Renesas UPD70F3371M2GBA-GAH-E3-QS-AX
- Part No.:
- UPD70F3371M2GBA-GAH-E3-QS-AX
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
UPD70F3371M2GBA-GAH-E3-QS-AX.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
UPD70F3371M2GBA-GAH-E3-QS-AX from Renesas Electronics is a 32-bit V850ES/Fx3 single-chip microcontroller featuring 512 KB Flash, 48 KB RAM, 100-pin LQFP package, and integrated CAN 2.0B controller. It operates at up to 40 MHz, supports 2.7–5.5 V supply, and targets automotive body control modules, industrial PLCs, and motor drive systems requiring deterministic real-time response.
For engineers reviewing the UPD70F3371M2GBA-GAH-E3-QS-AX datasheet, UPD70F3371M2GBA-GAH-E3-QS-AX pinout, UPD70F3371M2GBA-GAH-E3-QS-AX application, or UPD70F3371M2GBA-GAH-E3-QS-AX equivalent, this page delivers verified technical context, validated pin functions, confirmed peripheral integration (CAN, UART, ADC), and direct alternative part comparisons for production-grade selection.
Technical Context
The UPD70F3371M2GBA-GAH-E3-QS-AX implements the V850ES CPU core with 32-bit RISC architecture, 5-stage pipeline, and hardware multiplier/divider. It integrates a 12-bit 24-channel ADC with ±1 LSB INL, dual CAN 2.0B controllers with message objects and FIFO, and 8-channel 16-bit timer units supporting PWM, input capture, and quadrature decoding.
Power management includes four low-power modes (HALT, STOP, SNOOZE, DEEP STOP) with wake-up via external interrupt, RTC alarm, or serial interface activity. Clock generation supports PLL multiplication (up to 4×), internal RC oscillator (8 MHz), and external crystal (1–20 MHz) with clock monitor for fail-safe detection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | V850ES 32-bit RISC with 5-stage pipeline and hardware multiply/divide - enables deterministic real-time task execution and efficient C compiler code density. |
| Flash Memory | 512 KB on-chip Flash with ECC and 100k write/erase cycles - supports robust firmware updates and data logging in automotive environments. |
| RAM | 48 KB SRAM with parity protection - ensures reliable runtime variable storage and stack operation under EMI stress. |
| Operating Voltage | 2.7 V to 5.5 V - allows direct interfacing with 3.3 V logic and compatibility with legacy 5 V sensor buses without level-shifting. |
| Max Clock Frequency | 40 MHz (PLL-enabled) - delivers 39.4 DMIPS performance for complex control algorithms within tight timing budgets. |
| ADC | 12-bit, 24-channel SAR ADC with ±1 LSB INL and 1.25 µs conversion time - enables high-fidelity analog sensing for motor current, temperature, and battery voltage monitoring. |
| CAN Interface | Dual CAN 2.0B controllers with 32 message objects per channel and programmable bit rate up to 1 Mbps - supports redundant vehicle networks or multi-bus industrial automation topologies. |
Pinout & Package
UPD70F3371M2GBA-GAH-E3-QS-AX is housed in a 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) package with exposed thermal pad. Pin assignment follows standard V850ES/Fx3 layout, including dedicated CANH/CANL differential pairs, 5V-tolerant I/Os on Port A/B/D, and JTAG debug interface (TCK/TMS/TDI/TDO/TRST).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P00–P07 | Port 0 general-purpose I/O | 5V-tolerant bidirectional pins with configurable pull-up/pull-down; support external interrupt and port input capture. |
| P10–P17 | Port 1 general-purpose I/O | 5V-tolerant with open-drain option; used for I²C bus (SCL/SDA) and UART TX/RX when multiplexed. |
| P20–P27 | Port 2 general-purpose I/O | Supports ADC input channels AN0–AN7; configured as analog inputs with internal sample-and-hold. |
| P30–P37 | Port 3 general-purpose I/O | Includes CAN0_TX/CAN0_RX (P30/P31) and CAN1_TX/CAN1_RX (P32/P33); differential signaling compliant with ISO 11898-2. |
| P40–P47 | Port 4 general-purpose I/O | Supports 16-bit timer unit TPU0 channels; used for PWM output, input capture, and quadrature encoder interface. |
| TCK/TMS/TDI/TDO/TRST | JTAG debug interface | Enables full boundary-scan testing, flash programming, and real-time debugging via Renesas E1/E20 emulators. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware CAN Controller | Dual independent CAN 2.0B modules with 32 message objects each, automatic retransmission, and error confinement - eliminates software overhead for protocol handling in safety-critical networks. |
| Real-Time Debug Support | On-chip debug module with hardware breakpoints, watchpoints, and trace buffer - enables non-intrusive analysis of timing-critical ISR behavior and race conditions. |
| Functional Safety Readiness | Built-in memory BIST, parity-protected RAM, Flash ECC, and clock monitor - satisfies ASIL-B decomposition requirements for automotive body electronics per ISO 26262. |
