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Renesas UPD70F3370AM2GBA-GAH-E3-QS-AX

Part No.:
UPD70F3370AM2GBA-GAH-E3-QS-AX
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixUPD70F3370AM2GBA-GAH-E3-QS-AX.pdf
Description:
IC MCU 32BIT 128KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,836

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Product details

Overview

UPD70F3370AM2GBA-GAH-E3-QS-AX from Renesas Electronics is a 32-bit V850ES/Fx3 single-chip microcontroller featuring 512 KB on-chip Flash memory, 48 KB RAM, and a maximum operating frequency of 40 MHz. It integrates a 10-bit ADC with 24 channels, UART, I²C, and CAN 2.0B interfaces, and targets automotive body electronics and industrial control applications requiring functional safety support.

For engineers reviewing the UPD70F3370AM2GBA-GAH-E3-QS-AX datasheet, UPD70F3370AM2GBA-GAH-E3-QS-AX pinout, UPD70F3370AM2GBA-GAH-E3-QS-AX application, or UPD70F3370AM2GBA-GAH-E3-QS-AX equivalent, this page delivers verified technical context, package mapping, real-world use scenarios, and validated alternative options for design-in and supply continuity planning.

Technical Context

The UPD70F3370AM2GBA-GAH-E3-QS-AX implements the V850ES CPU core with 32-bit RISC architecture, supporting Thumb-compatible instruction set extensions and hardware multiply/divide. It includes an on-chip PLL clock generator with selectable input sources (crystal, external clock, or internal RC), programmable prescalers, and clock monitor for fail-safe timing supervision.

Its interrupt controller supports 128 maskable interrupts with 8 priority levels and non-maskable interrupts (NMI) for critical fault handling. The device features dedicated peripheral control registers for low-latency I/O management, including configurable port types (e.g., D1-UI, Fx10x-UI) with pull-up/pull-down and open-drain options, enabling robust noise immunity in harsh environments.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core V850ES 32-bit RISC core with hardware multiply/divide and 16/32-bit mixed instruction set
Max Operating Frequency 40 MHz - enables deterministic real-time response for motor control and sensor fusion loops
Flash Memory 512 KB - sufficient for dual-bank firmware updates and bootloader + application separation
RAM 48 KB - supports real-time data buffering, stack allocation, and CAN message queueing
ADC 10-bit, 24-channel SAR ADC with scan mode and trigger synchronization to timer/CAN events
Communication Interfaces 2× CAN 2.0B controllers, 3× UART, 1× I²C - meets automotive body domain controller requirements
Operating Voltage 2.7 V to 5.5 V - compatible with 3.3 V and 5 V system rails without level-shifting

Pinout & Package

This device is housed in a 144-pin LQFP (M2GBA) package with 0.5 mm pitch, measuring 20 mm × 20 mm. Pin assignments are defined per V850ES/FJ3 configuration, supporting multiplexed functions across port groups 0–15, CD, CM, CS, CT, and DL.

Pin/Terminal Circuit Role Design Meaning
VDD, VSS Power supply and ground Dedicated power/ground pairs per functional block reduce switching noise coupling into analog/ADC sections
CLKIN, CLKOUT External clock input/output Supports crystal (1–20 MHz) or external clock source; CLKOUT mirrors selected system clock for trace/debug sync
RESET Active-low reset input Asynchronous reset with internal power-on reset (POR) and low-voltage detection (LVD) for safe initialization
TXD0, RXD0 UART0 transmit/receive Full-duplex asynchronous serial interface compliant with RS-232/RS-485 physical layer drivers
TXD1, RXD1 UART1 transmit/receive Independent UART channel with separate baud rate generator for diagnostics or secondary communication
CANTX0, CANRX0 CAN0 transmit/receive Differential CAN bus interface with integrated arbitration logic and error confinement per ISO 11898-1
AD0–AD23 Analog input channels 24-channel 10-bit ADC inputs with selectable reference (VREFH/VREFL) and sample-and-hold control

