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Renesas UPD70F3370M2GBA-GAH-AX

Part No.:
UPD70F3370M2GBA-GAH-AX
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixUPD70F3370M2GBA-GAH-AX.pdf
Description:
IC MCU 32BIT 128MB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,069

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Product details

Overview

UPD70F3370M2GBA-GAH-AX from NEC Electronics is a 32-bit V850ES/FF3 single-chip microcontroller featuring 128 KB on-chip Flash memory, 80-pin QFP package, 32 MHz max CPU clock, integrated CAN 2.0B controller, and 10-bit A/D converter with 16 channels. It targets industrial control modules requiring deterministic real-time response and embedded CAN networking.

For engineers reviewing the UPD70F3370M2GBA-GAH-AX datasheet, UPD70F3370M2GBA-GAH-AX pinout, UPD70F3370M2GBA-GAH-AX application, or UPD70F3370M2GBA-GAH-AX equivalent, key selection considerations include its A-grade industrial temperature range (−40°C to +85°C), EVDD-supplied I/O groups, dual voltage regulator outputs (VRO = 2.5 V), and support for external crystal (4–16 MHz) with PLL multiplication.

Technical Context

The UPD70F3370M2GBA-GAH-AX implements the V850ES CPU core with Harvard architecture, supporting 32-bit fixed-point arithmetic and 16-bit compressed instruction set. Its clock system includes main and sub oscillators, internal RC oscillator (240 kHz), PLL with programmable multiplication factor, and Spread Spectrum Clock Generator (SSCG) for EMI reduction.

It integrates peripheral functions including UART, CSI, I²C, 16-bit timer arrays (TMR, RTMR), watchdog (WDT), power-on reset (POR), low-voltage interrupt (LVI), and programmable I/O ports grouped by supply domain (EVDD, BVDD, AVREF0). The device uses licensed SuperFlash® technology for Flash endurance and data retention.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreV850ES 32-bit RISC core with 16-bit compressed instruction set; enables compact code footprint and deterministic interrupt latency.
Max CPU Frequency32 MHz at VDD = 4.0–5.5 V; supports real-time control loops with sub-μs timer resolution.
Flash Memory128 KB on-chip Flash using SuperFlash® technology; rated for ≥10,000 write/erase cycles and 20-year data retention at 85°C.
A/D Converter10-bit SAR ADC with 16 input channels, selectable reference (AVREF0); supports simultaneous sampling in industrial sensor interfaces.
CAN InterfaceFull CAN 2.0B controller with 32 message objects, programmable bit timing, and error confinement; suitable for automotive body electronics and factory networks.
Operating Temperature−40°C to +85°C (A-grade); qualified for industrial automation, motor drives, and building control systems.
Supply VoltageVDD = EVDD = 3.3–5.5 V; dual-regulator output (VRO = 2.5 V) powers internal logic and analog blocks independently.

Pinout & Package

UPD70F3370M2GBA-GAH-AX is housed in an 80-pin plastic QFP (Quad Flat Package) with 0.65 mm lead pitch, compliant with JEDEC MS-026. Pin grouping follows EVDD-, BVDD-, AVREF0-, and VRO-supplied domains per datasheet Section 1.

Pin/TerminalCircuit RoleDesign Meaning
X1 / X2Main system clock crystal input/outputConnects to 4–16 MHz parallel-resonant crystal; forms primary timing source for CPU and peripherals.
RESETActive-low reset inputAsynchronous reset signal; internally synchronized and held active until VRO stabilizes after power-up.
P00–P03General-purpose I/O port group 0EVDD-supplied CMOS bidirectional pins; configurable as inputs with pull-up/down or open-drain outputs.
P70–P711Analog input channel groupConnected to AVREF0 domain; supports 16-channel 10-bit A/D conversion with programmable scan sequence.
PCM0–PCM3CAN module signal terminalsPCM0 (TX), PCM1 (RX), PCM2 (STB), PCM3 (CLK); implement physical layer interface for CAN bus communication.

