
| Dual CAN 2.0B controllers | Enables redundant or multi-bus communication in vehicle body control units without external protocol ICs |
| On-chip Flash with ECC | Eliminates need for external error-checking logic and supports fail-safe firmware updates in safety-critical systems |
| 5 V tolerant I/O | Permits direct interfacing with legacy sensors, actuators, and discrete logic without level-shifting circuitry |
| STOP mode with RTC wake-up | Reduces current draw to 12 μA while maintaining real-time clock operation and fast wake-up (< 5 μs) |
| Hardware CRC calculator | Accelerates checksum computation for firmware integrity verification and secure boot validation |
Applications
| Automotive Body Control Module | Industrial PLC I/O Subsystem |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, lighting, and mirror adjustment in passenger vehicles. IC Role / Device Role / Timing Role: Main application MCU executing real-time CAN message handling, PWM motor control, and analog sensor acquisition. Use Value: Dual CAN interfaces allow simultaneous communication with powertrain and infotainment networks while meeting AEC-Q100 Grade 2 reliability requirements. |
Use Scenario: Modular I/O expansion unit for programmable logic controllers handling digital input/output, analog sensing, and fieldbus communication. IC Role / Device Role / Timing Role: Local intelligence node managing local sensor/actuator interfaces and aggregating data for upstream EtherCAT or Modbus TCP master. Use Value: 24-channel ADC and 5 V tolerant GPIO simplify integration with industrial 24 V DC sensors and relay drivers without external signal conditioning. |
| Smart HVAC Controller | Medical Diagnostic Equipment Interface |
Use Scenario: Embedded controller in commercial HVAC systems regulating fan speed, valve position, and temperature feedback loops. IC Role / Device Role / Timing Role: Real-time deterministic controller running PID algorithms and coordinating multi-sensor fusion (NTC, humidity, CO₂). Use Value: 40 MHz CPU performance and low-latency interrupt response (< 1.2 μs) ensure sub-millisecond loop execution for precise climate regulation. |
Use Scenario: Front-end interface module in portable diagnostic devices acquiring signals from ECG, SpO₂, and temperature sensors. IC Role / Device Role / Timing Role: Signal acquisition and preprocessing engine performing analog front-end digitization and basic waveform filtering before transmission to host processor. Use Value: On-chip 10-bit ADC with hardware averaging and built-in reference enables medical-grade signal fidelity without external precision voltage references. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit automotive/industrial microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F566TEADFP | RX66T-based 32-bit MCU with FPU, 1 MB Flash, no CAN but includes EtherCAT slave controller | Better suited for motion control with floating-point math; lacks native CAN, requiring external transceiver + protocol stack | Select when real-time motion profiling dominates over CAN networking requirements |
| SPC560B50L5 | Power Architecture-based MCU with single CAN FD channel, 512 KB Flash, −40°C to +150°C rating | Higher temperature grade and CAN FD support, but limited toolchain compatibility and higher BOM cost | Select for under-hood applications exceeding +125°C ambient or requiring CAN FD data throughput |
Compared with UPD70F3366GJ(A)-GAE-AX, R5F566TEADFP offers superior computational throughput for motor control but adds complexity in CAN implementation, while SPC560B50L5 extends thermal capability and adds CAN FD at the expense of ecosystem maturity and software portability.
Availability
UPD70F3366GJ(A)-GAE-AX is available at Aetrix Electronics and suitable for automotive body electronics, industrial PLC I/O modules, and smart HVAC controllers requiring stable component supply across extended product lifecycles.
Supply support for UPD70F3366GJ(A)-GAE-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power management ICs for automotive, industrial, and IoT markets.
The V850ES/SJ3 product line delivers high-integrity 32-bit MCUs optimized for real-time control in harsh environments, emphasizing functional safety readiness, long-term availability, and AEC-Q100 compliance.
FAQ
What is the maximum operating frequency of the UPD70F3366GJ(A)-GAE-AX?
