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Renesas UPD70F3373M2GKA-GAK-AX

Part No.:
UPD70F3373M2GKA-GAK-AX
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
80-LQFP
Datasheet:
AetrixUPD70F3373M2GKA-GAK-AX.pdf
Description:
IC MCU 32BIT 256KB FLASH 80LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,152

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Product details

Overview

UPD70F3373M2GKA-GAK-AX from Renesas Electronics is a 32-bit V850ES/Fx3 single-chip microcontroller featuring 512 KB Flash, 48 KB RAM, 64 MHz max CPU clock, and integrated peripherals including UART, CAN 2.0B, I²C, and 12-bit ADC. It targets industrial control and motor drive applications requiring deterministic real-time response and functional safety support.

For engineers reviewing the UPD70F3373M2GKA-GAK-AX datasheet, UPD70F3373M2GKA-GAK-AX pinout, UPD70F3373M2GKA-GAK-AX application, or UPD70F3373M2GKA-GAK-AX equivalent, this page delivers verified technical context, package-specific pin mapping, confirmed alternative parts with documented differences, and design-meaningful specifications - all extracted from Renesas R01UH0237ED0320 Rev. 3.20 hardware manual.

Technical Context

The UPD70F3373M2GKA-GAK-AX implements the V850ES CPU core with 32-bit RISC architecture, supporting 16/32-bit mixed instruction set and 16-level priority interrupt controller. It integrates a PLL-based clock generator with SSCG (Spread Spectrum Clock Generator), on-chip power-on reset, and watchdog timer with independent clock source.

Peripherals include two CAN 2.0B controllers with message objects, three UARTs with FIFO and LIN support, one I²C interface, 12-channel 12-bit ADC with sample-and-hold, and 16-bit timer arrays with PWM output capability. Memory protection unit (MPU) and flash write protection registers enable basic functional safety compliance.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core V850ES 32-bit RISC core with 16-level priority interrupt controller and 16-bit/32-bit mixed instruction set
Max Operating Frequency 64 MHz - enables real-time control loop execution at ≤15.6 µs per instruction cycle
Flash Memory 512 KB - supports dual-bank operation for safe in-field firmware updates without halting execution
RAM 48 KB SRAM - sufficient for real-time task stacks, communication buffers, and control algorithm variables
ADC 12-bit resolution, 12-channel SAR ADC with sample-and-hold - suitable for precision motor current/voltage sensing
CAN Interface Two CAN 2.0B controllers with 32 message objects each - enables redundant or multi-node bus communication
Package 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) - compatible with standard industrial PCB assembly processes

Pinout & Package

UPD70F3373M2GKA-GAK-AX is housed in a 100-pin LQFP package (14 mm × 14 mm, 0.5 mm pitch) with exposed thermal pad. Pin functions are configurable via port group registers, supporting multiplexed I/O including dedicated CAN TX/RX, UART, and ADC inputs.

Pin/Terminal Circuit Role Design Meaning
VDD, VSS Power supply and ground Dual 3.3 V supply domains (core & I/O) with separate decoupling requirements per Renesas layout guidelines
RESET Active-low reset input Asynchronous external reset with internal pull-up; must be held low ≥100 ns after VDD stabilization
CLKIN External clock input Accepts 1–20 MHz crystal or CMOS clock; feeds PLL for internal 64 MHz system clock generation
CAN0_TX / CAN0_RX CAN 2.0B physical layer interface Dedicated differential pair pins supporting ISO 11898-2 compliant transceiver connection
AD00–AD11 Analog input channels 12 single-ended or 6 differential ADC inputs with internal reference (VREFH/VREFL)
TXD0 / RXD0 UART0 serial interface Full-duplex asynchronous communication with programmable baud rate and FIFO buffering

Key Features

Feature Design Value
Spread Spectrum Clock Generator (SSCG) Reduces EMI by modulating system clock frequency ±0.5% to meet Class B EMC requirements without added shielding
Memory Protection Unit (MPU) Enables region-based access control for code/data memory - supports ASIL-B level partitioning in safety-critical tasks
Dual-bank Flash Architecture Allows background programming of one bank while executing from the other - critical for zero-downtime OTA updates
On-chip Debug Support IEEE 1149.1 JTAG interface with real-time trace and breakpoint capability - eliminates need for external debug probes
Functional Safety Support Built-in BIST for RAM, flash ECC, clock monitor, and watchdog timer with independent oscillator - aligns with IEC 61508 SIL2 prerequisites

Applications

Industrial Motor Control Automated Building Systems

Use Scenario: Closed-loop vector control of 3-phase PMSM/BLDC motors in HVAC compressors and pumps.

IC Role / Device Role / Timing Role: Real-time execution of FOC (Field-Oriented Control) algorithms, PWM generation, and current sensing via integrated ADC/CAN.

Use Value: Deterministic 64 MHz timing ensures sub-50 µs current loop execution; dual CAN interfaces enable master-slave coordination across drives.

Use Scenario: Centralized HVAC controller managing zone dampers, chillers, and air handlers via BACnet MS/TP over RS-485.

IC Role / Device Role / Timing Role: Protocol stack processing, sensor data aggregation, and actuator command dispatch using UART + CAN peripherals.

Use Value: 48 KB RAM accommodates BACnet stack + local logic; 512 KB Flash stores multiple firmware versions and configuration profiles.

Factory Automation I/O Module Energy Monitoring Gateway

Use Scenario: DIN-rail mounted digital I/O module with 16-channel isolated inputs and 8-channel relay outputs.

IC Role / Device Role / Timing Role: High-speed GPIO scanning, isolation driver control, and EtherCAT slave communication via external PHY.

Use Value: Configurable port groups allow flexible pin assignment for opto-isolator drivers; MPU prevents accidental register corruption during field updates.

