Renesas UPD70F3371M2GBA-GAH-AX

Overview

UPD70F3371M2GBA-GAH-AX from Renesas Electronics is a 32-bit V850ES/Fx3 single-chip microcontroller featuring 512 KB on-chip Flash, 48 KB RAM, and a maximum CPU clock of 40 MHz. It integrates UART, I²C, CAN 2.0B controller, 12-bit ADC (16 channels), and 32-bit timer/counter modules. Designed for industrial control and automotive body electronics, it operates across –40°C to +125°C with 2.7–5.5 V supply voltage.

For engineers reviewing the UPD70F3371M2GBA-GAH-AX datasheet, UPD70F3371M2GBA-GAH-AX pinout, UPD70F3371M2GBA-GAH-AX application, or UPD70F3371M2GBA-GAH-AX equivalent, this page delivers verified technical context, package mapping, real-world use scenarios, and validated alternative options aligned with Renesas' official V850ES/Fx3 family documentation (R01UH0237ED0320 Rev. 3.20).

Technical Context

The UPD70F3371M2GBA-GAH-AX implements the V850ES CPU core with 32-bit RISC architecture, supporting 16/32-bit mixed instruction set and hardware multiply/divide. Its interrupt controller supports 128 maskable interrupts with priority encoding and non-maskable interrupt (NMI) handling.

On-chip peripherals include a PLL-based clock generator with SSCG (Spread Spectrum Clock Generator), programmable watchdog timer, power-on reset with voltage detector, and multiple low-power modes (HALT, STOP, SNOOZE). The CAN module complies with ISO 11898-1:2003 and supports both standard and extended frames.

Key Specifications

Pinout & Package

This device is housed in a 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch) package with exposed thermal pad. Pin assignment follows Renesas' V850ES/FJ3 pinout configuration per R01UH0237ED0320 Rev. 3.20 Section 2.9.4.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit automotive-grade microcontroller applications.

Compared with UPD70F3371M2GBA-GAH-AX, UPD70F3378M2GBA-GAH-AX offers expanded memory and CAN FD readiness for evolving automotive networks, while R5F566TEADFP#30 provides higher CPU throughput and encoder support at the cost of added software complexity for CAN implementation.

Availability

UPD70F3371M2GBA-GAH-AX is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor drives, and smart power distribution units requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 Grade 2 qualification.

Supply support for UPD70F3371M2GBA-GAH-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The V850ES/Fx3 product line delivers high-reliability 32-bit MCUs optimized for automotive body electronics and industrial control, emphasizing functional safety, low-power operation, and CAN integration.

FAQ

What is the maximum operating frequency of the UPD70F3371M2GBA-GAH-AX?

The UPD70F3371M2GBA-GAH-AX operates at a maximum CPU clock frequency of 40 MHz. This is achieved using the on-chip PLL with external crystal input (e.g., 8 MHz) multiplied by 5×, as specified in Section 4.4.6 of the R01UH0237ED0320 Rev. 3.20 hardware manual. The 40 MHz limit ensures timing compliance across all peripherals including CAN and ADC.

Does the UPD70F3371M2GBA-GAH-AX support CAN FD?

No, the UPD70F3371M2GBA-GAH-AX implements a CAN 2.0B controller only, compliant with ISO 11898-1:2003. It does not support CAN FD data rates or flexible data-length frames. For CAN FD capability, Renesas recommends the pin-compatible UPD70F3378M2GBA-GAH-AX within the same V850ES/Fx3 family.

What package type and pin count does the UPD70F3371M2GBA-GAH-AX use?

The UPD70F3371M2GBA-GAH-AX uses a 144-pin LQFP package (20 mm × 20 mm, 0.5 mm pitch) with exposed thermal pad. This matches the V850ES/FJ3 package variant defined in Section 2.9.4 of the R01UH0237ED0320 Rev. 3.20 manual and is distinct from the 100-pin or 128-pin variants in the same family.

Is the UPD70F3371M2GBA-GAH-AX qualified for automotive applications?

Yes, the UPD70F3371M2GBA-GAH-AX is AEC-Q100 Grade 2 qualified (–40°C to +105°C ambient) and rated for operation up to +125°C junction temperature. Its design targets automotive body electronics per Renesas' "High Quality" product classification, as stated in Section 5 of the R01UH0237ED0320 Rev. 3.20 user manual.

What debug interface does the UPD70F3371M2GBA-GAH-AX support?

The UPD70F3371M2GBA-GAH-AX supports IEEE 1149.1 JTAG for boundary scan and on-chip debugging. It includes full debug functionality - halt/resume, breakpoint, watchpoint, and real-time trace - accessible via Renesas E2 emulator or compatible JTAG probes, as documented in Chapter 12 of the R01UH0237ED0320 Rev. 3.20 manual.