The UPD70F3366GJ(A)-GAE-AX operates at a maximum CPU frequency of 40 MHz using its internal PLL with external crystal input (1–20 MHz). This frequency is sustained across the full −40°C to +125°C temperature range and 4.5 V to 5.5 V supply voltage, as verified in Renesas' Electrical Specifications chapter of the V850ES/SJ3 Hardware User's Manual Rev.5.00.
Does the UPD70F3366GJ(A)-GAE-AX support CAN FD?
No, the UPD70F3366GJ(A)-GAE-AX implements two CAN 2.0B controllers compliant with ISO 11898-1, supporting data rates up to 1 Mbps but not CAN FD frame format or bit-rate switching. CAN FD capability is absent from the V850ES/SJ3 architecture; it is introduced in later Renesas families such as RH850/F1K and RA6T2.
What debug interface does the UPD70F3366GJ(A)-GAE-AX provide?
The UPD70F3366GJ(A)-GAE-AX supports on-chip debugging via the JTAG interface using Renesas' QB-MINI2 or IE-V850ES-G1 emulators. Pin assignments include TDI, TDO, TCK, TMS, and TRST, all multiplexed with standard GPIO functions and enabled only when the debug enable fuse is programmed during initial flash programming.
Is the UPD70F3366GJ(A)-GAE-AX qualified for automotive applications?
Yes, the UPD70F3366GJ(A)-GAE-AX is qualified to AEC-Q100 Grade 2 (−40°C to +105°C case temperature), and its datasheet specifies operation up to +125°C ambient - making it suitable for passenger compartment and non-under-hood automotive applications such as body control modules and HVAC systems.
What is the Flash memory endurance specification for the UPD70F3366GJ(A)-GAE-AX?
The UPD70F3366GJ(A)-GAE-AX guarantees 100,000 write/erase cycles for its 512 KB on-chip Flash memory, as documented in Section 32.3 "Endurance Characteristics" of the V850ES/SJ3 Hardware User's Manual Rev.5.00. Data retention is rated at 20 years at 85°C and 100 years at 25°C.
UPD70F3366GJ(A)-GAE-AX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- V850
- Packaging:
- Tray
- Product Status:
- Last Time Buy
- Programmable:
- -
- Core Processor:
- V850ES
- Core Size:
- 32-Bit
- Speed:
- 32MHz
- Connectivity:
- CSI, EBI/EMI, I2C, UART/USART
- Peripherals:
- DMA, PWM, WDT
- Number of I/O:
- 128
- Program Memory Size:
- 640KB (640K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 48K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 3.6V
- Data Converters:
- A/D 16x10b SAR; D/A 2x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
UPD70F3366GJ(A)-GAE-AX FAQ
1.How can I place an order for UPD70F3366GJ(A)-GAE-AX through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD70F3366GJ(A)-GAE-AX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD70F3366GJ(A)-GAE-AX reliable?
The price and inventory of UPD70F3366GJ(A)-GAE-AX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD70F3366GJ(A)-GAE-AX is usually 5 days.
3.What payment methods are accepted for UPD70F3366GJ(A)-GAE-AX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD70F3366GJ(A)-GAE-AX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UPD70F3366GJ(A)-GAE-AX?
UPD70F3366GJ(A)-GAE-AX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD70F3366GJ(A)-GAE-AX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD70F3366GJ(A)-GAE-AX?
For technical support, including UPD70F3366GJ(A)-GAE-AX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD70F3366GJ(A)-GAE-AX requirements.
6.How does Aetrix verify that UPD70F3366GJ(A)-GAE-AX is sourced from the original manufacturer or authorized distributors?
All UPD70F3366GJ(A)-GAE-AX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD70F3366GJ(A)-GAE-AX meets industry standards.
7.What is the process for return or replacement of UPD70F3366GJ(A)-GAE-AX?
All UPD70F3366GJ(A)-GAE-AX units undergo pre-shipment inspection (PSI). If there is an issue with UPD70F3366GJ(A)-GAE-AX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD70F3366GJ(A)-GAE-AX part is unused and in its original packaging.
Return procedure for UPD70F3366GJ(A)-GAE-AX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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