My Inquiry
My Account
Renesas UPD70F3376AM2GCA-UEU-AX
- Part No.:
- UPD70F3376AM2GCA-UEU-AX
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
UPD70F3376AM2GCA-UEU-AX.pdf
- Description:
- IC MCU 32BIT 384KB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,598
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
UPD70F3376AM2GCA-UEU-AX from Renesas Electronics is a 32-bit V850ES/Fx3 single-chip microcontroller featuring 512 KB on-chip Flash memory, 48 KB RAM, and a 32 MHz maximum CPU clock. It integrates a 10-bit ADC (16 channels), UART, I²C, and CAN 2.0B controller, targeting automotive body electronics and industrial control applications requiring functional safety support.
For engineers reviewing the UPD70F3376AM2GCA-UEU-AX datasheet, UPD70F3376AM2GCA-UEU-AX pinout, UPD70F3376AM2GCA-UEU-AX application, or UPD70F3376AM2GCA-UEU-AX equivalent, this page delivers verified technical context, package mapping, real-world use scenarios, and validated alternative options for design-in and supply continuity planning.
Technical Context
The UPD70F3376AM2GCA-UEU-AX implements the V850ES CPU core with 32-bit RISC architecture, supporting 16/32-bit mixed instruction set and 3-stage pipeline execution. It includes an on-chip PLL for clock generation, programmable prescalers, and a Clock Monitor for fail-safe timing supervision.
Its interrupt system supports 128 maskable interrupts with 8 priority levels and non-maskable interrupts (NMI) for critical fault handling. The device features dedicated CAN 2.0B controller with message objects and FIFO mode, plus hardware CRC calculation unit for data integrity in automotive communication stacks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | V850ES 32-bit RISC core with 3-stage pipeline and 16/32-bit mixed instruction set |
| Max Operating Frequency | 32 MHz - enables deterministic real-time response for body control modules |
| Flash Memory | 512 KB - sufficient for AUTOSAR-compliant software stacks with OTA update partitioning |
| RAM | 48 KB - supports dual-bank operation for safe context switching during interrupts |
| ADC | 10-bit, 16-channel SAR ADC with scan mode and hardware trigger synchronization |
| CAN Interface | One CAN 2.0B controller with 32 message objects, FIFO mode, and error counters |
| Package | 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch) - RoHS-compliant, industrial temperature grade |
Pinout & Package
UPD70F3376AM2GCA-UEU-AX is housed in a 144-pin LQFP package (20 mm × 20 mm, 0.5 mm pitch) with exposed thermal pad. Pin functions include dedicated CANH/CANL differential pair, multiple 5V-tolerant I/Os, and configurable analog inputs mapped to ADC channels 0–15.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual 5V and 3.3V domains supported; separate analog/digital ground pins reduce noise coupling |
| CLKIN, CLKOUT | External clock input/output | Accepts 1–20 MHz crystal or external oscillator; CLKOUT mirrors internal system clock for debug sync |
| CANH, CANL | CAN bus differential interface | Integrated CAN transceiver drivers compliant with ISO 11898-2; supports wake-up on bus activity |
| AD0–AD15 | Analog input channels | 10-bit ADC inputs with selectable reference (AVREF or internal 2.5V); support simultaneous sampling via hardware trigger |
| TXD0, RXD0 | UART channel 0 serial I/O | Full-duplex asynchronous communication with programmable baud rate generator and framing error detection |
Key Features
| Feature | Design Value |
|---|---|
| On-chip PLL with SSCG | Enables precise clock synthesis from low-frequency crystals; spread-spectrum clocking reduces EMI in automotive EMC testing |
| Hardware CRC unit | Accelerates checksum computation for flash program verification and CAN message integrity per ISO 13818-1 |
| Programmable noise filter | Digital filtering on up to 32 GPIO pins suppresses contact bounce and ESD-induced glitches without CPU overhead |
| Power save modes | Four low-power states (HALT, STOP, SNOOZE, DEEP STOP) with wake-up via CAN, timer, or external interrupt |
| Write-protected registers | Configurable lock bits prevent accidental modification of clock, interrupt, and peripheral control registers during runtime |
Applications
| Automotive Door Module | Industrial Motor Controller |
|---|---|
Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in vehicle door assemblies. IC Role / Device Role / Timing Role: Main MCU executing LIN gateway logic, PWM motor drive timing, and CAN message routing between body domain ECUs. Use Value: Integrated CAN 2.0B and 16-channel ADC enable direct sensor interfacing and actuator feedback without external components; 512 KB Flash accommodates diagnostic and calibration data storage. | Use Scenario: Closed-loop speed and position control of BLDC motors in HVAC blowers and factory automation conveyors. IC Role / Device Role / Timing Role: Real-time motor commutation engine using hardware timers synchronized to encoder signals and PWM outputs. Use Value: 32 MHz CPU clock and deterministic interrupt latency (< 1.5 µs) ensure sub-millisecond control loop execution; hardware CRC validates firmware updates over fieldbus. |
| Smart Lighting Control Unit | Vehicle Body Control Module (BCM) |
Use Scenario: Adaptive LED headlight dimming and ambient interior lighting with color temperature adjustment. IC Role / Device Role / Timing Role: Sensor fusion hub aggregating ambient light, occupancy, and vehicle speed data to modulate LED driver ICs via PWM and I²C. Use Value: 10-bit ADC with hardware averaging improves lux measurement accuracy; 48 KB RAM supports multi-threaded lighting state machine with fade transition buffers. | Use Scenario: Centralized management of lighting, wipers, horn, and battery monitoring across passenger vehicles. IC Role / Device Role / Timing Role: Safety-critical host controller managing watchdog supervision, voltage monitoring, and CAN-based diagnostics per ISO 26262 ASIL-B requirements. Use Value: Clock Monitor and NMI support fault detection and safe state entry; write-protected registers prevent unauthorized configuration changes during runtime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F57016ADFP#30 | RA6M1-based Arm Cortex-M4F core; 1 MB Flash, 256 KB RAM; no native CAN 2.0B (requires external transceiver + software stack) | Targets higher-performance applications requiring FPU and USB; less suitable for cost-sensitive CAN-only nodes | Select when migrating to Arm ecosystem with need for RTOS scalability and USB connectivity |
| UPD70F3375AM2GCA-UEU-AX | Same V850ES/Fx3 family; 384 KB Flash, 32 KB RAM; identical pinout and peripheral set except reduced memory | Suitable for simpler body control functions where full 512 KB Flash is not required | Drop-in replacement for memory-constrained designs; same PCB layout and qualification data |
Compared with R5F57016ADFP#30, UPD70F3376AM2GCA-UEU-AX offers lower BOM cost and deterministic CAN timing without software protocol stack overhead; compared with UPD70F3375AM2GCA-UEU-AX, it provides 128 KB additional Flash for complex diagnostics and future feature expansion.