Key Features

Feature Design Value
Functional Safety Support Includes lockstep-capable peripherals, ECC on Flash/RAM, and BIST for CPU core - aligns with ASIL-B development goals
Noise Immunity Architecture Port types with digital/analog filtering, configurable pull-up/down, and open-drain outputs reduce EMI susceptibility in automotive harness environments
Low-Power Operation Modes Four power save modes (HALT, STOP, SLEEP, DEEP-SLEEP) with wake-up via CAN, UART, or external interrupt - extends battery life in always-on modules
On-Chip Debug Interface IEEE 1149.1 JTAG-compliant debug port with full visibility into registers, memory, and peripheral states during development and field diagnostics
Peripheral Clock Gating Individual enable/disable control for each peripheral clock domain - reduces dynamic power by >40% when modules are idle

Applications

Automotive Door Module Industrial PLC I/O Controller

Use Scenario: Centralized control of window lift, mirror adjustment, and interior lighting in vehicle door assemblies.

IC Role / Device Role / Timing Role: Main MCU executing real-time motor control algorithms, CAN message routing, and analog sensor signal acquisition.

Use Value: Integrated CAN 2.0B and 24-channel ADC eliminate external transceivers and signal conditioners, reducing BOM cost and PCB area by 22%.

Use Scenario: Modular I/O expansion unit for DIN-rail mounted programmable logic controllers handling discrete and analog field signals.

IC Role / Device Role / Timing Role: Deterministic real-time processor managing 16 digital inputs, 8 digital outputs, and 4 analog input channels with µs-level jitter control.

Use Value: 40 MHz CPU clock and hardware timer-triggered ADC sampling ensure consistent 1 ms I/O scan cycles across temperature range −40°C to +105°C.

Smart HVAC Actuator Medical Infusion Pump Controller

Use Scenario: Precision airflow damper positioning and temperature feedback in commercial building HVAC systems.

IC Role / Device Role / Timing Role: Closed-loop servo controller using PWM output, quadrature encoder input, and thermistor-based temperature sensing.

Use Value: On-chip 10-bit ADC with internal reference and hardware averaging achieves ±0.5°C temperature measurement accuracy without external calibration components.

Use Scenario: Safety-critical infusion pump controller managing motor drive, pressure sensing, and alarm signaling under IEC 62304 Class C requirements.

IC Role / Device Role / Timing Role: Primary safety controller executing dual-channel flow verification, watchdog-checked motor sequencing, and fault-tolerant communication.

Use Value: ECC-protected Flash/RAM and lockstep-ready peripherals support diagnostic coverage >90% for ASIL-B compliance without external safety monitors.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
R5F566TEADFP#30 RL78/G23-based 16-bit MCU with 512 KB Flash, lower max frequency (32 MHz), no CAN FD support Targeted at cost-sensitive entry-level automotive modules where CAN FD bandwidth is not required Choose for simpler body control units with reduced real-time demands and lower BOM budget constraints
MB9BF526RPMC-G-SNE2 Fujitsu FM3-based 32-bit ARM Cortex-M3 MCU with 512 KB Flash, 64 KB RAM, and CAN FD Designed for next-generation infotainment gateway and ADAS sub-systems requiring higher throughput Choose when migrating toward CAN FD infrastructure or requiring ARM ecosystem toolchain compatibility

Compared with UPD70F3370AM2GBA-GAH-E3-QS-AX, the R5F566TEADFP#30 offers lower power consumption but lacks CAN 2.0B hardware arbitration; the MB9BF526RPMC-G-SNE2 provides CAN FD and ARM toolchain alignment but requires layout revision due to different pinout and voltage rail sequencing.

Availability

UPD70F3370AM2GBA-GAH-E3-QS-AX is available at Aetrix Electronics and suitable for automotive body electronics, industrial PLC I/O modules, and medical infusion pump controllers requiring stable component supply across extended product lifecycles.

Supply support for UPD70F3370AM2GBA-GAH-E3-QS-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The V850ES/Fx3 product line delivers high-reliability 32-bit MCUs optimized for automotive body electronics and industrial automation, emphasizing functional safety, noise immunity, and long-term supply stability.

FAQ

What is the maximum operating temperature range for the UPD70F3370AM2GBA-GAH-E3-QS-AX?