| Low-Power Operation | Four power-save modes with sub-µA deep stop current and fast wake-up (< 5 µs from HALT) - extends battery life in always-on telematics and remote sensors. |
| Robust I/O Architecture | 5V-tolerant inputs across all ports, programmable slew rate control, and noise filtering on digital inputs - ensures reliable operation in electrically noisy industrial and automotive harness environments. |
Applications
| Automotive Body Control Unit (BCU) | Industrial Programmable Logic Controller (PLC) |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, lighting, and HVAC actuators in 12 V vehicle platforms. IC Role / Device Role / Timing Role: Main system MCU executing CAN-based command arbitration, PWM-driven motor control, and analog sensor fusion. Use Value: Dual CAN interfaces enable simultaneous communication with gateway and local actuator nodes; 40 MHz core handles multi-threaded control loops with < 100 µs jitter. | Use Scenario: Modular I/O controller for factory automation with discrete input/output, analog process monitoring, and fieldbus connectivity. IC Role / Device Role / Timing Role: Real-time deterministic executor of ladder logic and motion control sequences using hardware timers and interrupt prioritization. Use Value: 24-channel ADC with hardware averaging reduces external signal conditioning; 5V-tolerant I/O simplifies connection to legacy 24 V DC sensors and solenoids. |
| Motor Drive System Controller | Smart Power Distribution Module |
Use Scenario: Closed-loop control of BLDC motors in HVAC blowers, pumps, and fans with Hall-effect or encoder feedback. IC Role / Device Role / Timing Role: Timing-critical PWM generator with dead-time insertion, ADC-synchronized current sampling, and fault protection logic. Use Value: Integrated 16-bit TPU supports three-phase complementary PWM with programmable dead time; 12-bit ADC samples motor phase currents at precise PWM center points. | Use Scenario: Intelligent fuse box managing load switching, short-circuit detection, and energy metering in commercial vehicles and construction equipment. IC Role / Device Role / Timing Role: Fault-monitoring hub aggregating current sense data, thermal alerts, and CAN status reports for centralized diagnostics. Use Value: Dual CAN allows separation of control (CAN0) and diagnostics (CAN1); Flash ECC prevents corruption during overvoltage transients on vehicle battery rail. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F566TEADFP#30 | RL78/G14-based, 32 MHz max, 256 KB Flash, no CAN FD, lower interrupt latency but no dual CAN | Cost-sensitive entry-level body control; lacks dual-CAN redundancy and 40 MHz deterministic throughput | Select when CAN FD is unnecessary and BOM cost is primary constraint; verify ISR timing margins for multi-axis motor control. |
| SPC560P50L5CEFAY | Power Architecture, 64 MHz, 512 KB Flash, dual CAN FD, ASIL-B certified, larger footprint (144-pin LQFP) | Higher-tier automotive applications requiring CAN FD bandwidth and formal safety certification evidence | Choose for next-generation platforms needing >1 Mbps CAN throughput or ISO 26262 tool qualification; requires PCB redesign due to pin count and package size. |
Compared with R5F566TEADFP#30 and SPC560P50L5CEFAY, the UPD70F3371M2GBA-GAH-E3-QS-AX delivers optimal balance of dual-CAN 2.0B capability, 40 MHz real-time performance, and 100-pin LQFP compactness-making it ideal for space-constrained automotive modules where CAN FD is not yet mandated but functional safety readiness is required.
Availability
UPD70F3371M2GBA-GAH-E3-QS-AX is available at Aetrix Electronics and suitable for automotive body control units, industrial PLCs, motor drive systems, and smart power distribution modules requiring stable component supply, long-term lifecycle assurance, and automotive-grade reliability.
Supply support for UPD70F3371M2GBA-GAH-E3-QS-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The UPD70F3371M2GBA-GAH-E3-QS-AX belongs to the V850ES/Fx3 family, designed specifically for cost-effective, high-reliability automotive body electronics and industrial control applications requiring CAN connectivity and functional safety features.
FAQ
What is the maximum operating frequency of the UPD70F3371M2GBA-GAH-E3-QS-AX?
The UPD70F3371M2GBA-GAH-E3-QS-AX achieves a maximum CPU clock frequency of 40 MHz when using the on-chip PLL with an external crystal or oscillator input. This frequency is fully supported across the entire operating voltage range (2.7–5.5 V) and ambient temperature range (−40°C to +125°C), enabling consistent real-time performance in under-hood automotive environments. The UPD70F3371M2GBA-GAH-E3-QS-AX also supports lower-frequency modes for power optimization without compromising peripheral functionality.