Key Features

FeatureDesign Value
SuperFlash® Flash TechnologyEnables single-cycle Flash erase (sector) and program operations; reduces firmware update time and improves field reliability.
Dual Voltage RegulatorGenerates stable 2.5 V (VRO) from VDD; isolates analog and digital power domains to minimize noise coupling in mixed-signal operation.
Spread Spectrum Clock Generator (SSCG)Reduces electromagnetic interference by modulating system clock frequency; meets Class B EMC requirements without added shielding.
Programmable I/O GroupingEight pin groups assigned to distinct supply rails (EVDD, BVDD, AVREF0, VRO); allows independent power sequencing and domain-specific voltage scaling.
Hardware CAN 2.0B ControllerOffloads protocol handling from CPU; supports mailbox-based transmission/reception and automatic retransmission on error.

Applications

Industrial Motor ControlAutomotive Body Control Module

Use Scenario: Closed-loop speed and position control of BLDC motors in HVAC blowers and conveyor systems.

IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms, PWM generation via TMR units, and current sensing via 10-bit ADC with hardware trigger synchronization.

Use Value: Deterministic 32 MHz CPU timing ensures ≤1 μs interrupt latency for current-loop updates; EVDD-supplied I/O supports 5 V logic interfacing with gate drivers.

Use Scenario: Centralized control of door locks, window lifts, lighting, and mirror adjustment in passenger vehicles.

IC Role / Device Role / Timing Role: CAN 2.0B node managing message arbitration, filtering, and fault confinement across LIN/CAN gateway interfaces.

Use Value: Integrated CAN controller eliminates external transceiver dependency for basic diagnostics; A-grade temp range ensures operation in under-hood environments.

Building Automation Sensor HubFactory Floor PLC I/O Module

Use Scenario: Aggregation and preprocessing of temperature, humidity, CO₂, and occupancy sensor data in smart thermostats.

IC Role / Device Role / Timing Role: Multi-channel 10-bit ADC sampling with programmable scan and DMA-triggered storage; UART/CSI for sensor bridge communication.

Use Value: AVREF0-supplied analog domain provides stable 3.3–5.5 V reference for precision sensor readings; 128 KB Flash stores calibration tables and firmware updates.

Use Scenario: Digital input/output expansion unit for modular PLC systems with hot-swap capability.

IC Role / Device Role / Timing Role: Isolated GPIO management via EVDD/BVDD group separation; WDT and POC ensure fail-safe shutdown during brownout events.

Use Value: Dual-regulator architecture (VRO = 2.5 V) maintains core logic integrity while I/O banks tolerate 5 V transients; LVI detects supply dips before functional failure.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R5F566TEADFPRL78/G14 core, 32 MHz max, 256 KB Flash, 10-bit ADC (12 ch), no integrated CANLacks native CAN; requires external transceiver and software stack for CAN 2.0BSelect when CAN is not required and higher Flash density or lower active current is prioritized.
MB9BF516RPMCARM Cortex-M3 core, 100 MHz, 512 KB Flash, 12-bit ADC (24 ch), dual CAN controllersHigher performance, larger memory, and enhanced analog resolution but requires different toolchain and layoutSelect for new designs needing scalable performance, richer peripheral set, and long-term roadmap support.

Compared with R5F566TEADFP and MB9BF516RPMC, the UPD70F3370M2GBA-GAH-AX delivers integrated CAN 2.0B with minimal BOM overhead and deterministic real-time behavior suited for cost-sensitive industrial nodes, while offering proven reliability in legacy automotive and factory automation deployments.

Availability

UPD70F3370M2GBA-GAH-AX is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, building automation sensor hubs, and factory floor PLC I/O modules requiring stable component supply and long-lifecycle support.

Supply support for UPD70F3370M2GBA-GAH-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NEC Electronics Corporation (now part of Renesas Electronics) was a Japanese semiconductor manufacturer specializing in microcontrollers, analog ICs, and display drivers for industrial and automotive markets.