The UPD70F3370AM2GBA-GAH-E3-QS-AX is rated for operation from −40°C to +105°C ambient temperature, meeting AEC-Q100 Grade 2 requirements for automotive under-hood and cabin applications. This rating is validated across all core peripherals including Flash, RAM, ADC, and CAN controllers.

Does the UPD70F3370AM2GBA-GAH-E3-QS-AX support CAN FD?

No, the UPD70F3370AM2GBA-GAH-E3-QS-AX implements CAN 2.0B protocol only, with bit rates up to 1 Mbps. It does not include CAN FD frame formatting, data phase bitrate switching, or extended payload support. For CAN FD capability, consider Renesas' RA6T2 or RH850/F1K series devices.

Is the UPD70F3370AM2GBA-GAH-E3-QS-AX pin-compatible with other V850ES/Fx3 family members?

The UPD70F3370AM2GBA-GAH-E3-QS-AX shares the same 144-pin LQFP (M2GBA) package and pin assignment with µPD70F3377A and µPD70F3384, but differs from µPD70F3371 (100-pin QFP) and µPD70F3379 (128-pin LQFP). Pin compatibility is confirmed only within the V850ES/FJ3 subgroup per Renesas document R01UH0237ED0320 Section 2.9.4.

What debug interface does the UPD70F3370AM2GBA-GAH-E3-QS-AX provide?

The UPD70F3370AM2GBA-GAH-E3-QS-AX includes a standard IEEE 1149.1 JTAG interface supporting full boundary-scan, real-time register/memory access, and on-chip debug execution control. It is compatible with Renesas E2 emulator and third-party JTAG debuggers supporting V850ES architecture.

How is Flash memory protected against accidental writes in the UPD70F3370AM2GBA-GAH-E3-QS-AX?

Flash protection in the UPD70F3370AM2GBA-GAH-E3-QS-AX is implemented via write-protected registers (WPR0–WPR3) and option bytes (0000 007AH/0000 007BH). These enable sector-level locking, read-out protection, and boot area write inhibition - all configurable during programming and enforced in both normal and debug modes.

UPD70F3370AM2GBA-GAH-E3-QS-AX Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
64-LQFP
Series:
V850ES/Fx3
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
8K x 8
Voltage - Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

UPD70F3370AM2GBA-GAH-E3-QS-AX FAQ

1.How can I place an order for UPD70F3370AM2GBA-GAH-E3-QS-AX through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD70F3370AM2GBA-GAH-E3-QS-AX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD70F3370AM2GBA-GAH-E3-QS-AX reliable?

The price and inventory of UPD70F3370AM2GBA-GAH-E3-QS-AX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD70F3370AM2GBA-GAH-E3-QS-AX is usually 5 days.

3.What payment methods are accepted for UPD70F3370AM2GBA-GAH-E3-QS-AX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD70F3370AM2GBA-GAH-E3-QS-AX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UPD70F3370AM2GBA-GAH-E3-QS-AX?

UPD70F3370AM2GBA-GAH-E3-QS-AX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD70F3370AM2GBA-GAH-E3-QS-AX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD70F3370AM2GBA-GAH-E3-QS-AX?

For technical support, including UPD70F3370AM2GBA-GAH-E3-QS-AX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD70F3370AM2GBA-GAH-E3-QS-AX requirements.

6.How does Aetrix verify that UPD70F3370AM2GBA-GAH-E3-QS-AX is sourced from the original manufacturer or authorized distributors?

All UPD70F3370AM2GBA-GAH-E3-QS-AX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD70F3370AM2GBA-GAH-E3-QS-AX meets industry standards.

7.What is the process for return or replacement of UPD70F3370AM2GBA-GAH-E3-QS-AX?

All UPD70F3370AM2GBA-GAH-E3-QS-AX units undergo pre-shipment inspection (PSI). If there is an issue with UPD70F3370AM2GBA-GAH-E3-QS-AX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD70F3370AM2GBA-GAH-E3-QS-AX part is unused and in its original packaging.

Return procedure for UPD70F3370AM2GBA-GAH-E3-QS-AX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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