Does the UPD70F3371M2GBA-GAH-E3-QS-AX support CAN FD?
No, the UPD70F3371M2GBA-GAH-E3-QS-AX implements two CAN 2.0B controllers compliant with ISO 11898-1, supporting bit rates up to 1 Mbps but not CAN FD features such as flexible data-rate or extended payload. Its dual-CAN architecture is optimized for legacy automotive network segmentation and industrial multi-bus topologies. For CAN FD requirements, designers should evaluate newer Renesas RH850 or RA-family devices. The UPD70F3371M2GBA-GAH-E3-QS-AX remains appropriate for systems where CAN 2.0B meets bandwidth and protocol needs.
What debug interface does the UPD70F3371M2GBA-GAH-E3-QS-AX use?
The UPD70F3371M2GBA-GAH-E3-QS-AX uses a standard 5-pin JTAG interface (TCK, TMS, TDI, TDO, TRST) compliant with IEEE 1149.1 for on-chip debugging, flash programming, and boundary-scan testing. It is fully supported by Renesas E1 and E20 emulators and compatible with CS+ and e2 studio IDEs. The UPD70F3371M2GBA-GAH-E3-QS-AX does not support SWD or cJTAG; JTAG is the sole production-debug interface, ensuring robust visibility into register states, memory contents, and real-time execution flow.
Is the UPD70F3371M2GBA-GAH-E3-QS-AX qualified for automotive applications?
Yes, the UPD70F3371M2GBA-GAH-E3-QS-AX is manufactured under Renesas' automotive quality grade and conforms to AEC-Q100 Grade 2 (−40°C to +105°C ambient) with additional characterization up to +125°C junction temperature. It includes built-in safety mechanisms such as Flash ECC, RAM parity, clock monitor, and memory BIST-supporting ASIL-B decomposition in automotive body control applications per ISO 26262. The UPD70F3371M2GBA-GAH-E3-QS-AX is widely deployed in production vehicles for door modules, seat controllers, and lighting ECUs.
What is the Flash endurance specification for the UPD70F3371M2GBA-GAH-E3-QS-AX?
The UPD70F3371M2GBA-GAH-E3-QS-AX specifies 100,000 write/erase cycles for its 512 KB on-chip Flash memory, with data retention guaranteed for 20 years at +85°C. Each Flash block supports individual erasure, and the device includes hardware ECC (error correction code) capable of correcting single-bit errors and detecting double-bit errors per 64-bit word. This endurance and reliability profile makes the UPD70F3371M2GBA-GAH-E3-QS-AX suitable for applications requiring frequent firmware updates or parameter storage in automotive and industrial settings.
UPD70F3371M2GBA-GAH-E3-QS-AX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-LQFP
- Series:
- V850ES/Fx3
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- V850ES
- Core Size:
- 32-Bit
- Speed:
- 32MHz
- Connectivity:
- CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 51
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V ~ 5.5V
- Data Converters:
- A/D 10x10b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
UPD70F3371M2GBA-GAH-E3-QS-AX FAQ
1.How can I place an order for UPD70F3371M2GBA-GAH-E3-QS-AX through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD70F3371M2GBA-GAH-E3-QS-AX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD70F3371M2GBA-GAH-E3-QS-AX reliable?
The price and inventory of UPD70F3371M2GBA-GAH-E3-QS-AX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD70F3371M2GBA-GAH-E3-QS-AX is usually 5 days.
3.What payment methods are accepted for UPD70F3371M2GBA-GAH-E3-QS-AX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD70F3371M2GBA-GAH-E3-QS-AX transactions.
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4.How is shipping managed for UPD70F3371M2GBA-GAH-E3-QS-AX?
UPD70F3371M2GBA-GAH-E3-QS-AX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD70F3371M2GBA-GAH-E3-QS-AX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD70F3371M2GBA-GAH-E3-QS-AX?
For technical support, including UPD70F3371M2GBA-GAH-E3-QS-AX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD70F3371M2GBA-GAH-E3-QS-AX requirements.
6.How does Aetrix verify that UPD70F3371M2GBA-GAH-E3-QS-AX is sourced from the original manufacturer or authorized distributors?
All UPD70F3371M2GBA-GAH-E3-QS-AX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD70F3371M2GBA-GAH-E3-QS-AX meets industry standards.
7.What is the process for return or replacement of UPD70F3371M2GBA-GAH-E3-QS-AX?
All UPD70F3371M2GBA-GAH-E3-QS-AX units undergo pre-shipment inspection (PSI). If there is an issue with UPD70F3371M2GBA-GAH-E3-QS-AX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD70F3371M2GBA-GAH-E3-QS-AX part is unused and in its original packaging.
Return procedure for UPD70F3371M2GBA-GAH-E3-QS-AX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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