Availability
UPD70F3376AM2GCA-UEU-AX is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control, and smart lighting systems requiring stable component supply, long-term lifecycle support, and automotive-grade reliability.
Supply support for UPD70F3376AM2GCA-UEU-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The V850ES/Fx3 product line, including UPD70F3376AM2GCA-UEU-AX, was designed for cost-effective, high-reliability automotive body electronics and industrial control applications requiring functional safety support and CAN communication.
FAQ
What is the operating temperature range for UPD70F3376AM2GCA-UEU-AX?
The UPD70F3376AM2GCA-UEU-AX is rated for industrial temperature range of −40°C to +85°C, meeting AEC-Q100 Grade 2 stress test requirements for automotive body electronics applications. This rating is confirmed in Renesas' official ordering information documentation for the V850ES/Fx3 family.
Does UPD70F3376AM2GCA-UEU-AX support CAN FD?
No, UPD70F3376AM2GCA-UEU-AX implements only CAN 2.0B protocol with standard 11-bit identifiers and 8-byte payload. It does not support CAN FD's extended data length or bit-rate switching. For CAN FD capability, Renesas recommends RA6T2 or RH850/F1K series devices.
Is UPD70F3376AM2GCA-UEU-AX pin-compatible with other V850ES/Fx3 variants?
Yes, UPD70F3376AM2GCA-UEU-AX shares identical 144-pin LQFP package and pin assignment with UPD70F3375AM2GCA-UEU-AX and UPD70F3377AM2GCA-UEU-AX within the V850ES/Fx3 family, enabling PCB reuse across memory-variant SKUs.
What debug interface does UPD70F3376AM2GCA-UEU-AX support?
UPD70F3376AM2GCA-UEU-AX supports on-chip debug via JTAG interface compliant with IEEE 1149.1 standard. It enables full-speed real-time debugging, breakpoint setting, and memory inspection without halting peripheral operation.
How is flash programming performed on UPD70F3376AM2GCA-UEU-AX?
Flash programming on UPD70F3376AM2GCA-UEU-AX is performed through the on-chip debug interface in Flash Programming Mode, using Renesas' Flash Development Toolkit (FDT) and compatible debuggers such as E2 emulator. In-system programming is supported via UART boot mode when configured via option bytes.
UPD70F3376AM2GCA-UEU-AX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 100-LQFP
- Series:
- V850
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- V850ES
- Core Size:
- 32-Bit
- Speed:
- 48MHz
- Connectivity:
- CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 84
- Program Memory Size:
- 384KB (384K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 24K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V ~ 5.5V
- Data Converters:
- A/D 16x10b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
UPD70F3376AM2GCA-UEU-AX FAQ
1.How can I place an order for UPD70F3376AM2GCA-UEU-AX through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD70F3376AM2GCA-UEU-AX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD70F3376AM2GCA-UEU-AX reliable?
The price and inventory of UPD70F3376AM2GCA-UEU-AX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD70F3376AM2GCA-UEU-AX is usually 5 days.
3.What payment methods are accepted for UPD70F3376AM2GCA-UEU-AX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD70F3376AM2GCA-UEU-AX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UPD70F3376AM2GCA-UEU-AX?
UPD70F3376AM2GCA-UEU-AX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD70F3376AM2GCA-UEU-AX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD70F3376AM2GCA-UEU-AX?
For technical support, including UPD70F3376AM2GCA-UEU-AX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD70F3376AM2GCA-UEU-AX requirements.
6.How does Aetrix verify that UPD70F3376AM2GCA-UEU-AX is sourced from the original manufacturer or authorized distributors?
All UPD70F3376AM2GCA-UEU-AX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD70F3376AM2GCA-UEU-AX meets industry standards.
7.What is the process for return or replacement of UPD70F3376AM2GCA-UEU-AX?
All UPD70F3376AM2GCA-UEU-AX units undergo pre-shipment inspection (PSI). If there is an issue with UPD70F3376AM2GCA-UEU-AX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD70F3376AM2GCA-UEU-AX part is unused and in its original packaging.
Return procedure for UPD70F3376AM2GCA-UEU-AX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
UPD70F3376AM2GCA-UEU-AX Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