The V850ES/FF3 product line, including UPD70F3370M2GBA-GAH-AX, was designed for deterministic real-time control in resource-constrained embedded systems with integrated CAN, Flash, and mixed-signal peripherals.

FAQ

What is the maximum operating frequency of the UPD70F3370M2GBA-GAH-AX?

The UPD70F3370M2GBA-GAH-AX supports a maximum CPU clock frequency of 32 MHz when VDD is between 4.0 V and 5.5 V. At lower supply voltages (3.3–3.5 V), only core functions like CPU, Flash, RAM, and basic I/O remain operational - peripheral clocks are restricted or disabled per the datasheet's operating condition table.

Does the UPD70F3370M2GBA-GAH-AX include an integrated CAN controller?

Yes, the UPD70F3370M2GBA-GAH-AX integrates a full CAN 2.0B controller with 32 message objects, programmable bit timing, and automatic error confinement. It uses dedicated pins PCM0 (TX) and PCM1 (RX) and does not require external CAN protocol logic - only a physical-layer transceiver is needed for bus connection.

What package type and pin count does the UPD70F3370M2GBA-GAH-AX use?

The UPD70F3370M2GBA-GAH-AX is packaged in an 80-pin plastic QFP (Quad Flat Package) with 0.65 mm lead pitch, designated as FF3 in NEC's package nomenclature. This matches the pinout and thermal profile defined in datasheet section 5.1 and supports standard surface-mount assembly processes.

Is the UPD70F3370M2GBA-GAH-AX qualified for automotive applications?

The UPD70F3370M2GBA-GAH-AX is specified for A-grade industrial operation (−40°C to +85°C) and classified as "Standard" quality per NEC's documentation. While used historically in non-safety-critical automotive body control modules, it is not certified to AEC-Q100 or designated for safety-related vehicle systems.

What voltage references does the UPD70F3370M2GBA-GAH-AX support for its A/D converter?

The UPD70F3370M2GBA-GAH-AX A/D converter uses AVREF0 as its analog reference input, which must be supplied externally in the range of 3.3 V to 5.5 V. The device specifies that ADC operation is not guaranteed below 4.0 V on AVREF0 (ADA0CE bit must be cleared), and all 16 analog input channels (P70–P711) are tied to this domain.

UPD70F3370M2GBA-GAH-AX Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
64-LQFP
Series:
V850ES/FE3
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
8K x 8
Voltage - Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

UPD70F3370M2GBA-GAH-AX FAQ

1.How can I place an order for UPD70F3370M2GBA-GAH-AX through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD70F3370M2GBA-GAH-AX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD70F3370M2GBA-GAH-AX reliable?

The price and inventory of UPD70F3370M2GBA-GAH-AX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD70F3370M2GBA-GAH-AX is usually 5 days.

3.What payment methods are accepted for UPD70F3370M2GBA-GAH-AX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD70F3370M2GBA-GAH-AX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UPD70F3370M2GBA-GAH-AX?

UPD70F3370M2GBA-GAH-AX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD70F3370M2GBA-GAH-AX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD70F3370M2GBA-GAH-AX?

For technical support, including UPD70F3370M2GBA-GAH-AX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD70F3370M2GBA-GAH-AX requirements.

6.How does Aetrix verify that UPD70F3370M2GBA-GAH-AX is sourced from the original manufacturer or authorized distributors?

All UPD70F3370M2GBA-GAH-AX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD70F3370M2GBA-GAH-AX meets industry standards.

7.What is the process for return or replacement of UPD70F3370M2GBA-GAH-AX?

All UPD70F3370M2GBA-GAH-AX units undergo pre-shipment inspection (PSI). If there is an issue with UPD70F3370M2GBA-GAH-AX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD70F3370M2GBA-GAH-AX part is unused and in its original packaging.

Return procedure for UPD70F3370M2GBA-GAH-AX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

UPD70F3370M2GBA-GAH-AX Tags

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