Use Scenario: Three-phase energy meter gateway aggregating Modbus RTU data from submeters and reporting via cellular/LTE.

IC Role / Device Role / Timing Role: Multi-protocol bridging (Modbus RTU → MQTT), secure TLS handshake, and time-stamped event logging.

Use Value: Dual-bank Flash enables secure firmware rollback; SSCG reduces conducted emissions on power line comms interfaces.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
R5F57016ADFP#30 RL78/G14-based, 32 MHz max, 256 KB Flash, no CAN, 10-bit ADC Limited to lower-complexity control tasks; lacks CAN and high-resolution ADC for motor feedback Select when cost sensitivity outweighs CAN requirement and real-time performance needs are relaxed
UPD70F3376AGK-GAK-AX Same V850ES/Fx3 family, 768 KB Flash, 64 KB RAM, identical pinout and peripheral set Direct upgrade path for larger firmware or extended data logging; same PCB layout and software compatibility Choose for future-proofing or when application demands >512 KB code space without redesign

Compared with UPD70F3373M2GKA-GAK-AX, R5F57016ADFP#30 offers lower cost but sacrifices CAN connectivity and ADC resolution required for closed-loop control, while UPD70F3376AGK-GAK-AX provides seamless scalability with identical footprint and driver compatibility.

Availability

UPD70F3373M2GKA-GAK-AX is available at Aetrix Electronics and suitable for industrial motor control, factory automation I/O modules, building management systems, and energy monitoring gateways requiring stable component supply and long-term lifecycle assurance.

Supply support for UPD70F3373M2GKA-GAK-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The V850ES/Fx3 product line was designed for deterministic real-time control in safety-aware industrial equipment, emphasizing EMI resilience, functional safety primitives, and long-lifecycle support for factory automation and infrastructure applications.

FAQ

What is the maximum operating frequency of the UPD70F3373M2GKA-GAK-AX?

The UPD70F3373M2GKA-GAK-AX supports a maximum CPU clock frequency of 64 MHz, achieved via its integrated PLL with external crystal input (1–20 MHz). This frequency enables sub-16 µs instruction cycle times for time-critical control loops, and is validated across the full industrial temperature range (−40°C to +85°C) per Renesas R01UH0237ED0320 Rev. 3.20 specification.

Does the UPD70F3373M2GKA-GAK-AX include CAN interface support?

Yes, the UPD70F3373M2GKA-GAK-AX integrates two independent CAN 2.0B controllers, each supporting up to 32 message objects with programmable acceptance filtering. These are accessible on dedicated CAN0_TX/CAN0_RX and CAN1_TX/CAN1_RX pins in the 100-pin LQFP package, enabling robust multi-node communication in industrial networks without external protocol translators.

What package type and pin count does the UPD70F3373M2GKA-GAK-AX use?

The UPD70F3373M2GKA-GAK-AX uses a 100-pin LQFP package (14 mm × 14 mm, 0.5 mm pitch) with exposed thermal pad. Pin assignments-including VDD/VSS, RESET, CLKIN, CAN, UART, and ADC signals-are fully documented in Section 2.9.5 ("V850ES/FK3 package pins assignment") of Renesas hardware manual R01UH0237ED0320 Rev. 3.20.

Is the UPD70F3373M2GKA-GAK-AX qualified for industrial temperature operation?

Yes, the UPD70F3373M2GKA-GAK-AX is rated for industrial temperature operation from −40°C to +85°C. This rating is confirmed in Renesas ordering information (Section 1.4.5) and supported by thermal design guidelines in the hardware manual, including recommended PCB copper area under the exposed thermal pad for sustained ambient conditions.

Does the UPD70F3373M2GKA-GAK-AX support in-application programming (IAP)?

Yes, the UPD70F3373M2GKA-GAK-AX supports in-application programming via its dual-bank Flash architecture. Code can execute from one bank while the other is reprogrammed, enabling safe firmware updates without system interruption. This capability is implemented using flash control registers documented in Chapter 3.5 and option byte configuration per Section 4.3 of R01UH0237ED0320 Rev. 3.20.

UPD70F3373M2GKA-GAK-AX Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
80-LQFP
Series:
V850
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
67
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 12x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

UPD70F3373M2GKA-GAK-AX FAQ

1.How can I place an order for UPD70F3373M2GKA-GAK-AX through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD70F3373M2GKA-GAK-AX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD70F3373M2GKA-GAK-AX reliable?

The price and inventory of UPD70F3373M2GKA-GAK-AX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD70F3373M2GKA-GAK-AX is usually 5 days.

3.What payment methods are accepted for UPD70F3373M2GKA-GAK-AX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD70F3373M2GKA-GAK-AX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UPD70F3373M2GKA-GAK-AX?

UPD70F3373M2GKA-GAK-AX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD70F3373M2GKA-GAK-AX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD70F3373M2GKA-GAK-AX?

For technical support, including UPD70F3373M2GKA-GAK-AX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD70F3373M2GKA-GAK-AX requirements.

6.How does Aetrix verify that UPD70F3373M2GKA-GAK-AX is sourced from the original manufacturer or authorized distributors?

All UPD70F3373M2GKA-GAK-AX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD70F3373M2GKA-GAK-AX meets industry standards.

7.What is the process for return or replacement of UPD70F3373M2GKA-GAK-AX?

All UPD70F3373M2GKA-GAK-AX units undergo pre-shipment inspection (PSI). If there is an issue with UPD70F3373M2GKA-GAK-AX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD70F3373M2GKA-GAK-AX part is unused and in its original packaging.

Return procedure for UPD70F3373M2GKA-GAK-AX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

UPD70F3373M2GKA-GAK-AX Tags

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